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13th EAI International Conference on Body Area Networks / / edited by Chika Sugimoto, Hamed Farhadi, Matti Hämäläinen
| 13th EAI International Conference on Body Area Networks / / edited by Chika Sugimoto, Hamed Farhadi, Matti Hämäläinen |
| Edizione | [1st ed. 2020.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2020 |
| Descrizione fisica | 1 online resource (XI, 485 p. 247 illus., 202 illus. in color.) |
| Disciplina |
004.678
004.68 |
| Collana | EAI/Springer Innovations in Communication and Computing |
| Soggetto topico |
Electrical engineering
Application software Health informatics Electronics Microelectronics Signal processing Image processing Speech processing systems Communications Engineering, Networks Information Systems Applications (incl. Internet) Health Informatics Electronics and Microelectronics, Instrumentation Signal, Image and Speech Processing |
| ISBN | 3-030-29897-3 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction -- Ultra Wide Band for Body Area Networks -- Smart Body Area Networks -- Security & Safety -- Communications and Networking -- Systems and Applications -- Medical Applications -- Case studies & Wearable devices -- Antenna/Propagation and WiBEC project -- Conclusion. |
| Record Nr. | UNINA-9910383826403321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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3D Microelectronic Packaging : From Fundamentals to Applications / / edited by Yan Li, Deepak Goyal
| 3D Microelectronic Packaging : From Fundamentals to Applications / / edited by Yan Li, Deepak Goyal |
| Edizione | [1st ed. 2017.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 |
| Descrizione fisica | 1 online resource (IX, 463 p. 331 illus., 253 illus. in color.) |
| Disciplina | 621.381 |
| Collana | Springer Series in Advanced Microelectronics |
| Soggetto topico |
Electronics
Microelectronics Optical materials Electronic materials Electronic circuits Biotechnology Nanotechnology Metals Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Electronic Circuits and Devices Microengineering Nanotechnology and Microengineering Metallic Materials |
| ISBN | 3-319-44586-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction to 3D Microelectronic Packaging.-3D packaging architecture and assembly process design.-Materials and Processing of TSV.-Microstructural and Reliability Issues of TSV -- Fundamentals and failures in Die preparation for 3D packaging.-Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging -- Fundamental of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages -- Fundamentals of solder alloys in 3D packaging.-Fundamentals of Electromigration in interconnects of 3D packages.-Fundamentals of heat dissipation in 3D IC packaging -- Fundamentals of advanced materials and processes in organic substrate technology -- Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization -- Processing and Reliability of Solder Interconnections in Stacked Packaging -- Interconnect Quality and Reliability of 3D Packaging -- Fault isolation and failure analysis of 3D packaging. . |
| Record Nr. | UNINA-9910163046303321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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3D TCAD Simulation for CMOS Nanoeletronic Devices [[electronic resource] /] / by Yung-Chun Wu, Yi-Ruei Jhan
| 3D TCAD Simulation for CMOS Nanoeletronic Devices [[electronic resource] /] / by Yung-Chun Wu, Yi-Ruei Jhan |
| Autore | Wu Yung-Chun |
| Edizione | [1st ed. 2018.] |
| Pubbl/distr/stampa | Singapore : , : Springer Singapore : , : Imprint : Springer, , 2018 |
| Descrizione fisica | 1 online resource (XIII, 330 p. 243 illus., 240 illus. in color.) |
| Disciplina | 621.381 |
| Soggetto topico |
Electronics
Microelectronics Semiconductors Nanotechnology Industrial engineering Production engineering Electronics and Microelectronics, Instrumentation Nanotechnology and Microengineering Industrial and Production Engineering |
| ISBN | 981-10-3066-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction of Synopsys Sentaurus TCAD 2014 version software environment operation interface and tools -- Simulation analysis of 2D MOSFET -- Simulation analysis of 3D FinFET with LG = 15 nm -- Simulation analysis of Inverter and SRAM of 3D FinFET with LG = 15 nm -- Simulation analysis of GAA NWFET -- Simulation analysis of Junctionless FET with LG = 10 nm -- Simulation analysis of Tunnel FET -- Simulation analysis of Si and Ge 3D FinFET with LG = 3 nm. |
| Record Nr. | UNINA-9910299562903321 |
Wu Yung-Chun
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| Singapore : , : Springer Singapore : , : Imprint : Springer, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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3D Video Coding for Embedded Devices [[electronic resource] ] : Energy Efficient Algorithms and Architectures / / by Bruno Zatt, Muhammad Shafique, Sergio Bampi, Jörg Henkel
| 3D Video Coding for Embedded Devices [[electronic resource] ] : Energy Efficient Algorithms and Architectures / / by Bruno Zatt, Muhammad Shafique, Sergio Bampi, Jörg Henkel |
| Autore | Zatt Bruno |
| Edizione | [1st ed. 2013.] |
| Pubbl/distr/stampa | New York, NY : , : Springer New York : , : Imprint : Springer, , 2013 |
| Descrizione fisica | 1 online resource (219 p.) |
| Disciplina |
004.1
006.22 620 621.381 |
| Soggetto topico |
Electronic circuits
Electronics Microelectronics Microprocessors Circuits and Systems Electronics and Microelectronics, Instrumentation Processor Architectures |
| ISBN | 1-4614-6759-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction -- Background and Related Work -- Multiview Video Coding Analysis for Energy and Quality -- Energy-Effiecient Algorithms for Multiview Video Coding -- Energy-Efficient Architectures for Multiview Video Coding -- Results and Comparison -- Conclusion and future Works. |
| Record Nr. | UNINA-9910739446903321 |
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Zatt Bruno
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| New York, NY : , : Springer New York : , : Imprint : Springer, , 2013 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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3rd EAI International Conference on IoT in Urban Space / / edited by Rui José, Kristof Van Laerhoven, Helena Rodrigues
| 3rd EAI International Conference on IoT in Urban Space / / edited by Rui José, Kristof Van Laerhoven, Helena Rodrigues |
| Edizione | [1st ed. 2020.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2020 |
| Descrizione fisica | 1 online resource (XII, 179 p. 54 illus., 49 illus. in color.) |
| Disciplina |
621.382
307.76 |
| Collana | EAI/Springer Innovations in Communication and Computing |
| Soggetto topico |
Electrical engineering
Electronics Microelectronics User interfaces (Computer systems) Signal processing Image processing Speech processing systems Management Industrial management Urban planning City planning Communications Engineering, Networks Electronics and Microelectronics, Instrumentation User Interfaces and Human Computer Interaction Signal, Image and Speech Processing Innovation/Technology Management Urbanism |
| ISBN | 3-030-28925-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction -- CityFlow: Supporting Spatial-Temporal Edge Computing for Urban Machine Learning Applications -- Ethical and Social Aspects of Connected and Autonomous Vehicles: A Focus on Stakeholders’ Responsibility and Customers’ Willingness to Share Data -- Evaluating Street Networks for Predictive Policing -- SESSION 2: Design challenges in Urban IoT -- Challenges in Using IoT in Public Spaces Exploring new Digital Affordances of city life -- A Comprehensive View on Quality Characteristics of the IoT Solutions -- Connected Vehicles in the Shark Tank: Rethinking the Challenge for Cybersecurity to Keep Pace with Digital Innovation -- SESSION 3: Methods and technologies for IoT -- AudioIO: Indoor Outdoor Detection on smartphones via Active Sound Probing -- Day-ahead Load Forecasting based on Conditional Linear Predictions with Smoothed Daily Profile -- GANonymizer: Image Anonymization Method Integrating Object Detection and Generative Adversarial Network -- Performance Evaluation of Source Routing Minimum Cost Forwarding Protocol over 6TiSCH Applied to the OpenMote-B platform -- SESSION 4: Urban mobility and Connected Vehicles -- Analysis of time of use and intermodality of ride-hailing services in Singapore using mobile web traffic data -- An Exploratory Study of Relations between Site Features and I2V Link Performance -- Urban Landscape Revolution: The Potential of Connected Vehicles and Their Impact on the Mobility Ecosystem -- Review of Technological and Economic Considerations on Future Vehicle Design: Autonomous, Connected, Electric, and Shared Vehicles -- Conclusion. |
