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ISTFA 2010 [[electronic resource] ] : conference proceedings from the 36th International Symposium for Testing and Failure Analysis, November 14-18, 2010, InterContinental Hotel Dallas, Dallas, Texas, USA / / sponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2010, ASM International
| ISTFA 2010 [[electronic resource] ] : conference proceedings from the 36th International Symposium for Testing and Failure Analysis, November 14-18, 2010, InterContinental Hotel Dallas, Dallas, Texas, USA / / sponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2010, ASM International |
| Pubbl/distr/stampa | Materials Park, Ohio, : ASM International, 2010 |
| Descrizione fisica | 1 online resource (486 p.) |
| Soggetto topico |
Electronics - Materials - Testing
Electronic apparatus and appliances - Testing |
| ISBN |
1-68015-510-5
1-61503-727-6 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
""Contents""; ""Combining High-Resolution Pulsed TIVA and Nanoprobing Techniques to Identify Drive Strength Issues in Mixed-signal Circuits""; ""Laser Voltage Imaging: A new Perspective of Laser Voltage Probing""; ""Two-Photon X-Variation Mapping Based on a Diode-Pumped Femtosecond Laser""; ""Quantitative, nanoscale free-carrier concentration mapping using terahertz near-field nanoscopy""; ""Laser-Thermal Imaging""; ""Mobile Diffractive Solid Immersion Lens Design for Backside Laser Based Fault Localization""; ""Volume Electrical Failure Analysis for Product-Specific Yield Enhancement""
""Case Study in Fault Isolation of a Metal Short for Yield Enhancement""""Failure Analysis Methodology on Systematic defect in ADC_PLL Ring Pattern due to Plasma De-chuck Process""; ""Fault Isolation of Sub-surface Leakage Defects Using Electron Beam Induced Current Characterization in Next-Generation Flash Memory Technology Development""; ""A case study: Observation of counter doping of gate poly and its validation in high density 90nm CMOS SRAM Bitcell""; ""Magnetic Microscopy for 3D structures: use of the Simulation Approach for the precise localization of deep buried weak currents"" ""Advanced Sample Preparation Method for Lead Free Bump IMC and Solder Grain Image Enhancement""""Extending Acoustic Microscopy for Comprehensive Failure Analysis Applications""; ""Process induced defects in the silicon substrate: Approaches for successful Failure Analysis.""; ""X-sectional Scanning Capacitance Microscopy (SCM) Applications on Deep Submicron Devices at Specific Sites""; ""High Volume and Fast Turnaround Automated Inline TEM Sample Preparation for Manufacturing Process Monitoring""; ""Backscattered Electron Imaging for Embedded Subtle Defects in 32nm Processes"" ""Semi-Automated Full Wafer In-line SRAM Failure Analysis By Dual Beam Focused Ion Beam (FIB)""""Simulation Studies of Fluorine-induced Corrosion and Defects on Microchip Al Bondpads in Wafer Fabrication""; ""A Novel Wet Etch In-situ Decapsulation of Devices on Boards""; ""Low Temperature Plasma Decapsulation of Copper-wire-bonded and Exposed Copper Metallization Devices""; ""Decapsulation of Copper Bonded Plastic Encapsulated Integrated Circuits Utilizing Laser Ablation and Mixed Acid Chemistry"" ""Photoluminescence and EBIC for Process Control and Failure Analysis in Si-Based Photovoltaics""""Combined electron beam induced current imaging (EBIC) and focused ion beam (FIB) techniques for thin film solar cell characterization""; ""Activation Energy Analysis of Dark and Laser Illuminated I-V Characteristics of Thin-film Poly Silicon Solar Cells""; ""Characterization and failure analysis of 3D integrated semiconductor devices-novel tools for fault isolation, target preparation and high resolution material analysis""; ""A Novel Junction Profiling Methodology"" ""Improvement of optical resolution through chip backside using FIB trenches"" |
| Record Nr. | UNINA-9911004850403321 |
| Materials Park, Ohio, : ASM International, 2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
