Info
- Utilizzare la checkbox di selezione a fianco di ciascun documento per attivare le funzionalità di stampa, invio email, download nei formati disponibili del (i) record.
LCP for microwave packages and modules / / [edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara [[electronic resource]]
| LCP for microwave packages and modules / / [edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara [[electronic resource]] |
| Pubbl/distr/stampa | Cambridge : , : Cambridge University Press, , 2012 |
| Descrizione fisica | 1 online resource (xiv, 253 pages) : digital, PDF file(s) |
| Disciplina | 621.381/3 |
| Collana | The Cambridge RF and microwave engineering series |
| Soggetto topico |
Microwave devices - Materials
Flexible electronics Microelectronic packaging - Materials Liquid crystal devices Polymer liquid crystals |
| ISBN |
1-107-22699-6
1-139-41127-6 1-280-77372-3 9786613684493 1-139-42263-4 0-511-77724-8 1-139-41961-7 1-139-41756-8 1-139-42166-2 1-139-42370-3 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Machine generated contents note: 1. Introduction; 2. Characteristics of liquid crystal polymer (LCP) Morgan J. Chen, Kunia Aihara, Cheng Chen and Anh-Vu H. Pham; 3. Fabrication techniques for processing LCP laminates; 4. LCP for wafer level chip scale MEMS; 5. LCP for surface mount interconnects, packages, and modules; 6. LCP for passive components Hai Ta, Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 7. LCP for system design Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 8. LCP reliability. |
| Altri titoli varianti | LCP for Microwave Packages & Modules |
| Record Nr. | UNINA-9910462435303321 |
| Cambridge : , : Cambridge University Press, , 2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
LCP for microwave packages and modules / / [edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara [[electronic resource]]
| LCP for microwave packages and modules / / [edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara [[electronic resource]] |
| Pubbl/distr/stampa | Cambridge : , : Cambridge University Press, , 2012 |
| Descrizione fisica | 1 online resource (xiv, 253 pages) : digital, PDF file(s) |
| Disciplina | 621.381/3 |
| Collana | The Cambridge RF and microwave engineering series |
| Soggetto topico |
Microwave devices - Materials
Flexible electronics Microelectronic packaging - Materials Liquid crystal devices Polymer liquid crystals |
| ISBN |
1-107-22699-6
1-139-41127-6 1-280-77372-3 9786613684493 1-139-42263-4 0-511-77724-8 1-139-41961-7 1-139-41756-8 1-139-42166-2 1-139-42370-3 |
| Classificazione | TEC024000 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Machine generated contents note: 1. Introduction; 2. Characteristics of liquid crystal polymer (LCP) Morgan J. Chen, Kunia Aihara, Cheng Chen and Anh-Vu H. Pham; 3. Fabrication techniques for processing LCP laminates; 4. LCP for wafer level chip scale MEMS; 5. LCP for surface mount interconnects, packages, and modules; 6. LCP for passive components Hai Ta, Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 7. LCP for system design Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 8. LCP reliability. |
| Altri titoli varianti | LCP for Microwave Packages & Modules |
| Record Nr. | UNINA-9910790345703321 |
| Cambridge : , : Cambridge University Press, , 2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||