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Electronic materials / / [written by] H. L. Kwok
| Electronic materials / / [written by] H. L. Kwok |
| Autore | Kwok H. L. |
| Pubbl/distr/stampa | Stafa-Zuerich, Switzerland ; ; Enfield, New Hampshire : , : Trans Tech Publications LTD, , [2010] |
| Descrizione fisica | 1 online resource (484 p.) |
| Disciplina | 531 |
| Collana | Materials science foundations |
| Soggetto topico | Electronics - Materials |
| Soggetto genere / forma | Electronic books. |
| ISBN | 3-03813-443-0 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Electronic Materials; Preamble; Table of Contents ; Table of Contents; Chapter I. THE BASIC STRUCTURES OF SOLIDS; I-1. Introduction. I-2. Atoms and Binding Forces; I-3. Crystal Structures; I-4. Crystalline Solids; I-5. Polycrystalline and Non-Crystalline Solids; I-6. The Phase Diagrams; I-7. Techniques on Crystal Growth and Thin Film Deposition; I-8. Crystal Imperfection; I-9. Diffusion in Solids; I-10. Physical Diagnostic Tools; Glossary; References; Exercises for Chapter I; Chapter II. ELECTRICAL PROPERTIES OF SOLIDS; II-1. Introduction. II-2. Electrons in a Solid
II-3. Energy Distribution of the ElectronsII-4. The Energy Band Diagram; II-5. Mathematical Formulation of the Conduction Processes; II-6. Conductors; II-7. Semiconductors; II-8. Other Conduction Mechanisms; II-9. Velocity Saturation and Negative-Resistance Effect; II-10. Insulators; Glossary for End-of-Chapter Review; References; Exercises for Chapter II; Chapter III. P-N JUNCTIONS AND RELATED DEVICES; III-1. Introduction. III-2. Concept of a P-N Junction; III-3. Schottky Junction and its Electronic Properties; III-4. Metal-Semiconductor Contact III-5. MIS Junction and Field-Effect PropertiesIII-6. Materials Considerations; III-7. Structures and Operation of Transistors; III-8. Non-Ideal Effects and other Performance Parameters; III-9. New Transistors; Glossary for End-of-Chapter Review; References; Exercises for Chapter III; Chapter IV. OPTICAL PROPERTIES OF SOLIDS; IV-1. Introduction. IV-2. Review of the Properties of Light; IV-3. The Absorption Process; IV-4. The Emission Process; IV-5. Imagers; IV-6. Displays; IV-7. Power Generation; IV-8. Optical Signal Transmission Media; Glossary; References; Exercises for Chapter IV Chapter V. MAGNETIC AND SUPERCONDUCTING PROPERTIES OF SOLIDSV-1. Introduction; V-2. Magnetic Properties of Solids; V-3. Sources of Magnetization; V-4. Magnetic Anisotropy and Invar Alloys; V-5. Amorphous Magnetic Materials; V-6. Soft Magnets and Hard Magnets; V-7. Magnetic Devices and Applications; V-8. Properties of Superconductors; V-9. Applications of Superconductors; V-10. Superconducting Materials; Glossary for End-of-Chapter Review; References; Exercises for Chapter V; Chapter VI. MICROMACHINES, SENSORS AND PACKAGING MATERIALS; VI-1. Introduction. VI-2. Micromachining |
| Record Nr. | UNINA-9910465170903321 |
Kwok H. L.
