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100 Years of Radar / / by Gaspare Galati
| 100 Years of Radar / / by Gaspare Galati |
| Autore | Galati Gaspare |
| Edizione | [1st ed. 2016.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2016 |
| Descrizione fisica | 1 online resource (407 p.) |
| Disciplina | 530 |
| Soggetto topico |
Electronic circuits
Aerospace engineering Astronautics Physics History Electronic Circuits and Devices Aerospace Technology and Astronautics History and Philosophical Foundations of Physics History of Science |
| ISBN | 3-319-00584-7 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | The unfortunate inventor and the lucky one - the Ur-radar, primordial apparatus -- The owls and the Owl - birth of the Italian radar -- A simultaneous invention - the first developments -- The air defense and the alleged father of radar -- The Second World War and its legacies -- The radar flies: birth and development of airborne radar systems -- The Italian situation in post-war period: SMA, Microlambda, Sindel, Selenia, Contraves, GEM, IDS -- From terrestrial to space-based radar: the adventure of Synthetic Aperture Radar (SAR) -- Scops owls and bats - some considerations on the development of radar -- System Integration: final solution for the radar?. |
| Record Nr. | UNINA-9910254629503321 |
Galati Gaspare
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| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2016 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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3D Flash Memories [[electronic resource] /] / edited by Rino Micheloni
| 3D Flash Memories [[electronic resource] /] / edited by Rino Micheloni |
| Edizione | [1st ed. 2016.] |
| Pubbl/distr/stampa | Dordrecht : , : Springer Netherlands : , : Imprint : Springer, , 2016 |
| Descrizione fisica | 1 online resource (391 p.) |
| Disciplina | 004 |
| Soggetto topico |
Computer memory systems
Electronic circuits Memory Structures Electronic Circuits and Devices Circuits and Systems |
| ISBN | 94-017-7512-5 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Dedication Page -- Foreword -- Preface -- Introduction -- About the Editor -- Acknowledgements -- 1 The Business of NAND -- 2 Reliability of 3D NAND Flash memories -- 3 3D Stacked NAND Flash memories -- 4 3D Charge Trap NAND Flash memories -- 5 3D Floating Gate NAND Flash memories -- 6 Advanced Architectures for 3D NAND Flash memories with vertical channel -- 7 3D VG-Type NAND Flash memories -- 8 RRAM Cross-point arrays -- 9 3D Multi-Chip Integration and Packaging Technology -- 10 BCH and LDPC Error Correction Codes for NAND Flash memories -- 11 Advanced algebraic and graph-based ECC schemes for modern NVMs -- 12 System-Level Considerations on Design of 3D NAND Flash memories -- Index. |
| Record Nr. | UNINA-9910254982603321 |
| Dordrecht : , : Springer Netherlands : , : Imprint : Springer, , 2016 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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3D Microelectronic Packaging : From Fundamentals to Applications / / edited by Yan Li, Deepak Goyal
| 3D Microelectronic Packaging : From Fundamentals to Applications / / edited by Yan Li, Deepak Goyal |
| Edizione | [1st ed. 2017.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 |
| Descrizione fisica | 1 online resource (IX, 463 p. 331 illus., 253 illus. in color.) |
| Disciplina | 621.381 |
| Collana | Springer Series in Advanced Microelectronics |
| Soggetto topico |
Electronics
Microelectronics Optical materials Electronic materials Electronic circuits Biotechnology Nanotechnology Metals Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Electronic Circuits and Devices Microengineering Nanotechnology and Microengineering Metallic Materials |
| ISBN | 3-319-44586-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction to 3D Microelectronic Packaging.-3D packaging architecture and assembly process design.-Materials and Processing of TSV.-Microstructural and Reliability Issues of TSV -- Fundamentals and failures in Die preparation for 3D packaging.-Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging -- Fundamental of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages -- Fundamentals of solder alloys in 3D packaging.-Fundamentals of Electromigration in interconnects of 3D packages.-Fundamentals of heat dissipation in 3D IC packaging -- Fundamentals of advanced materials and processes in organic substrate technology -- Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization -- Processing and Reliability of Solder Interconnections in Stacked Packaging -- Interconnect Quality and Reliability of 3D Packaging -- Fault isolation and failure analysis of 3D packaging. . |
| Record Nr. | UNINA-9910163046303321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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3D Stacked Chips : From Emerging Processes to Heterogeneous Systems / / edited by Ibrahim (Abe) M. Elfadel, Gerhard Fettweis
| 3D Stacked Chips : From Emerging Processes to Heterogeneous Systems / / edited by Ibrahim (Abe) M. Elfadel, Gerhard Fettweis |
| Edizione | [1st ed. 2016.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2016 |
| Descrizione fisica | 1 online resource (XXIII, 339 p. 238 illus., 157 illus. in color.) |
