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'Dynamibility' of Mechanical Systems / / by Hani Ali Arafa
| 'Dynamibility' of Mechanical Systems / / by Hani Ali Arafa |
| Autore | Arafa Hani Ali |
| Edizione | [1st ed. 2026.] |
| Pubbl/distr/stampa | Cham : , : Springer Nature Switzerland : , : Imprint : Springer, , 2026 |
| Descrizione fisica | 1 online resource (214 pages) |
| Disciplina | 620.0042 |
| Collana | Mechanical Engineering (R0) Series |
| Soggetto topico |
Engineering design
Mechanics, Applied Machinery Mechanics Engineering Design Engineering Mechanics Machinery and Machine Elements Classical Mechanics |
| ISBN | 3-032-12645-2 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Drive over Highly Variable Operating Angles -- Hydraulic Variable-Displacement Pumps/Motors -- Mechanical Variable-Ratio Transmissions -- Four Degrees of Freedom Cylindrical Gearing -- High-Speed Reciprocating Mechanisms -- Damping Mobile Interface Load Dynamicity -- Inertial Response to a Change in Effort -- Micromotion Amplification into a Command -- Stabilizing Cardanic Suspended Rigid Bodies -- Variable Multi-Bladed Rotor Systems -- Attributes of Multistage Mechanical Systems. |
| Record Nr. | UNINA-9911049177903321 |
Arafa Hani Ali
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| Cham : , : Springer Nature Switzerland : , : Imprint : Springer, , 2026 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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1685-2022 : IEEE Standard for IP-XACT, Standard Structure for Packaging, Integrating, and Reusing IP within Tool Flows / / Institute of Electrical and Electronics Engineers
| 1685-2022 : IEEE Standard for IP-XACT, Standard Structure for Packaging, Integrating, and Reusing IP within Tool Flows / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | New York : , : IEEE, , [2023] |
| Descrizione fisica | 1 online resource (750 pages) |
| Disciplina | 620.0042 |
| Soggetto topico | Engineering design |
| ISBN | 1-5044-9448-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996575086803316 |
| New York : , : IEEE, , [2023] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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1st International Conference on Engineering Manufacture 2022 : Selected Contributions of EM 2022 / / edited by Lucas F. M. da Silva, Digavalli Ravi Kumar, Maria de Fátima Reis Vaz, Ricardo J. C. Carbas
| 1st International Conference on Engineering Manufacture 2022 : Selected Contributions of EM 2022 / / edited by Lucas F. M. da Silva, Digavalli Ravi Kumar, Maria de Fátima Reis Vaz, Ricardo J. C. Carbas |
| Edizione | [1st ed. 2023.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2023 |
| Descrizione fisica | 1 online resource (142 pages) |
| Disciplina | 621.988 |
| Collana | Proceedings in Engineering Mechanics, Research, Technology and Education |
| Soggetto topico |
Mechanical engineering
Industrial engineering Production engineering Engineering design Mechanical Engineering Industrial and Production Engineering Engineering Design |
| ISBN | 3-031-13234-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Mechanical Assessment of PBF-EB Manufactured IN718 Lattice Structures -- Enhanced Assessment of the Fatigue Behavior and Damage Tolerance of Additively Manufactured Metals and Components -- Effects of Printing Parameters on the Quality of FFF Printed Parts with Red PLA Filaments from Different Suppliers -- Grinding Wheel with On-line Grinding Force Collecting -- Improving the Efficiency of the Bowden Cable Terminal Injection Process for the Automotive Industry. |
| Record Nr. | UNINA-9910627243303321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2023 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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2010 International Conference on Simulation of Semiconductor Processes and Devices
| 2010 International Conference on Simulation of Semiconductor Processes and Devices |
| Pubbl/distr/stampa | [Place of publication not identified], : I E E E, 2010 |
| Descrizione fisica | 1 online resource (xiv, 324 pages) |
| Disciplina | 620.0042 |
| Soggetto topico |
Engineering design
Computer-aided design |
| ISBN | 1-4244-7700-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996218724603316 |
| [Place of publication not identified], : I E E E, 2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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2010 International Conference on Simulation of Semiconductor Processes and Devices
| 2010 International Conference on Simulation of Semiconductor Processes and Devices |
