Commercialization of high efficiency low cost CIGS technology based on electroplating [[electronic resource] ] : final technical progress report, September 28, 2007 - June 30, 2009 / / Bulent Basol |
Autore | Basol Bulent |
Pubbl/distr/stampa | Golden, CO : , : National Renewable Energy Laboratory, , [2010] |
Descrizione fisica | 1 online resource (iv, 19 pages) : digital, PDF file |
Collana | NREL/SR |
Soggetto topico |
Photovoltaic cells
Solar cells Electroplating Copper indium selenide |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Altri titoli varianti | Commercialization of high efficiency low cost CIGS technology based on electroplating |
Record Nr. | UNINA-9910699531603321 |
Basol Bulent | ||
Golden, CO : , : National Renewable Energy Laboratory, , [2010] | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Electrochemical phase formation and growth [[electronic resource] ] : an introduction to the initial stages of metal deposition / / E. Budevski, G. Staikov, W.J. Lorenz |
Autore | Budevski E (Evgeni) |
Pubbl/distr/stampa | Weinheim ; ; New York, : VCH, c1996 |
Descrizione fisica | 1 online resource (424 p.) |
Disciplina |
541.37
670.7/32 670.732 |
Altri autori (Persone) |
StaikovGeorgi
LorenzW. J |
Collana | Advances in electrochemical science and engineering |
Soggetto topico |
Electroplating
Metals - Surfaces Crystal growth |
Soggetto genere / forma | Electronic books. |
ISBN |
1-281-75852-3
9786611758523 3-527-61493-1 3-527-61492-3 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Electrochemical Phase Formation and Growth; Contents; 1 Fundamentals of Electrocrystallization of Metals; 1.1 Thermodynamic and Kinetic Aspects; 1.2 Metal Deposition Mechanisms; 1.3 Topics of this Book; 2 Crystalline Metal Surfaces; 2.1 Structural Aspects; Close-packed 2D and 3D crystal structures; Crystal imperfections and surface inhomogeneities; Surface reconstruction; Surface roughness and the kink position; Step roughness; 2.2 Atomic Dynamics; Atom exchange frequencies; Local, partial, and overall current densities; Kink atoms and the Nernst equilibrium potential
Exchange current density of kink atomsConcentration of adatoms; Exchange current density of adatoms; Mean residence time and surface displacement of adatoms; 2.3 Surface Profile Mobility; Surface diffusion and mean displacement of adatoms; Surface diffusion . The exact solution; Direct transfer; Current density on a stepped crystal face; 2.4 Conclusions; 3 Underpotential Deposition of Metals-2D Phases; 3.1 Historical Background; 3.2 Phenomenology; 3.3 Thermodynamics; Thermodynamic formalism; Adsorption isotherm models; Experimental results; 3.4 Structures of 2D Meads Phases Degree of registryInternal strain; Electrochemical results; Comparative and ex situ UHV results; In situ surface analytical results; 3.5 Kinetics; Quasi-homogeneous substrate surface approach; Inhomogeneous substrate surface approach; Phase transitions; 3.6 2D and 3D Me-S Alloy Formation; Phenomenology; Thermodynamics; Structures of 2D and 3D Me-alloys; Kinetics; 3.7 Conclusion; 4 Initial Stages of Bulk Phase Formation; 4.1 Equilibrium Form of Crystals and Forms of Growth; Equilibrium form; Crystal-substrate interaction; Gibbs-Wulff-Kaishew theorem; Two dimensional crystal; Forms of growth Energy of cluster formation3D nucleation; 2D nucleation; Gibbs-Thomson equation; 4.2 Nucleation Rate; Classical approach (Volmer and Weber); Kinetic approach (Becker and Doering); Binding