Advanced plasma technology / / edited by Riccardo d'Agostino [and five others] |
Pubbl/distr/stampa | Weinheim, Germany : , : Wiley-VCH Verlag GmbH & Co. KGaA, , 2008 |
Descrizione fisica | 1 online resource (481 p.) |
Disciplina |
621.044
660.004 |
Soggetto topico | Plasma engineering |
Soggetto genere / forma | Electronic books. |
ISBN |
1-281-94675-3
9786611946753 3-527-62218-7 3-527-62219-5 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Advanced Plasma Technology; Contents; Preface; List of Contributors; 1 Basic Approaches to Plasma Production and Control; 1.1 Plasma Production; 1.1.1 Under Low Gas Pressure (10 torr); 1.2 Energy Control; 1.2.1 Electron-Temperature Control; 1.2.2 Ion-Energy Control; 1.3 Dust Collection and Removal; References; 2 Plasma Sources and Reactor Configurations; 2.1 Introduction; 2.2 Characteristics of ICP; 2.2.1 Principle; 2.2.2 Transformer Model; 2.2.3 Technological Aspects; 2.2.3.1 Matching
2.2.3.2 Capacitive Coupling2.2.3.3 Standing Wave Effects; 2.3 Sources and Reactor Configuration; 2.3.1 Substrate Shape; 2.3.1.1 Flat Substrates; 2.3.1.2 Complex Three-Dimensional Shapes; 2.3.1.3 Large Area Treatment; 2.4 Conclusions; References; 3 Advanced Simulations for Industrial Plasma Applications; 3.1 Introduction; 3.2 PIC Simulations; 3.2.1 Capacitively Coupled O(2)/Ar Plasmas; 3.2.1.1 Gas Composition; 3.2.1.2 Pressure Effect in Ar/O(2) Plasmas; 3.2.2 Three-Dimensional (3D) Charge-up Simulation; 3.2.2.1 Description of 3D Charge-up Simulations 3.2.2.2 Effects of Secondary Electron Emission3.2.2.3 Negative Ion Extraction; 3.3 Fluid Simulations; 3.3.1 Capacitively Coupled Discharges; 3.3.2 Large Area Plasma Source; 3.4 Summary; References; 4 Modeling and Diagnostics of He Discharges for Treatment of Polymers; 4.1 Introduction; 4.2 Experimental; 4.3 Model Description; 4.4 Results and Discussion; 4.4.1 Electrical Properties; 4.4.2 Gas-Phase Chemistry; 4.4.3 Plasma-Surface Interactions; 4.5 Conclusions; References; 5 Three-Dimensional Modeling of Thermal Plasmas (RF and Transferred Arc) for the Design of Sources and Industrial Processes 5.1 Introduction5.2 Inductively Coupled Plasma Torches; 5.2.1 Modeling Approach; 5.2.1.1 Modeling Assumptions; 5.2.1.2 Governing Equations of the Continuum Phase; 5.2.1.3 Governing Equations of the Discrete Phase; 5.2.1.4 Computational Domain and Boundary Conditions; 5.2.2 Selected Simulation Results; 5.2.2.1 High-Definition Numerical Simulation of Industrial ICPTs; 5.2.2.2 Numerical Simulation of the Trajectories and Thermal Histories of Powders Injected in Industrial ICPTs; 5.3 DC Transferred Arc Plasma Torches; 5.3.1 Modeling Approach; 5.3.1.1 Modeling Assumptions 5.3.1.2 Governing Equations5.3.1.3 Computational Domain and Boundary Conditions; 5.3.2 Selected Simulation Results; 5.3.2.1 Magnetically Deflected Transferred Arc; 5.3.2.2 The Twin Torch; 5.3.2.3 The Cutting Torch; References; 6 Radiofrequency Plasma Sources for Semiconductor Processing; 6.1 Introduction; 6.2 Capacitively Coupled Plasmas; 6.2.1 Dual-Frequency CCPs; 6.3 Inductively Coupled Plasmas; 6.3.1 General Description; 6.3.2 Anomalous Skin Depth; 6.3.3 Magnetized ICPs; 6.4 Helicon Wave Sources; 6.4.1 General Description; 6.4.2 Unusual Features; 6.4.3 Extended Helicon Sources; References 7 Advanced Plasma Diagnostics for Thin-Film Deposition |
Record Nr. | UNINA-9910144100803321 |
Weinheim, Germany : , : Wiley-VCH Verlag GmbH & Co. KGaA, , 2008 | ||
![]() | ||
Lo trovi qui: Univ. Federico II | ||
|
Advanced plasma technology / / edited by Riccardo d'Agostino [and five others] |
Pubbl/distr/stampa | Weinheim, Germany : , : Wiley-VCH Verlag GmbH & Co. KGaA, , 2008 |
Descrizione fisica | 1 online resource (481 p.) |
Disciplina |
621.044
660.004 |
Soggetto topico | Plasma engineering |
ISBN |
1-281-94675-3
9786611946753 3-527-62218-7 3-527-62219-5 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Advanced Plasma Technology; Contents; Preface; List of Contributors; 1 Basic Approaches to Plasma Production and Control; 1.1 Plasma Production; 1.1.1 Under Low Gas Pressure (10 torr); 1.2 Energy Control; 1.2.1 Electron-Temperature Control; 1.2.2 Ion-Energy Control; 1.3 Dust Collection and Removal; References; 2 Plasma Sources and Reactor Configurations; 2.1 Introduction; 2.2 Characteristics of ICP; 2.2.1 Principle; 2.2.2 Transformer Model; 2.2.3 Technological Aspects; 2.2.3.1 Matching
2.2.3.2 Capacitive Coupling2.2.3.3 Standing Wave Effects; 2.3 Sources and Reactor Configuration; 2.3.1 Substrate Shape; 2.3.1.1 Flat Substrates; 2.3.1.2 Complex Three-Dimensional Shapes; 2.3.1.3 Large Area Treatment; 2.4 Conclusions; References; 3 Advanced Simulations for Industrial Plasma Applications; 3.1 Introduction; 3.2 PIC Simulations; 3.2.1 Capacitively Coupled O(2)/Ar Plasmas; 3.2.1.1 Gas Composition; 3.2.1.2 Pressure Effect in Ar/O(2) Plasmas; 3.2.2 Three-Dimensional (3D) Charge-up Simulation; 3.2.2.1 Description of 3D Charge-up Simulations 3.2.2.2 Effects of Secondary Electron Emission3.2.2.3 Negative Ion Extraction; 3.3 Fluid Simulations; 3.3.1 Capacitively Coupled Discharges; 3.3.2 Large Area Plasma Source; 3.4 Summary; References; 4 Modeling and Diagnostics of He Discharges for Treatment of Polymers; 4.1 Introduction; 4.2 Experimental; 4.3 Model Description; 4.4 Results and Discussion; 4.4.1 Electrical Properties; 4.4.2 Gas-Phase Chemistry; 4.4.3 Plasma-Surface Interactions; 4.5 Conclusions; References; 5 Three-Dimensional Modeling of Thermal Plasmas (RF and Transferred Arc) for the Design of Sources and Industrial Processes 5.1 Introduction5.2 Inductively Coupled Plasma Torches; 5.2.1 Modeling Approach; 5.2.1.1 Modeling Assumptions; 5.2.1.2 Governing Equations of the Continuum Phase; 5.2.1.3 Governing Equations of the Discrete Phase; 5.2.1.4 Computational Domain and Boundary Conditions; 5.2.2 Selected Simulation Results; 5.2.2.1 High-Definition Numerical Simulation of Industrial ICPTs; 5.2.2.2 Numerical Simulation of the Trajectories and Thermal Histories of Powders Injected in Industrial ICPTs; 5.3 DC Transferred Arc Plasma Torches; 5.3.1 Modeling Approach; 5.3.1.1 Modeling Assumptions 5.3.1.2 Governing Equations5.3.1.3 Computational Domain and Boundary Conditions; 5.3.2 Selected Simulation Results; 5.3.2.1 Magnetically Deflected Transferred Arc; 5.3.2.2 The Twin Torch; 5.3.2.3 The Cutting Torch; References; 6 Radiofrequency Plasma Sources for Semiconductor Processing; 6.1 Introduction; 6.2 Capacitively Coupled Plasmas; 6.2.1 Dual-Frequency CCPs; 6.3 Inductively Coupled Plasmas; 6.3.1 General Description; 6.3.2 Anomalous Skin Depth; 6.3.3 Magnetized ICPs; 6.4 Helicon Wave Sources; 6.4.1 General Description; 6.4.2 Unusual Features; 6.4.3 Extended Helicon Sources; References 7 Advanced Plasma Diagnostics for Thin-Film Deposition |
Record Nr. | UNINA-9910830298803321 |
Weinheim, Germany : , : Wiley-VCH Verlag GmbH & Co. KGaA, , 2008 | ||
![]() | ||
Lo trovi qui: Univ. Federico II | ||
|