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Cosmetic and toiletry formulations . Volume 8 / / by Ernest W. Flick
| Cosmetic and toiletry formulations . Volume 8 / / by Ernest W. Flick |
| Autore | Flick Ernest W |
| Edizione | [2nd ed.] |
| Pubbl/distr/stampa | Norwich, New York, : Noyes Publications, : William Andrew Publishing, 2001 |
| Descrizione fisica | 1 online resource (401 p.) |
| Disciplina |
668.55
668/.55 |
| Soggetto topico |
Cosmetics
Toilet preparations |
| ISBN |
1-282-01375-0
1-282-75524-2 9786612013751 9786612755248 0-08-094686-0 0-8155-1676-2 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Front Cover; Cosmetic and Toiletry Formulations; Copyright Page; Contents and Subject Index; SECTION I: ANTIPERSIPIRANTS AND DEODORANTS; Antiperspirant Roll-On; Antiperspirant Stick; Antiperspirant Solid; Antiperspirant Gel; Antiperspirant Stick; Antiperspirant Roll-On; Antiperspirant Suspension Roll-On; Antiperspirant Roll-On Emulsion; Deodorant Stick; Deodorant Stick with Phospholipid CDM; Promidium Deodorant Stick; Antiperspirant Stick; SECTION II: BABY PRODUCTS; Aloe Baby Lotion; Baby Bath; Baby Shampoo; Baby Lotion with Vitamin E and Aloe; Diaper Rash Cream with Aloe; Baby Milk
Baby CreamBaby Shampoo; Baby Wipes; Baby Shampoo with Olive Oil; Baby Care Cream; Baby Shampoo III; Baby Shampoo; Diaper Rash Cream; Sun Protection Baby Cream; Tear Free Baby Bath; Mild Children's Bubble Bath; Baby Wash; SECTION III: BATH AND SHOWER PRODUCTS; Bath Oil (2); Shower Bath; Bubble Bath (2); Clear Mild Body Wash; Emollient Bath Gelee; Conditioning Body Wash; Bath Gelee with Natural Lipid Protein; Emollient Body Wash; Bath Gelee with Silk Protein Quaternized to Natural Skin Emollients; Fitness Shower Gel; Washing Lotion; Foam Bath; Creamy Foam Bath; Foaming Bath Oil; Bath Oil Milk High Fragrance Bubble BathMoisturizing Three Layer Bath Oil; Milk Bath; After-Bath Oil; Moisturizing Body Wash; Moisturizing Shower Gel; Silky Shower Gel; Oil Foam Bath; Mild Foam Bath; Oil Bath Slightly Foaming with Good Refatting Property; Pearlescent Bath Lotion; Bath Oil; Shower Cream; Shower Gel; Shower Gel (2); Shower Gel (2); Shower Gel (2); Shower Gel with Avocado Exfoliants; Shower Gel with Jojoba Wax Exfoliants; Transparent Bath and Shower Bar; Bath Gelee; Transparent Bath and Shower Bar; Shower Soap; Ultra Mild Body Wash for Sensitive Skin; Ultra Mild body Wash for Normal Skin Ultra Mild Body Wash for Dry SkinMild Bubble Bath; 2 in 1 Shower Gel; Shower Gel; SECTION IV: BEAUTY AIDS; After Bath Spray Moisturizer; Clear Body Moisturizer; Anti-Aging Cream; Beta Hydroxy Moisturizing Clear Gel; Cleansing Milk; Chapstick Prototype; Clear AHA Moisturiser; Cream Eye Shadow; Eye Firming Gel; Creamy Lipstick; Lip Balm with Lanolin; Deep Red Lipstick; Lip Balm with Vitamin A; Eye Area Firming Gel; Face Bronzer with Sunscreen; Face Bronzer with Sunscreen; Facial Cleanser (2); Facial Mask; Facial Gel Cleanser; Facial Scrub; Facial Soap; Sting Free Facial Cleanser; Cleansing Milk Lip BalmLip Moisturizer; Lip Gloss with D-Panthenol; Lipstick; Liposilt Black Body Mask; Liposilt Black Cleansing Silt; Liposilt Green Cleansing Mud; Lipstick Base; High Melting Point Lipstick; Liquid Make-up with Panalane L14E and Ultrar esistant Pigments and Increased Wetting Agents; Liquid Talc; Body Silkening Dry Oil; Low Temperature Flowable Skin Cleanser; Clear Conditioning Silky Body Cleanser; Make-Up Base; Mascara Using Avalure UR 450 PolymerA002; ""Matte-Finish"" Make-Up; ""Matte-Finish"" Emollient Make-Up Formula for Lotion; Formula for Make-Up; Moisturiser with UV-Protection (2) Moisturiser with UV Protection |