energies and energy of nucleation; Atomistic model; Nucleation rate equation; Small cluster model; Experimental results; 4.3 3D Phase Formation on UPD Modified Foreign Substrate Surfaces; UPD-OPD transitions; Nucleation and growth; Epitaxy; Experimental results; 4.4 Conclusions; 5 Growth of Crystalline Faces; 5.1 Dislocation-Free Crystal Faces; Preparation of single crystal faces by electrodeposition Double pulse techniqueNucleation rate-overvoltage dependence; Time distribution of the nucleation events; Form of growth of monatomic layers; Propagation rate of monatomic steps; Space distribution of nucleation events; Propagation rate of polyatomic steps; Mechanism of metal deposition and adatom concentration; 5.2 Growth Kinetics of Perfect Faces; Mononuclear layer-by-layer growth; Multinuclear monolayer formation; Deposition kinetics on quasi-perfect crystal faces; 5.3 Real Crystal Faces; Dislocations; Spiral growth mechanism; Theory of spiral growth; Growth morphology Steady state and transient current densities |
Record Nr. | UNINA-9910144261803321 |
Budevski E (Evgeni) | ||
Weinheim ; ; New York, : VCH, c1996 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Electrochemical phase formation and growth [[electronic resource] ] : an introduction to the initial stages of metal deposition / / E. Budevski, G. Staikov, W.J. Lorenz |
Autore | Budevski E (Evgeni) |
Pubbl/distr/stampa | Weinheim ; ; New York, : VCH, c1996 |
Descrizione fisica | 1 online resource (424 p.) |
Disciplina |
541.37
670.7/32 670.732 |
Altri autori (Persone) |
StaikovGeorgi
LorenzW. J |
Collana | Advances in electrochemical science and engineering |
Soggetto topico |
Electroplating
Metals - Surfaces Crystal growth |
ISBN |
1-281-75852-3
9786611758523 3-527-61493-1 3-527-61492-3 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Electrochemical Phase Formation and Growth; Contents; 1 Fundamentals of Electrocrystallization of Metals; 1.1 Thermodynamic and Kinetic Aspects; 1.2 Metal Deposition Mechanisms; 1.3 Topics of this Book; 2 Crystalline Metal Surfaces; 2.1 Structural Aspects; Close-packed 2D and 3D crystal structures; Crystal imperfections and surface inhomogeneities; Surface reconstruction; Surface roughness and the kink position; Step roughness; 2.2 Atomic Dynamics; Atom exchange frequencies; Local, partial, and overall current densities; Kink atoms and the Nernst equilibrium potential
Exchange current density of kink atomsConcentration of adatoms; Exchange current density of adatoms; Mean residence time and surface displacement of adatoms; 2.3 Surface Profile Mobility; Surface diffusion and mean displacement of adatoms; Surface diffusion . The exact solution; Direct transfer; Current density on a stepped crystal face; 2.4 Conclusions; 3 Underpotential Deposition of Metals-2D Phases; 3.1 Historical Background; 3.2 Phenomenology; 3.3 Thermodynamics; Thermodynamic formalism; Adsorption isotherm models; Experimental results; 3.4 Structures of 2D Meads Phases Degree of registryInternal strain; Electrochemical results; Comparative and ex situ UHV results; In situ surface analytical results; 3.5 Kinetics; Quasi-homogeneous substrate surface approach; Inhomogeneous substrate surface approach; Phase transitions; 3.6 2D and 3D Me-S Alloy Formation; Phenomenology; Thermodynamics; Structures of 2D and 3D Me-alloys; Kinetics; 3.7 Conclusion; 4 Initial Stages of Bulk Phase Formation; 4.1 Equilibrium Form of Crystals and Forms of