| Disciplina | 621.3815 |
| Soggetto topico |
Electronic circuits
Microprocessors Circuits and Systems Electronic Circuits and Devices Processor Architectures |
| ISBN | 3-319-20481-5 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction to Electrical 3D Integration -- Copper-based TSV – Interposer -- Multi-TSV Crosstalk Channel Equalization with Non-Uniform Quantization -- Energy Efficient Electrical Intra-Chip Stack Communication -- Clock Generators for Heterogeneous MPSoCs within 3D Chip Stacks -- Energy Efficient Communications Employing 1-Bit Quantization at the Receiver -- 2-nm Laser Synthesized Si-Nanoparticles for Low Power Memory Applications -- Accurate Temperature Measurement for 3D Thermal Management -- EDA Environments for 3D Chip Stacks -- Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias -- Introduction to Optical Inter- and Intraconnects -- Optical Through-Silicon Vias -- Integrated Optical Devices for 3D Photonic Transceivers -- Cantilever Design for Tunable WDM Filters based on Silicon Microring Resonators -- Athermal photonic circuits for optical on-chip interconnects -- Integrated Circuits for 3D Photonic Transceivers -- Review of interdigitated back contacted full heterojunction solar cell (IBC-SHJ): a simulation approach.-. |
| Record Nr. | UNINA-9910254242703321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2016 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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5G and E-Band Communication Circuits in Deep-Scaled CMOS / / by Marco Vigilante, Patrick Reynaert
| 5G and E-Band Communication Circuits in Deep-Scaled CMOS / / by Marco Vigilante, Patrick Reynaert |
| Autore | Vigilante Marco |
| Edizione | [1st ed. 2018.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2018 |
| Descrizione fisica | 1 online resource (205 pages) : illustrations |
| Disciplina | 004.16 |
| Collana | Analog Circuits and Signal Processing |
| Soggetto topico |
Electronic circuits
Microprocessors Circuits and Systems Electronic Circuits and Devices Processor Architectures |
| ISBN | 3-319-72646-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction -- Gm Stage and Passives in deep-scaled CMOS -- Gain-Bandwidth Enhancement Techniques for mm-Wave fully integrated Amplifiers -- mm-Wave LC VCOs -- mm-Wave Dividers -- mm-Wave Broadband Downconverters -- mm-Wave Highly-Linear Broadband Power Amplifiers -- Conclusion. |
| Record Nr. | UNINA-9910299955203321 |
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Vigilante Marco
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| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Accurate and Robust Spectral Testing with Relaxed Instrumentation Requirements / / by Yuming Zhuang, Degang Chen
| Accurate and Robust Spectral Testing with Relaxed Instrumentation Requirements / / by Yuming Zhuang, Degang Chen |
| Autore | Zhuang Yuming |
| Edizione | [1st ed. 2018.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2018 |
| Descrizione fisica | 1 online resource (176 pages) |
| Disciplina | 621.381 |
| Soggetto topico |
Electronic circuits
Electronics Microelectronics Circuits and Systems Electronic Circuits and Devices Electronics and Microelectronics, Instrumentation |
| ISBN | 3-319-77718-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Chapter 1. Introduction -- Chapter 2.Algorithms for accurate spectral analysis in the presence of arbitrary non-coherency and large distortion -- Chapter 3.Accurate spectral testing with arbitrary non- coherency in sampling and simultaneous drifts in amplitude and frequency -- Chapter 4.High-purity sine wave generation using nonlinear DAC with pre-distortion based on low-cost accurate DAC-ADC co-testing -- Chapter 5.Low cost ultra-pure sine wave generation with self-calibration -- Chapter 6.Accurate spectral testing with non-coherent sampling for multi-tone test -- Chapter 7.Accurate spectral testing with impure test stimulus for multi-tone test -- Chapter 8.Multi-tone sine wave generation achieving the theoretical minimum of peak-to-average power ratio -- Chapter 9.Accurate linearity testing using low purity stimulus robust against flicker noise -- Chapter 10.Summary. |
| Record Nr. | UNINA-9910299940003321 |
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Zhuang Yuming
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| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Active Metamaterials : Terahertz Modulators and Detectors / / by Saroj Rout, Sameer Sonkusale
| Active Metamaterials : Terahertz Modulators and Detectors / / by Saroj Rout, Sameer Sonkusale |
| Autore | Rout Saroj |
| Edizione | [1st ed. 2017.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 |
| Descrizione fisica | 1 online resource (XIII, 118 p. 67 illus., 59 illus. in color.) |
| Disciplina | 621.3815 |
| Soggetto topico |
Electronic circuits
Signal processing Image processing Speech processing systems Optical materials Electronic materials Circuits and Systems Electronic Circuits and Devices Signal, Image and Speech Processing Optical and Electronic Materials |
| ISBN | 3-319-52219-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Chapter 1.Introduction -- Chapter 2. Background Theory -- Chapter 3.Experimental Methods -- Chapter 4.High Speed Terahertz Modulation using Active Metamaterial -- Chapter 5. A Terahertz Spatial Light Modulator for Imaging Application -- Chapter 6.A Terahertz Focal Plane Array using Metamaterials in a CMOS Process -- A. Electromagnetic Waves. . |