| Record Nr. | UNINA-9911006843403321 |
Flick Ernest W
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| Norwich, New York, : Noyes Publications, : William Andrew Publishing, 2001 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Fire behavior of upholstered furniture and mattresses / / by John F. Krasny, William J. Parker, Vytenis Babrauskas
| Fire behavior of upholstered furniture and mattresses / / by John F. Krasny, William J. Parker, Vytenis Babrauskas |
| Autore | Krasny John |
| Pubbl/distr/stampa | Park Ridge, N.J., : Noyes Publications |
| Descrizione fisica | 1 online resource (xiii, 437 pages) : illustrations |
| Disciplina |
628.9222
645.4 |
| Altri autori (Persone) |
ParkerW. J <1926-> (William James)
BabrauskasVytenis |
| Soggetto topico |
Bedding - Fire testing
Fire resistant materials Furniture - Fire testing Upholstery - Fire testing Upholstered furniture - Fire testing |
| ISBN |
9786612002434
9780815514572 9781591241775 1591241774 9781282002432 1282002430 9780080946870 0080946879 9780815517207 0815517203 978-0-8155-1457-3 9780815514573 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Fundamentals -- Test methods, standards and regulations -- Ignition sources -- Effects of test apparatus and of test scale -- Upholstered item design engineering -- Modeling -- Fire hazard analysis. |
| Record Nr. | UNINA-9911006843103321 |
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Krasny John
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| Park Ridge, N.J., : Noyes Publications | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Plastics additives [[electronic resource] ] : an industrial guide . Volume 3 / / by Ernest W. Flick
| Plastics additives [[electronic resource] ] : an industrial guide . Volume 3 / / by Ernest W. Flick |
| Autore | Flick Ernest W |
| Edizione | [3rd ed.] |
| Pubbl/distr/stampa | Norwich, N.Y., : William Andrew Publishing, c2002 |
| Descrizione fisica | 1 online resource (160 p.) |
| Disciplina |
668.4/11
668.41 |
| Collana | Plastics Design Library |
| Soggetto topico |
Plastics - Additives
Polymers - Additives |
| ISBN |
0-08-094692-5
0-8155-1864-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | FRONT COVER; PLASTICS ADDITIVES Volume III; Preface; Contents and Subject Index; Section XX Stabilizers; Section XXI Stearates; Section XXII UV Absorbers; Section XXIII Viscosity Regulators; Section XXIV Waxes; Section XXV Miscellaneous & Multipurpose Compounds; Tradenames; Suppliers' Address |
| Record Nr. | UNINA-9911006840003321 |
|
Flick Ernest W
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| Norwich, N.Y., : William Andrew Publishing, c2002 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Rheology Modifiers Handbook : Practical Use and Application / David B. Braun and Meyer R. Rosen
| Rheology Modifiers Handbook : Practical Use and Application / David B. Braun and Meyer R. Rosen |
| Pubbl/distr/stampa | New York : William Andrew Publishing, 2000 |
| Descrizione fisica | IX, 505 p. : ill. ; 24 cm |
| Altri autori (Persone) |
Braun, David B.
