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2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging? : 25-28 October 2018, Iasi, Romania / / Institute of Electrical and Electronics Engineers
| 2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging? : 25-28 October 2018, Iasi, Romania / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 |
| Descrizione fisica | 1 online resource (113 pages) |
| Disciplina | 621.381 |
| Soggetto topico |
Electronic packaging - Technological innovations
Electronic apparatus and appliances Electronic packaging - Design and construction |
| ISBN | 1-5386-5577-2 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910304156803321 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging? : 25-28 October 2018, Iasi, Romania / / Institute of Electrical and Electronics Engineers
| 2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging? : 25-28 October 2018, Iasi, Romania / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 |
| Descrizione fisica | 1 online resource (113 pages) |
| Disciplina | 621.381 |
| Soggetto topico |
Electronic packaging - Technological innovations
Electronic apparatus and appliances Electronic packaging - Design and construction |
| ISBN | 1-5386-5577-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996575282003316 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium : 16-18 December 2018, Chandigarh, India / / Institute of Electrical and Electronics Engineers
| 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium : 16-18 December 2018, Chandigarh, India / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 |
| Descrizione fisica | 1 online resource (54 pages) |
| Disciplina | 621.381046 |
| Soggetto topico |
Electronic packaging - Design and construction
Electronic systems - Design and construction |
| ISBN | 1-5386-6592-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910318350703321 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium : 16-18 December 2018, Chandigarh, India / / Institute of Electrical and Electronics Engineers
| 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium : 16-18 December 2018, Chandigarh, India / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 |
| Descrizione fisica | 1 online resource (54 pages) |
| Disciplina | 621.381046 |
| Soggetto topico |
Electronic packaging - Design and construction
Electronic systems - Design and construction |
| ISBN | 1-5386-6592-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996575426703316 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
EDAPS : 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium : December 14-16, 2016, Sheraton Waikiki, Honolulu, Hawaii / / sponsored by the IEEE Components, Packaging and Manufacturing Technology Society
| EDAPS : 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium : December 14-16, 2016, Sheraton Waikiki, Honolulu, Hawaii / / sponsored by the IEEE Components, Packaging and Manufacturing Technology Society |
| Pubbl/distr/stampa | New York : , : IEEE, , 2017 |
| Descrizione fisica | 1 online resource (221 pages) |
| Soggetto topico |
Electronic systems - Design and construction
Electronic packaging - Design and construction |
| ISBN | 1-5090-6185-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996279628703316 |
| New York : , : IEEE, , 2017 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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EDAPS : 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium : December 14-16, 2016, Sheraton Waikiki, Honolulu, Hawaii / / sponsored by the IEEE Components, Packaging and Manufacturing Technology Society
| EDAPS : 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium : December 14-16, 2016, Sheraton Waikiki, Honolulu, Hawaii / / sponsored by the IEEE Components, Packaging and Manufacturing Technology Society |
| Pubbl/distr/stampa | New York : , : IEEE, , 2017 |
| Descrizione fisica | 1 online resource (221 pages) |
| Soggetto topico |
Electronic systems - Design and construction
Electronic packaging - Design and construction |
| ISBN | 1-5090-6185-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910172633203321 |
| New York : , : IEEE, , 2017 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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EDAPS : 2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium : 14-16 December 2014
| EDAPS : 2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium : 14-16 December 2014 |
| Pubbl/distr/stampa | New York : , : IEEE, , 2015 |
| Descrizione fisica | 1 online resource (132 pages) |
| Soggetto topico | Electronic packaging - Design and construction |
| ISBN | 1-4799-6257-0 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996280287803316 |
| New York : , : IEEE, , 2015 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
EDAPS : 2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium : 14-16 December 2014
| EDAPS : 2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium : 14-16 December 2014 |
| Pubbl/distr/stampa | New York : , : IEEE, , 2015 |
| Descrizione fisica | 1 online resource (132 pages) |
| Soggetto topico | Electronic packaging - Design and construction |
| ISBN | 1-4799-6257-0 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910135224803321 |
| New York : , : IEEE, , 2015 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium : July 16-18, 2003 the Marriott Hotel, San Jose, CA, USA
| IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium : July 16-18, 2003 the Marriott Hotel, San Jose, CA, USA |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2003 |
| Disciplina | 621.381 |
| Soggetto topico |
Electronic industries - Design and construction
Electronic packaging - Design and construction Electronic apparatus and appliances - Design and construction Semiconductors Thin film devices Ball grid array technology Electrical & Computer Engineering Electrical Engineering Engineering & Applied Sciences |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996210177603316 |
| [Place of publication not identified], : IEEE, 2003 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium : July 16-18, 2003 the Marriott Hotel, San Jose, CA, USA
| IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium : July 16-18, 2003 the Marriott Hotel, San Jose, CA, USA |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2003 |
| Disciplina | 621.381 |
| Soggetto topico |
Electronic industries - Design and construction
Electronic packaging - Design and construction Electronic apparatus and appliances - Design and construction Semiconductors Thin film devices Ball grid array technology Electrical & Computer Engineering Electrical Engineering Engineering & Applied Sciences |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910872815903321 |
| [Place of publication not identified], : IEEE, 2003 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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