| Pubbl/distr/stampa | [Place of publication not identified], : I E E E, 2010 |
| Descrizione fisica | 1 online resource (xiv, 324 pages) |
| Disciplina | 620.0042 |
| Soggetto topico |
Engineering design
Computer-aided design |
| ISBN |
9781424477005
142447700X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910140913703321 |
| [Place of publication not identified], : I E E E, 2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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2012 2nd Interdisciplinary Engineering Design Education Conference
| 2012 2nd Interdisciplinary Engineering Design Education Conference |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2012 |
| Descrizione fisica | 1 online resource (123 pages) : illustrations |
| Disciplina | 620.0042 |
| Soggetto topico |
Engineering design
Industrial design |
| ISBN | 1-4673-0840-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996213587803316 |
| [Place of publication not identified], : IEEE, 2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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2012 2nd Interdisciplinary Engineering Design Education Conference
| 2012 2nd Interdisciplinary Engineering Design Education Conference |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2012 |
| Descrizione fisica | 1 online resource (123 pages) : illustrations |
| Disciplina | 620.0042 |
| Soggetto topico |
Engineering design
Industrial design |
| ISBN |
9781467308403
1467308404 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910130669903321 |
| [Place of publication not identified], : IEEE, 2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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2017 Joint International Symposium on e-Manufacturing and Design Collaboration (eMDC) & Semiconductor Manufacturing (ISSM) / / Institute of Electrical and Electronics Engineers
| 2017 Joint International Symposium on e-Manufacturing and Design Collaboration (eMDC) & Semiconductor Manufacturing (ISSM) / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : IEEE, , 2017 |
| Descrizione fisica | 1 online resource |
| Disciplina | 620.0042 |
| Soggetto topico | Engineering design |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | 2017 Joint International Symposium on e-Manufacturing and Design Collaboration |
| Record Nr. | UNISA-996279667403316 |
| Piscataway, New Jersey : , : IEEE, , 2017 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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2020 International Symposium on Semiconductor Manufacturing (ISSM) : proceedings of technical papers : December 15-16, 2020 / / Institute of Electrical and Electronics Engineers
| 2020 International Symposium on Semiconductor Manufacturing (ISSM) : proceedings of technical papers : December 15-16, 2020 / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : IEEE, , 2020 |
| Descrizione fisica | 1 online resource (141 pages) : illustrations |
| Disciplina | 670.285 |
| Soggetto topico |
Computer integrated manufacturing systems
Engineering design Manufacturing processes - Data processing |
| ISBN | 1-66540-364-0 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | 2020 International Symposium on Semiconductor Manufacturing |
| Record Nr. | UNINA-9910469149103321 |
| Piscataway, New Jersey : , : IEEE, , 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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2020 International Symposium on Semiconductor Manufacturing (ISSM) : proceedings of technical papers : December 15-16, 2020 / / Institute of Electrical and Electronics Engineers
| 2020 International Symposium on Semiconductor Manufacturing (ISSM) : proceedings of technical papers : December 15-16, 2020 / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : IEEE, , 2020 |
| Descrizione fisica | 1 online resource (141 pages) : illustrations |
| Disciplina | 670.285 |
| Soggetto topico |
Computer integrated manufacturing systems
Engineering design Manufacturing processes - Data processing |
| ISBN | 1-66540-364-0 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | 2020 International Symposium on Semiconductor Manufacturing |
| Record Nr. | UNISA-996574635703316 |
| Piscataway, New Jersey : , : IEEE, , 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
Soggetto topico
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Engineering design
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- Engineering Design (1077)
- Production engineering (212)
- Industrial engineering (209)
- Industrial and Production Engineering (199)