Info
- Utilizzare la checkbox di selezione a fianco di ciascun documento per attivare le funzionalità di stampa, invio email, download nei formati disponibili del (i) record.
Electromigration in thin films and electronic devices : materials and reliability / / edited by Choong-Un Kim
| Electromigration in thin films and electronic devices : materials and reliability / / edited by Choong-Un Kim |
| Edizione | [1st edition] |
| Pubbl/distr/stampa | Oxford ; ; Philadelphia, : Woodhead Pub., c2011 |
| Descrizione fisica | 1 online resource (353 p.) |
| Disciplina | 621.38152 |
| Altri autori (Persone) | KimChoong-Un |
| Collana | Woodhead Publishing Series in Electronic and Optical Materials |
| Soggetto topico |
Integrated circuits - Deterioration
Electrodiffusion Thin films Interconnects (Integrated circuit technology) |
| ISBN |
9780857093752
0857093754 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Part I. Introduction. Modeling electromigration phenomena / F. Cacho and X. Federspiel ; Modeling electromigratoin using the peridynamics approach / D.T. Read and V.K. Tewary and W.H. Gerstle ; Modeling, simulation and X-ray microbeam studies of electromigration / A.M. Maniatty, G.S. Cargill III, and H. Zhang -- Part II. Electromigration in copper interconnects. X-ray microbeam analysis of electromigration in copper inteerconnects / H. Zhang and G.S. Cargill III ; Voiding in copper interconnects during electromigration / C.L. Gan and M.K. Lim ; The evolution of microstructure in copper interconnects during electromigration / A.S> Budiman ; Scaling effects on electromigration reliability of copper interconnects / L. Zhang, J.W. Pyun, and P.S. Ho ; Electromigration failure in nanoscale copper interconnects / E.T. Ogawa -- Part III. Electromigration in solder. Electromigration-induced microstructural evolution in lead-free and lead-tin solders / K.-L. Lin ; Electromigration in flip-chip solder joints / D. Yang and Y.C. Chan and M. Pecht. |
| Record Nr. | UNINA-9911004740003321 |
| Oxford ; ; Philadelphia, : Woodhead Pub., c2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Electromigration in ULSI interconnections [[electronic resource] /] / Cher Ming Tan
| Electromigration in ULSI interconnections [[electronic resource] /] / Cher Ming Tan |
| Autore | Tan Cher Ming <1959-> |
| Pubbl/distr/stampa | Hackensack, N.J., : World Scientific, c2010 |
| Descrizione fisica | 1 online resource (312 p.) |
| Disciplina | 621.395 |
| Collana | International series on advances in solid state electronics and technology (ASSET) |
| Soggetto topico |
Integrated circuits - Ultra large scale integration
Electrodiffusion |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-283-14371-2
9786613143716 981-4273-33-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Preface; Contents; 1. Introduction; 2. History of Electromigration; 3. Experimental Studies of Al Interconnections; 4. Experimental Studies of Cu Interconnections; 5. Numerical Modeling of Electromigration; 6. Future Challenges; Index; Biography |
| Record Nr. | UNINA-9910456216003321 |
Tan Cher Ming <1959->
|
||
| Hackensack, N.J., : World Scientific, c2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Electromigration in ULSI interconnections [[electronic resource] /] / Cher Ming Tan
| Electromigration in ULSI interconnections [[electronic resource] /] / Cher Ming Tan |
| Autore | Tan Cher Ming <1959-> |
| Pubbl/distr/stampa | Hackensack, N.J., : World Scientific, c2010 |
| Descrizione fisica | 1 online resource (312 p.) |
| Disciplina | 621.395 |
| Collana | International series on advances in solid state electronics and technology (ASSET) |
| Soggetto topico |
Integrated circuits - Ultra large scale integration
Electrodiffusion |
| ISBN |
1-283-14371-2
9786613143716 981-4273-33-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Preface; Contents; 1. Introduction; 2. History of Electromigration; 3. Experimental Studies of Al Interconnections; 4. Experimental Studies of Cu Interconnections; 5. Numerical Modeling of Electromigration; 6. Future Challenges; Index; Biography |
| Record Nr. | UNINA-9910780711903321 |
|
Tan Cher Ming <1959->
|
||
| Hackensack, N.J., : World Scientific, c2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Electromigration induced stress, a study into current induced resistance changes in VLSI interconnects : proefschrift / Violeta Petrescu
| Electromigration induced stress, a study into current induced resistance changes in VLSI interconnects : proefschrift / Violeta Petrescu |
| Autore | Petrescu, Violeta |
| Descrizione fisica | 172 p. ; 25 cm |
| Disciplina | 621.3815 |
| Soggetto topico |
Interconnects (Integrated circuit technology) - Materials - Dissertations, Academic
Electrodiffusion |
| ISBN | 9036513979 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISALENTO-991004357337707536 |
|
Petrescu, Violeta
|
||
| Materiale a stampa | ||
| Lo trovi qui: Univ. del Salento | ||
| ||
Electromigration on semiconductor integrated circuits [[electronic resource]]
| Electromigration on semiconductor integrated circuits [[electronic resource]] |
| Pubbl/distr/stampa | Washington, DC : , : U.S. Nuclear Regulatory Commission, Office of Nuclear Reactror Regulation, , [2002] |
| Descrizione fisica | 1 online resource (2 pages) |
| Collana | NRC information notice |
| Soggetto topico |
Integrated circuits
Semiconductors Electrodiffusion |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910699662703321 |
| Washington, DC : , : U.S. Nuclear Regulatory Commission, Office of Nuclear Reactror Regulation, , [2002] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