ISTFA 2011 [[electronic resource] ] : conference proceedings of the 37th International Symposium for Testing and Failure Analysis : November 13-17, 2011, San Jose Convention Center, San Jose, California, USA / / sponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2009, ASM International
| ISTFA 2011 [[electronic resource] ] : conference proceedings of the 37th International Symposium for Testing and Failure Analysis : November 13-17, 2011, San Jose Convention Center, San Jose, California, USA / / sponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2009, ASM International |
| Pubbl/distr/stampa | Materials Park, Ohio, : ASM International, 2011 |
| Descrizione fisica | 1 online resource (478 p.) |
| Soggetto topico |
Electronics - Materials - Testing
Electronic apparatus and appliances - Testing |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-68015-511-3
1-61503-850-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
""Title Page""; ""Copyright""; ""Contents""; ""IPFA 2011 Best Paper""; ""Electrical Failure and Damage Analysis of Multi-layer Metal Films on Flexible Substrate during Cyclic Bending Deformation""; ""Session 1: Emerging FA Techniques and Concepts""; ""A Position-Sensitive, Single-Photon Detector with Enhanced NIR Response""; ""Advanced Scan Chain Failure Analysis Using Laser Modulation Mapping and Continuous Wave Probing""; ""Thermal Frequency Imaging: A new application of Laser Voltage Imaging applied on 40nm technology""
""Local Lattice Strain Measurement using Geometric Phase Analysis of Dark Field Images from Scanning Transmission Electron Microscopy""""Correcting for spherical aberrations in solid immersion microscopy using a deformable mirror""; ""Session 2: Circuit Edit""; ""The Challenges of Backside Focused Ion Beam (FIB) Editing in the Presence of Deep Trench Decoupling Capacitors""; ""State of the Art Substrate Manipulation As a Tool for Enhancing Product Performance""; ""Neon Ion Microscope Nanomachining Considerations"" ""Instant Solid Immersion Lens creation in silicon with a Focused Ion Beam- comparing refractive and diffractive methods""""Circuit Edit and Optical Probe Development and Validation for Next Generation Process Nodes""; ""Session 3: Packaging and Assembly Level FA I""; ""3DIC Fault Isolation Using the OBIRCH Approach""; ""Improving Wire Sweep Performance by Measuring Degree of Cure of Epoxy Mold Compounds""; ""Use of Lock-In Thermography for Non-Destructive 3D Defect Localization on System in Package and Stacked-Die Technology"" ""Quantitative Phase Shift Analysis for 3D Defect Localization Using Lock-in Thermography""""Failure Analysis of Flip Chip C4 Package Using Focused Ion Beam Milling Technique""; ""Session 4: Test and Diagnostics""; ""Layout-aware Diagnosis Leads to Efficient and Effective Physical Failure Analysis""; ""Device Selection for Failure Analysis of Chain Fails Using Diagnosis Driven Yield Analysis""; ""Debugging an Invisible Flaky Scan Chain Defect""; ""Diagnose Compound Hold Time Faults Caused by Spot Delay Defects at Clock Tree""; ""Session 5: Defect Characterization and Metrology"" ""A Comprehensive Analysis Methodology for Gate Oxide Integrity Failure Using Combined FA Techniques""""Al Bondpads, Halogens, and an ESCA-based Search for the Invisible Cause of Poor Throughput at Wafer Probe""; ""Whisker Formation in Copper Electroplating""; ""Comprehensive nano-structural approach of SSRM nanocontact on siliconthrough TEM-STEM study""; ""Highly Automated Transmission Electron Microscopy Tomography for Defect Understanding""; ""Transmission Electron Microscopy Characterization of FinFET � Understanding the 3D Structure by 2D Imaging Technique"" ""Session 6: Photon Based Fault Isolation Techniques"" |
| Record Nr. | UNINA-9910461119603321 |
| Materials Park, Ohio, : ASM International, 2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
ISTFA 2011 [[electronic resource] ] : conference proceedings of the 37th International Symposium for Testing and Failure Analysis : November 13-17, 2011, San Jose Convention Center, San Jose, California, USA / / sponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2009, ASM International
