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Biblioteca

MARC Lista (tabellare)
2.5D printing : bridging the gap between 2D and 3D applications / / by Carinna Parraman, Maria Ortiz Segovia
2.5D printing : bridging the gap between 2D and 3D applications / / by Carinna Parraman, Maria Ortiz Segovia
Autore Parraman Carinna
Edizione [First edition.]
Pubbl/distr/stampa Hoboken, New Jersey : , : John Wiley & Sons, , 2018
Descrizione fisica 1 online resource (275 pages)
Disciplina 621.9/88
Collana Wiley-IS&T series in imaging science and technology
Soggetto topico Three-dimensional printing
Texture (Art)
ISBN 1-118-96732-1
1-118-96733-X
1-118-96731-3
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Defining the field of 2.5D printing -- The past -- The present : materials, making, capturing and measuring -- The future -- Case studies.
Record Nr. UNINA-9910555242803321
Parraman Carinna  
Hoboken, New Jersey : , : John Wiley & Sons, , 2018
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
2.5D printing : bridging the gap between 2D and 3D applications / / by Carinna Parraman, Maria Ortiz Segovia
2.5D printing : bridging the gap between 2D and 3D applications / / by Carinna Parraman, Maria Ortiz Segovia
Autore Parraman Carinna
Edizione [First edition.]
Pubbl/distr/stampa Hoboken, New Jersey : , : John Wiley & Sons, , 2018
Descrizione fisica 1 online resource (275 pages)
Disciplina 621.9/88
Collana Wiley-IS&T series in imaging science and technology
Soggetto topico Three-dimensional printing
Texture (Art)
ISBN 1-118-96732-1
1-118-96733-X
1-118-96731-3
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Defining the field of 2.5D printing -- The past -- The present : materials, making, capturing and measuring -- The future -- Case studies.
Record Nr. UNINA-9910830801903321
Parraman Carinna  
Hoboken, New Jersey : , : John Wiley & Sons, , 2018
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
2008 IEEE 10th International Symposium on Spread Spectrum Technical and Applications : proceedings : 25-28 August 2008, Bologna, Italy / / Institute of Electrical and Electronics Engineers, IEEE International Symposium on Spread Spectrum Techniques & Applications
2008 IEEE 10th International Symposium on Spread Spectrum Technical and Applications : proceedings : 25-28 August 2008, Bologna, Italy / / Institute of Electrical and Electronics Engineers, IEEE International Symposium on Spread Spectrum Techniques & Applications
Pubbl/distr/stampa New York City, NY : , : IEEE Xplore, , 2008
Descrizione fisica 1 online resource : illustrations
Disciplina 621.382
Soggetto topico Spread spectrum communications
ISBN 1-5090-7881-9
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910134950503321
New York City, NY : , : IEEE Xplore, , 2008
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
2008 IEEE 10th International Symposium on Spread Spectrum Technical and Applications : proceedings : 25-28 August 2008, Bologna, Italy / / Institute of Electrical and Electronics Engineers, IEEE International Symposium on Spread Spectrum Techniques & Applications
2008 IEEE 10th International Symposium on Spread Spectrum Technical and Applications : proceedings : 25-28 August 2008, Bologna, Italy / / Institute of Electrical and Electronics Engineers, IEEE International Symposium on Spread Spectrum Techniques & Applications
Pubbl/distr/stampa New York City, NY : , : IEEE Xplore, , 2008
Descrizione fisica 1 online resource : illustrations
Disciplina 621.382
Soggetto topico Spread spectrum communications
ISBN 1-5090-7881-9
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNISA-996281146503316
New York City, NY : , : IEEE Xplore, , 2008
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
2016 Passenger Car and 2015 Concept Car Yearbook / / from the editors and contributors of Automotive Engineering International
2016 Passenger Car and 2015 Concept Car Yearbook / / from the editors and contributors of Automotive Engineering International
Edizione [1st ed.]
Pubbl/distr/stampa Warrendale, Pa. (400 Commonwealth Dr., Wallendale PA USA) : , : Society of Automotive Engineers, , 2016
Descrizione fisica 1 PDF (ix, 207 pages) : color illustrations
Disciplina 629.222
Collana Society of Automotive Engineers. Electronic publications.
