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1865.2-2019 - IEEE Standard Specifications for Maintenance and Test of Distributed Control Systems in Thermal Power Stations : Operation Service and Management / / Institute of Electrical and Electronics Engineers
| 1865.2-2019 - IEEE Standard Specifications for Maintenance and Test of Distributed Control Systems in Thermal Power Stations : Operation Service and Management / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | New York, New York : , : IEEE, , 2020 |
| Descrizione fisica | 1 online resource (202 pages) |
| Disciplina | 621.381046 |
| Soggetto topico |
Heat - Transmission
Power electronics - Standards |
| ISBN | 1-5044-6323-4 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | 1865.2-2019 - IEEE Standard Specifications for Maintenance and Test of Distributed Control Systems in Thermal Power Stations |
| Record Nr. | UNINA-9910389518903321 |
| New York, New York : , : IEEE, , 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
1865.2-2019 - IEEE Standard Specifications for Maintenance and Test of Distributed Control Systems in Thermal Power Stations : Operation Service and Management / / Institute of Electrical and Electronics Engineers
| 1865.2-2019 - IEEE Standard Specifications for Maintenance and Test of Distributed Control Systems in Thermal Power Stations : Operation Service and Management / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | New York, New York : , : IEEE, , 2020 |
| Descrizione fisica | 1 online resource (202 pages) |
| Disciplina | 621.381046 |
| Soggetto topico |
Heat - Transmission
Power electronics - Standards |
| ISBN | 1-5044-6323-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | 1865.2-2019 - IEEE Standard Specifications for Maintenance and Test of Distributed Control Systems in Thermal Power Stations |
| Record Nr. | UNISA-996574967103316 |
| New York, New York : , : IEEE, , 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
1996 Intersociety Conference on Thermal Phenomena in Electronic Systems Proceedings
| 1996 Intersociety Conference on Thermal Phenomena in Electronic Systems Proceedings |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 1996 |
| Descrizione fisica | 1 online resource (250 pages) |
| Disciplina | 621.381046 |
| Soggetto topico | Ball grid array technology |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910872609603321 |
| [Place of publication not identified], : IEEE, 1996 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
2005 6th International Conference on Electronic Packaging Technology
| 2005 6th International Conference on Electronic Packaging Technology |
| Pubbl/distr/stampa | [Place of publication not identified], : I E E E, 2005 |
| Descrizione fisica | 1 online resource |
| Disciplina | 621.381046 |
| Soggetto topico | Electronic packaging |
| ISBN | 1-5090-9936-0 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996199735703316 |
| [Place of publication not identified], : I E E E, 2005 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
2005 6th International Conference on Electronic Packaging Technology
| 2005 6th International Conference on Electronic Packaging Technology |
| Pubbl/distr/stampa | [Place of publication not identified], : I E E E, 2005 |
| Descrizione fisica | 1 online resource |
| Disciplina | 621.381046 |
| Soggetto topico | Electronic packaging |
| ISBN |
9781509099368
1509099360 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910142348903321 |
| [Place of publication not identified], : I E E E, 2005 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference : 10th International Conference on Electronic Materials & Packaging (EMAP) : 10th International Conference on Electronic Materials & Packaging (EMAP) : 22-24 October 2008, Taipei / / compiled by Institute of Electrical and Electronics Engineers
| 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference : 10th International Conference on Electronic Materials & Packaging (EMAP) : 10th International Conference on Electronic Materials & Packaging (EMAP) : 22-24 October 2008, Taipei / / compiled by Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2008 |
| Descrizione fisica | 1 online resource (423 pages) |
| Disciplina | 621.381046 |
| Soggetto topico |
Microelectronic packaging
Microelectromechanical systems |
| ISBN |
1-5090-8060-0
1-4244-3624-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910145427103321 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2008 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference : 10th International Conference on Electronic Materials & Packaging (EMAP) : 10th International Conference on Electronic Materials & Packaging (EMAP) : 22-24 October 2008, Taipei / / compiled by Institute of Electrical and Electronics Engineers
| 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference : 10th International Conference on Electronic Materials & Packaging (EMAP) : 10th International Conference on Electronic Materials & Packaging (EMAP) : 22-24 October 2008, Taipei / / compiled by Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2008 |
| Descrizione fisica | 1 online resource (423 pages) |
| Disciplina | 621.381046 |
| Soggetto topico |
Microelectronic packaging
Microelectromechanical systems |
| ISBN |
1-5090-8060-0
1-4244-3624-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996213965703316 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2008 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
2008 IEEE 9th VLSI Packaging Workshop of Japan
| 2008 IEEE 9th VLSI Packaging Workshop of Japan |
| Pubbl/distr/stampa | [Place of publication not identified], : I E E E, 2008 |
| Descrizione fisica | 1 online resource |
| Disciplina | 621.381046 |
| Soggetto topico |
Electronic packaging
Integrated circuits - Very large scale integration |
| ISBN |
9781424434978
1424434971 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910145399903321 |
| [Place of publication not identified], : I E E E, 2008 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium
| 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium |
| Pubbl/distr/stampa | [Place of publication not identified], : I E E E, 2010 |
| Descrizione fisica | 1 online resource (225 pages) : illustrations |
| Disciplina | 621.381046 |
| Soggetto topico | Electronic packaging |
| ISBN |
1-4244-9070-7
1-4244-9069-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996218112903316 |
| [Place of publication not identified], : I E E E, 2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium
| 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium |
| Pubbl/distr/stampa | [Place of publication not identified], : I E E E, 2010 |
| Descrizione fisica | 1 online resource (225 pages) : illustrations |
| Disciplina | 621.381046 |
| Soggetto topico | Electronic packaging |
| ISBN |
9781424490707
1424490707 9781424490691 1424490693 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910140897203321 |
| [Place of publication not identified], : I E E E, 2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