Rosen, Meyer R. |
| ISBN | 0-8155-1441-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-990000903490403321 |
| New York : William Andrew Publishing, 2000 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Sputtering materials for VLSI and thin film devices / / by Jaydeep Sarkar
| Sputtering materials for VLSI and thin film devices / / by Jaydeep Sarkar |
| Autore | Sarkar Jaydeep |
| Edizione | [First edition.] |
| Pubbl/distr/stampa | Oxford ; ; Boston : , : William Andrew Publishing, , 2014 |
| Descrizione fisica | 1 online resource (614 p.) |
| Disciplina | 621.381 |
| Soggetto topico |
Microelectronics - Materials
Flat panel displays - Materials Sputtering (Physics) |
| Soggetto genere / forma | Electronic books. |
| ISBN |
0-12-810080-X
0-8155-1987-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Front Cover; Sputtering Materials for VLSI and Thin Film Devices; Copyright Page; Contents; Preface; 1 Sputtering Targets and Sputtered Films for the Microelectronic Industry; 1.1 Materials for microelectronics; 1.1.1 Introduction; 1.1.1.1 Electrical conductivity; 1.1.2 Conductors; 1.1.3 Semiconductors; 1.1.4 Insulators; 1.2 Scope of sputtering in microelectronics; 1.3 Sputtering materials for integrated circuits; 1.3.1 Introduction; 1.3.2 Silicide contact; 1.3.3 Conductor, liner, barrier and anti-reflection coating; 1.3.4 Assembly and packaging (back-end processes)
1.3.4.1 Under bump metallization (UBM) and bond pad1.3.4.2 Through-silicon-via (TSV); 1.4 Sputtering materials for liquid crystal displays; 1.4.1 Introduction; 1.4.2 Active-matrix liquid crystal displays; 1.4.2.1 TFT array fabrication; 1.4.2.2 Cell assembly and Module assembly fabrication; 1.5 Sputtering materials for magnetic storage systems; 1.5.1 Introduction; 1.5.2 Thin film heads; 1.5.2.1 Inductive head; 1.5.2.2 Magnetoresistive head (MR heads); 1.5.2.3 Giant magnetoresistive head (GMR head); 1.5.3 Magnetic recording media; 1.6 Sputtering materials for optical storage media 1.7 Sputtering materials for photovoltaic devices1.7.1 Silicon wafer based solar cells; 1.7.2 Thin film solar cells; 1.8 Sputtering target industry; References; 2 Sputtering and Thin Film Deposition; 2.1 Introduction; 2.2 Physical vapor deposition; 2.3 Plasma and glow discharge; 2.4 Sputter deposition of thin films; 2.4.1 DC sputtering; 2.4.2 RF sputtering; 2.4.3 Reactive sputtering; 2.4.4 Magnetron sputtering; 2.4.4.1 Directional sputter deposition; 2.4.4.1.1 Long-throw sputter deposition; 2.4.4.1.2 Collimated sputter deposition; 2.4.4.2 Ionized physical vapor deposition (I-PVD) 2.4.4.3 Hollow cathode magnetron2.4.4.4 Magnetrons for large area coating; 2.5 Thin film characteristics; References; 3 Performance of Sputtering Targets and Productivity; 3.1 Introduction; 3.2 Target chemistry; 3.3 Target metallurgy; 3.3.1 Grain size inhomogeneity and banding of grains; 3.3.2 Second-phase particles, inclusions and porosity; 3.3.3 Preferred orientation of grains; 3.3.4 Sputter surface roughness and overall finish; 3.3.5 Particle performance; 3.3.6 Target bond characteristics; 3.4 Ferromagnetic targets; 3.5 Target cleaning and packaging; 3.6 Target burn-in 3.7 Target utilizationReferences; 4 Sputtering Target Manufacturing; 4.1 Introduction; 4.2 Designing sputtering targets; 4.3 Target material fabrication; 4.3.1 Liquid metallurgy processing of targets; 4.3.1.1 Cast structure; 4.3.1.1.1 Phase diagram and microstructure; 4.3.1.1.2 Melting and casting practice; 4.3.1.2 Segregation and inclusion; 4.3.1.3 Pipe and porosity; 4.3.2 Powder metallurgy processing of targets; 4.3.2.1 Powder preparation; 4.3.2.2 Powder compaction; 4.3.2.3 Powder consolidation using sintering; 4.3.2.3.1 Solid phase sintering; 4.3.2.3.2 Liquid phase sintering 4.3.2.3.3 Consolidation practice |
| Record Nr. | UNINA-9910453224803321 |
|
