| Edizione | [1st ed.] |
| Pubbl/distr/stampa |
Hauppauge, N.Y., : Nova Science Publishers, c2011
|
| Descrizione fisica |
1 online resource (281 p.)
|
| Disciplina |
669/.3
|
| Altri autori (Persone) |
NabokaMichael
GiordanoJennifer
|
| Collana |
Materials science and technologies
|
| Soggetto topico |
Copper alloys - Metallurgy
|
| ISBN |
1-62081-544-3
|
| Formato |
Materiale a stampa  |
| Livello bibliografico |
Monografia |
| Lingua di pubblicazione |
eng
|
| Nota di contenuto |
Intro -- COPPER ALLOYS: PREPARATION, PROPERTIES AND APPLICATIONS -- COPPER ALLOYS: PREPARATION, PROPERTIES AND APPLICATIONS -- CONTENTS -- PREFACE -- Chapter 1 ELECTROCATALYTIC OXIDATION OF METHANOL AND GLUCOSE ON NICU ALLOY ELECTRODE -- ABSTRACT -- 1. INTRODUCTION -- 2. MATERIALS AND METHODS -- 3. RESULTS AND DISCUSSION -- 3.1. Surface Analysis of Electrodeposited NiCu Alloy -- 3.2. Electrochemical Behavior of GC/Ni and GC/NiCu in Alkaline Solution -- 3.3. Electro-Oxidation of Methanol -- 3.4. Electro-Oxidation of Glucose -- CONCLUSION -- REFERENCES -- Chapter 2 ELECTRODEPOSITION OF COPPER BASED ALLOYS AND MULTILAYER FOR GIANT MAGNETO RESISTANCE APPLICATIONS -- ABSTRACT -- INTRODUCTION -- EXPERIMENTAL SURVEY -- EFFECT OF NUMBER OF BILAYERS -- EFFECT OF MAGNETIC LAYER THICKNESS ON THE GMR -- EFFECT OF NON-MAGNETIC LAYER THICKNESS ON THE GMR -- CO-CU/CU MULTILAYER FILMS -- Ni-Cu/Cu Multilayer Films -- Co-Ni-Cu/Cu Multilayer Films -- Fe-Co-Cu/Cu Multilayer Films -- Fe-Ni-Cu/Cu Multilayer Films -- Co-Zn-Cu/Cu Multilayer Films -- Fe-Co-Ni-Cu/Cu Multilayer Films -- CONCLUSION -- REFERENCES -- Chapter 3 DEVELOPMENT AND CHARACTERIZATION OF NICKEL-COPPER-BASED SUBSTRATES FOR 2ND GENERATION HIGH-CRITICAL TEMPERATURE SUPERCONDUCTING TAPES -- ABSTRACT -- INTRODUCTION -- EXPERIMENTAL -- RECRYSTALLIZATION TEXTURE -- Pure Copper -- Binary Nickel-Copper -- Ternary Ni-Cu-Co Alloy -- Ternary Ni-Cu-W Alloy -- MAGNETIC PROPERTIES -- OXIDATION BEHAVIOUR -- MECHANICAL PROPERTIES -- APPLICATION OF NI-CU-CO ALLOY TEXTURED SUBSTRATE FOR YBCO FILM DEPOSITION -- CONCLUSION -- ACKNOWLEDGMENT -- REFERENCES -- Chapter 4 MAGNETORESISTANCE EFFECTS IN CU AND CO, CO/CU MULTILAYERS AND GRANULAR CU-CO ALLOYS AND IN RAPIDLY QUENCHED GD-DOPED CU-CO ALLOYS -- ABSTRACT -- INTRODUCTION -- MAGNETORESISTANCE OF PURE COPPER.