Soggetto topico Automobiles - Design and construction
Experimental automobiles - Design and construction
ISBN 0-7680-8275-7
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto 2016 passenger car yearbook -- Audi A3 Sportback -- Audi A4 -- Audi Q7 -- Audi R8 -- Audi Light Tunnel -- BMW 7 Series -- Cadillac ATS-V -- Cadillac CT6 -- Cadillac CTS-V -- Chevrolet Camaro -- Chevrolet Cruze -- Chevrolet Malibu -- Chevolet Volt -- Acura Next-Gen NSX -- Ford Explorer -- Ford GT -- Ford Shelby GT350 -- Honda Civic -- Honda Civic Concept -- Honda Pilot -- Honda HR-V -- Hyundai Tucson -- Jaguar F-Pace -- Jaguar XF -- Kia Optima -- Range Rover Land Rover -- Land Rover Discovery Sport -- Lexus RX -- Lexus GS -- Mazda CX-3 -- Mazda MX-5 -- Mazda MX-5 Miata -- 570S Mclaren -- Mercedes-Benz GLE-Class -- Mini John Cooper Works -- Mitsubishi Outlander -- Nissa Maxima -- Nissan Titan -- Astra Opel -- Opel Group Corsa -- Scion IA and IM -- Smart ForTwo -- Toyota Mirai -- Toyota Prius -- Toyota Tacoma -- Volkswagen Tiguan -- 2015 Concept car yearbook -- Audi E-Tron Quattro Concept -- Audi Prologue -- Chevolet Bolt -- Dodge Challenger GT AWD Concept -- DS Divine -- EDAG Light Cocoon -- Infiniti Q60 -- Infiniti Q80 Inspiration -- KIA Trail'ster Concept -- KIA Sportpace Concept -- Lexus LF-SA Concept -- Lamborghini Asterion LIP 910-4 -- Lincoln Contintenal Concept -- Mercedes-Benz Concept IAA -- Mercedes-Benz F015 "luxury in motion" Concept -- Mitsubishi XR-Phev II Concept -- Nissan -- Peugeot Fractal -- Peugeot Quartz -- Toyota C-HR -- VW Cross Coupe GTE Concept -- VW XL Sport.
Altri titoli varianti 2016 Passenger Car.
2015 Concept Car Yearbook
Passenger car yearbook
Concept car yearbook
Record Nr. UNINA-9910438306003321
Warrendale, Pa. (400 Commonwealth Dr., Wallendale PA USA) : , : Society of Automotive Engineers, , 2016
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
3D and HD broadband video networking / / Benny Bing
3D and HD broadband video networking / / Benny Bing
Autore Bing Benny
Pubbl/distr/stampa Boston ; , : Artech House, , ©2010
Descrizione fisica 1 online resource (318 p.)
Disciplina 006.7
Collana Artech House telecommunications library
Soggetto topico Digital video
Digital television
Image transmission
Broadband communication systems
Multimedia communications
Soggetto genere / forma Electronic books.
ISBN 1-60807-052-2
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto 3D and HD Broadband Video Networking; Contents; Preface; Chapter 1 Empowering High-Quality Digital Video Delivery; Chapter 2 The Access and Home Networks; Chapter 3 Video Fundamentals; Chapter 4 The H.264 Standard; Chapter 5 Short-Term H.264 Bandwidth Prediction; Chapter 6 Long-Term H.264 Bandwidth Prediction; Chapter 7 Lossless FMO Removal for H.264 Videos; Chapter 8 Error Concealment Methods forImproving Video Quality; Chapter 9 Video Traffic Smoothing and Multiplexing; Chapter 10 Intelligent Policy Resource Management
Chapter 11 Supporting Compressed Video Applications over DOCSIS Cable NetworksChapter 12 Intelligent Activity Detection Techniques for Advanced Video Surveillance Systems; Chapter 13 Hand Gesture Control for Broadband-Enabled HDTVs and Multimedia PCs; Glossary; About the Author; Index
Record Nr. UNINA-9910459639003321
Bing Benny  
Boston ; , : Artech House, , ©2010
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
3D and HD broadband video networking / / Benny Bing
3D and HD broadband video networking / / Benny Bing
Autore Bing Benny
Pubbl/distr/stampa Boston ; , : Artech House, , ©2010
Descrizione fisica 1 online resource (318 p.)