|
||
| Stafa-Zuerich, Switzerland ; ; Enfield, New Hampshire : , : Trans Tech Publications LTD, , [2010] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Electronic materials / / [written by] H. L. Kwok
| Electronic materials / / [written by] H. L. Kwok |
| Autore | Kwok H. L. |
| Pubbl/distr/stampa | Stafa-Zuerich, Switzerland ; ; Enfield, New Hampshire : , : Trans Tech Publications LTD, , [2010] |
| Descrizione fisica | 1 online resource (484 p.) |
| Disciplina | 531 |
| Collana | Materials science foundations |
| Soggetto topico | Electronics - Materials |
| ISBN | 3-03813-443-0 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Electronic Materials; Preamble; Table of Contents ; Table of Contents; Chapter I. THE BASIC STRUCTURES OF SOLIDS; I-1. Introduction. I-2. Atoms and Binding Forces; I-3. Crystal Structures; I-4. Crystalline Solids; I-5. Polycrystalline and Non-Crystalline Solids; I-6. The Phase Diagrams; I-7. Techniques on Crystal Growth and Thin Film Deposition; I-8. Crystal Imperfection; I-9. Diffusion in Solids; I-10. Physical Diagnostic Tools; Glossary; References; Exercises for Chapter I; Chapter II. ELECTRICAL PROPERTIES OF SOLIDS; II-1. Introduction. II-2. Electrons in a Solid
II-3. Energy Distribution of the ElectronsII-4. The Energy Band Diagram; II-5. Mathematical Formulation of the Conduction Processes; II-6. Conductors; II-7. Semiconductors; II-8. Other Conduction Mechanisms; II-9. Velocity Saturation and Negative-Resistance Effect; II-10. Insulators; Glossary for End-of-Chapter Review; References; Exercises for Chapter II; Chapter III. P-N JUNCTIONS AND RELATED DEVICES; III-1. Introduction. III-2. Concept of a P-N Junction; III-3. Schottky Junction and its Electronic Properties; III-4. Metal-Semiconductor Contact III-5. MIS Junction and Field-Effect PropertiesIII-6. Materials Considerations; III-7. Structures and Operation of Transistors; III-8. Non-Ideal Effects and other Performance Parameters; III-9. New Transistors; Glossary for End-of-Chapter Review; References; Exercises for Chapter III; Chapter IV. OPTICAL PROPERTIES OF SOLIDS; IV-1. Introduction. IV-2. Review of the Properties of Light; IV-3. The Absorption Process; IV-4. The Emission Process; IV-5. Imagers; IV-6. Displays; IV-7. Power Generation; IV-8. Optical Signal Transmission Media; Glossary; References; Exercises for Chapter IV Chapter V. MAGNETIC AND SUPERCONDUCTING PROPERTIES OF SOLIDSV-1. Introduction; V-2. Magnetic Properties of Solids; V-3. Sources of Magnetization; V-4. Magnetic Anisotropy and Invar Alloys; V-5. Amorphous Magnetic Materials; V-6. Soft Magnets and Hard Magnets; V-7. Magnetic Devices and Applications; V-8. Properties of Superconductors; V-9. Applications of Superconductors; V-10. Superconducting Materials; Glossary for End-of-Chapter Review; References; Exercises for Chapter V; Chapter VI. MICROMACHINES, SENSORS AND PACKAGING MATERIALS; VI-1. Introduction. VI-2. Micromachining |
| Record Nr. | UNINA-9910786505403321 |
|
Kwok H. L.
|
||
| Stafa-Zuerich, Switzerland ; ; Enfield, New Hampshire : , : Trans Tech Publications LTD, , [2010] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Electronic materials / / [written by] H. L. Kwok
| Electronic materials / / [written by] H. L. Kwok |
| Autore | Kwok H. L. |
| Pubbl/distr/stampa | Stafa-Zuerich, Switzerland ; ; Enfield, New Hampshire : , : Trans Tech Publications LTD, , [2010] |
| Descrizione fisica | 1 online resource (484 p.) |
| Disciplina | 531 |
| Collana | Materials science foundations |
| Soggetto topico | Electronics - Materials |
| ISBN | 3-03813-443-0 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Electronic Materials; Preamble; Table of Contents ; Table of Contents; Chapter I. THE BASIC STRUCTURES OF SOLIDS; I-1. Introduction. I-2. Atoms and Binding Forces; I-3. Crystal Structures; I-4. Crystalline Solids; I-5. Polycrystalline and Non-Crystalline Solids; I-6. The Phase Diagrams; I-7. Techniques on Crystal Growth and Thin Film Deposition; I-8. Crystal Imperfection; I-9. Diffusion in Solids; I-10. Physical Diagnostic Tools; Glossary; References; Exercises for Chapter I; Chapter II. ELECTRICAL PROPERTIES OF SOLIDS; II-1. Introduction. II-2. Electrons in a Solid