Sarkar Jaydeep
|
||
| Oxford ; ; Boston : , : William Andrew Publishing, , 2014 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Sputtering materials for VLSI and thin film devices / / by Jaydeep Sarkar
| Sputtering materials for VLSI and thin film devices / / by Jaydeep Sarkar |
| Autore | Sarkar Jaydeep |
| Edizione | [First edition.] |
| Pubbl/distr/stampa | Oxford ; ; Boston : , : William Andrew Publishing, , 2014 |
| Descrizione fisica | 1 online resource (614 p.) |
| Disciplina | 621.381 |
| Soggetto topico |
Microelectronics - Materials
Flat panel displays - Materials Sputtering (Physics) |
| ISBN |
0-12-810080-X
0-8155-1987-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Front Cover; Sputtering Materials for VLSI and Thin Film Devices; Copyright Page; Contents; Preface; 1 Sputtering Targets and Sputtered Films for the Microelectronic Industry; 1.1 Materials for microelectronics; 1.1.1 Introduction; 1.1.1.1 Electrical conductivity; 1.1.2 Conductors; 1.1.3 Semiconductors; 1.1.4 Insulators; 1.2 Scope of sputtering in microelectronics; 1.3 Sputtering materials for integrated circuits; 1.3.1 Introduction; 1.3.2 Silicide contact; 1.3.3 Conductor, liner, barrier and anti-reflection coating; 1.3.4 Assembly and packaging (back-end processes)
1.3.4.1 Under bump metallization (UBM) and bond pad1.3.4.2 Through-silicon-via (TSV); 1.4 Sputtering materials for liquid crystal displays; 1.4.1 Introduction; 1.4.2 Active-matrix liquid crystal displays; 1.4.2.1 TFT array fabrication; 1.4.2.2 Cell assembly and Module assembly fabrication; 1.5 Sputtering materials for magnetic storage systems; 1.5.1 Introduction; 1.5.2 Thin film heads; 1.5.2.1 Inductive head; 1.5.2.2 Magnetoresistive head (MR heads); 1.5.2.3 Giant magnetoresistive head (GMR head); 1.5.3 Magnetic recording media; 1.6 Sputtering materials for optical storage media 1.7 Sputtering materials for photovoltaic devices1.7.1 Silicon wafer based solar cells; 1.7.2 Thin film solar cells; 1.8 Sputtering target industry; References; 2 Sputtering and Thin Film Deposition; 2.1 Introduction; 2.2 Physical vapor deposition; 2.3 Plasma and glow discharge; 2.4 Sputter deposition of thin films; 2.4.1 DC sputtering; 2.4.2 RF sputtering; 2.4.3 Reactive sputtering; 2.4.4 Magnetron sputtering; 2.4.4.1 Directional sputter deposition; 2.4.4.1.1 Long-throw sputter deposition; 2.4.4.1.2 Collimated sputter deposition; 2.4.4.2 Ionized physical vapor deposition (I-PVD) 2.4.4.3 Hollow cathode magnetron2.4.4.4 Magnetrons for large area coating; 2.5 Thin film characteristics; References; 3 Performance of Sputtering Targets and Productivity; 3.1 Introduction; 3.2 Target chemistry; 3.3 Target metallurgy; 3.3.1 Grain size inhomogeneity and banding of grains; 3.3.2 Second-phase particles, inclusions and porosity; 3.3.3 Preferred orientation of grains; 3.3.4 Sputter surface roughness and overall finish; 3.3.5 Particle performance; 3.3.6 Target bond characteristics; 3.4 Ferromagnetic targets; 3.5 Target cleaning and packaging; 3.6 Target burn-in 3.7 Target utilizationReferences; 4 Sputtering Target Manufacturing; 4.1 Introduction; 4.2 Designing sputtering targets; 4.3 Target material fabrication; 4.3.1 Liquid metallurgy processing of targets; 4.3.1.1 Cast structure; 4.3.1.1.1 Phase diagram and microstructure; 4.3.1.1.2 Melting and casting practice; 4.3.1.2 Segregation and inclusion; 4.3.1.3 Pipe and porosity; 4.3.2 Powder metallurgy processing of targets; 4.3.2.1 Powder preparation; 4.3.2.2 Powder compaction; 4.3.2.3 Powder consolidation using sintering; 4.3.2.3.1 Solid phase sintering; 4.3.2.3.2 Liquid phase sintering 4.3.2.3.3 Consolidation practice |
| Record Nr. | UNINA-9910790864503321 |
|
Sarkar Jaydeep
|
||
| Oxford ; ; Boston : , : William Andrew Publishing, , 2014 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
