| Pubbl/distr/stampa |
Cham, Switzerland : , : Springer, , [2022]
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| Descrizione fisica |
1 online resource (332 pages)
|
| Disciplina |
671.56
|
| Collana |
Topics in Mining, Metallurgy and Materials Engineering
|
| Soggetto topico |
Lead-free electronics manufacturing processes
Metals
|
| ISBN |
3-030-93441-1
|
| Formato |
Materiale a stampa  |
| Livello bibliografico |
Monografia |
| Lingua di pubblicazione |
eng
|
| Nota di contenuto |
Intro -- Preface -- Acknowledgements -- Contents -- About the Editors -- Development of Materials -- Recent Studies in the Development of Ceramic-Reinforced Lead-Free Composite Solder -- 1 Introduction -- 2 Materials Selection -- 2.1 Physical Properties -- 2.2 Mechanical Properties -- 2.3 Cost -- 3 Fabrication Technique -- 3.1 Casting -- 3.2 Powder Metallurgy -- 4 Characterisation -- 4.1 Microstructure and Properties of Ceramic Composite for Electronics -- 4.2 Electrical Properties -- 4.3 Mechanical Performance -- 5 Advantages and Limitation of Ceramics Composite Solder -- 6 Conclusion -- References -- Development of Geopolymer Ceramic-Reinforced Solder -- 1 Introduction -- 2 Geopolymer Materials -- 2.1 Fly Ash -- 2.2 Ground Granulated Blast Furnace Slag -- 2.3 Clay -- 2.4 Addition Mixture -- 3 Synthesis of Geopolymer Ceramics -- 3.1 Powder Metallurgy -- 3.2 Direct Sintering -- 3.3 Self-fluxing Agent of Low-Sintered Kaolin Geopolymer -- 4 Properties of Geopolymer Ceramic Particles for Solder Reinforcement -- 4.1 Geopolymer Ceramic -- 4.2 Geopolymer Ceramic with Polymer Addition -- 5 Application of Geopolymer Ceramic as a Reinforcement Particle in Lead-Free Solder -- 5.1 Composite Solder Fabrication -- 5.2 Properties of Solder Reinforced Geopolymer -- 6 Conclusion -- References -- Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Solders -- 1 Introduction -- 2 Issues in Ceramic-Reinforced Composite Solder -- 2.1 Phase Segregation -- 2.2 Non-wetting and Non-uniform Distribution Properties of Reinforcement Particle -- 3 Type of Surface Modification Technique on the Reinforced Solder -- 3.1 Pyrolysis -- 3.2 Chemical Route -- 3.3 Electroless Plating -- 4 Effect of Surface Modification on the Reinforced Particle to the Solder Properties -- 4.1 Intermetallic Compound -- 4.2 Microstructure -- 4.3 Thermal Properties -- 4.4 Wettability.
4.5 Mechanical Properties -- 5 Conclusion -- References -- Molecular Dynamic of the Nanoparticle Reinforcement in the Pb-Free Solder During Reflow Soldering Process -- 1 Introduction -- 2 Molecular Dynamics Approach -- 3 MD Simulation Setup -- 4 Solder Fabrication Techniques -- 5 Reflow Soldering Process -- 6 Results and Discussion -- 7 Conclusion -- References -- Recent Progress in Transient Liquid Phase (TLP) Solder for Next Generation Power Electronics -- 1 Introduction -- 2 Transient Liquid Phase (TLP) Bonding Concepts -- 2.1 Solid-Liquid Interdiffusion (SLID) Bonding -- 2.2 TLP Bonding via Multiple Reflows Technique -- 2.3 TLP Bonding for Metal Powder -- 2.4 TLP Bonding in Metal Preform -- 3 Recent Studies on Transient Liquid Phase (TLP) Solders Systems -- 4 Challenges in Transient Liquid Phase (TLP) Solders Development -- 5 Conclusion -- References -- Advanced Assembly of Miniaturized Surface Mount Technology Components Using Nano-reinforced Solder Paste -- 1 Introduction -- 2 Methodology -- 2.1 Preparation of the Miniaturized Package Assembly Using Nano-reinforced Lead-Free Solder -- 2.2 Characterization of the Nano-reinforced Lead-Free Solder Joint -- 3 Results and Discussion -- 3.1 Microstructure Investigation in the Miniaturized Solder Joint -- 3.2 Physical Integrity Analyses of Miniaturized Solder Joint -- 4 Conclusion -- References -- Properties of Sn0.7Cu Solder Alloys Bearing Fe and Bi -- 1 Introduction -- 2 Bulk Solder Specimen Preparation: Sn-0.7Cu Solder Alloy Bearing Fe and Bi -- 3 Mechanical Properties -- 4 Microstructure Properties -- 5 Thermal Behavior -- 6 Wetting Angle and Spreading Rate -- 7 Oxidation Behavior -- 8 Corrosion Behavior -- 9 Electrical Properties -- 10 Conclusion -- References -- Processing and Performances -- The Effect of Isothermal Ageing Treatment on Different PCB Surface Finishes: Simulation and Experimental.