II-3. Energy Distribution of the ElectronsII-4. The Energy Band Diagram; II-5. Mathematical Formulation of the Conduction Processes; II-6. Conductors; II-7. Semiconductors; II-8. Other Conduction Mechanisms; II-9. Velocity Saturation and Negative-Resistance Effect; II-10. Insulators; Glossary for End-of-Chapter Review; References; Exercises for Chapter II; Chapter III. P-N JUNCTIONS AND RELATED DEVICES; III-1. Introduction. III-2. Concept of a P-N Junction; III-3. Schottky Junction and its Electronic Properties; III-4. Metal-Semiconductor Contact III-5. MIS Junction and Field-Effect PropertiesIII-6. Materials Considerations; III-7. Structures and Operation of Transistors; III-8. Non-Ideal Effects and other Performance Parameters; III-9. New Transistors; Glossary for End-of-Chapter Review; References; Exercises for Chapter III; Chapter IV. OPTICAL PROPERTIES OF SOLIDS; IV-1. Introduction. IV-2. Review of the Properties of Light; IV-3. The Absorption Process; IV-4. The Emission Process; IV-5. Imagers; IV-6. Displays; IV-7. Power Generation; IV-8. Optical Signal Transmission Media; Glossary; References; Exercises for Chapter IV Chapter V. MAGNETIC AND SUPERCONDUCTING PROPERTIES OF SOLIDSV-1. Introduction; V-2. Magnetic Properties of Solids; V-3. Sources of Magnetization; V-4. Magnetic Anisotropy and Invar Alloys; V-5. Amorphous Magnetic Materials; V-6. Soft Magnets and Hard Magnets; V-7. Magnetic Devices and Applications; V-8. Properties of Superconductors; V-9. Applications of Superconductors; V-10. Superconducting Materials; Glossary for End-of-Chapter Review; References; Exercises for Chapter V; Chapter VI. MICROMACHINES, SENSORS AND PACKAGING MATERIALS; VI-1. Introduction. VI-2. Micromachining |
| Record Nr. | UNINA-9910814185403321 |
|
Kwok H. L.
|
||
| Stafa-Zuerich, Switzerland ; ; Enfield, New Hampshire : , : Trans Tech Publications LTD, , [2010] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Theory, modeling and numerical simulation of multi-physics materials behavior : selected, peer-reviewed papers from the symposium : theory, modeling and numerical simulation of multi-physics materials behavior, organized within the MRS fall meeting 2007 held in Boston, MA, USA November 26-30 2007 / / edited by Veena Tikare [and others]
| Theory, modeling and numerical simulation of multi-physics materials behavior : selected, peer-reviewed papers from the symposium : theory, modeling and numerical simulation of multi-physics materials behavior, organized within the MRS fall meeting 2007 held in Boston, MA, USA November 26-30 2007 / / edited by Veena Tikare [and others] |
| Pubbl/distr/stampa | Stafa-Zurich : , : Trans Tech Publications LTD, , [2008] |
| Descrizione fisica | 1 online resource (171 p.) |
| Disciplina | 620.1120151 |
| Altri autori (Persone) | TikareVeena |
| Collana | Diffusion and defect data. Pt. B. Solid state phenomena |
| Soggetto topico |
Materials - Mathematical models
Materials - Simulation methods |
| Soggetto genere / forma | Electronic books. |
| ISBN | 3-03813-200-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Theory, Modeling and Numerical Simulation; Preface ; Table of Contents; Atomistic Simulations of the Aluminum-Silicon Interfaces under Shear Loading; Shock Loading of Bone-Inspired Metallic Nanocomposites; Hydrogen Storage in MgH2 Matrices: An Ab-Initio Study of Mg-MgH2 Interface ; First-Principles Calculations of the Atomic and Electronic Structures in Au-Pd Slab Interfaces; In-Diffusion and Out-Diffusion of Oxygen from a Composite Containing Random Traps; Effects of Supports on Hydrogen Adsorption on Pt Clusters; First-Principles Calculations of Pd/Au(100) Interfaces with Adsorbates