Growth; Equilibrium form; Crystal-substrate interaction; Gibbs-Wulff-Kaishew theorem; Two dimensional crystal; Forms of growth Energy of cluster formation3D nucleation; 2D nucleation; Gibbs-Thomson equation; 4.2 Nucleation Rate; Classical approach (Volmer and Weber); Kinetic approach (Becker and Doering); Binding energies and energy of nucleation; Atomistic model; Nucleation rate equation; Small cluster model; Experimental results; 4.3 3D Phase Formation on UPD Modified Foreign Substrate Surfaces; UPD-OPD transitions; Nucleation and growth; Epitaxy; Experimental results; 4.4 Conclusions; 5 Growth of Crystalline Faces; 5.1 Dislocation-Free Crystal Faces; Preparation of single crystal faces by electrodeposition Double pulse techniqueNucleation rate-overvoltage dependence; Time distribution of the nucleation events; Form of growth of monatomic layers; Propagation rate of monatomic steps; Space distribution of nucleation events; Propagation rate of polyatomic steps; Mechanism of metal deposition and adatom concentration; 5.2 Growth Kinetics of Perfect Faces; Mononuclear layer-by-layer growth; Multinuclear monolayer formation; Deposition kinetics on quasi-perfect crystal faces; 5.3 Real Crystal Faces; Dislocations; Spiral growth mechanism; Theory of spiral growth; Growth morphology Steady state and transient current densities |
Record Nr. | UNISA-996203158703316 |
Budevski E (Evgeni) | ||
Weinheim ; ; New York, : VCH, c1996 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. di Salerno | ||
|
Electrochemical phase formation and growth [[electronic resource] ] : an introduction to the initial stages of metal deposition / / E. Budevski, G. Staikov, W.J. Lorenz |
Autore | Budevski E (Evgeni) |
Pubbl/distr/stampa | Weinheim ; ; New York, : VCH, c1996 |
Descrizione fisica | 1 online resource (424 p.) |
Disciplina |
541.37
670.7/32 670.732 |
Altri autori (Persone) |
StaikovGeorgi
LorenzW. J |
Collana | Advances in electrochemical science and engineering |
Soggetto topico |
Electroplating
Metals - Surfaces Crystal growth |
ISBN |
1-281-75852-3
9786611758523 3-527-61493-1 3-527-61492-3 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Electrochemical Phase Formation and Growth; Contents; 1 Fundamentals of Electrocrystallization of Metals; 1.1 Thermodynamic and Kinetic Aspects; 1.2 Metal Deposition Mechanisms; 1.3 Topics of this Book; 2 Crystalline Metal Surfaces; 2.1 Structural Aspects; Close-packed 2D and 3D crystal structures; Crystal imperfections and surface inhomogeneities; Surface reconstruction; Surface roughness and the kink position; Step roughness; 2.2 Atomic Dynamics; Atom exchange frequencies; Local, partial, and overall current densities; Kink atoms and the Nernst equilibrium potential
Exchange current density of kink atomsConcentration of adatoms; Exchange current density of adatoms; Mean residence time and surface displacement of adatoms; 2.3 Surface Profile Mobility; Surface diffusion and mean displacement of adatoms; Surface diffusion . The exact solution; Direct transfer; Current density on a stepped crystal face; 2.4 Conclusions; 3 Underpotential Deposition of Metals-2D Phases; 3.1 Historical Background; 3.2 Phenomenology; 3.3 Thermodynamics; Thermodynamic formalism; Adsorption isotherm models; Experimental results; 3.4 Structures of 2D Meads Phases Degree of registryInternal strain; Electrochemical results; Comparative and ex situ UHV results; In situ surface analytical results; 3.5 