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2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems / / IEEE
| 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems / / IEEE |
| Pubbl/distr/stampa | Piscataway, NJ : , : IEEE, , 2012 |
| Descrizione fisica | 1 online resource : illustrations |
| Disciplina | 621.3 |
| Soggetto topico | Miniature electronic equipment |
| ISBN | 1-4673-1513-3 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti |
VLSI Design
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems |
| Record Nr. | UNISA-996210241803316 |
| Piscataway, NJ : , : IEEE, , 2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems / / IEEE
| 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems / / IEEE |
| Pubbl/distr/stampa | Piscataway, NJ : , : IEEE, , 2012 |
| Descrizione fisica | 1 online resource : illustrations |
| Disciplina | 621.3 |
| Soggetto topico | Miniature electronic equipment |
| ISBN | 1-4673-1513-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti |
VLSI Design
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems |
| Record Nr. | UNINA-9910130679503321 |
| Piscataway, NJ : , : IEEE, , 2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems : EuroSimE 2007 / / edited by L.J. Ernst ... [et al.] ; fully sponsored by IEEE--CPMT
| Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems : EuroSimE 2007 / / edited by L.J. Ernst ... [et al.] ; fully sponsored by IEEE--CPMT |
| Pubbl/distr/stampa | IEEE |
| Disciplina | 621.38101/1 |
| Altri autori (Persone) | ErnstL. J |
| Soggetto topico |
Microelectronics - Simulation methods
Systems engineering - Simulation methods |
| ISBN | 1-5090-8960-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti |
VLSI Design
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 |
| Record Nr. | UNISA-996281109203316 |
| IEEE | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems : EuroSimE 2007 / / edited by L.J. Ernst ... [et al.] ; fully sponsored by IEEE--CPMT
| Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems : EuroSimE 2007 / / edited by L.J. Ernst ... [et al.] ; fully sponsored by IEEE--CPMT |
| Pubbl/distr/stampa | IEEE |
| Disciplina | 621.38101/1 |
| Altri autori (Persone) | ErnstL. J |
| Soggetto topico |
Microelectronics - Simulation methods
Systems engineering - Simulation methods |
| ISBN |
9781509089604
1509089608 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti |
VLSI Design
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 |
| Record Nr. | UNINA-9910143028503321 |
| IEEE | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Thermal Issues in Emerging Technologies: Theory and Application, 2007. THETA 2007. International Conference on
| Thermal Issues in Emerging Technologies: Theory and Application, 2007. THETA 2007. International Conference on |
| Pubbl/distr/stampa | IEEE |
| ISBN | 1-5090-8498-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti |
VLSI Design
2007 International Conference on Thermal Issues in Emerging Technologies 2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application |
| Record Nr. | UNISA-996281109303316 |
| IEEE | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
Thermal Issues in Emerging Technologies: Theory and Application, 2007. THETA 2007. International Conference on
| Thermal Issues in Emerging Technologies: Theory and Application, 2007. THETA 2007. International Conference on |
| Pubbl/distr/stampa | IEEE |
| ISBN |
9781509084982
1509084983 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti |
VLSI Design
2007 International Conference on Thermal Issues in Emerging Technologies 2007 International Conference on Thermal Issues in Emerging Technologies: Theory and Application |
| Record Nr. | UNINA-9910143032703321 |
| IEEE | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||