In-Plane Rotated Crystal Structure in Continuous Growth of Bismuth Cuprate Superconducting FilmDynamical Interaction between Thermally Activated Glide of Screw Dislocation and Self-Interstitial Clusters in Bcc Fe; The Effects of Solute Segregation on the Evolution and Strength of Dislocation Junctions; Physics Mechanisms Involved in the Formation and Recrystallization of Amorphous Regions in Si through Ion Irradiation; Hotspot Formation in Shock-Induced Void Collapse; Molecular Dynamics Simulation of Nanocrystalline Tantalum under Uniaxial Tension Diffusion Mechanisms near Tilt Grain Boundaries in Ni3Al IntermetallidePhase-Transformation Wave Dynamics in LiFePO4 ; Molecular-Dynamics Analysis of the Structural Properties of Silica during Cooling; Atomistic Simulations of Copper Precipitation and Radiation Induced Segregation in α-Iron; Ab-Initio Calculation for the Study of Nano Scale Silicon Based Device Structure; Modelling of Elastic Modulus and Molecular Structure Interrelationship of an Oriented Crystalline Polymer; Reaction Rate as an Effective Tool for Analysis of Chemical Diffusion in Solids Simulation of the Columnar-to-Equiaxed Transition in Alloy Solidification - The Effect of Nucleation Undercooling, Density of Nuclei in Bulk Liquid and Alloy Solidification Range on the TransitionSimulation of Surface-Enhanced Ordering in Smectic Films; Atomic Scale Modelling of Materials: A Prerequisite for any Multi-Scale Approach to Structural and Dynamical Properties; Morphological Evolution of Intragranular Void under the Thermal-Stress Gradient Generated by the Steady State Heat Flow in Encapsulated Metallic Films: Special Reference to Flip Chip Solder Joints Effect of C on Vacancy Migration in α-IronKeywords Index; Authors Index |
| Record Nr. | UNINA-9910462775903321 |
| Stafa-Zurich : , : Trans Tech Publications LTD, , [2008] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Theory, modeling and numerical simulation of multi-physics materials behavior : selected, peer-reviewed papers from the symposium : theory, modeling and numerical simulation of multi-physics materials behavior, organized within the MRS fall meeting 2007 held in Boston, MA, USA November 26-30 2007 / / edited by Veena Tikare [and others]
| Theory, modeling and numerical simulation of multi-physics materials behavior : selected, peer-reviewed papers from the symposium : theory, modeling and numerical simulation of multi-physics materials behavior, organized within the MRS fall meeting 2007 held in Boston, MA, USA November 26-30 2007 / / edited by Veena Tikare [and others] |
| Pubbl/distr/stampa | Stafa-Zurich : , : Trans Tech Publications LTD, , [2008] |
| Descrizione fisica | 1 online resource (171 p.) |
| Disciplina | 620.1120151 |
| Altri autori (Persone) | TikareVeena |
| Collana | Diffusion and defect data. Pt. B. Solid state phenomena |
| Soggetto topico |
Materials - Mathematical models
Materials - Simulation methods |
| ISBN | 3-03813-200-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Theory, Modeling and Numerical Simulation; Preface ; Table of Contents; Atomistic Simulations of the Aluminum-Silicon Interfaces under Shear Loading; Shock Loading of Bone-Inspired Metallic Nanocomposites; Hydrogen Storage in MgH2 Matrices: An Ab-Initio Study of Mg-MgH2 Interface ; First-Principles Calculations of the Atomic and Electronic Structures in Au-Pd Slab Interfaces; In-Diffusion and Out-Diffusion of Oxygen from a Composite Containing Random Traps; Effects of Supports on Hydrogen Adsorption on Pt Clusters; First-Principles Calculations of Pd/Au(100) Interfaces with Adsorbates
In-Plane Rotated Crystal Structure in Continuous Growth of Bismuth Cuprate Superconducting FilmDynamical Interaction between Thermally Activated Glide of Screw Dislocation and Self-Interstitial Clusters in Bcc Fe; The Effects of Solute Segregation on the Evolution and Strength of Dislocation Junctions; Physics Mechanisms Involved in the Formation and Recrystallization of Amorphous Regions in Si through Ion Irradiation; Hotspot Formation in Shock-Induced Void Collapse; Molecular Dynamics Simulation of Nanocrystalline Tantalum under Uniaxial Tension Diffusion Mechanisms near Tilt Grain Boundaries in Ni3Al IntermetallidePhase-Transformation Wave Dynamics in LiFePO4 ; Molecular-Dynamics Analysis of the Structural Properties of Silica during Cooling; Atomistic Simulations of Copper Precipitation and Radiation Induced Segregation in α-Iron; Ab-Initio Calculation for the Study of Nano Scale Silicon Based Device Structure; Modelling of Elastic Modulus and Molecular Structure Interrelationship of an Oriented Crystalline Polymer; Reaction Rate as an Effective Tool for Analysis of Chemical Diffusion in Solids Simulation of the Columnar-to-Equiaxed Transition in Alloy Solidification - The Effect of Nucleation Undercooling, Density of Nuclei in Bulk Liquid and Alloy Solidification Range on the TransitionSimulation of Surface-Enhanced Ordering in Smectic Films; Atomic Scale Modelling of Materials: A Prerequisite for any Multi-Scale Approach to Structural and Dynamical Properties; Morphological Evolution of Intragranular Void under the Thermal-Stress Gradient Generated by the Steady State Heat Flow in Encapsulated Metallic Films: Special Reference to Flip Chip Solder Joints Effect of C on Vacancy Migration in α-IronKeywords Index; Authors Index |