1 Introduction -- 2 Experimental Procedure -- 2.1 Simulation Analysis -- 2.2 Modeling for Steady-State Thermal Analysis -- 2.3 Sample Preparation -- 2.4 Isothermal Ageing Treatment -- 2.5 Characterization Analysis -- 3 Results and Discussion -- 3.1 Thermal Distribution, Total Deformation, and Equivalent Stress -- 3.2 Intermetallic Compounds Formation During Isothermal Ageing Treatment -- 4 Conclusion -- References -- Flux Modification for Wettability and Reliability Improvement in Solder Joints -- 1 Introduction -- 2 Overview of Flux for Soldering -- 2.1 Flux Reaction -- 2.2 Factors that Affect Flux Performance -- 2.3 Problems in Flux Soldering -- 3 Type of Flux Used in Soldering -- 4 Properties of Flux -- 5 Flux Modifications and Future Trends -- 6 Conclusion -- References -- Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints -- 1 Introduction -- 1.1 Surface Finish Comparison and Specific Requirements -- 2 Electroless Nickel Immersion Gold (ENIG) -- 3 Immersion Tin (ImSn) -- 4 Immersion Silver (ImAg) -- 5 Organic Surface Protectant (OSP) -- 6 Controlling Intermetallic Compound (IMC) via Printed Circuit Board (PCB) Surface Finishes -- 7 Soldering Applications Using Surface Finishes -- 7.1 Surface Finish Applications -- 7.2 Surface Finish Reliability Testing -- 8 Summary -- References -- Significance of Intermetallic Compound (IMC) Layer to the Reliability of a Solder Joint, Methods of IMC Layer Thickness Measurements -- 1 Introduction -- 1.1 Significance of Intermetallic Compound Layer to the Reliability of Solder Joint -- 1.2 Intermetallic Compound (IMC) Layer Thickness Measurements -- 1.3 Stereometry Consideration on Intermetallic Compound (IMC) Layer Thickness Measurements -- 1.4 Summary -- References.
The Effect of Laser Soldering onto Intermetallic Compound Formation, Growth -- 1 Introduction -- 2 Type Laser Soldering and Its Characteristics -- 2.1 Carbon Dioxide (CO2) Laser -- 2.2 Nd:YAG Laser -- 2.3 Semiconductor Laser -- 3 The Intermetallic Compound (IMC) Formation and Growth -- 3.1 The Formation of IMC -- 3.2 Effect of Laser Soldering Parameters onto Interfacial Reaction at Solder Joint -- 4 Conclusion -- References -- Reliability Analysis on the Flexible Printed Circuit Board After Reflow Soldering -- 1 Introduction -- 2 Flexible Printed Circuit Board -- 3 Reflow Soldering of Flexible Printed Circuit Board -- 4 Defects During Soldering Process -- 5 Tensile Test of the Flexible Printed Circuit Board -- 6 Results and Discussion -- 7 Conclusion -- References -- Solder Paste's Rheology Data for Stencil Printing Numerical Investigations -- 1 Introduction -- 2 Numerical Simulation on Stencil Printing -- 3 Solder Paste Rheology -- 4 Solder Paste Viscosity Test -- 5 Solder Paste Rheology Measurement Using Rotary Rheometer -- 6 Non-newtonian Modelling for Solder Paste -- 6.1 Cross-Model Viscosity Model -- 6.2 Carreau-Yasuda Viscosity Model -- 6.3 Non-Newtonian Power Law Model -- 7 Conclusions -- References -- Tin Whiskers Growth in Electronic Assemblies -- 1 Introduction -- 2 Formation of Tin Whiskers -- 3 Results and Discussion -- 4 Measurement of Tin Whisker -- 5 Morphology of Tin Whisker -- 6 Factors of Tin Whiskers Formation -- 6.1 Tin Grain Structure -- 6.2 Intermetallic Compound Layers -- 6.3 Temperature and Humidity -- 6.4 Oxidation -- 7 Whisker Mitigation Practices -- 7.1 Underlayers -- 7.2 Annealing and Recrystallization -- 7.3 Use Matte Tin Finish -- 7.4 Substitution of Addictive in Solder Alloy -- 8 Conclusion -- References.
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| Record Nr. | UNINA-9910551838003321 |
Info
Assembly and reliability of lead-free solder joints / / John H. Lau, Ning-Cheng Lee
