Info
- Utilizzare la checkbox di selezione a fianco di ciascun documento per attivare le funzionalità di stampa, invio email, download nei formati disponibili del (i) record.
Electrically Assisted Forming : Modeling and Control / / by Wesley A. Salandro, Joshua J. Jones, Cristina Bunget, Laine Mears, John T. Roth
| Electrically Assisted Forming : Modeling and Control / / by Wesley A. Salandro, Joshua J. Jones, Cristina Bunget, Laine Mears, John T. Roth |
| Autore | Salandro Wesley A |
| Edizione | [1st ed. 2015.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2015 |
| Descrizione fisica | 1 online resource (366 p.) |
| Disciplina | 671.732 |
| Collana | Springer Series in Advanced Manufacturing |
| Soggetto topico |
Manufactures
Manufacturing, Machines, Tools, Processes |
| ISBN | 3-319-08879-3 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction to Electrically-Assisted Forming -- Bulk Modeling Methodology for Electrically-Assisted Manufacturing -- The Electroplastic Effect -- Comprehensive EAF Modeling -- Experimental Findings for EAF -- Contact Effects of EAF -- Microstructural Effects on EAF -- Phase distribution Effects on EAF -- Analysis of EAF Modeling Sensitivity and Robustness -- Broader Impacts of EAF -- Tooling design considerations -- Additional Applications of Electrically-Assisted Manufacturing (EAM) -- Control design for Electrically-Assisted Forming -- Cost and Energy Analysis. |
| Record Nr. | UNINA-9910299854603321 |
Salandro Wesley A
|
||
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2015 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Electrodeposition [[electronic resource] ] : properties, processes, and applications / / Udit Surya Mohanty, editor
| Electrodeposition [[electronic resource] ] : properties, processes, and applications / / Udit Surya Mohanty, editor |
| Pubbl/distr/stampa | New York, : Nova Science Publishers, c2012 |
| Descrizione fisica | 1 online resource (375 p.) |
| Disciplina | 671.732 |
| Altri autori (Persone) | MohantyUdit Surya |
| Collana | Electrical Engineering Developments |
| Soggetto topico |
Alloy plating
Electroplating |
| Soggetto genere / forma | Electronic books. |
| ISBN | 1-61470-845-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
""ELECTRODEPOSITION ""; ""ELECTRODEPOSITION ""; ""CONTENTS ""; ""PREFACE ""; ""A REVIEW ON THE ELECTRODEPOSITION OF NICKEL: SYNTHESIS, MAGNETIC, THERMODYNAMIC PROPERTIES AND ITS POTENTIAL APPLICATIONS ""; ""ABSTRACT ""; ""INTRODUCTION ""; ""1.1. CRYSTAL STRUCTURES OF NICKEL ""; ""1.2. SYNTHESIS ""; ""1.2.1. FCC Nickel ""; ""1.2.2. HCP Nickel""; ""1.3. MAGNETIC AND THERMODYNAMIC PROPERTIES ""; ""1.4. APPLICATIONS ""; ""CONCLUSION ""; ""REFERENCES""; ""DEPOSITION AND PROPERTIES OF ELECTROCHEMICAL COMPOSITE COATINGS ""; ""ABSTRACT ""; ""INTRODUCTION ""