| Record Nr. | UNINA-9910163008403321 |
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Rout Saroj
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| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Advanced Linear Machines and Drive Systems [[electronic resource] /] / edited by Wei Xu, Md. Rabiul Islam, Marcello Pucci
| Advanced Linear Machines and Drive Systems [[electronic resource] /] / edited by Wei Xu, Md. Rabiul Islam, Marcello Pucci |
| Edizione | [1st ed. 2019.] |
| Pubbl/distr/stampa | Singapore : , : Springer Singapore : , : Imprint : Springer, , 2019 |
| Descrizione fisica | 1 online resource (XXXVI, 341 p. 238 illus., 203 illus. in color.) |
| Disciplina | 621.3815 |
| Soggetto topico |
Electronic circuits
Power electronics Control engineering Mathematical optimization Electronic Circuits and Devices Power Electronics, Electrical Machines and Networks Control and Systems Theory Optimization |
| ISBN | 981-13-9616-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction -- Electro-Magnetic Design of LIM -- Dynamic Modeling of LIMs -- Advanced Design Optimization Techniques of Linear Machines -- Superconducting Linear Machines -- Loss Minimization Control of LIM and Drives -- Model Predictive Control of LIM -- Non-linear Control Techniques for LIMs -- Sensorless Control Techniques for LIMs. |
| Record Nr. | UNINA-9910350221803321 |
| Singapore : , : Springer Singapore : , : Imprint : Springer, , 2019 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Advanced Materials : Techniques, Physics, Mechanics and Applications / / edited by Ivan A. Parinov, Shun-Hsyung Chang, Muaffaq A. Jani
| Advanced Materials : Techniques, Physics, Mechanics and Applications / / edited by Ivan A. Parinov, Shun-Hsyung Chang, Muaffaq A. Jani |
| Edizione | [1st ed. 2017.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 |
| Descrizione fisica | 1 online resource (627 pages) |
| Disciplina | 620.11 |
| Collana | Springer Proceedings in Physics |
| Soggetto topico |
Structural materials
Electronic circuits Semiconductors Mechanics Mechanics, Applied Electrochemistry Structural Materials Circuits and Systems Electronic Circuits and Devices Solid Mechanics |
| ISBN | 3-319-56062-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | From the contents: Methods for Comprehensive Characterization of Radar Absorbing Materials -- Pump Control System using Microcontroller and Sort Message Service (SMS) Gateway for Flood Prevention -- Obtaining and Study Of Ptcu/C Electro-Catalyst -- Effect of an Electromagnetic Waves Scattering by Multiple Infinite Cylinders on Formation of Photonic Nanojet -- New Ge-Related Center in Nano- and Microcrystalline High-Quality HPHT Diamonds -- Dielectric Characteristics of Solid Solutions of Binary System (1-х)BiFeO3-xPbTiO3 -- The Effect of Electroless Plating on Aluminum Metal Matrix Composite Reinforcement Bottom Ash Coal on the Density and Porosity for Propeller Applications -- Non-Thermal Effect of High-Voltage Nanosecond Pulses on Kimberlite Rock-Forming Minerals Processing -- The Behavior of the Elastic Properties in SBN:61 Single Crystal Doped with Cobalt at Changing of Sample Polarization Degree -- Stress Assessment for a Pipeline Segment with Volumetric Surf ace Defects Repaired Using Composite Materials -- Investigations of the Capability to Heavy Metals Adsorption Humic Acids -- IMF Features of FP1 EEG Signal Using EMD Methods for Cerebral Palsy. |
| Record Nr. | UNINA-9910254599503321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Advanced Materials for Integrated Optical Waveguides / / by Xingcun Colin Tong Ph.D
| Advanced Materials for Integrated Optical Waveguides / / by Xingcun Colin Tong Ph.D |
| Autore | Tong Ph.D Xingcun Colin |
| Edizione | [1st ed. 2014.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2014 |
| Descrizione fisica | 1 online resource (574 p.) |
| Disciplina | 621.3693 |
| Collana | Springer Series in Advanced Microelectronics |
| Soggetto topico |
Electronic circuits
Optical materials Electronic materials Electronics Microelectronics Lasers Photonics Semiconductors Electronic Circuits and Devices Optical and Electronic Materials Electronics and Microelectronics, Instrumentation Optics, Lasers, Photonics, Optical Devices |
| ISBN | 3-319-01550-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Preface -- Abbreviations -- 1 Fundamentals and design guides for optical waveguides -- 2 Characterization methodologies of optical waveguides -- 3 Optoelectronic devices integrated with optical waveguides -- 4 Optical fibers -- 5 Semiconductor waveguides -- 6 Silicon-on-insulator waveguides -- 7 Glass waveguides -- 8 Electro-optic waveguides -- 9 Polymer based optical waveguides -- 10 Hollow waveguides -- 11 Metamaterial optical waveguides -- 12 Perspectives and future trends -- Index. |
| Record Nr. | UNINA-9910300395903321 |
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Tong Ph.D Xingcun Colin
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| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2014 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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