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Advances in Forming, Machining and Automation : Proceedings of AIMTDR 2018 / / edited by M. S. Shunmugam, M. Kanthababu
| Advances in Forming, Machining and Automation : Proceedings of AIMTDR 2018 / / edited by M. S. Shunmugam, M. Kanthababu |
| Edizione | [1st ed. 2019.] |
| Pubbl/distr/stampa | Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2019 |
| Descrizione fisica | 1 online resource (725 pages) |
| Disciplina | 671.58 |
| Collana | Lecture Notes on Multidisciplinary Industrial Engineering |
| Soggetto topico |
Coatings
Tribology Corrosion and anti-corrosives Manufactures Machinery Surfaces (Technology) Thin films Corrosion Machines, Tools, Processes Machinery and Machine Elements Surfaces, Interfaces and Thin Film |
| ISBN | 981-329-417-5 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Effect of Heat Treatment on Formability of AA6082 by Single Point Incremental Forming -- Forming Behavior of AA5052-H32 & AA6061-T6 During Single Point Incremental Forming -- Pull out Forming: Experiments and Process Simulation -- Failure Prediction and Forming Behavior of AA5754 Sheets at Warm Temperature -- Magnetic Pulse Forming and Punching of Al Tubes - A Novel Technique for Forming and Perforation of Tubes -- Experimental Investigation on the Forming of AA 5052-H32 Sheet Using a Rigid Body Based Impact in a Shock Tube. |
| Record Nr. | UNINA-9910357821603321 |
| Singapore : , : Springer Nature Singapore : , : Imprint : Springer, , 2019 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Copper wire bonding / / Preeti S. Chauhan [and three others]
| Copper wire bonding / / Preeti S. Chauhan [and three others] |
| Autore | Chauhan Preeti S |
| Edizione | [1st ed. 2014.] |
| Pubbl/distr/stampa | New York : , : Springer, , 2014 |
| Descrizione fisica | 1 online resource (xxvi, 235 pages) : illustrations (some color) |
| Disciplina | 671.58 |
| Collana | Gale eBooks |
| Soggetto topico |
Wire bonding (Electronic packaging)
Copper wire |
| ISBN | 1-4614-5761-0 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Copper Wire Bonding -- Bonding Process -- Bonding Metallurgies -- Wire Bond Evaluation -- Thermal Reliability Tests -- Humidity and Electromigration Tests -- Wire Bond Pads -- Concerns and Solutions -- Recommendations -- Appendix A: Reliability Data -- Appendix B: Patents on Copper Wire Bonding. |
| Record Nr. | UNINA-9910299461003321 |
Chauhan Preeti S
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| New York : , : Springer, , 2014 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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