Kinetics; Quasi-homogeneous substrate surface approach; Inhomogeneous substrate surface approach; Phase transitions; 3.6 2D and 3D Me-S Alloy Formation; Phenomenology; Thermodynamics; Structures of 2D and 3D Me-alloys; Kinetics; 3.7 Conclusion; 4 Initial Stages of Bulk Phase Formation; 4.1 Equilibrium Form of Crystals and Forms of Growth; Equilibrium form; Crystal-substrate interaction; Gibbs-Wulff-Kaishew theorem; Two dimensional crystal; Forms of growth Energy of cluster formation3D nucleation; 2D nucleation; Gibbs-Thomson equation; 4.2 Nucleation Rate; Classical approach (Volmer and Weber); Kinetic approach (Becker and Doering); Binding energies and energy of nucleation; Atomistic model; Nucleation rate equation; Small cluster model; Experimental results; 4.3 3D Phase Formation on UPD Modified Foreign Substrate Surfaces; UPD-OPD transitions; Nucleation and growth; Epitaxy; Experimental results; 4.4 Conclusions; 5 Growth of Crystalline Faces; 5.1 Dislocation-Free Crystal Faces; Preparation of single crystal faces by electrodeposition Double pulse techniqueNucleation rate-overvoltage dependence; Time distribution of the nucleation events; Form of growth of monatomic layers; Propagation rate of monatomic steps; Space distribution of nucleation events; Propagation rate of polyatomic steps; Mechanism of metal deposition and adatom concentration; 5.2 Growth Kinetics of Perfect Faces; Mononuclear layer-by-layer growth; Multinuclear monolayer formation; Deposition kinetics on quasi-perfect crystal faces; 5.3 Real Crystal Faces; Dislocations; Spiral growth mechanism; Theory of spiral growth; Growth morphology Steady state and transient current densities |
Record Nr. | UNINA-9910830791003321 |
Budevski E (Evgeni) | ||
Weinheim ; ; New York, : VCH, c1996 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Electrochemical phase formation and growth : an introduction to the initial stages of metal deposition / / E. Budevski, G. Staikov, W.J. Lorenz |
Autore | Budevski E (Evgeni) |
Pubbl/distr/stampa | Weinheim ; ; New York, : VCH, c1996 |
Descrizione fisica | 1 online resource (424 p.) |
Disciplina |
541.37
670.7/32 670.732 |
Altri autori (Persone) |
StaikovGeorgi
LorenzW. J |
Collana | Advances in electrochemical science and engineering |
Soggetto topico |
Electroplating
Metals - Surfaces Crystal growth |
ISBN |
1-281-75852-3
9786611758523 3-527-61493-1 3-527-61492-3 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Electrochemical Phase Formation and Growth; Contents; 1 Fundamentals of Electrocrystallization of Metals; 1.1 Thermodynamic and Kinetic Aspects; 1.2 Metal Deposition Mechanisms; 1.3 Topics of this Book; 2 Crystalline Metal Surfaces; 2.1 Structural Aspects; Close-packed 2D and 3D crystal structures; Crystal imperfections and surface inhomogeneities; Surface reconstruction; Surface roughness and the kink position; Step roughness; 2.2 Atomic Dynamics; Atom exchange frequencies; Local, partial, and overall current densities; Kink atoms and the Nernst equilibrium potential
Exchange current density of kink atomsConcentration of adatoms; Exchange current density of adatoms; Mean residence time and surface displacement of adatoms; 2.3 Surface Profile Mobility; Surface diffusion and mean displacement of adatoms; Surface diffusion . The exact solution; Direct transfer; Current density on a stepped crystal face; 2.4 Conclusions; 3 Underpotential Deposition of Metals-2D Phases; 3.1 Historical Background; 3.2 Phenomenology; 3.3 Thermodynamics; Thermodynamic formalism; Adsorption isotherm models; Experimental results; 3.4 Structures of 2D Meads Phases Degree of registryInternal strain; Electrochemical results; Comparative and ex situ UHV results; In situ surface analytical results; 3.5 Kinetics; Quasi-homogeneous substrate surface approach; Inhomogeneous substrate surface approach; Phase transitions; 3.6 2D and 3D Me-S Alloy Formation; Phenomenology; Thermodynamics; Structures of 2D and 3D Me-alloys; Kinetics; 3.7 Conclusion; 4 Initial Stages of Bulk Phase Formation; 4.1 Equilibrium Form of Crystals and Forms of Growth; Equilibrium form; Crystal-substrate interaction; Gibbs-Wulff-Kaishew theorem; Two dimensional crystal; Forms of growth Energy of cluster formation3D nucleation; 2D nucleation; Gibbs-Thomson equation; 4.2 Nucleation Rate; Classical approach (Volmer and Weber); Kinetic approach (Becker and Doering); Binding energies and energy of nucleation; Atomistic model; Nucleation rate equation; Small cluster model; Experimental results; 4.3 3D Phase Formation on UPD Modified Foreign Substrate Surfaces; UPD-OPD transitions; Nucleation and growth; Epitaxy; Experimental results; 4.4 Conclusions; 5 Growth of Crystalline Faces; 5.1 Dislocation-Free Crystal Faces; Preparation of single crystal faces by electrodeposition Double pulse techniqueNucleation rate-overvoltage dependence; Time distribution of the nucleation events; Form of growth of monatomic layers; Propagation rate of monatomic steps; Space distribution of nucleation events; Propagation rate of polyatomic steps; Mechanism of metal deposition and adatom concentration; 5.2 Growth Kinetics of Perfect Faces; Mononuclear layer-by-layer growth; Multinuclear monolayer formation; Deposition kinetics on quasi-perfect crystal faces; 5.3 Real Crystal Faces; Dislocations; Spiral growth mechanism; Theory of spiral growth; Growth morphology Steady state and transient current densities |
Record Nr. | UNINA-9910877455603321 |
Budevski E (Evgeni) | ||
Weinheim ; ; New York, : VCH, c1996 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Electrodeposition [[electronic resource] ] : properties, processes, and applications / / Udit Surya Mohanty, editor |
Pubbl/distr/stampa | New York, : Nova Science Publishers, c2012 |
Descrizione fisica | 1 online resource (375 p.) |
Disciplina | 671.732 |
Altri autori (Persone) | MohantyUdit Surya |
Collana | Electrical Engineering Developments |
Soggetto topico |
Alloy plating
Electroplating |
Soggetto genere / forma | Electronic books. |
ISBN | 1-61470-845-2 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
""ELECTRODEPOSITION ""; ""ELECTRODEPOSITION ""; ""CONTENTS ""; ""PREFACE ""; ""A REVIEW ON THE ELECTRODEPOSITION OF NICKEL: SYNTHESIS, MAGNETIC, THERMODYNAMIC PROPERTIES AND ITS POTENTIAL APPLICATIONS ""; ""ABSTRACT ""; ""INTRODUCTION ""; ""1.1. CRYSTAL STRUCTURES OF NICKEL ""; ""1.2. SYNTHESIS ""; ""1.2.1. FCC Nickel ""; ""1.2.2. HCP Nickel""; ""1.3. MAGNETIC AND THERMODYNAMIC PROPERTIES ""; ""1.4. APPLICATIONS ""; ""CONCLUSION ""; ""REFERENCES""; ""DEPOSITION AND PROPERTIES OF ELECTROCHEMICAL COMPOSITE COATINGS ""; ""ABSTRACT ""; ""INTRODUCTION ""
