In the matter of certain semiconductor chips with minimized chip package size and products containing same (III) [[electronic resource] ] : investigation no. 337-TA-630

• Pubblicazione: Washington, DC : , : U.S. International Trade Commission, , [2010]
• Descrizione fisica: 1 online resource (249 unnumbered pages)
• Soggetto topico: Semiconductor industry - United States; Patent infringement
• Soggetto geografico: United States Commercial policy
• Note generali: Title from title screen (viewed on July 2, 2012).; "December 2010."
• Nota di bibliografia: Includes bibliographical references.
• Altri titoli varianti: In the matter of certain semiconductor chips with minimized chip package size and products containing same
• Titolo autorizzato: In the matter of certain semiconductor chips with minimized chip package size and products containing same (III)
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: 9910700871503321
• Lo trovi qui: Univ. Federico II