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Assembly and reliability of lead-free solder joints / / John H. Lau, Ning-Cheng Lee
| Assembly and reliability of lead-free solder joints / / John H. Lau, Ning-Cheng Lee |
| Autore | Lau John H |
| Edizione | [1st ed. 2020.] |
| Pubbl/distr/stampa | Singapore : , : Springer Singapore : , : Imprint : Springer, , 2020 |
| Descrizione fisica | 1 online resource (545 pages) |
| Disciplina | 671.56 |
| Soggetto topico |
Joints (Engineering)
Solder and soldering |
| ISBN | 981-15-3920-0 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Solder Joints in Printed Circuit Board Assembly -- Solder Joints in Advanced Packaging -- Prevailing Lead-Free Materials -- Soldering Processes -- Advanced Specialty Flux Design -- Solder Joint Characterization -- Reliability Tests and Data Analyses of Solder Joints -- Design for Reliability and Failure Analysis of Solder Joints. |
| Record Nr. | UNINA-9910403764003321 |
Lau John H
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| Singapore : , : Springer Singapore : , : Imprint : Springer, , 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Lead free solders / / edited by Abhijit Kar
| Lead free solders / / edited by Abhijit Kar |
| Pubbl/distr/stampa | London, England : , : IntechOpen, , [2019] |
| Descrizione fisica | 1 online resource 94 pages : illustrations |
| Disciplina | 671.56 |
| Soggetto topico | Solder and soldering |
| ISBN | 1-78985-460-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910353352203321 |
| London, England : , : IntechOpen, , [2019] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Lead Free Solders / / edited by Abhijit Kar
| Lead Free Solders / / edited by Abhijit Kar |
| Pubbl/distr/stampa | London : , : IntechOpen, , 2019 |
| Descrizione fisica | 1 online resource (94 pages) : illustrations |
| Disciplina | 671.56 |
| Soggetto topico | Solder and soldering |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910688380503321 |
| London : , : IntechOpen, , 2019 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Papers on Soldering (1962)
| Papers on Soldering (1962) |
| Pubbl/distr/stampa | [Place of publication not identified], : American Society for Testing & Materials, 1963 |
| Descrizione fisica | 1 online resource (v, 92 pages) |
| Disciplina | 671.56 |
| Soggetto topico | Solder and soldering |
| ISBN | 0-8031-6721-0 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | Papers on Soldering |
| Record Nr. | UNINA-9910164752403321 |
| [Place of publication not identified], : American Society for Testing & Materials, 1963 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Recent Progress in Lead-Free Solder Technology : Materials Development, Processing and Performances / / edited by Mohd Arif Anuar Mohd Salleh, Mohd Sharizal Abdul Aziz, Azman Jalar, Mohd Izrul Izwan Ramli
| Recent Progress in Lead-Free Solder Technology : Materials Development, Processing and Performances / / edited by Mohd Arif Anuar Mohd Salleh, Mohd Sharizal Abdul Aziz, Azman Jalar, Mohd Izrul Izwan Ramli |
| Edizione | [1st ed. 2022.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2022 |
| Descrizione fisica | 1 online resource (332 pages) |
| Disciplina | 671.56 |
| Collana | Topics in Mining, Metallurgy and Materials Engineering |
| Soggetto topico |
Metals
Metals and Alloys |
| ISBN | 3-030-93441-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Recent Studies in The Development of Ceramic Reinforced Lead-Free Composite Solder -- Development of Geopolymer Ceramic Reinforced Solder -- Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Solders -- Molecular Dynamic on the Nanoparticle Reinforcement into Lead-free Solder during Reflow Soldering Process -- Recent Progress in Transient Liquid Phase (TLP) Solder for Next Generation Power Electronics -- Advanced assembly of Miniaturized Surface Mount Technology Components using Nano-Reinforced Solder Paste -- Properties of Sn0.7Cu Solder Alloys Bearing Fe and Bi -- The Effect of Isothermal Ageing Treatment on Different PCB Surface Finishes: Simulation & Experimental -- Flux Modification for Wettability and Reliability Improvement in Solder Joints -- Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints -- Significance of Interfacial Intermetallic Compound (IMC) Layer to the Reliability of a Solder Joint and Methods of IMC Layer Thickness Measurements -- The Effect of Laser Soldering onto Intermetallic Compound Formation and Growth -- Reliability Analysis on the Flexible Printed Circuit Board During Reflow Soldering -- Solder Paste’s Rheology Data for Stencil Printing Numerical Investigations -- Tin Whiskers Growth in Electronic Assemblies. |
| Record Nr. | UNINA-9910551838003321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2022 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Soldering & surface mount technology
| Soldering & surface mount technology |
| Pubbl/distr/stampa | Bradford, England, : MCB University Press, 1989- |
| Descrizione fisica | 1 online resource |
| Disciplina | 671.56 |
| Soggetto topico |
Solder and soldering
Surface mount technology |
| Soggetto genere / forma | Periodicals. |
| ISSN | 1758-6836 |
| Formato | Materiale a stampa |
| Livello bibliografico | Periodico |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | Soldering and surface mount technology |
| Record Nr. | UNISA-996398435003316 |
| Bradford, England, : MCB University Press, 1989- | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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Soldering & surface mount technology
| Soldering & surface mount technology |
| Pubbl/distr/stampa | Bradford, England, : MCB University Press, 1989- |
| Descrizione fisica | 1 online resource |
| Disciplina | 671.56 |
| Soggetto topico |
Solder and soldering
Surface mount technology |
| Soggetto genere / forma | Periodicals. |
| ISSN | 1758-6836 |
| Formato | Materiale a stampa |
| Livello bibliografico | Periodico |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | Soldering and surface mount technology |
| Record Nr. | UNINA-9910142566103321 |
| Bradford, England, : MCB University Press, 1989- | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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