top

  Info

  • Utilizzare la checkbox di selezione a fianco di ciascun documento per attivare le funzionalità di stampa, invio email, download nei formati disponibili del (i) record.

  Info

  • Utilizzare questo link per rimuovere la selezione effettuata.
10th IEEE Workshop on Signal Propagation on Interconnects : May 09-12, 2006, "Dorint Sofitel Schweizerhof Berlin", Berlin, Germany : proceedings / / co-sponsored by IEEE Components, Packaging and Manufacturing Technology Society (CPMT), Technical Committee on Electrical Design, Modeling and Simulation (TC-EMDS) [i.e. TC-EDMS], and by IEEE Computer Society, Test Technology Technical Council (TTTC)
10th IEEE Workshop on Signal Propagation on Interconnects : May 09-12, 2006, "Dorint Sofitel Schweizerhof Berlin", Berlin, Germany : proceedings / / co-sponsored by IEEE Components, Packaging and Manufacturing Technology Society (CPMT), Technical Committee on Electrical Design, Modeling and Simulation (TC-EMDS) [i.e. TC-EDMS], and by IEEE Computer Society, Test Technology Technical Council (TTTC)
Pubbl/distr/stampa IEEE
Disciplina 621.3815/31
Soggetto topico Printed circuits
Interconnects (Integrated circuit technology)
Signal theory (Telecommunication)
ISBN 1-5090-9224-2
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti 2006 IEEE Workship on Signal Propagation on Interconnects
Systems, Man and Cybernetics
Record Nr. UNISA-996279698403316
IEEE
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
10th IEEE Workshop on Signal Propagation on Interconnects : May 09-12, 2006, "Dorint Sofitel Schweizerhof Berlin", Berlin, Germany : proceedings / / co-sponsored by IEEE Components, Packaging and Manufacturing Technology Society (CPMT), Technical Committee on Electrical Design, Modeling and Simulation (TC-EMDS) [i.e. TC-EDMS], and by IEEE Computer Society, Test Technology Technical Council (TTTC)
10th IEEE Workshop on Signal Propagation on Interconnects : May 09-12, 2006, "Dorint Sofitel Schweizerhof Berlin", Berlin, Germany : proceedings / / co-sponsored by IEEE Components, Packaging and Manufacturing Technology Society (CPMT), Technical Committee on Electrical Design, Modeling and Simulation (TC-EMDS) [i.e. TC-EDMS], and by IEEE Computer Society, Test Technology Technical Council (TTTC)
Pubbl/distr/stampa IEEE
Disciplina 621.3815/31
Soggetto topico Printed circuits
Interconnects (Integrated circuit technology)
Signal theory (Telecommunication)
ISBN 1-5090-9224-2
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti 2006 IEEE Workship on Signal Propagation on Interconnects
Systems, Man and Cybernetics
Record Nr. UNINA-9910142665303321
IEEE
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Systems, Man and Cybernetics (SMC), 2014 IEEE International Conference on
Systems, Man and Cybernetics (SMC), 2014 IEEE International Conference on
Pubbl/distr/stampa IEEE
ISBN 1-4799-3840-8
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti 2014 IEEE International Conference on Systems, Man, and Cybernetics (SMC)
2014 IEEE International Conference on Systems, Man, and Cybernetics
Systems, Man and Cybernetics
Record Nr. UNISA-996280224003316
IEEE
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
Systems, Man and Cybernetics (SMC), 2014 IEEE International Conference on
Systems, Man and Cybernetics (SMC), 2014 IEEE International Conference on
Pubbl/distr/stampa IEEE
ISBN 1-4799-3840-8
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti 2014 IEEE International Conference on Systems, Man, and Cybernetics (SMC)
2014 IEEE International Conference on Systems, Man, and Cybernetics
Systems, Man and Cybernetics
Record Nr. UNINA-9910135592703321
IEEE
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui