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Materials characterization [[electronic resource] ] : introduction to microscopic and spectroscopic methods / / Yang Leng
| Materials characterization [[electronic resource] ] : introduction to microscopic and spectroscopic methods / / Yang Leng |
| Autore | Leng Y (Yang) |
| Edizione | [2nd ed.] |
| Pubbl/distr/stampa | Weinheim, : J. Wiley, c2013 |
| Descrizione fisica | xiv, 376 p. : ill |
| Disciplina | 620.1/1 |
| Soggetto topico |
Materials - Analysis
Materials |
| ISBN |
9783527670802
3527670807 9783527670772 |
| Classificazione |
501.4
620.11 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910796092403321 |
Leng Y (Yang)
|
||
| Weinheim, : J. Wiley, c2013 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Materials characterization : introduction to microscopic and spectroscopic methods / / Yang Leng
| Materials characterization : introduction to microscopic and spectroscopic methods / / Yang Leng |
| Autore | Leng Y (Yang) |
| Edizione | [2nd ed.] |
| Pubbl/distr/stampa | Weinheim, : J. Wiley, c2013 |
| Descrizione fisica | xiv, 376 p. : ill |
| Disciplina | 620.1/1 |
| Soggetto topico |
Materials - Analysis
Materials |
| ISBN |
9783527670802
3527670807 9783527670772 |
| Classificazione |
501.4
620.11 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Intro -- Materials Characterization -- Contents -- 1 Light Microscopy -- 1.1 Optical Principles -- 1.1.1 Image Formation -- 1.1.2 Resolution -- 1.1.2.1 Effective Magnification -- 1.1.2.2 Brightness and Contrast -- 1.1.3 Depth of Field -- 1.1.4 Aberrations -- 1.2 Instrumentation -- 1.2.1 Illumination System -- 1.2.2 Objective Lens and Eyepiece -- 1.2.2.1 Steps for Optimum Resolution -- 1.2.2.2 Steps to Improve Depth of Field -- 1.3 Specimen Preparation -- 1.3.1 Sectioning -- 1.3.1.1 Cutting -- 1.3.1.2 Microtomy -- 1.3.2 Mounting -- 1.3.3 Grinding and Polishing -- 1.3.3.1 Grinding -- 1.3.3.2 Polishing -- 1.3.4 Etching -- 1.4 Imaging Modes -- 1.4.1 Bright-Field and Dark-Field Imaging -- 1.4.2 Phase-Contrast Microscopy -- 1.4.3 Polarized-Light Microscopy -- 1.4.4 Nomarski Microscopy -- 1.4.5 Fluorescence Microscopy -- 1.5 Confocal Microscopy -- 1.5.1 Working Principles -- 1.5.2 Three-Dimensional Images -- References -- Further Reading -- 2 X-Ray Diffraction Methods -- 2.1 X-Ray Radiation -- 2.1.1 Generation of X-Rays -- 2.1.2 X-Ray Absorption -- 2.2 Theoretical Background of Diffraction -- 2.2.1 Diffraction Geometry -- 2.2.1.1 Bragg's Law -- 2.2.1.2 Reciprocal Lattice -- 2.2.1.3 Ewald Sphere -- 2.2.2 Diffraction Intensity -- 2.2.2.1 Structure Extinction -- 2.3 X-Ray Diffractometry -- 2.3.1 Instrumentation -- 2.3.1.1 System Aberrations -- 2.3.2 Samples and Data Acquisition -- 2.3.2.1 Sample Preparation -- 2.3.2.2 Acquisition and Treatment of Diffraction Data -- 2.3.3 Distortions of Diffraction Spectra -- 2.3.3.1 Preferential Orientation -- 2.3.3.2 Crystallite Size -- 2.3.3.3 Residual Stress -- 2.3.4 Applications -- 2.3.4.1 Crystal-Phase Identification -- 2.3.4.2 Quantitative Measurement -- 2.4 Wide-Angle X-Ray Diffraction and Scattering -- 2.4.1 Wide-Angle Diffraction -- 2.4.2 Wide-Angle Scattering -- References -- Further Reading.