| Record Nr. | UNINA-9910786394403321 |
| Stafa-Zurich : , : Trans Tech Publications LTD, , [2008] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Theory, modeling and numerical simulation of multi-physics materials behavior : selected, peer-reviewed papers from the symposium : theory, modeling and numerical simulation of multi-physics materials behavior, organized within the MRS fall meeting 2007 held in Boston, MA, USA November 26-30 2007 / / edited by Veena Tikare [and others]
| Theory, modeling and numerical simulation of multi-physics materials behavior : selected, peer-reviewed papers from the symposium : theory, modeling and numerical simulation of multi-physics materials behavior, organized within the MRS fall meeting 2007 held in Boston, MA, USA November 26-30 2007 / / edited by Veena Tikare [and others] |
| Pubbl/distr/stampa | Stafa-Zurich : , : Trans Tech Publications LTD, , [2008] |
| Descrizione fisica | 1 online resource (171 p.) |
| Disciplina | 620.1120151 |
| Altri autori (Persone) | TikareVeena |
| Collana | Diffusion and defect data. Pt. B. Solid state phenomena |
| Soggetto topico |
Materials - Mathematical models
Materials - Simulation methods |
| ISBN | 3-03813-200-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Theory, Modeling and Numerical Simulation; Preface ; Table of Contents; Atomistic Simulations of the Aluminum-Silicon Interfaces under Shear Loading; Shock Loading of Bone-Inspired Metallic Nanocomposites; Hydrogen Storage in MgH2 Matrices: An Ab-Initio Study of Mg-MgH2 Interface ; First-Principles Calculations of the Atomic and Electronic Structures in Au-Pd Slab Interfaces; In-Diffusion and Out-Diffusion of Oxygen from a Composite Containing Random Traps; Effects of Supports on Hydrogen Adsorption on Pt Clusters; First-Principles Calculations of Pd/Au(100) Interfaces with Adsorbates
In-Plane Rotated Crystal Structure in Continuous Growth of Bismuth Cuprate Superconducting FilmDynamical Interaction between Thermally Activated Glide of Screw Dislocation and Self-Interstitial Clusters in Bcc Fe; The Effects of Solute Segregation on the Evolution and Strength of Dislocation Junctions; Physics Mechanisms Involved in the Formation and Recrystallization of Amorphous Regions in Si through Ion Irradiation; Hotspot Formation in Shock-Induced Void Collapse; Molecular Dynamics Simulation of Nanocrystalline Tantalum under Uniaxial Tension Diffusion Mechanisms near Tilt Grain Boundaries in Ni3Al IntermetallidePhase-Transformation Wave Dynamics in LiFePO4 ; Molecular-Dynamics Analysis of the Structural Properties of Silica during Cooling; Atomistic Simulations of Copper Precipitation and Radiation Induced Segregation in α-Iron; Ab-Initio Calculation for the Study of Nano Scale Silicon Based Device Structure; Modelling of Elastic Modulus and Molecular Structure Interrelationship of an Oriented Crystalline Polymer; Reaction Rate as an Effective Tool for Analysis of Chemical Diffusion in Solids Simulation of the Columnar-to-Equiaxed Transition in Alloy Solidification - The Effect of Nucleation Undercooling, Density of Nuclei in Bulk Liquid and Alloy Solidification Range on the TransitionSimulation of Surface-Enhanced Ordering in Smectic Films; Atomic Scale Modelling of Materials: A Prerequisite for any Multi-Scale Approach to Structural and Dynamical Properties; Morphological Evolution of Intragranular Void under the Thermal-Stress Gradient Generated by the Steady State Heat Flow in Encapsulated Metallic Films: Special Reference to Flip Chip Solder Joints Effect of C on Vacancy Migration in α-IronKeywords Index; Authors Index |
| Record Nr. | UNINA-9910813947703321 |
| Stafa-Zurich : , : Trans Tech Publications LTD, , [2008] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