""2.1. DIFFERENT TYPES OF ELECTROCHEMICAL COMPOSITE COATINGS (ECC) """"2.1.1. Nickel-Based ECC ""; ""2.1.2. Chromium-Based ECC ""; ""2.1.3. Copper-Based ECC ""; ""2.1.4. Iron-Based ECC""; ""2.1.5. Zinc-Based ECC ""; ""2.1.6. ECC Based on Noble Metals ""; ""CONCLUSION ""; ""REFERENCES ""; ""ELECTRODEPOSITION OF AU-SN ALLOYS ""; ""ABSTRACT""; ""INTRODUCTION ""; ""3.1. ELECTRODEPOSITION OF AU-SN ALLOYS FROM A SINGLE SOLUTION""; ""3.1.1. Solution Preparation ""; ""3.2. SOLUTION STABILITY ""; ""3.2.1. Solution Precipitation and Turbidity Measurements "" ""3.2.2. Characterization of Precipitates """"3.2.3. UV/Vis Spectroscopy and X-Ray Photoelectron Spectroscopy Studies ""; ""3.3. MICROSTRUCTURE OF ELECTRODEPOSITED FILMS""; ""3.3.1. Microstructure of Eutectic Deposits and Reflowed Solder ""; ""3.4. RECOVERY OF AU FROM THE WASTE SOLUTION ""; ""3.5. SEQUENTIAL ELECTRODEPOSITION FROM TWO SEPARATE SOLUTIONS ""; ""3.5.1. Solution Preparation and Electrodeposition of Pure Au Films ""; ""3.5.2. Solution Preparation and Electrodeposition of Pure Sn Films ""; ""3.5.3. Microstructure of Sequentially Deposited Eutectic Alloys and Reflowed Solder"" ""CONCLUSION """"ACKNOWLEDGMENTS ""; ""REFERENCES ""; ""ELECTROCHEMICAL CORROSION BEHAVIOUR OF LEAD � FREE SOLDER ALLOYS IN 3.5 % NACL SOLUTION""; ""ABSTRACT ""; ""INTRODUCTION ""; ""4.1. ELECTROCHEMICAL CORROSION STUDY OF SN-XAG-0.5 CU SOLDER ALLOYS ""; ""4. 1.1. Polarisation Study ""; ""4.1.2. Surface Characterisation Studies ""; ""4.2. ELECTROCHEMICAL CORROSION STUDY OF SN-8.5ZN-XAG-0.1AL-0.05GA SOLDER ALLOYS ""; ""4.2.1. Polarization Study ""; ""4.2.2. Surface Characterisation Studies""; ""4.3. ELECTROCHEMICAL CORROSION STUDY OF SN-8.5ZN-X AL-0.5 GA SOLDER ALLOYS "" ""4.3.1. Polarisation Study""""4.3.2. Surface Characterisation Studies: ""; ""CONCLUSION""; ""REFERENCES ""; ""PROPERTIES AND APPLICATIONS OF NICKEL COATINGS SYNTHESIZED BY PULSE ELECTRODEPOSITION""; ""ABSTRACT""; ""INTRODUCTION ""; ""5.1. THE SYNTHESIS OF NICKEL COATING WITH HIGH DENSITY NT ""; ""5.1.1. The Synthesis of Nickel Coatings with High Density NT ""; ""5.1.2. The Corrosion Property of Nickel Coating with High Density NT ""; ""5.1.3. The Semiconducting Behavior of Passive Film of NT Nickel ""; ""5.2. INHIBITION OF HYDROGEN BLISTER ON CU�SN ALLOY COATINGS "" ""5.2.1. Influence of Current Density on Hydrogen Permeation "" |
| Record Nr. | UNINA-9910452168203321 |
| New York, : Nova Science Publishers, c2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Electrodeposition [[electronic resource] ] : properties, processes, and applications / / Udit Surya Mohanty, editor
| Electrodeposition [[electronic resource] ] : properties, processes, and applications / / Udit Surya Mohanty, editor |
| Pubbl/distr/stampa | New York, : Nova Science Publishers, c2012 |
| Descrizione fisica | 1 online resource (375 p.) |
| Disciplina | 671.732 |
| Altri autori (Persone) | MohantyUdit Surya |
| Collana | Electrical Engineering Developments |
| Soggetto topico |
Alloy plating
Electroplating |
| ISBN | 1-61470-845-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
""ELECTRODEPOSITION ""; ""ELECTRODEPOSITION ""; ""CONTENTS ""; ""PREFACE ""; ""A REVIEW ON THE ELECTRODEPOSITION OF NICKEL: SYNTHESIS, MAGNETIC, THERMODYNAMIC PROPERTIES AND ITS POTENTIAL APPLICATIONS ""; ""ABSTRACT ""; ""INTRODUCTION ""; ""1.1. CRYSTAL STRUCTURES OF NICKEL ""; ""1.2. SYNTHESIS ""; ""1.2.1. FCC Nickel ""; ""1.2.2. HCP Nickel""; ""1.3. MAGNETIC AND THERMODYNAMIC PROPERTIES ""; ""1.4. APPLICATIONS ""; ""CONCLUSION ""; ""REFERENCES""; ""DEPOSITION AND PROPERTIES OF ELECTROCHEMICAL COMPOSITE COATINGS ""; ""ABSTRACT ""; ""INTRODUCTION ""
""2.1. DIFFERENT TYPES OF ELECTROCHEMICAL COMPOSITE COATINGS (ECC) """"2.1.1. Nickel-Based ECC ""; ""2.1.2. Chromium-Based ECC ""; ""2.1.3. Copper-Based ECC ""; ""2.1.4. Iron-Based ECC""; ""2.1.5. Zinc-Based ECC ""; ""2.1.6. ECC Based on Noble Metals ""; ""CONCLUSION ""; ""REFERENCES ""; ""ELECTRODEPOSITION OF AU-SN ALLOYS ""; ""ABSTRACT""; ""INTRODUCTION ""; ""3.1. ELECTRODEPOSITION OF AU-SN ALLOYS FROM A SINGLE SOLUTION""; ""3.1.1. Solution Preparation ""; ""3.2. SOLUTION STABILITY ""; ""3.2.1. Solution Precipitation and Turbidity Measurements "" ""3.2.2. Characterization of Precipitates """"3.2.3. UV/Vis Spectroscopy and X-Ray Photoelectron Spectroscopy Studies ""; ""3.3. MICROSTRUCTURE OF ELECTRODEPOSITED FILMS""; ""3.3.1. Microstructure of Eutectic Deposits and Reflowed Solder ""; ""3.4. RECOVERY OF AU FROM THE WASTE SOLUTION ""; ""3.5. SEQUENTIAL ELECTRODEPOSITION FROM TWO SEPARATE SOLUTIONS ""; ""3.5.1. Solution Preparation and Electrodeposition of Pure Au Films ""; ""3.5.2. Solution Preparation and Electrodeposition of Pure Sn Films ""; ""3.5.3. Microstructure of Sequentially Deposited Eutectic Alloys and Reflowed Solder"" ""CONCLUSION """"ACKNOWLEDGMENTS ""; ""REFERENCES ""; ""ELECTROCHEMICAL CORROSION BEHAVIOUR OF LEAD � FREE SOLDER ALLOYS IN 3.5 % NACL SOLUTION""; ""ABSTRACT ""; ""INTRODUCTION ""; ""4.1. ELECTROCHEMICAL CORROSION STUDY OF SN-XAG-0.5 CU SOLDER ALLOYS ""; ""4. 1.1. Polarisation Study ""; ""4.1.2. Surface Characterisation Studies ""; ""4.2. ELECTROCHEMICAL CORROSION STUDY OF SN-8.5ZN-XAG-0.1AL-0.05GA SOLDER ALLOYS ""; ""4.2.1. Polarization Study ""; ""4.2.2. Surface Characterisation Studies""; ""4.3. ELECTROCHEMICAL CORROSION STUDY OF SN-8.5ZN-X AL-0.5 GA SOLDER ALLOYS "" ""4.3.1. Polarisation Study""""4.3.2. Surface Characterisation Studies: ""; ""CONCLUSION""; ""REFERENCES ""; ""PROPERTIES AND APPLICATIONS OF NICKEL COATINGS SYNTHESIZED BY PULSE ELECTRODEPOSITION""; ""ABSTRACT""; ""INTRODUCTION ""; ""5.1. THE SYNTHESIS OF NICKEL COATING WITH HIGH DENSITY NT ""; ""5.1.1. The Synthesis of Nickel Coatings with High Density NT ""; ""5.1.2. The Corrosion Property of Nickel Coating with High Density NT ""; ""5.1.3. The Semiconducting Behavior of Passive Film of NT Nickel ""; ""5.2. INHIBITION OF HYDROGEN BLISTER ON CU�SN ALLOY COATINGS "" ""5.2.1. Influence of Current Density on Hydrogen Permeation "" |
| Record Nr. | UNINA-9910779507503321 |
| New York, : Nova Science Publishers, c2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Electrodeposition [[electronic resource] ] : properties, processes, and applications / / Udit Surya Mohanty, editor
| Electrodeposition [[electronic resource] ] : properties, processes, and applications / / Udit Surya Mohanty, editor |
| Edizione | [1st ed.] |
| Pubbl/distr/stampa | New York, : Nova Science Publishers, c2012 |
| Descrizione fisica | 1 online resource (375 p.) |
| Disciplina | 671.732 |
| Altri autori (Persone) | MohantyUdit Surya |
| Collana | Electrical Engineering Developments |
| Soggetto topico |
Alloy plating
Electroplating |
| ISBN | 1-61470-845-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
""ELECTRODEPOSITION ""; ""ELECTRODEPOSITION ""; ""CONTENTS ""; ""PREFACE ""; ""A REVIEW ON THE ELECTRODEPOSITION OF NICKEL: SYNTHESIS, MAGNETIC, THERMODYNAMIC PROPERTIES AND ITS POTENTIAL APPLICATIONS ""; ""ABSTRACT ""; ""INTRODUCTION ""; ""1.1. CRYSTAL STRUCTURES OF NICKEL ""; ""1.2. SYNTHESIS ""; ""1.2.1. FCC Nickel ""; ""1.2.2. HCP Nickel""; ""1.3. MAGNETIC AND THERMODYNAMIC PROPERTIES ""; ""1.4. APPLICATIONS ""; ""CONCLUSION ""; ""REFERENCES""; ""DEPOSITION AND PROPERTIES OF ELECTROCHEMICAL COMPOSITE COATINGS ""; ""ABSTRACT ""; ""INTRODUCTION ""
""2.1. DIFFERENT TYPES OF ELECTROCHEMICAL COMPOSITE COATINGS (ECC) """"2.1.1. Nickel-Based ECC ""; ""2.1.2. Chromium-Based ECC ""; ""2.1.3. Copper-Based ECC ""; ""2.1.4. Iron-Based ECC""; ""2.1.5. Zinc-Based ECC ""; ""2.1.6. ECC Based on Noble Metals ""; ""CONCLUSION ""; ""REFERENCES ""; ""ELECTRODEPOSITION OF AU-SN ALLOYS ""; ""ABSTRACT""; ""INTRODUCTION ""; ""3.1. ELECTRODEPOSITION OF AU-SN ALLOYS FROM A SINGLE SOLUTION""; ""3.1.1. Solution Preparation ""; ""3.2. SOLUTION STABILITY ""; ""3.2.1. Solution Precipitation and Turbidity Measurements "" ""3.2.2. Characterization of Precipitates """"3.2.3. UV/Vis Spectroscopy and X-Ray Photoelectron Spectroscopy Studies ""; ""3.3. MICROSTRUCTURE OF ELECTRODEPOSITED FILMS""; ""3.3.1. Microstructure of Eutectic Deposits and Reflowed Solder ""; ""3.4. RECOVERY OF AU FROM THE WASTE SOLUTION ""; ""3.5. SEQUENTIAL ELECTRODEPOSITION FROM TWO SEPARATE SOLUTIONS ""; ""3.5.1. Solution Preparation and Electrodeposition of Pure Au Films ""; ""3.5.2. Solution Preparation and Electrodeposition of Pure Sn Films ""; ""3.5.3. Microstructure of Sequentially Deposited Eutectic Alloys and Reflowed Solder"" ""CONCLUSION """"ACKNOWLEDGMENTS ""; ""REFERENCES ""; ""ELECTROCHEMICAL CORROSION BEHAVIOUR OF LEAD � FREE SOLDER ALLOYS IN 3.5 % NACL SOLUTION""; ""ABSTRACT ""; ""INTRODUCTION ""; ""4.1. ELECTROCHEMICAL CORROSION STUDY OF SN-XAG-0.5 CU SOLDER ALLOYS ""; ""4. 1.1. Polarisation Study ""; ""4.1.2. Surface Characterisation Studies ""; ""4.2. ELECTROCHEMICAL CORROSION STUDY OF SN-8.5ZN-XAG-0.1AL-0.05GA SOLDER ALLOYS ""; ""4.2.1. Polarization Study ""; ""4.2.2. Surface Characterisation Studies""; ""4.3. ELECTROCHEMICAL CORROSION STUDY OF SN-8.5ZN-X AL-0.5 GA SOLDER ALLOYS "" ""4.3.1. Polarisation Study""""4.3.2. Surface Characterisation Studies: ""; ""CONCLUSION""; ""REFERENCES ""; ""PROPERTIES AND APPLICATIONS OF NICKEL COATINGS SYNTHESIZED BY PULSE ELECTRODEPOSITION""; ""ABSTRACT""; ""INTRODUCTION ""; ""5.1. THE SYNTHESIS OF NICKEL COATING WITH HIGH DENSITY NT ""; ""5.1.1. The Synthesis of Nickel Coatings with High Density NT ""; ""5.1.2. The Corrosion Property of Nickel Coating with High Density NT ""; ""5.1.3. The Semiconducting Behavior of Passive Film of NT Nickel ""; ""5.2. INHIBITION OF HYDROGEN BLISTER ON CU�SN ALLOY COATINGS "" ""5.2.1. Influence of Current Density on Hydrogen Permeation "" |
| Record Nr. | UNINA-9910820921703321 |
| New York, : Nova Science Publishers, c2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Electrodeposition and Surface Finishing : Fundamentals and Applications / / edited by Stojan S. Djokić
| Electrodeposition and Surface Finishing : Fundamentals and Applications / / edited by Stojan S. Djokić |
| Edizione | [1st ed. 2014.] |
| Pubbl/distr/stampa | New York, NY : , : Springer New York : , : Imprint : Springer, , 2014 |
| Descrizione fisica | 1 online resource (376 p.) |
| Disciplina | 671.732 |
| Collana | Modern Aspects of Electrochemistry |
| Soggetto topico |
Electrochemistry
Mechanical engineering Metals Nanotechnology Electronics Microelectronics Mechanical Engineering Metallic Materials Electronics and Microelectronics, Instrumentation |
| ISBN | 1-4939-0289-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Electrodeposition and Characterization of Alloys and Composite Materials -- A New Approach to the Understanding of the Mechanism of Lead Electrodeposition -- Electrophoretic Deposition of Ceramic Coatings on Metal Surfaces -- Electrochemical Synthesis of Metal Oxides for Energy Applications -- Luminescence During the Electrochemical Oxidation of Aluminum -- Electrochemical Aspects of Chemical Mechanical Polishing -- Metallization of Semiconductors and Non-Conductive Surfaces from Aqueous Solutions. |
| Record Nr. | UNINA-9910298463603321 |
| New York, NY : , : Springer New York : , : Imprint : Springer, , 2014 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Electrodeposition of Composite Materials / / Adel M. A. Mohamed, Teresa D. Golden
| Electrodeposition of Composite Materials / / Adel M. A. Mohamed, Teresa D. Golden |
| Autore | Mohamed Adel M. A. |
| Pubbl/distr/stampa | Rijeka, Croatia : , : IntechOpen, , 2016 |
| Descrizione fisica | 1 online resource (284 pages) : illustrations (some color) |
| Disciplina | 671.732 |
| Soggetto topico |
Coating processes
Nanocomposites (Materials) |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910764193803321 |
|
Mohamed Adel M. A.
|
||
| Rijeka, Croatia : , : IntechOpen, , 2016 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Electrodeposition of Composite Materials / / edited by Adel M. A. Mohamed and Teresa D. Golden
| Electrodeposition of Composite Materials / / edited by Adel M. A. Mohamed and Teresa D. Golden |
| Pubbl/distr/stampa | Rijeka : , : InTech, , 2016 |
| Descrizione fisica | 1 online resource (284 pages) : illustrations |
| Disciplina | 671.732 |
| Soggetto topico |
Coating processes
Composite materials Electroplating |
| ISBN |
953-51-4205-4
953-51-2270-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910136972903321 |
| Rijeka : , : InTech, , 2016 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Electroplating / / edited by Darwin Sebayang and Sulaiman Bin Haji Hasan
| Electroplating / / edited by Darwin Sebayang and Sulaiman Bin Haji Hasan |
| Pubbl/distr/stampa | Rijeka : , : IntechOpen, , 2012 |
| Descrizione fisica | 1 online resource (xi, 178 pages) : illustrations |
| Disciplina | 671.732 |
| Soggetto topico | Electroplating |
| ISBN | 953-51-4991-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910317602703321 |
| Rijeka : , : IntechOpen, , 2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
ELECTROPLATING engineering handbook / edited by A. K. Graham and H. L. Pinkerton
| ELECTROPLATING engineering handbook / edited by A. K. Graham and H. L. Pinkerton |
| Edizione | [2. ed.] |
| Pubbl/distr/stampa | New York : Reinhold publishing, 1962 |
| Descrizione fisica | XXI, 774 p. : ill. ; 26 cm |
| Disciplina | 671.732 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | ita |
| Record Nr. | UNINA-990000034530403321 |
| New York : Reinhold publishing, 1962 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Fundamentals of electrochemical deposition [[electronic resource] /] / Milan Paunovic, Mordechay Schlesinger
| Fundamentals of electrochemical deposition [[electronic resource] /] / Milan Paunovic, Mordechay Schlesinger |
| Autore | Paunovic Milan |
| Edizione | [2nd ed.] |
| Pubbl/distr/stampa | Hoboken, N.J., : Wiley-Interscience, c2006 |
| Descrizione fisica | 1 online resource (388 p.) |
| Disciplina |
541.37
671.732 |
| Altri autori (Persone) | SchlesingerMordechay |
| Collana | The Electrochemical Society series |
| Soggetto topico | Electroplating |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-280-55149-6
9786610551491 0-470-00940-3 0-470-00939-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
FUNDAMENTALS OF ELECTROCHEMICAL DEPOSITION; CONTENTS; Preface to the Second Edition; Preface to the First Edition; 1. Overview; 2. Water and Ionic Solutions; 3. Metals and Metal Surfaces; 4. Metal-Solution Interphase; 5. Equilibrium Electrode Potential; 6. Kinetics and Mechanism of Electrodeposition; 7. Nucleation and Growth Models; 8. Electroless Deposition; 9. Displacement Deposition; 10. Effect of Additives; 11. Electrodeposition of Alloys; 12. Metal Deposit and Current Distribution; 13. Characterization of Metallic Surfaces and Thin Films; 14. In Situ Characterization of Deposition
15. Mathematical Modeling in Electrochemistry16. Structure and Properties of Deposits; 17. Electrodeposited Multilayers; 18. Interdiffusion in Thin Films; 19. Applications in Semiconductor Technology; 20. Applications in the Fields of Magnetism and Microelectronics; 21. Frontiers in Applications: The Field of Medicine; Index |
| Record Nr. | UNINA-9910143569903321 |
|
Paunovic Milan
|
||
| Hoboken, N.J., : Wiley-Interscience, c2006 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