Disciplina 006.7
Collana Artech House telecommunications library
Soggetto topico Digital video
Digital television
Image transmission
Broadband communication systems
Multimedia communications
ISBN 1-60807-052-2
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto 3D and HD Broadband Video Networking; Contents; Preface; Chapter 1 Empowering High-Quality Digital Video Delivery; Chapter 2 The Access and Home Networks; Chapter 3 Video Fundamentals; Chapter 4 The H.264 Standard; Chapter 5 Short-Term H.264 Bandwidth Prediction; Chapter 6 Long-Term H.264 Bandwidth Prediction; Chapter 7 Lossless FMO Removal for H.264 Videos; Chapter 8 Error Concealment Methods forImproving Video Quality; Chapter 9 Video Traffic Smoothing and Multiplexing; Chapter 10 Intelligent Policy Resource Management
Chapter 11 Supporting Compressed Video Applications over DOCSIS Cable NetworksChapter 12 Intelligent Activity Detection Techniques for Advanced Video Surveillance Systems; Chapter 13 Hand Gesture Control for Broadband-Enabled HDTVs and Multimedia PCs; Glossary; About the Author; Index
Record Nr. UNINA-9910785261703321
Bing Benny  
Boston ; , : Artech House, , ©2010
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
3D and HD broadband video networking / / Benny Bing
3D and HD broadband video networking / / Benny Bing
Autore Bing Benny
Pubbl/distr/stampa Boston ; , : Artech House, , ©2010
Descrizione fisica 1 online resource (318 p.)
Disciplina 006.7
Collana Artech House telecommunications library
Soggetto topico Digital video
Digital television
Image transmission
Broadband communication systems
Multimedia communications
ISBN 1-60807-052-2
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto 3D and HD Broadband Video Networking; Contents; Preface; Chapter 1 Empowering High-Quality Digital Video Delivery; Chapter 2 The Access and Home Networks; Chapter 3 Video Fundamentals; Chapter 4 The H.264 Standard; Chapter 5 Short-Term H.264 Bandwidth Prediction; Chapter 6 Long-Term H.264 Bandwidth Prediction; Chapter 7 Lossless FMO Removal for H.264 Videos; Chapter 8 Error Concealment Methods forImproving Video Quality; Chapter 9 Video Traffic Smoothing and Multiplexing; Chapter 10 Intelligent Policy Resource Management
Chapter 11 Supporting Compressed Video Applications over DOCSIS Cable NetworksChapter 12 Intelligent Activity Detection Techniques for Advanced Video Surveillance Systems; Chapter 13 Hand Gesture Control for Broadband-Enabled HDTVs and Multimedia PCs; Glossary; About the Author; Index
Record Nr. UNINA-9910811857703321
Bing Benny  
Boston ; , : Artech House, , ©2010
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
3D IC and RF SiPs : advanced stacking and planar solutions for 5G mobility / / by Professor Lih-Tyng Hwang, Professor Tzyy-Sheng Jason Horng
3D IC and RF SiPs : advanced stacking and planar solutions for 5G mobility / / by Professor Lih-Tyng Hwang, Professor Tzyy-Sheng Jason Horng
Autore Hwang Lih-Tyng
Edizione [1st edition.]
Pubbl/distr/stampa Hoboken, New Jersey : , : John Wiley & Sons, , 2018
Descrizione fisica 1 online resource (464 pages)
Disciplina 621.39/5
Soggetto topico Mobile communication systems - Technological innovations
ISBN 1-119-28966-1
1-119-28967-X
1-119-28965-3
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto 1 MM and MTM for Mobility 1 -- 1.1 Convergence in Communications and the Future, 5G 3 -- 1.1.1 From 1980 (1G) to 2010 (4G) 3 -- 1.1.2 LTE-A and Rel 10 in 2010s 6 -- 1.1.3 The Future: 5G and IoT (Targeting 2020) 8 -- 1.2 Review of Key Products in Communication Networks 14 -- 1.2.1 Wired Communications 14 -- 1.2.2 Wireless Communications 21 -- 1.3 MM and MTM, an Intro to Hardware Technology 31 -- 1.3.1 Moore's Law 31 -- 1.3.2 More Than Moore 43 -- 1.3.3 MTM Packaging Map and MMiư MTM Business Model 53 -- 2 Interconnects 67 -- 2.1 Hierarchy of Interconnection 69 -- 2.1.1 Oniư Chip (Level 0) Interconnections 69 -- 2.1.2 Peripheral Pads on Semiconductor ICs (Level 0) 72 -- 2.1.3 Al pads (Wirebond and Flip Chip) 73 -- 2.1.4 Cu/Lowiư K Re-Distribution Using Damascene Techniques (Flip Chip) 74 -- 2.1.5 Au Pads (III-V) 77 -- 2.1.6 Level 1 Interconnections: WB and FC--Why FC Interconnections are Preferred? 78 -- 2.2 Level 1, Interconnection Gap in FC-PBGA, and Level 0.5 80 -- 2.2.1 Wirebonds 80 -- 2.2.2 Flip Chip Bumps with UBM 85 -- 2.2.3 TSV and Microbumps, Cu or Au Stud Bumps (Level 0.5) 91 -- 2.3 Changing Dynamics of Semiconductor Manufacturing 100 -- 2.3.1 Bumping Itself is a Business 100 -- 2.3.2 Cu/Low-K in BEOL 102 -- 2.3.3 Wafer Fab Foundry and OSAT are Competing for Their Business Shares 102 -- 3 Stateiư of iưtheiư Art IC Packages, Modules, and Substrates 111 -- 3.1 Single-Chip Packages (SCPs): Standardized Packages 113 -- 3.1.1 Lead Frame Based: SO, QFP/QFN, and TAB 114 -- 3.1.2 Organic Interposer Based: BGA/CSP and LGA 114 -- 3.1.3 Known Good Bare Die 120 -- 3.1.4 Single-Chip Packaging Processes 121 -- 3.1.5 IC Testing 123 -- 3.2 Advanced IC Substrates and Assembly 124 -- 3.2.1 MLO Substrates for ICs 126 -- 3.2.2 Multi-Layered Organic (MLO) for IC Packages 127 -- 3.3 Customized Assemblies: MCP/MCMs and Modules 130 -- 3.3.1 Multi-Chip Module (MCM) or Multi-Chip Package (MCP) 131 -- 3.3.2 Modules 132 -- 4 Passives Technology 139 -- 4.1 Thick-Film Ceramic Technology (TFC) for MLC 146.
4.1.1 Green Tapes 146 -- 4.1.2 Thick-Film Fabrication 149 -- 4.1.3 LTCC EPs, Thick-Film IPD, and LTCC-Based RF Modules 151 -- 4.1.4 SMT (or SMD) 155 -- 4.2 MLO Passives by Laminate Organic (LO) 156 -- 4.2.1 MLO-Based RF Modules 156 -- 4.2.2 Laminates 156 -- 4.2.3 MLO Fabrication 157 -- 4.2.4 MLO EPs and RF Modules 159 -- 4.3 On-Chip Passives 166 -- 4.3.1 RF Isolation (BCM4330) 166 -- 4.3.2 Monolithic FEOL On-Chip Passives 168 -- 4.3.3 Rs, Ls, and Cs in BEOL Layers 170 -- 4.3.4 Goals 172 -- 4.4 Thin-Film Multilayer (TFM) and IPD 173 -- 4.5 Summary on Passives Fabrication Technologies: Solutions for RF-Passives Systems 191 -- 5 Electrical Design for 5G Hardware--Digital Focus 199 -- 5.1 Introduction to PCB 201 -- 5.2 Signal Transmission Techniques: Singled-Ended and Differential Signals 202 -- 5.2.1 Single-Ended and Differential 202 -- 5.3 Co-Design Examples 216 -- 5.3.1 Interconnection RF Models and Library 216 -- 5.3.2 Chip-Package and Chip-Package-Board Co-Designs 219 -- 5.4 Wide I/O Memory Using TSVs 228 -- 5.4.1 JEDEC Memory Standards 230 -- 5.4.2 Data Structure Using TSV-Based Wide I/O 230 -- 6 Electrical Design for 5G Hardware--RF Focus 239 -- 6.1 PHY, Modulated RF Carriers; a PoP Possible? 240 -- 6.1.1 Frequency Bands and Wave Propagation Characteristics 240 -- 6.1.2 Narrow-Band Process and CW Carrier for Digital Signals 242 -- 6.2 Antennas 244 -- 6.2.1 Two Often Encountered RF Passive Structures in Modern Portable Electronics: Antenna and Its Feed 244 -- 6.2.2 Types of Antennas: Linear, Microstrip-Patch, and Multi-Element Antenna 245 -- 6.2.3 Active-Integrated Antennas and Measurement of Antenna Performance 251 -- 6.3 RF Functional Components 256 -- 6.3.1 Bandpass Filters 256 -- 6.3.2 Baluns 257 -- 6.3.3 Switches and Duplexers 262 -- 6.4 EMI/EMC 263 -- 6.4.1 Sources of Interference 264 -- 6.4.2 Diagnostic and Regulations Conformation Techniques 264 -- 6.4.3 Containment Techniques 267 -- 7 Product, Process Development, and Control 271.
7.1 Business Processes 272 -- 7.1.1 Strategic Management (Product and Process Development) 272 -- 7.1.2 Design and Manufacturing; Outsourced or Not 273 -- 7.2 History of Statistical Approach for Quality Management 273 -- 7.2.1 Quality Guidelines and Standards 274 -- 7.2.2 Semiconductor Process Development and Characterization 274 -- 7.3 APQP--An Iterative Process for Product and Process Development 275 -- 7.3.1 Translate Product Ideas Into Processes 275 -- 7.4 FMEA, Control Plan, and Initial Process Study 276 -- 7.4.1 RPN 276 -- 7.4.2 Locating the Root Causes 281 -- 7.4.3 Pre-Launch Control Plan 283 -- 7.4.4 Initial Process Study 284 -- 7.5 PPAP and SPC 287 -- 7.5.1 PPAP 287 -- 7.5.2 SPC 287 -- 8 Product Life and Reliability Assessment 291 -- 8.1 Product Life Prediction 292 -- 8.1.1 Calculate MTTF from Processes and Theoretical Distributions 293 -- 8.1.2 Practices to Obtain the Expected Product Life 296 -- 8.1.3 Activation Energy 300 -- 8.2 Reliability Assessment 301 -- 8.2.1 Assessment Variables for Reliability Tests 302 -- 8.2.2 Reliability Assessment Practices 303 -- 8.2.3 Discussions on Weibull Analysis and Weibull Plotting 309 -- 9 Hardware Solutions for 5G Mobility 317 -- 9.1 5G Mobility Products and Planar Solutions 318 -- 9.1.1 High-Density and Logic Products 319 -- 9.1.2 RF-Passives Systems 326 -- 9.1.3 A Summary: WLP and LPP Used for Both HD&L and RF-Passives Products 333 -- 9.2 Advanced Interconnection and Future Business Model 336 -- 9.2.1 Advanced Interconnection 336 -- 9.2.2 New Business Model 341 -- 9.3 Finale--What's Not 343 -- 9.3.1 New from Wafer Foundries 343 -- 9.3.2 System and Architectural Design of Mobile Handsets 345 -- 9.3.3 Thermo-Mechanical and Thermal Science 349 -- 9.3.4 Sensors and IoT 349 -- A Failure Mechanisms and Failure Analysis 357 -- A.1 Failure Mechanisms, or Macroscopic Models 358 -- A.1.1 Silicon Oxide Breakdown 359 -- A.1.2 Stress-Induced Migration (SM) 360 -- A.1.3 Electro-Migration (EM) and Hillocks 360.