| ISTFA 2011 [[electronic resource] ] : conference proceedings of the 37th International Symposium for Testing and Failure Analysis : November 13-17, 2011, San Jose Convention Center, San Jose, California, USA / / sponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2009, ASM International |
| Pubbl/distr/stampa | Materials Park, Ohio, : ASM International, 2011 |
| Descrizione fisica | 1 online resource (478 p.) |
| Soggetto topico |
Electronics - Materials - Testing
Electronic apparatus and appliances - Testing |
| ISBN |
1-68015-511-3
1-61503-850-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
""Title Page""; ""Copyright""; ""Contents""; ""IPFA 2011 Best Paper""; ""Electrical Failure and Damage Analysis of Multi-layer Metal Films on Flexible Substrate during Cyclic Bending Deformation""; ""Session 1: Emerging FA Techniques and Concepts""; ""A Position-Sensitive, Single-Photon Detector with Enhanced NIR Response""; ""Advanced Scan Chain Failure Analysis Using Laser Modulation Mapping and Continuous Wave Probing""; ""Thermal Frequency Imaging: A new application of Laser Voltage Imaging applied on 40nm technology""
""Local Lattice Strain Measurement using Geometric Phase Analysis of Dark Field Images from Scanning Transmission Electron Microscopy""""Correcting for spherical aberrations in solid immersion microscopy using a deformable mirror""; ""Session 2: Circuit Edit""; ""The Challenges of Backside Focused Ion Beam (FIB) Editing in the Presence of Deep Trench Decoupling Capacitors""; ""State of the Art Substrate Manipulation As a Tool for Enhancing Product Performance""; ""Neon Ion Microscope Nanomachining Considerations"" ""Instant Solid Immersion Lens creation in silicon with a Focused Ion Beam- comparing refractive and diffractive methods""""Circuit Edit and Optical Probe Development and Validation for Next Generation Process Nodes""; ""Session 3: Packaging and Assembly Level FA I""; ""3DIC Fault Isolation Using the OBIRCH Approach""; ""Improving Wire Sweep Performance by Measuring Degree of Cure of Epoxy Mold Compounds""; ""Use of Lock-In Thermography for Non-Destructive 3D Defect Localization on System in Package and Stacked-Die Technology"" ""Quantitative Phase Shift Analysis for 3D Defect Localization Using Lock-in Thermography""""Failure Analysis of Flip Chip C4 Package Using Focused Ion Beam Milling Technique""; ""Session 4: Test and Diagnostics""; ""Layout-aware Diagnosis Leads to Efficient and Effective Physical Failure Analysis""; ""Device Selection for Failure Analysis of Chain Fails Using Diagnosis Driven Yield Analysis""; ""Debugging an Invisible Flaky Scan Chain Defect""; ""Diagnose Compound Hold Time Faults Caused by Spot Delay Defects at Clock Tree""; ""Session 5: Defect Characterization and Metrology"" ""A Comprehensive Analysis Methodology for Gate Oxide Integrity Failure Using Combined FA Techniques""""Al Bondpads, Halogens, and an ESCA-based Search for the Invisible Cause of Poor Throughput at Wafer Probe""; ""Whisker Formation in Copper Electroplating""; ""Comprehensive nano-structural approach of SSRM nanocontact on siliconthrough TEM-STEM study""; ""Highly Automated Transmission Electron Microscopy Tomography for Defect Understanding""; ""Transmission Electron Microscopy Characterization of FinFET � Understanding the 3D Structure by 2D Imaging Technique"" ""Session 6: Photon Based Fault Isolation Techniques"" |
| Record Nr. | UNINA-9910789968203321 |
| Materials Park, Ohio, : ASM International, 2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
ISTFA 2012 [[electronic resource] ] : conference proceedings from the 38th International Symposium for Testing and Failure Analysis : November 11-15, 2012, Phoenix Convention Center, Phoenix, Arizona, USA
| ISTFA 2012 [[electronic resource] ] : conference proceedings from the 38th International Symposium for Testing and Failure Analysis : November 11-15, 2012, Phoenix Convention Center, Phoenix, Arizona, USA |
| Pubbl/distr/stampa | Materials Park, Ohio, : ASM International, 2012 |
| Descrizione fisica | 1 online resource (642 p.) |
| Soggetto topico |
Electronics - Materials - Testing
Electronic apparatus and appliances - Testing |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-68015-512-1
1-61503-995-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
""Title Page""; ""Copyright""; ""Board of Directors""; ""Organizing Committee""; ""Symposium Committee""; ""User Groups""; ""Contents""; ""2012 IPFA Best Paper""; ""Laser Voltage Probing in Failure Analysis of Advanced Integrated Circuits on SOI""; ""Emerging Concepts and Techniques""; ""Closer to the Theoretical Limit: Spherical Corrections to Aplanatic Solid Immersion Imaging with Adaptive Optics""; ""Fault Isolation of Open Defects Using Space Domain Reflectometry""; ""Localization of Dead Open in a Solder Bump by Space Domain Reflectometry""
""Advanced Fault Isolation Technique Using Electro-Optical Terahertz Pulse Reflectometry (EOTPR) for 2D and 2.5D Flip-Chip Package""""Novel Plasma FIB/SEM for High Speed Failure Analysis and Real Time Imaging of Large Volume Removal""; ""FemtoFarad/TeraOhm Endpoint Detection for Microsurgery of Integrated Circuit Devices""; ""Fault Isolation and Failure Analysis of TSV""; ""Cross Section Analysis of Cu Filled TSVs Based On High Throughput Plasma- FIB Milling""; ""Microstructural Considerations on the Reliability of 3D Packaging"" ""High-Frequency TSV Failure Detection Method with Z Parameter""""Enhanced Failure Analysis on Open TSV Interconnects""; ""Nanoprobing Techniques""; ""A New Technique for Non-Invasive Short-Localisation in Thin Dielectric Layers by Electron Beam Absorbed Current (EBAC) Imaging""; ""Precise Localization of 28 nm via Chain Resistive Defect Using EBAC and Nanoprobing""; ""In FAB 300 mm Wafer Level Atomic Force Probe Characterization""; ""Nanoelectronic Analog Circuit PFA � The Return of Circuit Level Probing""; ""Fault Isolation and Failure Analysis of 3D Packages"" ""Enhanced Comparison of Lock-in Thermography and Magnetic Microscopy for 3D Defect Localization of System in Packages""""Non Destructive Failure Analysis of 3D Electronic Packages Using Both Electro Optical Terahertz Pulse Reflectometry and 3D X-ray Computed Tomography""; ""Failure Analysis Using Scanning Acoustic Microscopy for Diagnostics of Electronic Devices and 3D System Integration Technologies""; ""Nanoprobing Applications""; ""Analysis of an Anomalous Transistor Exhibiting Dual-Vt Characteristics and Its Cause in a 90 nm Node CMOS Technology"" ""Study of Static Noise Margin, Cell Stability and Influence of Electron Beam on Sub-30 nm SRAM Using SEM-Based Nanoprobing with 8 Nanoprobes""""Leaky Device Channel Anomaly Identification and Case Study by Nano-Probing Technique, Curve Fitting, and Model Analysis""; ""Photon Based Techniques: An Understanding""; ""Photon Emission Spectra of FETs as Obtained by InGaAs Detector""; ""Near-Infrared Photon Emission Spectroscopy Trends in Scaled SOI Technologies"" ""Characterization and TCAD Simulation of 90 nm Technology PMOS Transistor Under Continuous Photoelectric Laser Stimulation for Failure Analysis Improvement"" |
| Record Nr. | UNINA-9910452751103321 |
| Materials Park, Ohio, : ASM International, 2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
ISTFA 2012 [[electronic resource] ] : conference proceedings from the 38th International Symposium for Testing and Failure Analysis : November 11-15, 2012, Phoenix Convention Center, Phoenix, Arizona, USA
| ISTFA 2012 [[electronic resource] ] : conference proceedings from the 38th International Symposium for Testing and Failure Analysis : November 11-15, 2012, Phoenix Convention Center, Phoenix, Arizona, USA |
| Pubbl/distr/stampa | Materials Park, Ohio, : ASM International, 2012 |
| Descrizione fisica | 1 online resource (642 p.) |
| Soggetto topico |
Electronics - Materials - Testing
Electronic apparatus and appliances - Testing |
| ISBN |
1-68015-512-1
1-61503-995-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
""Title Page""; ""Copyright""; ""Board of Directors""; ""Organizing Committee""; ""Symposium Committee""; ""User Groups""; ""Contents""; ""2012 IPFA Best Paper""; ""Laser Voltage Probing in Failure Analysis of Advanced Integrated Circuits on SOI""; ""Emerging Concepts and Techniques""; ""Closer to the Theoretical Limit: Spherical Corrections to Aplanatic Solid Immersion Imaging with Adaptive Optics""; ""Fault Isolation of Open Defects Using Space Domain Reflectometry""; ""Localization of Dead Open in a Solder Bump by Space Domain Reflectometry""
""Advanced Fault Isolation Technique Using Electro-Optical Terahertz Pulse Reflectometry (EOTPR) for 2D and 2.5D Flip-Chip Package""""Novel Plasma FIB/SEM for High Speed Failure Analysis and Real Time Imaging of Large Volume Removal""; ""FemtoFarad/TeraOhm Endpoint Detection for Microsurgery of Integrated Circuit Devices""; ""Fault Isolation and Failure Analysis of TSV""; ""Cross Section Analysis of Cu Filled TSVs Based On High Throughput Plasma- FIB Milling""; ""Microstructural Considerations on the Reliability of 3D Packaging"" ""High-Frequency TSV Failure Detection Method with Z Parameter""""Enhanced Failure Analysis on Open TSV Interconnects""; ""Nanoprobing Techniques""; ""A New Technique for Non-Invasive Short-Localisation in Thin Dielectric Layers by Electron Beam Absorbed Current (EBAC) Imaging""; ""Precise Localization of 28 nm via Chain Resistive Defect Using EBAC and Nanoprobing""; ""In FAB 300 mm Wafer Level Atomic Force Probe Characterization""; ""Nanoelectronic Analog Circuit PFA � The Return of Circuit Level Probing""; ""Fault Isolation and Failure Analysis of 3D Packages"" ""Enhanced Comparison of Lock-in Thermography and Magnetic Microscopy for 3D Defect Localization of System in Packages""""Non Destructive Failure Analysis of 3D Electronic Packages Using Both Electro Optical Terahertz Pulse Reflectometry and 3D X-ray Computed Tomography""; ""Failure Analysis Using Scanning Acoustic Microscopy for Diagnostics of Electronic Devices and 3D System Integration Technologies""; ""Nanoprobing Applications""; ""Analysis of an Anomalous Transistor Exhibiting Dual-Vt Characteristics and Its Cause in a 90 nm Node CMOS Technology"" ""Study of Static Noise Margin, Cell Stability and Influence of Electron Beam on Sub-30 nm SRAM Using SEM-Based Nanoprobing with 8 Nanoprobes""""Leaky Device Channel Anomaly Identification and Case Study by Nano-Probing Technique, Curve Fitting, and Model Analysis""; ""Photon Based Techniques: An Understanding""; ""Photon Emission Spectra of FETs as Obtained by InGaAs Detector""; ""Near-Infrared Photon Emission Spectroscopy Trends in Scaled SOI Technologies"" ""Characterization and TCAD Simulation of 90 nm Technology PMOS Transistor Under Continuous Photoelectric Laser Stimulation for Failure Analysis Improvement"" |
| Record Nr. | UNINA-9910779657003321 |
| Materials Park, Ohio, : ASM International, 2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
ISTFA 2014 : conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA / / organized by Electronic Device Failure Analysis Society, ASM International
| ISTFA 2014 : conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA / / organized by Electronic Device Failure Analysis Society, ASM International |
| Pubbl/distr/stampa | Materials Park, Ohio : , : ASM International, , 2014 |
| Descrizione fisica | 1 online resource (560 p.) |
| Disciplina | 621.381 |
| Soggetto topico |
Electronics - Materials - Testing
Electronic apparatus and appliances - Testing |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-62708-075-9
1-68015-514-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
""Title Page""; ""TitlePage_2014""; ""COPYRight Page""; ""EDFAS 2014 Board of Directors""; ""Organizing Committee-2014""; ""Technical Program Committee - 2014""; ""Contents_2014""; ""ISTFA2014_Combined""; ""cp2014istfa001""; ""cp2014istfa005""; ""cp2014istfa006""; ""cp2014istfa012""; ""cp2014istfa023""; ""cp2014istfa028""; ""cp2014istfa033""; ""cp2014istfa038""; ""cp2014istfa043""; ""cp2014istfa049""; ""cp2014istfa055""; ""cp2014istfa065""; ""cp2014istfa073""; ""cp2014istfa082""; ""cp2014istfa087""; ""cp2014istfa094""; ""cp2014istfa100""; ""cp2014istfa105""; ""cp2014istfa110""
