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Particles on surfaces 8 : detection, adhesion and removal / / editor, K.L. Mittal
| Particles on surfaces 8 : detection, adhesion and removal / / editor, K.L. Mittal |
| Edizione | [First edition.] |
| Pubbl/distr/stampa | Utrecht ; ; Boston, : VSP, 2003 |
| Descrizione fisica | 1 online resource (361 p.) |
| Disciplina | 620/.44 |
| Altri autori (Persone) | MittalK. L. <1945-> |
| Soggetto topico |
Particles
Surfaces (Technology) |
| ISBN |
0-429-08813-2
1-280-46548-4 9786610465484 1-4175-7782-7 90-474-0333-9 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Contents; Preface; The nature and characterization of small particles; Surface and micro-analytical methods for particle identification; The haze of a wafer: A new approach to monitor nano-sized particles; Particle transport and adhesion in an ultra-clean ion-beam sputter deposition process; Particle deposition from a carry-over layer during immersion rinsing; The use of surfactants to reduce particulate contamination on surfaces; The use of rectangular jets for surface decontamination; Ice-air blast cleaning: Case studies
Development of a technique for glass cleaning in the course of demanufacturing of electronic productsMechanics of nanoparticle adhesion - A continuum approach; A new thermodynamic theory of adhesion of particles on surfaces; Particle adhesion on nanoscale rough surfaces; Advanced wet cleaning of sub-micrometer sized particles; Modified SC-1 solutions for silicon wafer cleaning; Investigation of ozonated DI water in semiconductor wafer cleaning; Possible post-CMP cleaning processes for STI ceria slurries; The ideal ultrasonic parameters for delicate parts cleaning Effects of megasonics coupled with SC-1 process parameters on particle removal on 300-mm silicon wafersInfluences of various parameters on microparticles removal during laser surface cleaning; Particle removal with pulsed-laser induced plasma over an extended area of a silicon wafer; Particle removal by collisions with energetic clusters |
| Altri titoli varianti | Particles on surfaces eight |
| Record Nr. | UNINA-9910816981303321 |
| Utrecht ; ; Boston, : VSP, 2003 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Particles on surfaces: detection, adhesion and removal . Volume 8 / / edited by Kash L. Mittal
| Particles on surfaces: detection, adhesion and removal . Volume 8 / / edited by Kash L. Mittal |
| Edizione | [First edition.] |
| Pubbl/distr/stampa | Boca Raton, FL : , : CRC Press, an imprint of Taylor and Francis, , 2003 |
| Descrizione fisica | 1 online resource (361 p.) |
| Disciplina | 620/.44 |
| Soggetto topico |
Particles
Surfaces (Technology) |
| Soggetto genere / forma | Electronic books. |
| ISBN |
0-429-08813-2
1-280-46548-4 9786610465484 1-4175-7782-7 90-474-0333-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Contents; Preface; The nature and characterization of small particles; Surface and micro-analytical methods for particle identification; The haze of a wafer: A new approach to monitor nano-sized particles; Particle transport and adhesion in an ultra-clean ion-beam sputter deposition process; Particle deposition from a carry-over layer during immersion rinsing; The use of surfactants to reduce particulate contamination on surfaces; The use of rectangular jets for surface decontamination; Ice-air blast cleaning: Case studies
Development of a technique for glass cleaning in the course of demanufacturing of electronic productsMechanics of nanoparticle adhesion - A continuum approach; A new thermodynamic theory of adhesion of particles on surfaces; Particle adhesion on nanoscale rough surfaces; Advanced wet cleaning of sub-micrometer sized particles; Modified SC-1 solutions for silicon wafer cleaning; Investigation of ozonated DI water in semiconductor wafer cleaning; Possible post-CMP cleaning processes for STI ceria slurries; The ideal ultrasonic parameters for delicate parts cleaning Effects of megasonics coupled with SC-1 process parameters on particle removal on 300-mm silicon wafersInfluences of various parameters on microparticles removal during laser surface cleaning; Particle removal with pulsed-laser induced plasma over an extended area of a silicon wafer; Particle removal by collisions with energetic clusters |
| Altri titoli varianti | Particles on surfaces eight |
| Record Nr. | UNINA-9910450117003321 |
| Boca Raton, FL : , : CRC Press, an imprint of Taylor and Francis, , 2003 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Particles on surfaces: detection, adhesion and removal . Volume 8 / / edited by Kash L. Mittal
| Particles on surfaces: detection, adhesion and removal . Volume 8 / / edited by Kash L. Mittal |
| Edizione | [First edition.] |
| Pubbl/distr/stampa | Boca Raton, FL : , : CRC Press, an imprint of Taylor and Francis, , 2003 |
| Descrizione fisica | 1 online resource (361 p.) |
| Disciplina | 620/.44 |
| Soggetto topico |
Particles
Surfaces (Technology) |
| ISBN |
0-429-08813-2
1-280-46548-4 9786610465484 1-4175-7782-7 90-474-0333-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Contents; Preface; The nature and characterization of small particles; Surface and micro-analytical methods for particle identification; The haze of a wafer: A new approach to monitor nano-sized particles; Particle transport and adhesion in an ultra-clean ion-beam sputter deposition process; Particle deposition from a carry-over layer during immersion rinsing; The use of surfactants to reduce particulate contamination on surfaces; The use of rectangular jets for surface decontamination; Ice-air blast cleaning: Case studies
Development of a technique for glass cleaning in the course of demanufacturing of electronic productsMechanics of nanoparticle adhesion - A continuum approach; A new thermodynamic theory of adhesion of particles on surfaces; Particle adhesion on nanoscale rough surfaces; Advanced wet cleaning of sub-micrometer sized particles; Modified SC-1 solutions for silicon wafer cleaning; Investigation of ozonated DI water in semiconductor wafer cleaning; Possible post-CMP cleaning processes for STI ceria slurries; The ideal ultrasonic parameters for delicate parts cleaning Effects of megasonics coupled with SC-1 process parameters on particle removal on 300-mm silicon wafersInfluences of various parameters on microparticles removal during laser surface cleaning; Particle removal with pulsed-laser induced plasma over an extended area of a silicon wafer; Particle removal by collisions with energetic clusters |
| Altri titoli varianti | Particles on surfaces eight |
| Record Nr. | UNINA-9910783226703321 |
| Boca Raton, FL : , : CRC Press, an imprint of Taylor and Francis, , 2003 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||