| Record Nr. | UNINA-9910366590303321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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4th International Conference on Nanotechnologies and Biomedical Engineering : Proceedings of ICNBME-2019, September 18-21, 2019, Chisinau, Moldova / / edited by Ion Tiginyanu, Victor Sontea, Serghei Railean
| 4th International Conference on Nanotechnologies and Biomedical Engineering : Proceedings of ICNBME-2019, September 18-21, 2019, Chisinau, Moldova / / edited by Ion Tiginyanu, Victor Sontea, Serghei Railean |
| Edizione | [1st ed. 2020.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2020 |
| Descrizione fisica | 1 online resource (XLV, 835 p. 630 illus., 470 illus. in color.) |
| Disciplina |
610.28
620.5 |
| Collana | IFMBE Proceedings |
| Soggetto topico |
Biomedical engineering
Nanotechnology Medical physics Radiation Electronics Microelectronics Biomedical Engineering and Bioengineering Medical and Radiation Physics Electronics and Microelectronics, Instrumentation |
| ISBN | 3-030-31866-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | 3D-Printed Sensor Array of Semiconducting Oxides -- Broad-band Spectroscopy of Nanoconfined Water Molecules -- Superconductivity and Weak Ferromagnetism in Inclination Bicrystal Interfaces of Bismuth and Antimony -- Unusual Size Dependence of Acoustic Properties in Layered Nanostructures -- Features of Radiative Recombination of Iron-doped Gallium Antimonide -- Change in Microstructure and Magnetic Properties of Transition Metal Nitride Thin Films by Substrate Temperature -- Structural and Photoluminescence Properties of Nanoparticles Formed by Laser Ablation of Porous Silicon in Ethanol and Liquid Nitrogen -- Quantum Interferences with Equidistant Three-level Quantum Wells -- Surface Modification of PVDF Copolymer Nanofiber by Chitosan/Ag(NP)/Nanosilica Composite -- Silanized Citric Acid Capped Magnetic Nanoparticles and Influence on Chlorophyll -- Hydrogels Based on Collagen and Dextran for Bioartificial Tissues. |
| Record Nr. | UNINA-9910366612603321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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5G Enabled Secure Wireless Networks / / edited by Dushantha Nalin K. Jayakody, Kathiravan Srinivasan, Vishal Sharma
| 5G Enabled Secure Wireless Networks / / edited by Dushantha Nalin K. Jayakody, Kathiravan Srinivasan, Vishal Sharma |
| Edizione | [1st ed. 2019.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2019 |
| Descrizione fisica | 1 online resource (XVIII, 200 p. 64 illus., 62 illus. in color.) |
| Disciplina | 621.382 |
| Soggetto topico |
Electrical engineering
Power electronics Data protection Electronics Microelectronics Application software Energy efficiency Communications Engineering, Networks Power Electronics, Electrical Machines and Networks Security Electronics and Microelectronics, Instrumentation Information Systems Applications (incl. Internet) Energy Efficiency |
| ISBN | 3-030-03508-5 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Chapter1: 5G Enabled Wireless Networks: A Security, Data and Privacy Perspective -- Chapter2: 5G Applications and Architectures -- Chapter3:A Survey on the Security and the Evolution of Osmotic and Catalytic Computing for 5G Networks -- Chapter4: Physical Layer Security in 5G Hybrid Heterogeneous Networks -- Chapter5: Physical Layer Security of Energy Harvesting M2M Communication System -- Chapter6: Beam-Domain Full-Duplex Massive MIMO Transmission in the Cellular System. |
| Record Nr. | UNINA-9910337632503321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2019 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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8051 Microcontrollers : Fundamental Concepts, Hardware, Software and Applications in Electronics / / by Salvador Pinillos Gimenez
| 8051 Microcontrollers : Fundamental Concepts, Hardware, Software and Applications in Electronics / / by Salvador Pinillos Gimenez |
| Autore | Gimenez Salvador Pinillos |
| Edizione | [1st ed. 2019.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2019 |
| Descrizione fisica | 1 online resource (XIII, 322 p. 172 illus., 47 illus. in color.) |