A.1.4 Spiking 362 -- A.1.5 IMC, Purple plague (Gold-Al Intermetallics) 363 -- A.1.6 Fatigue and Creeping 364 -- A.1.7 Die Cracking 366 -- A.1.8 Delamination and Popcorning 366 -- A.1.9 Corrosion 367 -- A.2 Failure Analysis (FA) Techniques and FA Tools 368 -- A.2.1 De-Processing (or De-Capping) Techniques 368 -- A.2.2 Microscopic and Analytical Tools 369 -- B ANOVA 375 -- B.1 One-Way ANOVA 376 -- B.2 Two-Way ANOVA 377 -- C Gauge R&R and DOE 381 -- C.1 GR&R 381 -- C.1.1 AIAG's Xbar/Range Method for Gauge R&R Study 381 -- C.1.2 Minitab 383 -- C.1.3 GR&R Casted in the ANOVA Format 383 -- C.1.4 Criteria 384 -- C.2 DOE 384 -- C.2.1 DOE Guidelines 385 -- C.2.2 2k Runs, Unreplicated Case 386 -- C.2.3 Fractional Factorial Designs, 2k-p Run, p = 1, 2,.., < k 399 -- D Statistics Tables 409 -- D.1 F Distribution 409 D.2 Poisson Table of Expected # of Occurrences at a Confidence Level (C.L.) 409 -- D.3 MR Percentile Table 409.
Record Nr. UNINA-9910271018703321
Hwang Lih-Tyng  
Hoboken, New Jersey : , : John Wiley & Sons, , 2018
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
3D IC and RF SiPs : advanced stacking and planar solutions for 5G mobility / / by Professor Lih-Tyng Hwang, Professor Tzyy-Sheng Jason Horng
3D IC and RF SiPs : advanced stacking and planar solutions for 5G mobility / / by Professor Lih-Tyng Hwang, Professor Tzyy-Sheng Jason Horng
Autore Hwang Lih-Tyng
Edizione [1st edition.]
Pubbl/distr/stampa Hoboken, New Jersey : , : John Wiley & Sons, , 2018
Descrizione fisica 1 online resource (464 pages)
Disciplina 621.39/5
Soggetto topico Mobile communication systems - Technological innovations
ISBN 1-119-28966-1
1-119-28967-X
1-119-28965-3
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto 1 MM and MTM for Mobility 1 -- 1.1 Convergence in Communications and the Future, 5G 3 -- 1.1.1 From 1980 (1G) to 2010 (4G) 3 -- 1.1.2 LTE-A and Rel 10 in 2010s 6 -- 1.1.3 The Future: 5G and IoT (Targeting 2020) 8 -- 1.2 Review of Key Products in Communication Networks 14 -- 1.2.1 Wired Communications 14 -- 1.2.2 Wireless Communications 21 -- 1.3 MM and MTM, an Intro to Hardware Technology 31 -- 1.3.1 Moore's Law 31 -- 1.3.2 More Than Moore 43 -- 1.3.3 MTM Packaging Map and MMiư MTM Business Model 53 -- 2 Interconnects 67 -- 2.1 Hierarchy of Interconnection 69 -- 2.1.1 Oniư Chip (Level 0) Interconnections 69 -- 2.1.2 Peripheral Pads on Semiconductor ICs (Level 0) 72 -- 2.1.3 Al pads (Wirebond and Flip Chip) 73 -- 2.1.4 Cu/Lowiư K Re-Distribution Using Damascene Techniques (Flip Chip) 74 -- 2.1.5 Au Pads (III-V) 77 -- 2.1.6 Level 1 Interconnections: WB and FC--Why FC Interconnections are Preferred? 