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Lead-free solder process development / / Jasbir Bath, Greg Henshall, Carol Handwerker
| Lead-free solder process development / / Jasbir Bath, Greg Henshall, Carol Handwerker |
| Autore | Bath Jasbir |
| Pubbl/distr/stampa | Hoboken, New Jersey : , : Wiley, , c2010 |
| Descrizione fisica | 1 online resource (286 p.) |
| Disciplina |
621.38104
621.9/77 |
| Altri autori (Persone) |
HandwerkerCarol A
HenshallGregory Arthur |
| Soggetto topico |
Lead-free electronics manufacturing processes
Solder and soldering |
| ISBN |
1-283-02524-8
9786613025241 1-118-10274-6 0-470-90119-5 0-470-90118-7 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Front Matter -- Regulatory and Voluntary Drivers for Environmental Improvement: Hazardous Substances, Life-Cycle Design, and End of Life / John Hawley -- Lead-Free Surface Mount Technology / Jasbir Bath, Jennifer Nguyen, Sundar Sethuraman -- Lead-Free Wave Soldering / Denis Barbini, Jasbir Bath -- Lead-Free Rework / Alan Donaldson -- Lead-Free Alloys for BGA/CSP Components / Gregory Henshall -- Growth Mechanisms and Mitigation Strategies of Tin Whisker Growth / Peng Su -- Testability of Lead-Free Printed Circuit Assemblies / Rosa D Reinosa, Aileen M Allen -- Board-Level Solder Joint Reliability of High-Performance Computers Under Mechanical Loading / Keith Newman -- Lead-Free Reliability in Aerospace/Military Environments / Thomas A Woodrow, Jasbir Bath -- Lead-Free Reliability in Automotive Environments / Richard D Parker -- Index. |
| Record Nr. | UNINA-9910139210903321 |
Bath Jasbir
|
||
| Hoboken, New Jersey : , : Wiley, , c2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Lead-free solder process development / / Jasbir Bath, Greg Henshall, Carol Handwerker
| Lead-free solder process development / / Jasbir Bath, Greg Henshall, Carol Handwerker |
| Autore | Bath Jasbir |
| Pubbl/distr/stampa | Hoboken, New Jersey : , : Wiley, , c2010 |
| Descrizione fisica | 1 online resource (286 p.) |
| Disciplina |
621.38104
621.9/77 |
| Altri autori (Persone) |
HandwerkerCarol A
HenshallGregory Arthur |
| Soggetto topico |
Lead-free electronics manufacturing processes
Solder and soldering |
| ISBN |
1-283-02524-8
9786613025241 1-118-10274-6 0-470-90119-5 0-470-90118-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Front Matter -- Regulatory and Voluntary Drivers for Environmental Improvement: Hazardous Substances, Life-Cycle Design, and End of Life / John Hawley -- Lead-Free Surface Mount Technology / Jasbir Bath, Jennifer Nguyen, Sundar Sethuraman -- Lead-Free Wave Soldering / Denis Barbini, Jasbir Bath -- Lead-Free Rework / Alan Donaldson -- Lead-Free Alloys for BGA/CSP Components / Gregory Henshall -- Growth Mechanisms and Mitigation Strategies of Tin Whisker Growth / Peng Su -- Testability of Lead-Free Printed Circuit Assemblies / Rosa D Reinosa, Aileen M Allen -- Board-Level Solder Joint Reliability of High-Performance Computers Under Mechanical Loading / Keith Newman -- Lead-Free Reliability in Aerospace/Military Environments / Thomas A Woodrow, Jasbir Bath -- Lead-Free Reliability in Automotive Environments / Richard D Parker -- Index. |
| Record Nr. | UNINA-9910830099503321 |
|
Bath Jasbir
|
||
| Hoboken, New Jersey : , : Wiley, , c2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Lead-free solder process development / / edited by Greg Henshall, Jasbir Bath, Carol A. Handwerker
| Lead-free solder process development / / edited by Greg Henshall, Jasbir Bath, Carol A. Handwerker |
| Pubbl/distr/stampa | Hoboken, NJ, : Wiley, c2011 |
| Descrizione fisica | 1 online resource (286 p.) |
| Disciplina | 621.9/77 |
| Altri autori (Persone) |
HenshallGregory Arthur
BathJasbir HandwerkerCarol A |
| Soggetto topico |
Lead-free electronics manufacturing processes
Solder and soldering |
| ISBN |
9786613025241
9781283025249 1283025248 9781118102749 1118102746 9780470901199 0470901195 9780470901182 0470901187 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Front Matter -- Regulatory and Voluntary Drivers for Environmental Improvement: Hazardous Substances, Life-Cycle Design, and End of Life / John Hawley -- Lead-Free Surface Mount Technology / Jasbir Bath, Jennifer Nguyen, Sundar Sethuraman -- Lead-Free Wave Soldering / Denis Barbini, Jasbir Bath -- Lead-Free Rework / Alan Donaldson -- Lead-Free Alloys for BGA/CSP Components / Gregory Henshall -- Growth Mechanisms and Mitigation Strategies of Tin Whisker Growth / Peng Su -- Testability of Lead-Free Printed Circuit Assemblies / Rosa D Reinosa, Aileen M Allen -- Board-Level Solder Joint Reliability of High-Performance Computers Under Mechanical Loading / Keith Newman -- Lead-Free Reliability in Aerospace/Military Environments / Thomas A Woodrow, Jasbir Bath -- Lead-Free Reliability in Automotive Environments / Richard D Parker -- Index. |
| Record Nr. | UNINA-9911019090803321 |
| Hoboken, NJ, : Wiley, c2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Lead-free solders
| Lead-free solders |
| Pubbl/distr/stampa | [Place of publication not identified], : ASTM International, 2011 |
| Disciplina | 621.9/77 |
| Collana | Journal of ASTM International selected technical papers Lead-free solders |
| Soggetto topico |
Lead-free electronics manufacturing processes - Materials
Solder and soldering Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
| ISBN |
1-62198-738-8
0-8031-8683-5 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9911007027203321 |
| [Place of publication not identified], : ASTM International, 2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||