3 Transmission Electron Microscopy -- 3.1 Instrumentation -- 3.1.1 Electron Sources -- 3.1.1.1 Thermionic Emission Gun -- 3.1.1.2 Field Emission Gun -- 3.1.2 Electromagnetic Lenses -- 3.1.3 Specimen Stage -- 3.2 Specimen Preparation -- 3.2.1 Prethinning -- 3.2.2 Final Thinning -- 3.2.2.1 Electrolytic Thinning -- 3.2.2.2 Ion Milling -- 3.2.2.3 Ultramicrotomy -- 3.3 Image Modes -- 3.3.1 Mass-Density Contrast -- 3.3.2 Diffraction Contrast -- 3.3.3 Phase Contrast -- 3.3.3.1 Theoretical Aspects -- 3.3.3.2 Two-Beam and Multiple-Beam Imaging -- 3.4 Selected-Area Diffraction (SAD) -- 3.4.1 Selected-Area Diffraction Characteristics -- 3.4.2 Single-Crystal Diffraction -- 3.4.2.1 Indexing a Cubic Crystal Pattern -- 3.4.2.2 Identification of Crystal Phases -- 3.4.3 Multicrystal Diffraction -- 3.4.4 Kikuchi Lines -- 3.5 Images of Crystal Defects -- 3.5.1 Wedge Fringe -- 3.5.2 Bending Contours -- 3.5.3 Dislocations -- References -- Further Reading -- 4 Scanning Electron Microscopy -- 4.1 Instrumentation -- 4.1.1 Optical Arrangement -- 4.1.2 Signal Detection -- 4.1.2.1 Detector -- 4.1.3 Probe Size and Current -- 4.2 Contrast Formation -- 4.2.1 Electron-Specimen Interactions -- 4.2.2 Topographic Contrast -- 4.2.3 Compositional Contrast -- 4.3 Operational Variables -- 4.3.1 Working Distance and Aperture Size -- 4.3.2 Acceleration Voltage and Probe Current -- 4.3.3 Astigmatism -- 4.4 Specimen Preparation -- 4.4.1 Preparation for Topographic Examination -- 4.4.1.1 Charging and Its Prevention -- 4.4.2 Preparation for Microcomposition Examination -- 4.4.3 Dehydration -- 4.5 Electron Backscatter Diffraction -- 4.5.1 EBSD Pattern Formation -- 4.5.2 EBSD Indexing and Its Automation -- 4.5.3 Applications of EBSD -- 4.6 Environmental SEM -- 4.6.1 ESEM Working Principle -- 4.6.2 Applications -- References -- Further Reading -- 5 Scanning Probe Microscopy -- 5.1 Instrumentation. 5.1.1 Probe and Scanner -- 5.1.2 Control and Vibration Isolation -- 5.2 Scanning Tunneling Microscopy -- 5.2.1 Tunneling Current -- 5.2.2 Probe Tips and Working Environments -- 5.2.3 Operational Modes -- 5.2.4 Typical Applications -- 5.3 Atomic Force Microscopy -- 5.3.1 Near-Field Forces -- 5.3.1.1 Short-Range Forces -- 5.3.1.2 van der Waals Forces -- 5.3.1.3 Electrostatic Forces -- 5.3.1.4 Capillary Forces -- 5.3.2 Force Sensors -- 5.3.3 Operational Modes -- 5.3.3.1 Static Contact Modes -- 5.3.3.2 Lateral Force Microscopy -- 5.3.3.3 Dynamic Operational Modes -- 5.3.4 Typical Applications -- 5.3.4.1 Static Mode -- 5.3.4.2 Dynamic Noncontact Mode -- 5.3.4.3 Tapping Mode -- 5.3.4.4 Force Modulation -- 5.4 Image Artifacts -- 5.4.1 Tip -- 5.4.2 Scanner -- 5.4.3 Vibration and Operation -- References -- Further Reading -- 6 X-Ray Spectroscopy for Elemental Analysis -- 6.1 Features of Characteristic X-Rays -- 6.1.1 Types of Characteristic X-Rays -- 6.1.1.1 Selection Rules -- 6.1.2 Comparison of K, L, and M Series -- 6.2 X-Ray Fluorescence Spectrometry -- 6.2.1 Wavelength Dispersive Spectroscopy -- 6.2.1.1 Analyzing Crystal -- 6.2.1.2 Wavelength Dispersive Spectra -- 6.2.2 Energy Dispersive Spectroscopy -- 6.2.2.1 Detector -- 6.2.2.2 Energy Dispersive Spectra -- 6.2.2.3 Advances in Energy Dispersive Spectroscopy -- 6.2.3 XRF Working Atmosphere and Sample Preparation -- 6.3 Energy Dispersive Spectroscopy in Electron Microscopes -- 6.3.1 Special Features -- 6.3.2 Scanning Modes -- 6.4 Qualitative and Quantitative Analysis -- 6.4.1 Qualitative Analysis -- 6.4.2 Quantitative Analysis -- 6.4.2.1 Quantitative Analysis by X-Ray Fluorescence -- 6.4.2.2 Fundamental Parameter Method -- 6.4.2.3 Quantitative Analysis in Electron Microscopy -- References -- Further Reading -- 7 Electron Spectroscopy for Surface Analysis -- 7.1 Basic Principles. 7.1.1 X-Ray Photoelectron Spectroscopy -- 7.1.2 Auger Electron Spectroscopy -- 7.2 Instrumentation -- 7.2.1 Ultrahigh Vacuum System -- 7.2.2 Source Guns -- 7.2.2.1 X-Ray Gun -- 7.2.2.2 Electron Gun -- 7.2.2.3 Ion Gun -- 7.2.3 Electron Energy Analyzers -- 7.3 Characteristics of Electron Spectra -- 7.3.1 Photoelectron Spectra -- 7.3.2 Auger Electron Spectra -- 7.4 Qualitative and Quantitative Analysis -- 7.4.1 Qualitative Analysis -- 7.4.1.1 Peak Identification -- 7.4.1.2 Chemical Shifts -- 7.4.1.3 Problems with Insulating Materials -- 7.4.2 Quantitative Analysis -- 7.4.2.1 Peaks and Sensitivity Factors -- 7.4.3 Composition Depth Profiling -- References -- Further Reading -- 8 Secondary Ion Mass Spectrometry for Surface Analysis -- 8.1 Basic Principles -- 8.1.1 Secondary Ion Generation -- 8.1.2 Dynamic and Static SIMS -- 8.2 Instrumentation -- 8.2.1 Primary Ion System -- 8.2.1.1 Ion Sources -- 8.2.1.2 Wien Filter -- 8.2.2 Mass Analysis System -- 8.2.2.1 Magnetic Sector Analyzer -- 8.2.2.2 Quadrupole Mass Analyzer -- 8.2.2.3 Time-of-Flight Analyzer -- 8.3 Surface Structure Analysis -- 8.3.1 Experimental Aspects -- 8.3.1.1 Primary Ions -- 8.3.1.2 Flood Gun -- 8.3.1.3 Sample Handling -- 8.3.2 Spectrum Interpretation -- 8.3.2.1 Element Identification -- 8.4 SIMS Imaging -- 8.4.1 Generation of SIMS Images -- 8.4.2 Image Quality -- 8.5 SIMS Depth Profiling -- 8.5.1 Generation of Depth Profiles -- 8.5.2 Optimization of Depth Profiling -- 8.5.2.1 Primary Beam Energy -- 8.5.2.2 Incident Angle of Primary Beam -- 8.5.2.3 Analysis Area -- References -- 9 Vibrational Spectroscopy for Molecular Analysis -- 9.1 Theoretical Background -- 9.1.1 Electromagnetic Radiation -- 9.1.2 Origin of Molecular Vibrations -- 9.1.3 Principles of Vibrational Spectroscopy -- 9.1.3.1 Infrared Absorption -- 9.1.3.2 Raman Scattering -- 9.1.4 Normal Mode of Molecular Vibrations. 9.1.4.1 Number of Normal Vibration Modes -- 9.1.4.2 Classification of Normal Vibration Modes -- 9.1.5 Infrared and Raman Activity -- 9.1.5.1 Infrared Activity -- 9.1.5.2 Raman Activity -- 9.2 Fourier Transform Infrared Spectroscopy -- 9.2.1 Working Principles -- 9.2.2 Instrumentation -- 9.2.2.1 Infrared Light Source -- 9.2.2.2 Beamsplitter -- 9.2.2.3 Infrared Detector -- 9.2.2.4 Fourier Transform Infrared Spectra -- 9.2.3 Examination Techniques -- 9.2.3.1 Transmittance -- 9.2.3.2 Solid Sample Preparation -- 9.2.3.3 Liquid and Gas Sample Preparation -- 9.2.3.4 Reflectance -- 9.2.4 Fourier Transform Infrared Microspectroscopy -- 9.2.4.1 Instrumentation -- 9.2.4.2 Applications -- 9.3 Raman Microscopy -- 9.3.1 Instrumentation -- 9.3.1.1 Laser Source -- 9.3.1.2 Microscope System -- 9.3.1.3 Prefilters -- 9.3.1.4 Diffraction Grating -- 9.3.1.5 Detector -- 9.3.2 Fluorescence Problem -- 9.3.3 Raman Imaging -- 9.3.4 Applications -- 9.3.4.1 Phase Identification -- 9.3.4.2 Polymer Identification -- 9.3.4.3 Composition Determination -- 9.3.4.4 Determination of Residual Strain -- 9.3.4.5 Determination of Crystallographic Orientation -- 9.4 Interpretation of Vibrational Spectra -- 9.4.1 Qualitative Methods -- 9.4.1.1 Spectrum Comparison -- 9.4.1.2 Identifying Characteristic Bands -- 9.4.1.3 Band Intensities -- 9.4.2 Quantitative Methods -- 9.4.2.1 Quantitative Analysis of Infrared Spectra -- 9.4.2.2 Quantitative Analysis of Raman Spectra -- References -- Further Reading -- 10 Thermal Analysis -- 10.1 Common Characteristics -- 10.1.1 Thermal Events -- 10.1.1.1 Enthalpy Change -- 10.1.2 Instrumentation -- 10.1.3 Experimental Parameters -- 10.2 Differential Thermal Analysis and Differential Scanning Calorimetry -- 10.2.1 Working Principles -- 10.2.1.1 Differential Thermal Analysis -- 10.2.1.2 Differential Scanning Calorimetry. 10.2.1.3 Temperature-Modulated Differential Scanning Calorimetry. |
| Record Nr. | UNINA-9910822761803321 |
|
Leng Y (Yang)
|
||
| Weinheim, : J. Wiley, c2013 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||