78 -- 2.2 Level 1, Interconnection Gap in FC-PBGA, and Level 0.5 80 -- 2.2.1 Wirebonds 80 -- 2.2.2 Flip Chip Bumps with UBM 85 -- 2.2.3 TSV and Microbumps, Cu or Au Stud Bumps (Level 0.5) 91 -- 2.3 Changing Dynamics of Semiconductor Manufacturing 100 -- 2.3.1 Bumping Itself is a Business 100 -- 2.3.2 Cu/Low-K in BEOL 102 -- 2.3.3 Wafer Fab Foundry and OSAT are Competing for Their Business Shares 102 -- 3 Stateiư of iưtheiư Art IC Packages, Modules, and Substrates 111 -- 3.1 Single-Chip Packages (SCPs): Standardized Packages 113 -- 3.1.1 Lead Frame Based: SO, QFP/QFN, and TAB 114 -- 3.1.2 Organic Interposer Based: BGA/CSP and LGA 114 -- 3.1.3 Known Good Bare Die 120 -- 3.1.4 Single-Chip Packaging Processes 121 -- 3.1.5 IC Testing 123 -- 3.2 Advanced IC Substrates and Assembly 124 -- 3.2.1 MLO Substrates for ICs 126 -- 3.2.2 Multi-Layered Organic (MLO) for IC Packages 127 -- 3.3 Customized Assemblies: MCP/MCMs and Modules 130 -- 3.3.1 Multi-Chip Module (MCM) or Multi-Chip Package (MCP) 131 -- 3.3.2 Modules 132 -- 4 Passives Technology 139 -- 4.1 Thick-Film Ceramic Technology (TFC) for MLC 146.
4.1.1 Green Tapes 146 -- 4.1.2 Thick-Film Fabrication 149 -- 4.1.3 LTCC EPs, Thick-Film IPD, and LTCC-Based RF Modules 151 -- 4.1.4 SMT (or SMD) 155 -- 4.2 MLO Passives by Laminate Organic (LO) 156 -- 4.2.1 MLO-Based RF Modules 156 -- 4.2.2 Laminates 156 -- 4.2.3 MLO Fabrication 157 -- 4.2.4 MLO EPs and RF Modules 159 -- 4.3 On-Chip Passives 166 -- 4.3.1 RF Isolation (BCM4330) 166 -- 4.3.2 Monolithic FEOL On-Chip Passives 168 -- 4.3.3 Rs, Ls, and Cs in BEOL Layers 170 -- 4.3.4 Goals 172 -- 4.4 Thin-Film Multilayer (TFM) and IPD 173 -- 4.5 Summary on Passives Fabrication Technologies: Solutions for RF-Passives Systems 191 -- 5 Electrical Design for 5G Hardware--Digital Focus 199 -- 5.1 Introduction to PCB 201 -- 5.2 Signal Transmission Techniques: Singled-Ended and Differential Signals 202 -- 5.2.1 Single-Ended and Differential 202 -- 5.3 Co-Design Examples 216 -- 5.3.1 Interconnection RF Models and Library 216 -- 5.3.2 Chip-Package and Chip-Package-Board Co-Designs 219 -- 5.4 Wide I/O Memory Using TSVs 228 -- 5.4.1 JEDEC Memory Standards 230 -- 5.4.2 Data Structure Using TSV-Based Wide I/O 230 -- 6 Electrical Design for 5G Hardware--RF Focus 239 -- 6.1 PHY, Modulated RF Carriers; a PoP Possible? 240 -- 6.1.1 Frequency Bands and Wave Propagation Characteristics 240 -- 6.1.2 Narrow-Band Process and CW Carrier for Digital Signals 242 -- 6.2 Antennas 244 -- 6.2.1 Two Often Encountered RF Passive Structures in Modern Portable Electronics: Antenna and Its Feed 244 -- 6.2.2 Types of Antennas: Linear, Microstrip-Patch, and Multi-Element Antenna 245 -- 6.2.3 Active-Integrated Antennas and Measurement of Antenna Performance 251 -- 6.3 RF Functional Components 256 -- 6.3.1 Bandpass Filters 256 -- 6.3.2 Baluns 257 -- 6.3.3 Switches and Duplexers 262 -- 6.4 EMI/EMC 263 -- 6.4.1 Sources of Interference 264 -- 6.4.2 Diagnostic and Regulations Conformation Techniques 264 -- 6.4.3 Containment Techniques 267 -- 7 Product, Process Development, and Control 271.
