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1996 IEEE Electrical Performance of Electronic Packaging
| 1996 IEEE Electrical Performance of Electronic Packaging |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 1996 |
| Disciplina | 621.381/046 |
| Soggetto topico |
Electronic packaging - Congresses
Materials - Congresses - Electric properties Electrical & Computer Engineering Electrical Engineering Engineering & Applied Sciences |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996203704703316 |
| [Place of publication not identified], : IEEE, 1996 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
1996 IEEE Electrical Performance of Electronic Packaging
| 1996 IEEE Electrical Performance of Electronic Packaging |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 1996 |
| Disciplina | 621.381/046 |
| Soggetto topico |
Electronic packaging
Materials - Electric properties Electrical & Computer Engineering Electrical Engineering Engineering & Applied Sciences |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910872648803321 |
| [Place of publication not identified], : IEEE, 1996 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
1997 International Symposium on Advanced Packaging Materials
| 1997 International Symposium on Advanced Packaging Materials |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 1997 |
| Disciplina | 621.381/046 |
| Soggetto topico |
Electronic packaging - Materials - Congresses
Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996217390403316 |
| [Place of publication not identified], : IEEE, 1997 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
1997 International Symposium on Advanced Packaging Materials
| 1997 International Symposium on Advanced Packaging Materials |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 1997 |
| Disciplina | 621.381/046 |
| Soggetto topico |
Electronic packaging - Materials - Congresses
Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910872797803321 |
| [Place of publication not identified], : IEEE, 1997 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
1998 2nd IEMT/IMC Symposium : April 15-17, 1998, Sonic City-Omiya, Tokyo, Japan
| 1998 2nd IEMT/IMC Symposium : April 15-17, 1998, Sonic City-Omiya, Tokyo, Japan |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 1998 |
| Disciplina | 621.381/046 |
| Soggetto topico |
Microelectronic packaging - Congresses - Japan
Electronic apparatus and appliances - Congresses - Design and construction Microelectronics industry - Technological innovations - Congresses Electrical & Computer Engineering Electrical Engineering Engineering & Applied Sciences |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996199638003316 |
| [Place of publication not identified], : IEEE, 1998 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
1998 2nd IEMT/IMC Symposium : April 15-17, 1998, Sonic City-Omiya, Tokyo, Japan
| 1998 2nd IEMT/IMC Symposium : April 15-17, 1998, Sonic City-Omiya, Tokyo, Japan |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 1998 |
| Disciplina | 621.381/046 |
| Soggetto topico |
Microelectronic packaging - Congresses - Japan
Electronic apparatus and appliances - Design and construction Microelectronics industry - Technological innovations - Congresses Electrical & Computer Engineering Electrical Engineering Engineering & Applied Sciences |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910872892403321 |
| [Place of publication not identified], : IEEE, 1998 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
1998 3rd International Conference on Adhesives Joining and Coating Technology in Electronic Manufacturing Proceedings
| 1998 3rd International Conference on Adhesives Joining and Coating Technology in Electronic Manufacturing Proceedings |
| Pubbl/distr/stampa | [Place of publication not identified], : I E E E, 1998 |
| Disciplina | 621.381/046 |
| Soggetto topico |
Electrical & Computer Engineering
Electrical Engineering Engineering & Applied Sciences |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996199451503316 |
| [Place of publication not identified], : I E E E, 1998 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
1998 3rd International Conference on Adhesives Joining and Coating Technology in Electronic Manufacturing Proceedings
| 1998 3rd International Conference on Adhesives Joining and Coating Technology in Electronic Manufacturing Proceedings |
| Pubbl/distr/stampa | [Place of publication not identified], : I E E E, 1998 |
| Disciplina | 621.381/046 |
| Soggetto topico |
Electrical & Computer Engineering
Electrical Engineering Engineering & Applied Sciences |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910872623403321 |
| [Place of publication not identified], : I E E E, 1998 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
1998 International Conference on Multichip Modules and High Density Packaging
| 1998 International Conference on Multichip Modules and High Density Packaging |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 1998 |
| Disciplina | 621.381/046 |
| Soggetto topico |
Multichip modules (Microelectronics) - Congresses
Microelectronic packaging - Congresses Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996212591603316 |
| [Place of publication not identified], : IEEE, 1998 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
1998 International Conference on Multichip Modules and High Density Packaging
| 1998 International Conference on Multichip Modules and High Density Packaging |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 1998 |
| Disciplina | 621.381/046 |
| Soggetto topico |
Multichip modules (Microelectronics) - Congresses
Microelectronic packaging Electrical & Computer Engineering Engineering & Applied Sciences Electrical Engineering |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910872663403321 |
| [Place of publication not identified], : IEEE, 1998 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