""cp2014istfa115""""cp2014istfa125""; ""cp2014istfa130""; ""cp2014istfa136""; ""cp2014istfa143""; ""cp2014istfa148""; ""cp2014istfa152""; ""cp2014istfa156""; ""cp2014istfa166""; ""cp2014istfa172""; ""cp2014istfa178""; ""cp2014istfa184""; ""Combined_189-536""; ""Analysis of InGaAs Epi Defects by Conductive AFM""; ""Failure analysis of bit line to SNC leakage fail in 2xnm DRAM using Nano- Probing technique""; ""Analysis of an Anomalous CMOS Transistor Exhibiting Drain to Source Leakage � Its Model and Cause""; ""Feature Based Non-Destructive Fault Isolation in Advanced IC Packages"" ""Understanding the Cu Void Formation by TEM Failure Analysis""""microPREPTM - A New Laser Tool for High-Throughput Sample Preparation""; ""Using Energy Dispersive Spectroscopy (EDS) to Determine the Resistance of FIB Jumpers for Circuit Edit""; ""New Ion Source for High Precision FIB Nanomachining and Circuit Edit""; ""Evaluation of Power SiC-MOSFET Using Super-Higher-Order Scanning Nonlinear Dielectric Microscopy: Imaging of Carrier Distribution and Depletion Layer""; ""Imaging Performance of aSIL Microscopy on Subsurface Imaging of SOI Chips"" ""Methods to Reconstruct SEM and Optical Probe Tips using a FIB Tool""""Near-Field Scanning Optical Microscopy for Through-Silicon Imaging and Fault Isolation of Integrated Circuits""; ""Characterization and simulation of a body biased structure in triple-well technology under pulsed photoelectric laser stimulation""; ""Continuous-wave 1064nm laser for Laser Voltage Imaging and Probing Applications""; ""Marginal Failure Diagnosed with LADA: Case Studies.""; ""Sample Preparation for High Numerical Aperture Solid Immersion Lens Laser Imaging""; ""TDR Analysis On Short Transmission Lines"" ""Productive Polishing TEM Sample Preparation Methodology Development""""Optimization of TEM Sample Preparation to Reduce the Overlapping of TEM Images""; ""Delayering on Advanced Process Technologies using FIB""; ""Failure Analysis Enhancement by Incorporating a Compact Scan Diagnosis System""; ""Debugging Phase-Locked Loop Failures in Integrated Circuit Products""; ""A Novel Method for the Specified Site Planar View TEM Sample Preparation""; ""Investigation of Protection Layer Materials for Ex-situ �lift-out� TEM Sample Preparation with FIB for 14nm FinFET"" ""Localization of weak points in thin dielectric layers by Electron Beam Absorbed Current (EBAC) Imaging"" |
| Record Nr. | UNINA-9910460219703321 |
| Materials Park, Ohio : , : ASM International, , 2014 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
ISTFA 2014 : conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA / / organized by Electronic Device Failure Analysis Society, ASM International
| ISTFA 2014 : conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA / / organized by Electronic Device Failure Analysis Society, ASM International |
| Pubbl/distr/stampa | Materials Park, Ohio : , : ASM International, , 2014 |
| Descrizione fisica | 1 online resource (560 p.) |
| Disciplina | 621.381 |
| Soggetto topico |
Electronics - Materials - Testing
Electronic apparatus and appliances - Testing |
| ISBN |
1-62708-075-9
1-68015-514-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
""Title Page""; ""TitlePage_2014""; ""COPYRight Page""; ""EDFAS 2014 Board of Directors""; ""Organizing Committee-2014""; ""Technical Program Committee - 2014""; ""Contents_2014""; ""ISTFA2014_Combined""; ""cp2014istfa001""; ""cp2014istfa005""; ""cp2014istfa006""; ""cp2014istfa012""; ""cp2014istfa023""; ""cp2014istfa028""; ""cp2014istfa033""; ""cp2014istfa038""; ""cp2014istfa043""; ""cp2014istfa049""; ""cp2014istfa055""; ""cp2014istfa065""; ""cp2014istfa073""; ""cp2014istfa082""; ""cp2014istfa087""; ""cp2014istfa094""; ""cp2014istfa100""; ""cp2014istfa105""; ""cp2014istfa110""