MAGNETORESISTANCE OF ALLOYS AND COMPOSITES COPPER - COBALT -- MAGNETORESISTANCE OF ALLOYS COPPER - COBALT - GADOLINIUM -- ACKNOWLEDGMENTS -- REFERENCES -- Chapter 5 MECHANICAL PROPERTIES OF COPPER UNDER DYNAMIC LOAD -- ABBREVIATIONS -- DEFINITION OF COOPER PROPERTIES BY KOLSKY METHOD -- Experimental Apparatus for Dynamic Tests -- Determination of the Dynamic Characteristics of Strength and Plasticity -- RESULTS OF TESTS OF COPPER USING KOLSKY METHOD -- CRITICAL SPALL STRENGTH OF COPPER -- Experimental Apparatus for Slpall Strength Determination -- Critical Spall Strength Determination -- Durability of Copper at Explosive Jet High-Speed Stretching -- Dynamic Viscosity and Cooper Relaxation Time Under Dynamic Load -- CONCLUSION -- REFERENCES -- Chapter 6 COPPER ALLOY MICROSTRUCTURES FOR APPLICATION IN MICROREACTORS -- ABSTRACT -- I. INTRODUCTION -- II. EXPERIMENTAL -- Materials, Processing and Characterization -- III. RESULTS AND DISCUSSION -- III.1. Zeolite Film Growth on Copper-Based Plates -- III.2. Zeolite Film Growth on Brass Microchannels -- III.3. Confined Zeolite Film Growth on Brass Microchannels -- III.3. Zeolite Film Growth on Brass Microgrids -- IV. MICROREACTOR ASSEMBLY WITH THE ZEOLITE/BRASS MICROSTRUCTURES -- CONCLUSIONS -- ACKNOWLEDGMENTS -- REFERENCES -- Chapter 7 COMPOSITE ELECTRODEPOSITS WITH C60 FULLERENE -- ABSTRACT -- INTRODUCTION -- EXPERIMENTAL -- RESULTS AND DISCUSSION -- REFERENCES -- Chapter 8 INFLUENCE OF ALLOYING WITH NI, AL, ZN, SN AND AG ON THE ANNEAL HARDENING EFFECT IN SINTERED COPPER BASE ALLOYS -- ABSTRACT -- INTRODUCTION -- EXPERIMENTAL -- Cold Rolling -- Anneal Hardening Effect -- CONCLUSIONS -- ACKNOWLEDGMENTS -- REFERENCES -- Chapter9HIGHSTRENGTHCOPPER-BASEDCONDUCTORMATERIALS -- Abstract -- 1.GeneralAspectsofCu-BasedConductorMaterials -- 1.1.TheSpecificResistivity -- 1.2.HardeningofConductorMaterials.
1.3.CommonCu-basedConductorMaterials -- 1.3.1.Nickel-BasedPrecipitates -- 1.3.2.Iron-BasedPrecipitates -- 1.3.3.Titanium-BasedPrecipitates -- 1.3.4.Chromium-BasedPrecipitates -- 1.3.5.ComparisonoftheConstituents -- 2.Cu-AgAlloys -- 2.1.PrecipitationReaction -- 2.2.SeparatingMatrixGrains -- 2.3.ThirdElementAdditions -- 2.3.1.CuAgCeandCuAgY -- 2.3.2.CuAgNiandCuAgMg -- 2.3.3.CuAgCrandCuAgFe -- 2.3.4.CuAgZr -- 2.4.StrengthandConductivity -- 3.Cu-NbAlloys -- 3.1.SurpassingtheSolubilityLimits -- 3.2.PrecipitationReaction -- 3.3.MicrostructuresStability -- 3.4.StrengthandConductivity -- 4.SummaryandOutlook -- Acknowledgment -- References -- Chapter 10 NEW MATERIALS FOR TECHNOLOGICAL APPLICATIONS FROM THE TI CR CU TERNARY SYSTEM -- ABSTRACT -- INTRODUCTION -- Background -- From the Binaries Ti Cr, Ti Cu and Cr Cu to the Ternary Ti Cr Cu System -- EXPERIMENTAL -- RESULTS -- Phase Equilibria in the Ti Cr Cu System at 800 °C -- The Pseudo Binary (Ti1 Xcrx)(Cr1 Ycuy)2 Phase -- The Ternary Compound Ti3(Crxcu1 X)5 -- The Pseudo Binary (Ti1 Xcrx)2(Crycu1 Y) -- The Pseudo Binary (Ti1 Xcux)(Crycu1 Y) -- The Pseudo Binary Ti2(Crxcu1 X)3 and Ti3(Crxcu1 X)4 -- The Binary Ticu4 Phase -- Metastable "Ti3Cu" and "Ticu3" Phases -- Physical Properties of a Fcc Cu Solid Solution Phase and the Ternary Ti3CrCu4 Compound -- CONCLUDING SUMMARY -- REFERENCES -- Chapter 11 CHEMICAL MECHANICAL POLISHING OF COPPER ALLOYS -- 1. INTRODUCTION -- 2. FUNDAMENTALS OF CHEMICAL MECHANICAL POLISHING -- 2.1. Material Removal Rate, MRR -- 2.2. Chemical Processes and Related Mechanisms of Material Removal -- 3. SLURRY COMPOSITIONS -- 4. POLISHING PAD DESIGN -- CONCLUSIONS -- ACKNOWLEDGMENT -- REFERENCES -- INDEX.
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| Record Nr. | UNINA-9910965393403321 |
Info
Copper alloys [[electronic resource] ] : preparation, properties and applications / / Michael Naboka and Jennifer Giordano, editors