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Electrodeposition : the materials science of coatings and substrates / / by Jack W. Dini
| Electrodeposition : the materials science of coatings and substrates / / by Jack W. Dini |
| Autore | Dini J. W |
| Pubbl/distr/stampa | Park Ridge, N.J., U.S.A., : Noyes Publications, c1993 |
| Descrizione fisica | xiii, 367 p. : ill |
| Disciplina | 671.7/32 |
| Collana | Materials science and process technology series |
| Soggetto topico |
Electroplating
Metals - Finishing |
| ISBN |
1-282-00227-9
9786612002274 0-8155-1698-3 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9911006661103321 |
Dini J. W
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| Park Ridge, N.J., U.S.A., : Noyes Publications, c1993 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Fundamentals of electrochemical deposition / / Milan Paunovic, Mordechay Schlesinger
| Fundamentals of electrochemical deposition / / Milan Paunovic, Mordechay Schlesinger |
| Autore | Paunovic Milan |
| Edizione | [2nd ed.] |
| Pubbl/distr/stampa | Hoboken, N.J., : Wiley-Interscience, c2006 |
| Descrizione fisica | 1 online resource (388 p.) |
| Disciplina | 671.7/32 |
| Altri autori (Persone) | SchlesingerMordechay |
| Collana | The Electrochemical Society series |
| Soggetto topico | Electroplating |
| ISBN |
9786610551491
9781280551499 1280551496 9780470009406 0470009403 9780470009390 047000939X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
FUNDAMENTALS OF ELECTROCHEMICAL DEPOSITION; CONTENTS; Preface to the Second Edition; Preface to the First Edition; 1. Overview; 2. Water and Ionic Solutions; 3. Metals and Metal Surfaces; 4. Metal-Solution Interphase; 5. Equilibrium Electrode Potential; 6. Kinetics and Mechanism of Electrodeposition; 7. Nucleation and Growth Models; 8. Electroless Deposition; 9. Displacement Deposition; 10. Effect of Additives; 11. Electrodeposition of Alloys; 12. Metal Deposit and Current Distribution; 13. Characterization of Metallic Surfaces and Thin Films; 14. In Situ Characterization of Deposition
15. Mathematical Modeling in Electrochemistry16. Structure and Properties of Deposits; 17. Electrodeposited Multilayers; 18. Interdiffusion in Thin Films; 19. Applications in Semiconductor Technology; 20. Applications in the Fields of Magnetism and Microelectronics; 21. Frontiers in Applications: The Field of Medicine; Index |
| Record Nr. | UNINA-9911019830903321 |
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Paunovic Milan
|
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| Hoboken, N.J., : Wiley-Interscience, c2006 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Modern electroplating [[electronic resource] /] / edited by Mordechay Schlesinger, Milan Paunovic
| Modern electroplating [[electronic resource] /] / edited by Mordechay Schlesinger, Milan Paunovic |
| Edizione | [5th ed.] |
| Pubbl/distr/stampa | Hoboken, NJ, : Wiley, c2010 |
| Descrizione fisica | 1 online resource (749 p.) |
| Disciplina | 671.7/32 |
| Altri autori (Persone) |
PaunovicMilan
SchlesingerMordechay |
| Collana | The ECS series of texts and monographs |
| Soggetto topico |
Electroplating
Metals - Finishing |
| ISBN |
1-118-06314-7
1-283-37153-7 9786613371539 0-470-60262-7 0-470-60263-5 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
MODERN ELECTROPLATING; CONTENTS; PREFACE; PREFACE TO THE FOURTH EDITION; CONTRIBUTORS; CONVERSION FACTORS; GRAPHICAL CONVERSIONS; THE ELECTROCHEMICAL SOCIETY SERIES; 1 FUNDAMENTAL CONSIDERATIONS; 2 ELECTRODEPOSITION OF COPPER; 3 ELECTRODEPOSITION OF NICKEL; 4 ELECTRODEPOSITION OF GOLD; 5 ELECTROLESS AND ELECTRODEPOSITION OF SILVER; 6 TIN AND TIN ALLOYS FOR LEAD-FREE SOLDER; 7 ELECTRODEPOSITION OF CHROMIUM; 8 ELECTRODEPOSITION OF LEAD AND LEAD ALLOYS; 9 ELECTRODEPOSITION OF TIN-LEAD ALLOYS; 10 ELECTRODEPOSITION OF ZINC AND ZINC ALLOYS; 11 ELECTRODEPOSITION OF IRON AND IRON ALLOYS
12 PALLADIUM ELECTROPLATING13 ELECTROCHEMICAL DEPOSITION PROCESS FOR ULSI INTERCONNECTION DEVICES; 14 ELECTRODEPOSITION OF SEMICONDUCTORS; 15 DEPOSITION ON NONCONDUCTORS; 16 CONDUCTIVE POLYMERS: ELECTROPLATING OF ORGANIC FILMS; 17 ELECTROLESS DEPOSITION OF COPPER; 18 ELECTROLESS DEPOSITION OF NICKEL; 19 ELECTROCHEMICAL SYNTHESIS OF METAL ALLOYS FOR MAGNETIC RECORDING SYSTEMS; 20 ELECTROLESS DEPOSITION OF PALLADIUM AND PLATINUM; 21 ELECTROLESS DEPOSITION OF GOLD; 22 ELECTROLESS DEPOSITION OF ALLOYS; 23 PREPARATION FOR DEPOSITION; 24 MANUFACTURING TOOLS; 25 MONITORING AND CONTROL 26 ENVIRONMENTAL ASPECTS OF ELECTRODEPOSITION27 APPLICATIONS TO MAGNETIC RECORDING AND MICROELECTRONIC TECHNOLOGIES; 28 MICROELECTROMECHANICAL SYSTEMS; 29 ANALYSIS OF ELECTROPLATED FILMS USING DUAL-BEAM FIB/SEM AND TEM TECHNIQUES; 30 IONIC LIQUID TREATMENTS FOR ENHANCED CORROSION RESISTANCE OF MAGNESIUM-BASED SUBSTRATES; APPENDIX; INDEX |
| Record Nr. | UNINA-9910133458303321 |
| Hoboken, NJ, : Wiley, c2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Modern electroplating / / edited by Mordechay Schlesinger, Milan Paunovic
| Modern electroplating / / edited by Mordechay Schlesinger, Milan Paunovic |
| Edizione | [5th ed.] |
| Pubbl/distr/stampa | Hoboken, NJ, : Wiley, c2010 |
| Descrizione fisica | 1 online resource (749 p.) |
| Disciplina | 671.7/32 |
| Altri autori (Persone) |
PaunovicMilan
SchlesingerMordechay |
| Collana | The ECS series of texts and monographs |
| Soggetto topico |
Electroplating
Metals - Finishing |
| ISBN |
9786613371539
9781118063149 1118063147 9781283371537 1283371537 9780470602621 0470602627 9780470602638 0470602635 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
MODERN ELECTROPLATING; CONTENTS; PREFACE; PREFACE TO THE FOURTH EDITION; CONTRIBUTORS; CONVERSION FACTORS; GRAPHICAL CONVERSIONS; THE ELECTROCHEMICAL SOCIETY SERIES; 1 FUNDAMENTAL CONSIDERATIONS; 2 ELECTRODEPOSITION OF COPPER; 3 ELECTRODEPOSITION OF NICKEL; 4 ELECTRODEPOSITION OF GOLD; 5 ELECTROLESS AND ELECTRODEPOSITION OF SILVER; 6 TIN AND TIN ALLOYS FOR LEAD-FREE SOLDER; 7 ELECTRODEPOSITION OF CHROMIUM; 8 ELECTRODEPOSITION OF LEAD AND LEAD ALLOYS; 9 ELECTRODEPOSITION OF TIN-LEAD ALLOYS; 10 ELECTRODEPOSITION OF ZINC AND ZINC ALLOYS; 11 ELECTRODEPOSITION OF IRON AND IRON ALLOYS
12 PALLADIUM ELECTROPLATING13 ELECTROCHEMICAL DEPOSITION PROCESS FOR ULSI INTERCONNECTION DEVICES; 14 ELECTRODEPOSITION OF SEMICONDUCTORS; 15 DEPOSITION ON NONCONDUCTORS; 16 CONDUCTIVE POLYMERS: ELECTROPLATING OF ORGANIC FILMS; 17 ELECTROLESS DEPOSITION OF COPPER; 18 ELECTROLESS DEPOSITION OF NICKEL; 19 ELECTROCHEMICAL SYNTHESIS OF METAL ALLOYS FOR MAGNETIC RECORDING SYSTEMS; 20 ELECTROLESS DEPOSITION OF PALLADIUM AND PLATINUM; 21 ELECTROLESS DEPOSITION OF GOLD; 22 ELECTROLESS DEPOSITION OF ALLOYS; 23 PREPARATION FOR DEPOSITION; 24 MANUFACTURING TOOLS; 25 MONITORING AND CONTROL 26 ENVIRONMENTAL ASPECTS OF ELECTRODEPOSITION27 APPLICATIONS TO MAGNETIC RECORDING AND MICROELECTRONIC TECHNOLOGIES; 28 MICROELECTROMECHANICAL SYSTEMS; 29 ANALYSIS OF ELECTROPLATED FILMS USING DUAL-BEAM FIB/SEM AND TEM TECHNIQUES; 30 IONIC LIQUID TREATMENTS FOR ENHANCED CORROSION RESISTANCE OF MAGNESIUM-BASED SUBSTRATES; APPENDIX; INDEX |
| Record Nr. | UNINA-9910826412903321 |
| Hoboken, NJ, : Wiley, c2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||