""cp2014istfa115""""cp2014istfa125""; ""cp2014istfa130""; ""cp2014istfa136""; ""cp2014istfa143""; ""cp2014istfa148""; ""cp2014istfa152""; ""cp2014istfa156""; ""cp2014istfa166""; ""cp2014istfa172""; ""cp2014istfa178""; ""cp2014istfa184""; ""Combined_189-536""; ""Analysis of InGaAs Epi Defects by Conductive AFM""; ""Failure analysis of bit line to SNC leakage fail in 2xnm DRAM using Nano- Probing technique""; ""Analysis of an Anomalous CMOS Transistor Exhibiting Drain to Source Leakage � Its Model and Cause""; ""Feature Based Non-Destructive Fault Isolation in Advanced IC Packages"" ""Understanding the Cu Void Formation by TEM Failure Analysis""""microPREPTM - A New Laser Tool for High-Throughput Sample Preparation""; ""Using Energy Dispersive Spectroscopy (EDS) to Determine the Resistance of FIB Jumpers for Circuit Edit""; ""New Ion Source for High Precision FIB Nanomachining and Circuit Edit""; ""Evaluation of Power SiC-MOSFET Using Super-Higher-Order Scanning Nonlinear Dielectric Microscopy: Imaging of Carrier Distribution and Depletion Layer""; ""Imaging Performance of aSIL Microscopy on Subsurface Imaging of SOI Chips"" ""Methods to Reconstruct SEM and Optical Probe Tips using a FIB Tool""""Near-Field Scanning Optical Microscopy for Through-Silicon Imaging and Fault Isolation of Integrated Circuits""; ""Characterization and simulation of a body biased structure in triple-well technology under pulsed photoelectric laser stimulation""; ""Continuous-wave 1064nm laser for Laser Voltage Imaging and Probing Applications""; ""Marginal Failure Diagnosed with LADA: Case Studies.""; ""Sample Preparation for High Numerical Aperture Solid Immersion Lens Laser Imaging""; ""TDR Analysis On Short Transmission Lines"" ""Productive Polishing TEM Sample Preparation Methodology Development""""Optimization of TEM Sample Preparation to Reduce the Overlapping of TEM Images""; ""Delayering on Advanced Process Technologies using FIB""; ""Failure Analysis Enhancement by Incorporating a Compact Scan Diagnosis System""; ""Debugging Phase-Locked Loop Failures in Integrated Circuit Products""; ""A Novel Method for the Specified Site Planar View TEM Sample Preparation""; ""Investigation of Protection Layer Materials for Ex-situ �lift-out� TEM Sample Preparation with FIB for 14nm FinFET"" ""Localization of weak points in thin dielectric layers by Electron Beam Absorbed Current (EBAC) Imaging"" |
| Record Nr. | UNINA-9910787498103321 |
| Materials Park, Ohio : , : ASM International, , 2014 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
ISTFA 2014 : conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA / / organized by Electronic Device Failure Analysis Society, ASM International
| ISTFA 2014 : conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA / / organized by Electronic Device Failure Analysis Society, ASM International |
| Pubbl/distr/stampa | Materials Park, Ohio : , : ASM International, , 2014 |
| Descrizione fisica | 1 online resource (560 p.) |
| Disciplina | 621.381 |
| Soggetto topico |
Electronics - Materials - Testing
Electronic apparatus and appliances - Testing |
| ISBN |
1-62708-075-9
1-68015-514-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
""Title Page""; ""TitlePage_2014""; ""COPYRight Page""; ""EDFAS 2014 Board of Directors""; ""Organizing Committee-2014""; ""Technical Program Committee - 2014""; ""Contents_2014""; ""ISTFA2014_Combined""; ""cp2014istfa001""; ""cp2014istfa005""; ""cp2014istfa006""; ""cp2014istfa012""; ""cp2014istfa023""; ""cp2014istfa028""; ""cp2014istfa033""; ""cp2014istfa038""; ""cp2014istfa043""; ""cp2014istfa049""; ""cp2014istfa055""; ""cp2014istfa065""; ""cp2014istfa073""; ""cp2014istfa082""; ""cp2014istfa087""; ""cp2014istfa094""; ""cp2014istfa100""; ""cp2014istfa105""; ""cp2014istfa110""
""cp2014istfa115""""cp2014istfa125""; ""cp2014istfa130""; ""cp2014istfa136""; ""cp2014istfa143""; ""cp2014istfa148""; ""cp2014istfa152""; ""cp2014istfa156""; ""cp2014istfa166""; ""cp2014istfa172""; ""cp2014istfa178""; ""cp2014istfa184""; ""Combined_189-536""; ""Analysis of InGaAs Epi Defects by Conductive AFM""; ""Failure analysis of bit line to SNC leakage fail in 2xnm DRAM using Nano- Probing technique""; ""Analysis of an Anomalous CMOS Transistor Exhibiting Drain to Source Leakage � Its Model and Cause""; ""Feature Based Non-Destructive Fault Isolation in Advanced IC Packages"" ""Understanding the Cu Void Formation by TEM Failure Analysis""""microPREPTM - A New Laser Tool for High-Throughput Sample Preparation""; ""Using Energy Dispersive Spectroscopy (EDS) to Determine the Resistance of FIB Jumpers for Circuit Edit""; ""New Ion Source for High Precision FIB Nanomachining and Circuit Edit""; ""Evaluation of Power SiC-MOSFET Using Super-Higher-Order Scanning Nonlinear Dielectric Microscopy: Imaging of Carrier Distribution and Depletion Layer""; ""Imaging Performance of aSIL Microscopy on Subsurface Imaging of SOI Chips"" ""Methods to Reconstruct SEM and Optical Probe Tips using a FIB Tool""""Near-Field Scanning Optical Microscopy for Through-Silicon Imaging and Fault Isolation of Integrated Circuits""; ""Characterization and simulation of a body biased structure in triple-well technology under pulsed photoelectric laser stimulation""; ""Continuous-wave 1064nm laser for Laser Voltage Imaging and Probing Applications""; ""Marginal Failure Diagnosed with LADA: Case Studies.""; ""Sample Preparation for High Numerical Aperture Solid Immersion Lens Laser Imaging""; ""TDR Analysis On Short Transmission Lines"" ""Productive Polishing TEM Sample Preparation Methodology Development""""Optimization of TEM Sample Preparation to Reduce the Overlapping of TEM Images""; ""Delayering on Advanced Process Technologies using FIB""; ""Failure Analysis Enhancement by Incorporating a Compact Scan Diagnosis System""; ""Debugging Phase-Locked Loop Failures in Integrated Circuit Products""; ""A Novel Method for the Specified Site Planar View TEM Sample Preparation""; ""Investigation of Protection Layer Materials for Ex-situ �lift-out� TEM Sample Preparation with FIB for 14nm FinFET"" ""Localization of weak points in thin dielectric layers by Electron Beam Absorbed Current (EBAC) Imaging"" |
| Record Nr. | UNINA-9910811406203321 |
| Materials Park, Ohio : , : ASM International, , 2014 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
ISTFA 2015 conference proceedings from the 41st International Symposium for Testing and Failure Analysis : November 1-5 2015, Oregon Convention Center, Portland, Oregon, USA / / organized by ISTFA/2015, Electronic Device Failure Analysis Society (EDFAS), ASM International
| ISTFA 2015 conference proceedings from the 41st International Symposium for Testing and Failure Analysis : November 1-5 2015, Oregon Convention Center, Portland, Oregon, USA / / organized by ISTFA/2015, Electronic Device Failure Analysis Society (EDFAS), ASM International |
| Pubbl/distr/stampa | Materials Park, Ohio : , : ASM International, , [2015] |
| Descrizione fisica | 1 online resource (536 pages) : illustrations (some color) |
| Soggetto topico |
Electronics - Materials - Testing
Materials - Testing Electronic apparatus and appliances - Testing Semiconductors - Testing |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-5231-0206-3
1-62708-103-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910467594603321 |
| Materials Park, Ohio : , : ASM International, , [2015] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
ISTFA 2015 conference proceedings from the 41st International Symposium for Testing and Failure Analysis : November 1-5 2015, Oregon Convention Center, Portland, Oregon, USA / / organized by ISTFA/2015, Electronic Device Failure Analysis Society (EDFAS), ASM International
| ISTFA 2015 conference proceedings from the 41st International Symposium for Testing and Failure Analysis : November 1-5 2015, Oregon Convention Center, Portland, Oregon, USA / / organized by ISTFA/2015, Electronic Device Failure Analysis Society (EDFAS), ASM International |
| Pubbl/distr/stampa | Materials Park, Ohio : , : ASM International, , [2015] |
| Descrizione fisica | 1 online resource (536 pages) : illustrations (some color) |
| Soggetto topico |
Electronics - Materials - Testing
Materials - Testing Electronic apparatus and appliances - Testing Semiconductors - Testing |
| ISBN |
1-5231-0206-3
1-62708-103-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910796671003321 |
| Materials Park, Ohio : , : ASM International, , [2015] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