| Disciplina | 004.165 |
| Soggetto topico |
Electronic circuits
Electronics Microelectronics Microprocessors Circuits and Systems Electronics and Microelectronics, Instrumentation Processor Architectures |
| ISBN | 3-319-76439-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Fundamental Concepts of Computer Systems -- 8051 Core Microcontrollers -- 8051 - Core Microcontroller Instruction Set -- Flowchart and Assembly Programming -- Subroutine and Structuring of the Assembly Programming Language -- Input/output Ports of 8051 - Core Microcontrollers -- Basic 8051 - Core Microcontroller Interruptions -- Timers/Counters of the 8051 Core Microcontroller -- The Serial Communication Interface of the 8051 - Core Microcontroller. |
| Record Nr. | UNINA-9910337654803321 |
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Gimenez Salvador Pinillos
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| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2019 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Accurate and Robust Spectral Testing with Relaxed Instrumentation Requirements / / by Yuming Zhuang, Degang Chen
| Accurate and Robust Spectral Testing with Relaxed Instrumentation Requirements / / by Yuming Zhuang, Degang Chen |
| Autore | Zhuang Yuming |
| Edizione | [1st ed. 2018.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2018 |
| Descrizione fisica | 1 online resource (176 pages) |
| Disciplina | 621.381 |
| Soggetto topico |
Electronic circuits
Electronics Microelectronics Circuits and Systems Electronic Circuits and Devices Electronics and Microelectronics, Instrumentation |
| ISBN | 3-319-77718-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Chapter 1. Introduction -- Chapter 2.Algorithms for accurate spectral analysis in the presence of arbitrary non-coherency and large distortion -- Chapter 3.Accurate spectral testing with arbitrary non- coherency in sampling and simultaneous drifts in amplitude and frequency -- Chapter 4.High-purity sine wave generation using nonlinear DAC with pre-distortion based on low-cost accurate DAC-ADC co-testing -- Chapter 5.Low cost ultra-pure sine wave generation with self-calibration -- Chapter 6.Accurate spectral testing with non-coherent sampling for multi-tone test -- Chapter 7.Accurate spectral testing with impure test stimulus for multi-tone test -- Chapter 8.Multi-tone sine wave generation achieving the theoretical minimum of peak-to-average power ratio -- Chapter 9.Accurate linearity testing using low purity stimulus robust against flicker noise -- Chapter 10.Summary. |
| Record Nr. | UNINA-9910299940003321 |
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Zhuang Yuming
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| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Active Cancellation of Probing in Linear Dipole Phased Array [[electronic resource] /] / by Hema Singh, N. Bala Ankaiah, Rakesh Mohan Jha
| Active Cancellation of Probing in Linear Dipole Phased Array [[electronic resource] /] / by Hema Singh, N. Bala Ankaiah, Rakesh Mohan Jha |
| Autore | Singh Hema |
| Edizione | [1st ed. 2015.] |
| Pubbl/distr/stampa | Singapore : , : Springer Singapore : , : Imprint : Springer, , 2015 |
| Descrizione fisica | 1 online resource (73 p.) |
| Disciplina | 621.384135 |
| Collana | SpringerBriefs in Computational Electromagnetics |
| Soggetto topico |
Microwaves
Optical engineering Mathematical physics Electronics Microelectronics Microwaves, RF and Optical Engineering Theoretical, Mathematical and Computational Physics Electronics and Microelectronics, Instrumentation |
| ISBN | 981-287-829-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction -- Formulation for Adapted Pattern in Dipole Array -- Simulation Results: Without Mutual Coupling -- Mutual Coupling Effect in Array Processing -- Simulation Results: With Mutual Coupling -- Edge Effect in Array Processing -- Conclusion. |
| Record Nr. | UNINA-9910299673403321 |
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Singh Hema
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| Singapore : , : Springer Singapore : , : Imprint : Springer, , 2015 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Soggetto topico
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Electronics and Microelectronics, Instrumentation
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