""2.1. DIFFERENT TYPES OF ELECTROCHEMICAL COMPOSITE COATINGS (ECC) """"2.1.1. Nickel-Based ECC ""; ""2.1.2. Chromium-Based ECC ""; ""2.1.3. Copper-Based ECC ""; ""2.1.4. Iron-Based ECC""; ""2.1.5. Zinc-Based ECC ""; ""2.1.6. ECC Based on Noble Metals ""; ""CONCLUSION ""; ""REFERENCES ""; ""ELECTRODEPOSITION OF AU-SN ALLOYS ""; ""ABSTRACT""; ""INTRODUCTION ""; ""3.1. ELECTRODEPOSITION OF AU-SN ALLOYS FROM A SINGLE SOLUTION""; ""3.1.1. Solution Preparation ""; ""3.2. SOLUTION STABILITY ""; ""3.2.1. Solution Precipitation and Turbidity Measurements "" ""3.2.2. Characterization of Precipitates """"3.2.3. UV/Vis Spectroscopy and X-Ray Photoelectron Spectroscopy Studies ""; ""3.3. MICROSTRUCTURE OF ELECTRODEPOSITED FILMS""; ""3.3.1. Microstructure of Eutectic Deposits and Reflowed Solder ""; ""3.4. RECOVERY OF AU FROM THE WASTE SOLUTION ""; ""3.5. SEQUENTIAL ELECTRODEPOSITION FROM TWO SEPARATE SOLUTIONS ""; ""3.5.1. Solution Preparation and Electrodeposition of Pure Au Films ""; ""3.5.2. Solution Preparation and Electrodeposition of Pure Sn Films ""; ""3.5.3. Microstructure of Sequentially Deposited Eutectic Alloys and Reflowed Solder"" ""CONCLUSION """"ACKNOWLEDGMENTS ""; ""REFERENCES ""; ""ELECTROCHEMICAL CORROSION BEHAVIOUR OF LEAD � FREE SOLDER ALLOYS IN 3.5 % NACL SOLUTION""; ""ABSTRACT ""; ""INTRODUCTION ""; ""4.1. ELECTROCHEMICAL CORROSION STUDY OF SN-XAG-0.5 CU SOLDER ALLOYS ""; ""4. 1.1. Polarisation Study ""; ""4.1.2. Surface Characterisation Studies ""; ""4.2. ELECTROCHEMICAL CORROSION STUDY OF SN-8.5ZN-XAG-0.1AL-0.05GA SOLDER ALLOYS ""; ""4.2.1. Polarization Study ""; ""4.2.2. Surface Characterisation Studies""; ""4.3. ELECTROCHEMICAL CORROSION STUDY OF SN-8.5ZN-X AL-0.5 GA SOLDER ALLOYS "" ""4.3.1. Polarisation Study""""4.3.2. Surface Characterisation Studies: ""; ""CONCLUSION""; ""REFERENCES ""; ""PROPERTIES AND APPLICATIONS OF NICKEL COATINGS SYNTHESIZED BY PULSE ELECTRODEPOSITION""; ""ABSTRACT""; ""INTRODUCTION ""; ""5.1. THE SYNTHESIS OF NICKEL COATING WITH HIGH DENSITY NT ""; ""5.1.1. The Synthesis of Nickel Coatings with High Density NT ""; ""5.1.2. The Corrosion Property of Nickel Coating with High Density NT ""; ""5.1.3. The Semiconducting Behavior of Passive Film of NT Nickel ""; ""5.2. INHIBITION OF HYDROGEN BLISTER ON CU�SN ALLOY COATINGS "" ""5.2.1. Influence of Current Density on Hydrogen Permeation "" |
Record Nr. | UNINA-9910452168203321 |
New York, : Nova Science Publishers, c2012 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Electrodeposition [[electronic resource] ] : properties, processes, and applications / / Udit Surya Mohanty, editor |
Pubbl/distr/stampa | New York, : Nova Science Publishers, c2012 |
Descrizione fisica | 1 online resource (375 p.) |
Disciplina | 671.732 |
Altri autori (Persone) | MohantyUdit Surya |
Collana | Electrical Engineering Developments |
Soggetto topico |
Alloy plating
Electroplating |
ISBN | 1-61470-845-2 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
""ELECTRODEPOSITION ""; ""ELECTRODEPOSITION ""; ""CONTENTS ""; ""PREFACE ""; ""A REVIEW ON THE ELECTRODEPOSITION OF NICKEL: SYNTHESIS, MAGNETIC, THERMODYNAMIC PROPERTIES AND ITS POTENTIAL APPLICATIONS ""; ""ABSTRACT ""; ""INTRODUCTION ""; ""1.1. CRYSTAL STRUCTURES OF NICKEL ""; ""1.2. SYNTHESIS ""; ""1.2.1. FCC Nickel ""; ""1.2.2. HCP Nickel""; ""1.3. MAGNETIC AND THERMODYNAMIC PROPERTIES ""; ""1.4. APPLICATIONS ""; ""CONCLUSION ""; ""REFERENCES""; ""DEPOSITION AND PROPERTIES OF ELECTROCHEMICAL COMPOSITE COATINGS ""; ""ABSTRACT ""; ""INTRODUCTION ""
""2.1. DIFFERENT TYPES OF ELECTROCHEMICAL COMPOSITE COATINGS (ECC) """"2.1.1. Nickel-Based ECC ""; ""2.1.2. Chromium-Based ECC ""; ""2.1.3. Copper-Based ECC ""; ""2.1.4. Iron-Based ECC""; ""2.1.5. Zinc-Based ECC ""; ""2.1.6. ECC Based on Noble Metals ""; ""CONCLUSION ""; ""REFERENCES ""; ""ELECTRODEPOSITION OF AU-SN ALLOYS ""; ""ABSTRACT""; ""INTRODUCTION ""; ""3.1. ELECTRODEPOSITION OF AU-SN ALLOYS FROM A SINGLE SOLUTION""; ""3.1.1. Solution Preparation ""; ""3.2. SOLUTION STABILITY ""; ""3.2.1. Solution Precipitation and Turbidity Measurements "" ""3.2.2. Characterization of Precipitates """"3.2.3. UV/Vis Spectroscopy and X-Ray Photoelectron Spectroscopy Studies ""; ""3.3. MICROSTRUCTURE OF ELECTRODEPOSITED FILMS""; ""3.3.1. Microstructure of Eutectic Deposits and Reflowed Solder ""; ""3.4. RECOVERY OF AU FROM THE WASTE SOLUTION ""; ""3.5. SEQUENTIAL ELECTRODEPOSITION FROM TWO SEPARATE SOLUTIONS ""; ""3.5.1. Solution Preparation and Electrodeposition of Pure Au Films ""; ""3.5.2. Solution Preparation and Electrodeposition of Pure Sn Films ""; ""3.5.3. Microstructure of Sequentially Deposited Eutectic Alloys and Reflowed Solder"" ""CONCLUSION """"ACKNOWLEDGMENTS ""; ""REFERENCES ""; ""ELECTROCHEMICAL CORROSION BEHAVIOUR OF LEAD � FREE SOLDER ALLOYS IN 3.5 % NACL SOLUTION""; ""ABSTRACT ""; ""INTRODUCTION ""; ""4.1. ELECTROCHEMICAL CORROSION STUDY OF SN-XAG-0.5 CU SOLDER ALLOYS ""; ""4. 1.1. Polarisation Study ""; ""4.1.2. Surface Characterisation Studies ""; ""4.2. ELECTROCHEMICAL CORROSION STUDY OF SN-8.5ZN-XAG-0.1AL-0.05GA SOLDER ALLOYS ""; ""4.2.1. Polarization Study ""; ""4.2.2. Surface Characterisation Studies""; ""4.3. ELECTROCHEMICAL CORROSION STUDY OF SN-8.5ZN-X AL-0.5 GA SOLDER ALLOYS "" ""4.3.1. Polarisation Study""""4.3.2. Surface Characterisation Studies: ""; ""CONCLUSION""; ""REFERENCES ""; ""PROPERTIES AND APPLICATIONS OF NICKEL COATINGS SYNTHESIZED BY PULSE ELECTRODEPOSITION""; ""ABSTRACT""; ""INTRODUCTION ""; ""5.1. THE SYNTHESIS OF NICKEL COATING WITH HIGH DENSITY NT ""; ""5.1.1. The Synthesis of Nickel Coatings with High Density NT ""; ""5.1.2. The Corrosion Property of Nickel Coating with High Density NT ""; ""5.1.3. The Semiconducting Behavior of Passive Film of NT Nickel ""; ""5.2. INHIBITION OF HYDROGEN BLISTER ON CU�SN ALLOY COATINGS "" ""5.2.1. Influence of Current Density on Hydrogen Permeation "" |
Record Nr. | UNINA-9910779507503321 |
New York, : Nova Science Publishers, c2012 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Electrodeposition [[electronic resource] ] : properties, processes, and applications / / Udit Surya Mohanty, editor |
Edizione | [1st ed.] |
Pubbl/distr/stampa | New York, : Nova Science Publishers, c2012 |
Descrizione fisica | 1 online resource (375 p.) |
Disciplina | 671.732 |
Altri autori (Persone) | MohantyUdit Surya |
Collana | Electrical Engineering Developments |
Soggetto topico |
Alloy plating
Electroplating |
ISBN | 1-61470-845-2 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
""ELECTRODEPOSITION ""; ""ELECTRODEPOSITION ""; ""CONTENTS ""; ""PREFACE ""; ""A REVIEW ON THE ELECTRODEPOSITION OF NICKEL: SYNTHESIS, MAGNETIC, THERMODYNAMIC PROPERTIES AND ITS POTENTIAL APPLICATIONS ""; ""ABSTRACT ""; ""INTRODUCTION ""; ""1.1. CRYSTAL STRUCTURES OF NICKEL ""; ""1.2. SYNTHESIS ""; ""1.2.1. FCC Nickel ""; ""1.2.2. HCP Nickel""; ""1.3. MAGNETIC AND THERMODYNAMIC PROPERTIES ""; ""1.4. APPLICATIONS ""; ""CONCLUSION ""; ""REFERENCES""; ""DEPOSITION AND PROPERTIES OF ELECTROCHEMICAL COMPOSITE COATINGS ""; ""ABSTRACT ""; ""INTRODUCTION ""
""2.1. DIFFERENT TYPES OF ELECTROCHEMICAL COMPOSITE COATINGS (ECC) """"2.1.1. Nickel-Based ECC ""; ""2.1.2. Chromium-Based ECC ""; ""2.1.3. Copper-Based ECC ""; ""2.1.4. Iron-Based ECC""; ""2.1.5. Zinc-Based ECC ""; ""2.1.6. ECC Based on Noble Metals ""; ""CONCLUSION ""; ""REFERENCES ""; ""ELECTRODEPOSITION OF AU-SN ALLOYS ""; ""ABSTRACT""; ""INTRODUCTION ""; ""3.1. ELECTRODEPOSITION OF AU-SN ALLOYS FROM A SINGLE SOLUTION""; ""3.1.1. Solution Preparation ""; ""3.2. SOLUTION STABILITY ""; ""3.2.1. Solution Precipitation and Turbidity Measurements "" ""3.2.2. Characterization of Precipitates """"3.2.3. UV/Vis Spectroscopy and X-Ray Photoelectron Spectroscopy Studies ""; ""3.3. MICROSTRUCTURE OF ELECTRODEPOSITED FILMS""; ""3.3.1. Microstructure of Eutectic Deposits and Reflowed Solder ""; ""3.4. RECOVERY OF AU FROM THE WASTE SOLUTION ""; ""3.5. SEQUENTIAL ELECTRODEPOSITION FROM TWO SEPARATE SOLUTIONS ""; ""3.5.1. Solution Preparation and Electrodeposition of Pure Au Films ""; ""3.5.2. Solution Preparation and Electrodeposition of Pure Sn Films ""; ""3.5.3. Microstructure of Sequentially Deposited Eutectic Alloys and Reflowed Solder"" ""CONCLUSION """"ACKNOWLEDGMENTS ""; ""REFERENCES ""; ""ELECTROCHEMICAL CORROSION BEHAVIOUR OF LEAD � FREE SOLDER ALLOYS IN 3.5 % NACL SOLUTION""; ""ABSTRACT ""; ""INTRODUCTION ""; ""4.1. ELECTROCHEMICAL CORROSION STUDY OF SN-XAG-0.5 CU SOLDER ALLOYS ""; ""4. 1.1. Polarisation Study ""; ""4.1.2. Surface Characterisation Studies ""; ""4.2. ELECTROCHEMICAL CORROSION STUDY OF SN-8.5ZN-XAG-0.1AL-0.05GA SOLDER ALLOYS ""; ""4.2.1. Polarization Study ""; ""4.2.2. Surface Characterisation Studies""; ""4.3. ELECTROCHEMICAL CORROSION STUDY OF SN-8.5ZN-X AL-0.5 GA SOLDER ALLOYS "" ""4.3.1. Polarisation Study""""4.3.2. Surface Characterisation Studies: ""; ""CONCLUSION""; ""REFERENCES ""; ""PROPERTIES AND APPLICATIONS OF NICKEL COATINGS SYNTHESIZED BY PULSE ELECTRODEPOSITION""; ""ABSTRACT""; ""INTRODUCTION ""; ""5.1. THE SYNTHESIS OF NICKEL COATING WITH HIGH DENSITY NT ""; ""5.1.1. The Synthesis of Nickel Coatings with High Density NT ""; ""5.1.2. The Corrosion Property of Nickel Coating with High Density NT ""; ""5.1.3. The Semiconducting Behavior of Passive Film of NT Nickel ""; ""5.2. INHIBITION OF HYDROGEN BLISTER ON CU�SN ALLOY COATINGS "" ""5.2.1. Influence of Current Density on Hydrogen Permeation "" |
Record Nr. | UNINA-9910820921703321 |
New York, : Nova Science Publishers, c2012 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
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Electrodeposition of Composite Materials / / edited by Adel M. A. Mohamed and Teresa D. Golden |
Pubbl/distr/stampa | Rijeka : , : InTech, , 2016 |
Descrizione fisica | 1 online resource (284 pages) : illustrations |
Disciplina | 671.732 |
Soggetto topico |
Coating processes
Composite materials Electroplating |
ISBN |
953-51-4205-4
953-51-2270-3 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910136972903321 |
Rijeka : , : InTech, , 2016 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
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Electroplating / / edited by Darwin Sebayang and Sulaiman Bin Haji Hasan |
Pubbl/distr/stampa | Rijeka : , : IntechOpen, , 2012 |
Descrizione fisica | 1 online resource (xi, 178 pages) : illustrations |
Disciplina | 671.732 |
Soggetto topico | Electroplating |
ISBN | 953-51-4991-1 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910317602703321 |
Rijeka : , : IntechOpen, , 2012 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
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