7.1 Business Processes 272 -- 7.1.1 Strategic Management (Product and Process Development) 272 -- 7.1.2 Design and Manufacturing; Outsourced or Not 273 -- 7.2 History of Statistical Approach for Quality Management 273 -- 7.2.1 Quality Guidelines and Standards 274 -- 7.2.2 Semiconductor Process Development and Characterization 274 -- 7.3 APQP--An Iterative Process for Product and Process Development 275 -- 7.3.1 Translate Product Ideas Into Processes 275 -- 7.4 FMEA, Control Plan, and Initial Process Study 276 -- 7.4.1 RPN 276 -- 7.4.2 Locating the Root Causes 281 -- 7.4.3 Pre-Launch Control Plan 283 -- 7.4.4 Initial Process Study 284 -- 7.5 PPAP and SPC 287 -- 7.5.1 PPAP 287 -- 7.5.2 SPC 287 -- 8 Product Life and Reliability Assessment 291 -- 8.1 Product Life Prediction 292 -- 8.1.1 Calculate MTTF from Processes and Theoretical Distributions 293 -- 8.1.2 Practices to Obtain the Expected Product Life 296 -- 8.1.3 Activation Energy 300 -- 8.2 Reliability Assessment 301 -- 8.2.1 Assessment Variables for Reliability Tests 302 -- 8.2.2 Reliability Assessment Practices 303 -- 8.2.3 Discussions on Weibull Analysis and Weibull Plotting 309 -- 9 Hardware Solutions for 5G Mobility 317 -- 9.1 5G Mobility Products and Planar Solutions 318 -- 9.1.1 High-Density and Logic Products 319 -- 9.1.2 RF-Passives Systems 326 -- 9.1.3 A Summary: WLP and LPP Used for Both HD&L and RF-Passives Products 333 -- 9.2 Advanced Interconnection and Future Business Model 336 -- 9.2.1 Advanced Interconnection 336 -- 9.2.2 New Business Model 341 -- 9.3 Finale--What's Not 343 -- 9.3.1 New from Wafer Foundries 343 -- 9.3.2 System and Architectural Design of Mobile Handsets 345 -- 9.3.3 Thermo-Mechanical and Thermal Science 349 -- 9.3.4 Sensors and IoT 349 -- A Failure Mechanisms and Failure Analysis 357 -- A.1 Failure Mechanisms, or Macroscopic Models 358 -- A.1.1 Silicon Oxide Breakdown 359 -- A.1.2 Stress-Induced Migration (SM) 360 -- A.1.3 Electro-Migration (EM) and Hillocks 360.
A.1.4 Spiking 362 -- A.1.5 IMC, Purple plague (Gold-Al Intermetallics) 363 -- A.1.6 Fatigue and Creeping 364 -- A.1.7 Die Cracking 366 -- A.1.8 Delamination and Popcorning 366 -- A.1.9 Corrosion 367 -- A.2 Failure Analysis (FA) Techniques and FA Tools 368 -- A.2.1 De-Processing (or De-Capping) Techniques 368 -- A.2.2 Microscopic and Analytical Tools 369 -- B ANOVA 375 -- B.1 One-Way ANOVA 376 -- B.2 Two-Way ANOVA 377 -- C Gauge R&R and DOE 381 -- C.1 GR&R 381 -- C.1.1 AIAG's Xbar/Range Method for Gauge R&R Study 381 -- C.1.2 Minitab 383 -- C.1.3 GR&R Casted in the ANOVA Format 383 -- C.1.4 Criteria 384 -- C.2 DOE 384 -- C.2.1 DOE Guidelines 385 -- C.2.2 2k Runs, Unreplicated Case 386 -- C.2.3 Fractional Factorial Designs, 2k-p Run, p = 1, 2,.., < k 399 -- D Statistics Tables 409 -- D.1 F Distribution 409 D.2 Poisson Table of Expected # of Occurrences at a Confidence Level (C.L.) 409 -- D.3 MR Percentile Table 409.
Record Nr. UNINA-9910830231303321
Hwang Lih-Tyng  
Hoboken, New Jersey : , : John Wiley & Sons, , 2018
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