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1865.2-2019 - IEEE Standard Specifications for Maintenance and Test of Distributed Control Systems in Thermal Power Stations : Operation Service and Management / / Institute of Electrical and Electronics Engineers
1865.2-2019 - IEEE Standard Specifications for Maintenance and Test of Distributed Control Systems in Thermal Power Stations : Operation Service and Management / / Institute of Electrical and Electronics Engineers
Pubbl/distr/stampa New York, New York : , : IEEE, , 2020
Descrizione fisica 1 online resource (202 pages)
Disciplina 621.381046
Soggetto topico Heat - Transmission
Power electronics - Standards
ISBN 1-5044-6323-4
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti 1865.2-2019 - IEEE Standard Specifications for Maintenance and Test of Distributed Control Systems in Thermal Power Stations
Record Nr. UNINA-9910389518903321
New York, New York : , : IEEE, , 2020
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
1865.2-2019 - IEEE Standard Specifications for Maintenance and Test of Distributed Control Systems in Thermal Power Stations : Operation Service and Management / / Institute of Electrical and Electronics Engineers
1865.2-2019 - IEEE Standard Specifications for Maintenance and Test of Distributed Control Systems in Thermal Power Stations : Operation Service and Management / / Institute of Electrical and Electronics Engineers
Pubbl/distr/stampa New York, New York : , : IEEE, , 2020
Descrizione fisica 1 online resource (202 pages)
Disciplina 621.381046
Soggetto topico Heat - Transmission
Power electronics - Standards
ISBN 1-5044-6323-4
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti 1865.2-2019 - IEEE Standard Specifications for Maintenance and Test of Distributed Control Systems in Thermal Power Stations
Record Nr. UNISA-996574967103316
New York, New York : , : IEEE, , 2020
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
2005 6th International Conference on Electronic Packaging Technology
2005 6th International Conference on Electronic Packaging Technology
Pubbl/distr/stampa [Place of publication not identified], : I E E E, 2005
Descrizione fisica 1 online resource
Disciplina 621.381046
Soggetto topico Electronic packaging
ISBN 1-5090-9936-0
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNISA-996199735703316
[Place of publication not identified], : I E E E, 2005
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
2005 6th International Conference on Electronic Packaging Technology
2005 6th International Conference on Electronic Packaging Technology
Pubbl/distr/stampa [Place of publication not identified], : I E E E, 2005
Descrizione fisica 1 online resource
Disciplina 621.381046
Soggetto topico Electronic packaging
ISBN 1-5090-9936-0
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910142348903321
[Place of publication not identified], : I E E E, 2005
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference : 10th International Conference on Electronic Materials & Packaging (EMAP) : 10th International Conference on Electronic Materials & Packaging (EMAP) : 22-24 October 2008, Taipei / / compiled by Institute of Electrical and Electronics Engineers
2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference : 10th International Conference on Electronic Materials & Packaging (EMAP) : 10th International Conference on Electronic Materials & Packaging (EMAP) : 22-24 October 2008, Taipei / / compiled by Institute of Electrical and Electronics Engineers
Pubbl/distr/stampa Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2008
Descrizione fisica 1 online resource (423 pages)
Disciplina 621.381046
Soggetto topico Microelectronic packaging
Microelectromechanical systems
ISBN 1-5090-8060-0
1-4244-3624-9
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910145427103321
Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2008
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference : 10th International Conference on Electronic Materials & Packaging (EMAP) : 10th International Conference on Electronic Materials & Packaging (EMAP) : 22-24 October 2008, Taipei / / compiled by Institute of Electrical and Electronics Engineers
2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference : 10th International Conference on Electronic Materials & Packaging (EMAP) : 10th International Conference on Electronic Materials & Packaging (EMAP) : 22-24 October 2008, Taipei / / compiled by Institute of Electrical and Electronics Engineers
Pubbl/distr/stampa Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2008
Descrizione fisica 1 online resource (423 pages)
Disciplina 621.381046
Soggetto topico Microelectronic packaging
Microelectromechanical systems
ISBN 1-5090-8060-0
1-4244-3624-9
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNISA-996213965703316
Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2008
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium
2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium
Pubbl/distr/stampa [Place of publication not identified], : I E E E, 2010
Descrizione fisica 1 online resource (225 pages) : illustrations
Disciplina 621.381046
Soggetto topico Electronic packaging
ISBN 1-4244-9070-7
1-4244-9069-3
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNISA-996218112903316
[Place of publication not identified], : I E E E, 2010
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium
2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium
Pubbl/distr/stampa [Place of publication not identified], : I E E E, 2010
Descrizione fisica 1 online resource (225 pages) : illustrations
Disciplina 621.381046
Soggetto topico Electronic packaging
ISBN 1-4244-9070-7
1-4244-9069-3
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910140897203321
[Place of publication not identified], : I E E E, 2010
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium
2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium
Pubbl/distr/stampa [Place of publication not identified], : IEEE, 2012
Descrizione fisica 1 online resource
Disciplina 621.381046
Soggetto topico Electronic packaging
ISBN 1-4673-1443-9
1-4673-1445-5
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNISA-996280779203316
[Place of publication not identified], : IEEE, 2012
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium
2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium
Pubbl/distr/stampa [Place of publication not identified], : IEEE, 2012
Descrizione fisica 1 online resource
Disciplina 621.381046
Soggetto topico Electronic packaging
ISBN 1-4673-1443-9
1-4673-1445-5
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910133568703321
[Place of publication not identified], : IEEE, 2012
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui