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Biblioteca

MARC Lista (tabellare)
I-THERM : proceedings / / Intersociety Conference on Thermal Phenomena in Electronic Systems
I-THERM : proceedings / / Intersociety Conference on Thermal Phenomena in Electronic Systems
Pubbl/distr/stampa New York, N.Y. : , : IEEE, , 1990-1996
Disciplina 621
621.381/044
Soggetto topico Electronic apparatus and appliances - Thermal properties
Electronic apparatus and appliances - Design and construction
Heat - Transmission
Soggetto genere / forma Periodicals.
Conference papers and proceedings.
Formato Materiale a stampa
Livello bibliografico Periodico
Lingua di pubblicazione eng
Record Nr. UNISA-996281106503316
New York, N.Y. : , : IEEE, , 1990-1996
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
ISLPED'04 : proceedings of the 2004 International Symposium on Low Power Electronics and Design : Newport Beach Marriott Hotel, Newport Beach, California, USA, August 9-11, 2004
ISLPED'04 : proceedings of the 2004 International Symposium on Low Power Electronics and Design : Newport Beach Marriott Hotel, Newport Beach, California, USA, August 9-11, 2004
Pubbl/distr/stampa [Place of publication not identified], : Association for Computing Machinery, 2004
Descrizione fisica 1 online resource (414 p.;)
Disciplina 621.381/044
Collana ACM Conferences
Soggetto topico Power electronics
Electrical & Computer Engineering
Engineering & Applied Sciences
Electrical Engineering
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti ISLPED '04
Record Nr. UNISA-996206251203316
[Place of publication not identified], : Association for Computing Machinery, 2004
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
ISLPED'04 : proceedings of the 2004 International Symposium on Low Power Electronics and Design : Newport Beach Marriott Hotel, Newport Beach, California, USA, August 9-11, 2004
ISLPED'04 : proceedings of the 2004 International Symposium on Low Power Electronics and Design : Newport Beach Marriott Hotel, Newport Beach, California, USA, August 9-11, 2004
Pubbl/distr/stampa [Place of publication not identified], : Association for Computing Machinery, 2004
Descrizione fisica 1 online resource (414 p.;)
Disciplina 621.381/044
Collana ACM Conferences
Soggetto topico Power electronics
Electrical & Computer Engineering
Engineering & Applied Sciences
Electrical Engineering
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti ISLPED '04
Record Nr. UNINA-9910146777503321
[Place of publication not identified], : Association for Computing Machinery, 2004
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Managing power electronics : VLSI and DSP-driven computer systems / / Nazzareno Rossetti
Managing power electronics : VLSI and DSP-driven computer systems / / Nazzareno Rossetti
Autore Rossetti Nazzareno <1951->
Edizione [1st edition]
Pubbl/distr/stampa Hoboken, New Jersey : , : Wiley, , c2006
Descrizione fisica 1 online resource (405 p.)
Disciplina 621.381/044
621.381044
Soggetto topico Integrated circuits - Very large scale integration
Semiconductors
Signal processing - Digital techniques
ISBN 1-280-28701-2
9786610287017
0-470-24390-2
0-471-77633-5
0-471-77629-7
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Foreword -- Preface -- 1. Introduction -- 1.1 Technology Landscape -- 1.2 A Young Industry after All -- 2. Power Management Technologies -- 2.1 Introduction -- 2.2 Integrated Circuits Power Technology: Processing and Packaging -- Diodes and Bipolar Transistors -- Metal-Oxide-Semiconductor (MOS) Transistors -- DMOS Transistors -- CMOS Transistors -- Passive Components -- A Monolithic Process Example -- Packaging -- 2.3 Discrete Power Technology: Processing and Packaging -- From Wall to Board -- Power MOSFET Technology Basics -- Package Technologies -- 2.4 Ongoing Trends -- 3. Circuits -- PART I. ANALOG CIRCUITS -- 3.1 Transistors -- NPN -- PNP -- Trans-Conductance -- Transistor as Transfer-Resistor -- Transistor Equations -- MOS versus Bipolar Transistors -- 3.2 Elementary Circuits -- Current Mirror -- Current Source -- Differential Input Stage -- Differential to Single Input Stage -- Buffer -- 3.3 Operational Amplifier (Opamp) -- Inverting and Non-Inverting Inputs -- Rail to Rail Output Operation -- CMOS Opamp -- Opamp Symbol and Configurations -- DC Open Loop Gain -- AC Open Loop Gain -- 3.4 Voltage Reference -- Positive TC of ?VBE -- Negative TC of VBE -- Build a ?VBE -- Building a Voltage Reference -- Fractional Band-Gap Voltage Reference -- 3.5 Voltage Regulator -- 3.6 Linear versus Switching -- 3.7 Switching Regulators -- 3.8 Buck Converters -- Switching Regulator Power Train -- Output Capacitor -- Electrolytic Capacitors and Transient Response -- Ceramic Capacitors -- Losses in the Power Train -- The Analog Modulator -- Driver -- Switching Regulator Block Diagram -- Switching Regulator Control Loop -- Input Filter -- Input Inductor LIN -- Input Capacitor -- Current Mode -- 3.9 Flyback Converters -- PART II. DIGITAL CIRCUITS -- 3.10 Logic Functions -- NAND Gate -- Set-Reset R Flip-Flop -- Current Mode with Anti-Bouncing Flip-Flop -- 4. DC-DC Conversion Architectures -- 4.1 Valley Control Architecture -- Peak and Valley Control Architectures -- Transient Response of Each System.
Valley Control with FAN5093 -- Conclusion -- 4.2 Monolithic Buck Converter -- A New Design Methodology for Faster Time to Market The Design Cycle -- The FAN5301 -- The Behavioral Model -- Light Load Operation -- Full Load Operation -- Over-Current -- One Shot -- Comparator -- Results -- Timing -- Conclusion -- 4.3 Active Clamp -- Introduction -- Application -- Test Results -- Comments -- 4.4 Battery Charging Techniques: New Solutions for Notebook Battery Chargers -- High Efficiency -- The Smart Battery System -- Data Conversion -- Fast Charge -- Battery Charger System -- 4.5 Digital Power -- Control Algorithm of Modern Switching Regulators: Analog or Digital? -- Fast Switch mode Regulators and Digital Control -- 5. Offline (AC-DC) Architectures -- 5.1 Offline Power Architectures -- Introduction -- Offline Control -- PFC Architecture -- DC-DC Conversion Down to Low Voltage -- Future Trends -- 5.2 Power AC Adapter: Thermal and Electrical Design -- Introduction: The Challenge -- AC Adapter Power Dissipation -- AC Adapter Case Temperature -- Active and No-load Operation -- Development of a Solution -- Conclusion -- 6. Power Management of Ultraportable Devices -- 6.1 Power Management of Wireless Computing and Communications Devices -- The Wireless Landscape -- Power Management Technologies for Wireless -- Cellular Telephones -- Wireless Handheld -- Charge -- Protection and Fuel Gauging -- Convergence of Cellular Telephone and Handheld -- Future Architectures -- 6.2 Power Management in Wireless Telephones: Subsystem Design Requirements -- Smart Phone Subsystems -- Display Board -- Keypad Board -- Main Board -- Battery Pack -- AC Adapter -- 6.3 Powering Feature-Rich Handsets -- Growing Complexity and Shrinking Cycle Time -- Power Management Unit -- Low Dropouts (LDOs) -- 6.4 More on Power Management Units in Cell Phones -- Barriers to Up-Integration -- PMU Building Blocks -- CPU Regulator -- Low Dropout Block -- The Microcontroller -- The Microcontroller Die -- Processing Requirements.
Microcontroller-Driven Illumination System -- 6.5 Color Displays and Cameras Increase Demand on Power Sources and Management -- Digital Still Camera -- Camera Phones -- Power Minimization -- Untethered Operation -- 7. Computing and Communications Systems.
7.1 Power Management of Desktop and Notebook Computers -- Power Management System Solution for a Pentium III Desktop System -- Power Management System Solution for Pentium IV Systems (Desktop and Notebook) -- Desktop Systems -- Powering the Silver Box -- Notebook Systems -- Future Power Trends -- 7.2 Computing and Data Communications Converge at the Point of Load -- The Proliferation of Power Supplies -- Telecom Power Distribution -- Computing Power Distribution -- Multiphase Buck Converter for POLs and VRMs -- Conclusion -- 7.3 Efficient Power Management ICs Tailored for DDR-SDRAM Memories -- Introduction -- DDR Power Management Architecture -- Worst Case Current Consumption -- Average Power Consumption -- Transient Operation -- Standby Operation -- Linear versus Switching -- Second Generation DDR-DDR2 -- FAN5236 for DDR and DDR2 Memories -- Future Trends -- 7.4 Power Management of Digital Set-Top Boxes -- Set-Top Box Architecture -- Power Management -- High Power Set-Top Boxes -- Low Power Set-Top Boxes -- Conclusion -- 7.5 Power Conversion for the Data Communications Market -- Introduction -- Current Environment with Separate Networks -- Migration to Converged Voice/Data/Video IP -- Telecom -48 V DC Power Distribution -- Datacom AC Power Distribution -- Conclusion -- 8. Future Directions and Special Topics -- 8.1 Beyond Productivity and Toys: Designing ICs for the Health Care Market -- 8.2 Power Management Protocols Help Save Energy -- ACPI -- Motherboard (DC-DC) Voltage Regulators -- Offline (AC-DC) Voltage Regulators with Power -- Factor Correction (PFC) -- Green Power (Energy Management) -- New Low Power System Requirements -- Conclusion -- 8.3 Heat Disposal in Electronics Applications -- Active versus Passive Cooling --Limits of Passive Cooling -- Active Cooling -- Active Cooling-Yes or No? -- Active Cooling Implementation -- 8.4 Web Based Design Tools -- The Tools on the Web -- 8.5 Motor Drivers for Portable Electronic Appliances -- Introduction -- Camera Basics -- Motors and Motor Drivers -- Driving Implementation -- Efficiency -- DSC Power Consumption -- Conclusion -- Appendix A.Fairchild Specifications for FAN5093 -- Appendix B. Fairchild Specifications for FAN4803 -- Appendix C. Fairchild Specifications for FSD210 and FSD200 -- Appendix D. Fairchild Specifications for FAN5307 -- Appendix E. Fairchild Specifications for ACE1502 -- Appendix F. Fairchild Specifications for FAN5236 -- Appendix G. Fairchild Specifications for FAN8702 -- Glossary -- Further Reading -- Index.
Record Nr. UNINA-9910143569003321
Rossetti Nazzareno <1951->  
Hoboken, New Jersey : , : Wiley, , c2006
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Managing power electronics : VLSI and DSP-driven computer systems / / Nazzareno Rossetti
Managing power electronics : VLSI and DSP-driven computer systems / / Nazzareno Rossetti
Autore Rossetti Nazzareno <1951->
Edizione [1st edition]
Pubbl/distr/stampa Hoboken, New Jersey : , : Wiley, , c2006
Descrizione fisica 1 online resource (405 p.)
Disciplina 621.381/044
621.381044
Soggetto topico Integrated circuits - Very large scale integration
Semiconductors
Signal processing - Digital techniques
ISBN 1-280-28701-2
9786610287017
0-470-24390-2
0-471-77633-5
0-471-77629-7
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Foreword -- Preface -- 1. Introduction -- 1.1 Technology Landscape -- 1.2 A Young Industry after All -- 2. Power Management Technologies -- 2.1 Introduction -- 2.2 Integrated Circuits Power Technology: Processing and Packaging -- Diodes and Bipolar Transistors -- Metal-Oxide-Semiconductor (MOS) Transistors -- DMOS Transistors -- CMOS Transistors -- Passive Components -- A Monolithic Process Example -- Packaging -- 2.3 Discrete Power Technology: Processing and Packaging -- From Wall to Board -- Power MOSFET Technology Basics -- Package Technologies -- 2.4 Ongoing Trends -- 3. Circuits -- PART I. ANALOG CIRCUITS -- 3.1 Transistors -- NPN -- PNP -- Trans-Conductance -- Transistor as Transfer-Resistor -- Transistor Equations -- MOS versus Bipolar Transistors -- 3.2 Elementary Circuits -- Current Mirror -- Current Source -- Differential Input Stage -- Differential to Single Input Stage -- Buffer -- 3.3 Operational Amplifier (Opamp) -- Inverting and Non-Inverting Inputs -- Rail to Rail Output Operation -- CMOS Opamp -- Opamp Symbol and Configurations -- DC Open Loop Gain -- AC Open Loop Gain -- 3.4 Voltage Reference -- Positive TC of ?VBE -- Negative TC of VBE -- Build a ?VBE -- Building a Voltage Reference -- Fractional Band-Gap Voltage Reference -- 3.5 Voltage Regulator -- 3.6 Linear versus Switching -- 3.7 Switching Regulators -- 3.8 Buck Converters -- Switching Regulator Power Train -- Output Capacitor -- Electrolytic Capacitors and Transient Response -- Ceramic Capacitors -- Losses in the Power Train -- The Analog Modulator -- Driver -- Switching Regulator Block Diagram -- Switching Regulator Control Loop -- Input Filter -- Input Inductor LIN -- Input Capacitor -- Current Mode -- 3.9 Flyback Converters -- PART II. DIGITAL CIRCUITS -- 3.10 Logic Functions -- NAND Gate -- Set-Reset R Flip-Flop -- Current Mode with Anti-Bouncing Flip-Flop -- 4. DC-DC Conversion Architectures -- 4.1 Valley Control Architecture -- Peak and Valley Control Architectures -- Transient Response of Each System.
Valley Control with FAN5093 -- Conclusion -- 4.2 Monolithic Buck Converter -- A New Design Methodology for Faster Time to Market The Design Cycle -- The FAN5301 -- The Behavioral Model -- Light Load Operation -- Full Load Operation -- Over-Current -- One Shot -- Comparator -- Results -- Timing -- Conclusion -- 4.3 Active Clamp -- Introduction -- Application -- Test Results -- Comments -- 4.4 Battery Charging Techniques: New Solutions for Notebook Battery Chargers -- High Efficiency -- The Smart Battery System -- Data Conversion -- Fast Charge -- Battery Charger System -- 4.5 Digital Power -- Control Algorithm of Modern Switching Regulators: Analog or Digital? -- Fast Switch mode Regulators and Digital Control -- 5. Offline (AC-DC) Architectures -- 5.1 Offline Power Architectures -- Introduction -- Offline Control -- PFC Architecture -- DC-DC Conversion Down to Low Voltage -- Future Trends -- 5.2 Power AC Adapter: Thermal and Electrical Design -- Introduction: The Challenge -- AC Adapter Power Dissipation -- AC Adapter Case Temperature -- Active and No-load Operation -- Development of a Solution -- Conclusion -- 6. Power Management of Ultraportable Devices -- 6.1 Power Management of Wireless Computing and Communications Devices -- The Wireless Landscape -- Power Management Technologies for Wireless -- Cellular Telephones -- Wireless Handheld -- Charge -- Protection and Fuel Gauging -- Convergence of Cellular Telephone and Handheld -- Future Architectures -- 6.2 Power Management in Wireless Telephones: Subsystem Design Requirements -- Smart Phone Subsystems -- Display Board -- Keypad Board -- Main Board -- Battery Pack -- AC Adapter -- 6.3 Powering Feature-Rich Handsets -- Growing Complexity and Shrinking Cycle Time -- Power Management Unit -- Low Dropouts (LDOs) -- 6.4 More on Power Management Units in Cell Phones -- Barriers to Up-Integration -- PMU Building Blocks -- CPU Regulator -- Low Dropout Block -- The Microcontroller -- The Microcontroller Die -- Processing Requirements.
Microcontroller-Driven Illumination System -- 6.5 Color Displays and Cameras Increase Demand on Power Sources and Management -- Digital Still Camera -- Camera Phones -- Power Minimization -- Untethered Operation -- 7. Computing and Communications Systems.
7.1 Power Management of Desktop and Notebook Computers -- Power Management System Solution for a Pentium III Desktop System -- Power Management System Solution for Pentium IV Systems (Desktop and Notebook) -- Desktop Systems -- Powering the Silver Box -- Notebook Systems -- Future Power Trends -- 7.2 Computing and Data Communications Converge at the Point of Load -- The Proliferation of Power Supplies -- Telecom Power Distribution -- Computing Power Distribution -- Multiphase Buck Converter for POLs and VRMs -- Conclusion -- 7.3 Efficient Power Management ICs Tailored for DDR-SDRAM Memories -- Introduction -- DDR Power Management Architecture -- Worst Case Current Consumption -- Average Power Consumption -- Transient Operation -- Standby Operation -- Linear versus Switching -- Second Generation DDR-DDR2 -- FAN5236 for DDR and DDR2 Memories -- Future Trends -- 7.4 Power Management of Digital Set-Top Boxes -- Set-Top Box Architecture -- Power Management -- High Power Set-Top Boxes -- Low Power Set-Top Boxes -- Conclusion -- 7.5 Power Conversion for the Data Communications Market -- Introduction -- Current Environment with Separate Networks -- Migration to Converged Voice/Data/Video IP -- Telecom -48 V DC Power Distribution -- Datacom AC Power Distribution -- Conclusion -- 8. Future Directions and Special Topics -- 8.1 Beyond Productivity and Toys: Designing ICs for the Health Care Market -- 8.2 Power Management Protocols Help Save Energy -- ACPI -- Motherboard (DC-DC) Voltage Regulators -- Offline (AC-DC) Voltage Regulators with Power -- Factor Correction (PFC) -- Green Power (Energy Management) -- New Low Power System Requirements -- Conclusion -- 8.3 Heat Disposal in Electronics Applications -- Active versus Passive Cooling --Limits of Passive Cooling -- Active Cooling -- Active Cooling-Yes or No? -- Active Cooling Implementation -- 8.4 Web Based Design Tools -- The Tools on the Web -- 8.5 Motor Drivers for Portable Electronic Appliances -- Introduction -- Camera Basics -- Motors and Motor Drivers -- Driving Implementation -- Efficiency -- DSC Power Consumption -- Conclusion -- Appendix A.Fairchild Specifications for FAN5093 -- Appendix B. Fairchild Specifications for FAN4803 -- Appendix C. Fairchild Specifications for FSD210 and FSD200 -- Appendix D. Fairchild Specifications for FAN5307 -- Appendix E. Fairchild Specifications for ACE1502 -- Appendix F. Fairchild Specifications for FAN5236 -- Appendix G. Fairchild Specifications for FAN8702 -- Glossary -- Further Reading -- Index.
Altri titoli varianti VLSI and DSP-driven computer systems
Record Nr. UNINA-9910830443603321
Rossetti Nazzareno <1951->  
Hoboken, New Jersey : , : Wiley, , c2006
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Managing power electronics : VLSI and DSP-driven computer systems / / Nazzareno Rossetti
Managing power electronics : VLSI and DSP-driven computer systems / / Nazzareno Rossetti
Autore Rossetti Nazzareno <1951->
Edizione [1st edition]
Pubbl/distr/stampa Hoboken, N.J., : Wiley, c2006
Descrizione fisica 1 online resource (405 p.)
Disciplina 621.381/044
Soggetto topico Integrated circuits - Very large scale integration
Semiconductors
Signal processing - Digital techniques
ISBN 9786610287017
9781280287015
1280287012
9780470243909
0470243902
9780471776338
0471776335
9780471776291
0471776297
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Foreword -- Preface -- 1. Introduction -- 1.1 Technology Landscape -- 1.2 A Young Industry after All -- 2. Power Management Technologies -- 2.1 Introduction -- 2.2 Integrated Circuits Power Technology: Processing and Packaging -- Diodes and Bipolar Transistors -- Metal-Oxide-Semiconductor (MOS) Transistors -- DMOS Transistors -- CMOS Transistors -- Passive Components -- A Monolithic Process Example -- Packaging -- 2.3 Discrete Power Technology: Processing and Packaging -- From Wall to Board -- Power MOSFET Technology Basics -- Package Technologies -- 2.4 Ongoing Trends -- 3. Circuits -- PART I. ANALOG CIRCUITS -- 3.1 Transistors -- NPN -- PNP -- Trans-Conductance -- Transistor as Transfer-Resistor -- Transistor Equations -- MOS versus Bipolar Transistors -- 3.2 Elementary Circuits -- Current Mirror -- Current Source -- Differential Input Stage -- Differential to Single Input Stage -- Buffer -- 3.3 Operational Amplifier (Opamp) -- Inverting and Non-Inverting Inputs -- Rail to Rail Output Operation -- CMOS Opamp -- Opamp Symbol and Configurations -- DC Open Loop Gain -- AC Open Loop Gain -- 3.4 Voltage Reference -- Positive TC of ?VBE -- Negative TC of VBE -- Build a ?VBE -- Building a Voltage Reference -- Fractional Band-Gap Voltage Reference -- 3.5 Voltage Regulator -- 3.6 Linear versus Switching -- 3.7 Switching Regulators -- 3.8 Buck Converters -- Switching Regulator Power Train -- Output Capacitor -- Electrolytic Capacitors and Transient Response -- Ceramic Capacitors -- Losses in the Power Train -- The Analog Modulator -- Driver -- Switching Regulator Block Diagram -- Switching Regulator Control Loop -- Input Filter -- Input Inductor LIN -- Input Capacitor -- Current Mode -- 3.9 Flyback Converters -- PART II. DIGITAL CIRCUITS -- 3.10 Logic Functions -- NAND Gate -- Set-Reset R Flip-Flop -- Current Mode with Anti-Bouncing Flip-Flop -- 4. DC-DC Conversion Architectures -- 4.1 Valley Control Architecture -- Peak and Valley Control Architectures -- Transient Response of Each System.
Valley Control with FAN5093 -- Conclusion -- 4.2 Monolithic Buck Converter -- A New Design Methodology for Faster Time to Market The Design Cycle -- The FAN5301 -- The Behavioral Model -- Light Load Operation -- Full Load Operation -- Over-Current -- One Shot -- Comparator -- Results -- Timing -- Conclusion -- 4.3 Active Clamp -- Introduction -- Application -- Test Results -- Comments -- 4.4 Battery Charging Techniques: New Solutions for Notebook Battery Chargers -- High Efficiency -- The Smart Battery System -- Data Conversion -- Fast Charge -- Battery Charger System -- 4.5 Digital Power -- Control Algorithm of Modern Switching Regulators: Analog or Digital? -- Fast Switch mode Regulators and Digital Control -- 5. Offline (AC-DC) Architectures -- 5.1 Offline Power Architectures -- Introduction -- Offline Control -- PFC Architecture -- DC-DC Conversion Down to Low Voltage -- Future Trends -- 5.2 Power AC Adapter: Thermal and Electrical Design -- Introduction: The Challenge -- AC Adapter Power Dissipation -- AC Adapter Case Temperature -- Active and No-load Operation -- Development of a Solution -- Conclusion -- 6. Power Management of Ultraportable Devices -- 6.1 Power Management of Wireless Computing and Communications Devices -- The Wireless Landscape -- Power Management Technologies for Wireless -- Cellular Telephones -- Wireless Handheld -- Charge -- Protection and Fuel Gauging -- Convergence of Cellular Telephone and Handheld -- Future Architectures -- 6.2 Power Management in Wireless Telephones: Subsystem Design Requirements -- Smart Phone Subsystems -- Display Board -- Keypad Board -- Main Board -- Battery Pack -- AC Adapter -- 6.3 Powering Feature-Rich Handsets -- Growing Complexity and Shrinking Cycle Time -- Power Management Unit -- Low Dropouts (LDOs) -- 6.4 More on Power Management Units in Cell Phones -- Barriers to Up-Integration -- PMU Building Blocks -- CPU Regulator -- Low Dropout Block -- The Microcontroller -- The Microcontroller Die -- Processing Requirements.
Microcontroller-Driven Illumination System -- 6.5 Color Displays and Cameras Increase Demand on Power Sources and Management -- Digital Still Camera -- Camera Phones -- Power Minimization -- Untethered Operation -- 7. Computing and Communications Systems.
7.1 Power Management of Desktop and Notebook Computers -- Power Management System Solution for a Pentium III Desktop System -- Power Management System Solution for Pentium IV Systems (Desktop and Notebook) -- Desktop Systems -- Powering the Silver Box -- Notebook Systems -- Future Power Trends -- 7.2 Computing and Data Communications Converge at the Point of Load -- The Proliferation of Power Supplies -- Telecom Power Distribution -- Computing Power Distribution -- Multiphase Buck Converter for POLs and VRMs -- Conclusion -- 7.3 Efficient Power Management ICs Tailored for DDR-SDRAM Memories -- Introduction -- DDR Power Management Architecture -- Worst Case Current Consumption -- Average Power Consumption -- Transient Operation -- Standby Operation -- Linear versus Switching -- Second Generation DDR-DDR2 -- FAN5236 for DDR and DDR2 Memories -- Future Trends -- 7.4 Power Management of Digital Set-Top Boxes -- Set-Top Box Architecture -- Power Management -- High Power Set-Top Boxes -- Low Power Set-Top Boxes -- Conclusion -- 7.5 Power Conversion for the Data Communications Market -- Introduction -- Current Environment with Separate Networks -- Migration to Converged Voice/Data/Video IP -- Telecom -48 V DC Power Distribution -- Datacom AC Power Distribution -- Conclusion -- 8. Future Directions and Special Topics -- 8.1 Beyond Productivity and Toys: Designing ICs for the Health Care Market -- 8.2 Power Management Protocols Help Save Energy -- ACPI -- Motherboard (DC-DC) Voltage Regulators -- Offline (AC-DC) Voltage Regulators with Power -- Factor Correction (PFC) -- Green Power (Energy Management) -- New Low Power System Requirements -- Conclusion -- 8.3 Heat Disposal in Electronics Applications -- Active versus Passive Cooling --Limits of Passive Cooling -- Active Cooling -- Active Cooling-Yes or No? -- Active Cooling Implementation -- 8.4 Web Based Design Tools -- The Tools on the Web -- 8.5 Motor Drivers for Portable Electronic Appliances -- Introduction -- Camera Basics -- Motors and Motor Drivers -- Driving Implementation -- Efficiency -- DSC Power Consumption -- Conclusion -- Appendix A.Fairchild Specifications for FAN5093 -- Appendix B. Fairchild Specifications for FAN4803 -- Appendix C. Fairchild Specifications for FSD210 and FSD200 -- Appendix D. Fairchild Specifications for FAN5307 -- Appendix E. Fairchild Specifications for ACE1502 -- Appendix F. Fairchild Specifications for FAN5236 -- Appendix G. Fairchild Specifications for FAN8702 -- Glossary -- Further Reading -- Index.
Altri titoli varianti VLSI and DSP-driven computer systems
Record Nr. UNINA-9910877035103321
Rossetti Nazzareno <1951->  
Hoboken, N.J., : Wiley, c2006
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Power electronics semiconductor devices [[electronic resource] /] / edited by Robert Perret
Power electronics semiconductor devices [[electronic resource] /] / edited by Robert Perret
Pubbl/distr/stampa London, : ISTE
Descrizione fisica 1 online resource (569 p.)
Disciplina 621.381/044
621.38152
Altri autori (Persone) PerretRobert
Collana ISTE
Soggetto topico Power electronics
Power semiconductors
Solid state electronics
ISBN 1-282-25383-2
9786613814487
0-470-61149-9
0-470-39414-5
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Power Electronics Semiconductor Devices; Table of Contents; Preface; Chapter 1. Power MOSFET Transistors; 1.1. Introduction; 1.2. Power MOSFET technologies; 1.2.1. Diffusion process; 1.2.2. Physical and structural MOS parameters; 1.2.3. Permanent sustaining current; 1.3. Mechanism of power MOSFET operation; 1.3.1. Basic principle; 1.3.2. Electron injection; 1.3.3. Static operation; 1.3.4. Dynamic operation; 1.4. Power MOSFET main characteristics; 1.5. Switching cycle with an inductive load; 1.5.1. Switch-on study; 1.5.2. Switch-off study
1.6. Characteristic variations due to MOSFET temperature changes1.7. Over-constrained operations; 1.7.1. Overvoltage on the gate; 1.7.2. Over-current; 1.7.3. Avalanche sustaining; 1.7.4. Use of the body diode; 1.7.5. Safe operating areas; 1.8. Future developments of the power MOSFET; 1.9. References; Chapter 2. Insulated Gate Bipolar Transistors; 2.1. Introduction; 2.2. IGBT technology; 2.2.1. IGBT structure; 2.2.2. Voltage and current characteristics; 2.3. Operation technique; 2.3.1. Basic principle; 2.3.2. Continuous operation; 2.3.3. Dynamic operation; 2.4. Main IGBT characteristics
2.5 One cycle of hard switching on the inductive load2.5.1. Switch-on study; 2.5.2. Switch-off study; 2.6 Soft switching study; 2.6.1. Soft switching switch-on: ZVS (Zero Voltage Switching); 2.6.2. Soft switching switch-off: ZCS (Zero Current Switching); 2.7. Temperature operation; 2.8. Over-constraint operations; 2.8.1. Overvoltage; 2.8.2. Over-current; 2.8.3. Manufacturer's specified safe operating areas; 2.9. Future of IGBT; 2.9.1. Silicon evolution; 2.9.2. Saturation voltage improvements; 2.10. IGBT and MOSFET drives and protections; 2.10.1. Gate drive design; 2.10.2. Gate drive circuits
2.10.3. MOSFET and IGBT protections2.11. References; Chapter 3. Series and Parallel Connections of MOS and IGBT; 3.1. Introduction; 3.2. Kinds of associations; 3.2.1. Increase of power; 3.2.2. Increasing performance; 3.3. The study of associations: operation and parameter influence on imbalances in series and parallel; 3.3.1. Analysis and characteristics for the study of associations; 3.3.2. Static operation; 3.3.3. Dynamic operation: commutation; 3.3.4. Transient operation; 3.3.5. Technological parameters that influence imbalances; 3.4. Solutions for design; 3.4.1. Parallel association
3.4.2. Series associations3.4.3. Matrix connection of components; 3.5. References; Chapter 4. Silicon Carbide Applications in Power Electronics; 4.1. Introduction; 4.2. Physical properties of silicon carbide; 4.2.1. Structural features; 4.2.2. Chemical, mechanical and thermal features; 4.2.3. Electronic and thermal features; 4.2.4. Other "candidates" as semiconductors of power; 4.3. State of the art technology for silicon carbide power components; 4.3.1. Substrates and thin layers of SiC; 4.3.2. Technological steps for achieving power components
4.4. Applications of silicon carbide in power electronics
Record Nr. UNINA-9910829904303321
London, : ISTE
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Power electronics semiconductor devices / / edited by Robert Perret
Power electronics semiconductor devices / / edited by Robert Perret
Pubbl/distr/stampa London, : ISTE
Descrizione fisica 1 online resource (569 p.)
Disciplina 621.381/044
621.38152
Altri autori (Persone) PerretRobert
Collana ISTE
Soggetto topico Power electronics
Power semiconductors
Solid state electronics
ISBN 1-282-25383-2
9786613814487
0-470-61149-9
0-470-39414-5
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Power Electronics Semiconductor Devices; Table of Contents; Preface; Chapter 1. Power MOSFET Transistors; 1.1. Introduction; 1.2. Power MOSFET technologies; 1.2.1. Diffusion process; 1.2.2. Physical and structural MOS parameters; 1.2.3. Permanent sustaining current; 1.3. Mechanism of power MOSFET operation; 1.3.1. Basic principle; 1.3.2. Electron injection; 1.3.3. Static operation; 1.3.4. Dynamic operation; 1.4. Power MOSFET main characteristics; 1.5. Switching cycle with an inductive load; 1.5.1. Switch-on study; 1.5.2. Switch-off study
1.6. Characteristic variations due to MOSFET temperature changes1.7. Over-constrained operations; 1.7.1. Overvoltage on the gate; 1.7.2. Over-current; 1.7.3. Avalanche sustaining; 1.7.4. Use of the body diode; 1.7.5. Safe operating areas; 1.8. Future developments of the power MOSFET; 1.9. References; Chapter 2. Insulated Gate Bipolar Transistors; 2.1. Introduction; 2.2. IGBT technology; 2.2.1. IGBT structure; 2.2.2. Voltage and current characteristics; 2.3. Operation technique; 2.3.1. Basic principle; 2.3.2. Continuous operation; 2.3.3. Dynamic operation; 2.4. Main IGBT characteristics
2.5 One cycle of hard switching on the inductive load2.5.1. Switch-on study; 2.5.2. Switch-off study; 2.6 Soft switching study; 2.6.1. Soft switching switch-on: ZVS (Zero Voltage Switching); 2.6.2. Soft switching switch-off: ZCS (Zero Current Switching); 2.7. Temperature operation; 2.8. Over-constraint operations; 2.8.1. Overvoltage; 2.8.2. Over-current; 2.8.3. Manufacturer's specified safe operating areas; 2.9. Future of IGBT; 2.9.1. Silicon evolution; 2.9.2. Saturation voltage improvements; 2.10. IGBT and MOSFET drives and protections; 2.10.1. Gate drive design; 2.10.2. Gate drive circuits
2.10.3. MOSFET and IGBT protections2.11. References; Chapter 3. Series and Parallel Connections of MOS and IGBT; 3.1. Introduction; 3.2. Kinds of associations; 3.2.1. Increase of power; 3.2.2. Increasing performance; 3.3. The study of associations: operation and parameter influence on imbalances in series and parallel; 3.3.1. Analysis and characteristics for the study of associations; 3.3.2. Static operation; 3.3.3. Dynamic operation: commutation; 3.3.4. Transient operation; 3.3.5. Technological parameters that influence imbalances; 3.4. Solutions for design; 3.4.1. Parallel association
3.4.2. Series associations3.4.3. Matrix connection of components; 3.5. References; Chapter 4. Silicon Carbide Applications in Power Electronics; 4.1. Introduction; 4.2. Physical properties of silicon carbide; 4.2.1. Structural features; 4.2.2. Chemical, mechanical and thermal features; 4.2.3. Electronic and thermal features; 4.2.4. Other "candidates" as semiconductors of power; 4.3. State of the art technology for silicon carbide power components; 4.3.1. Substrates and thin layers of SiC; 4.3.2. Technological steps for achieving power components
4.4. Applications of silicon carbide in power electronics
Record Nr. UNINA-9910876788603321
London, : ISTE
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Pulse-width modulated DC-DC power converters / / Marian K. Kazimierczuk
Pulse-width modulated DC-DC power converters / / Marian K. Kazimierczuk
Autore Kazimierczuk Marian K.
Edizione [Second edition.]
Pubbl/distr/stampa Chichester, West Sussex, [England] : , : Wiley, , 2016
Descrizione fisica 1 online resource (963 p.)
Disciplina 621.381/044
Soggetto topico DC-to-DC converters
Pulse circuits
PWM power converters
ISBN 1-119-00959-6
1-119-00957-X
1-119-00956-1
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Pulse-Width Modulated DC--DC Power Converters; Contents; About the Author; Preface; Nomenclature; 1 Introduction; 1.1 Classification of Power Supplies; 1.2 Basic Functions of Voltage Regulators; 1.3 Power Relationships in DC-DC Converters; 1.4 DC Transfer Functions of DC-DC Converters; 1.5 Static Characteristics of DC Voltage Regulators; 1.6 Dynamic Characteristics of DC Voltage Regulators; 1.7 Linear Voltage Regulators; 1.7.1 Series Voltage Regulator; 1.7.2 Shunt Voltage Regulator; 1.8 Topologies of PWM DC-DC Converters; 1.9 Relationships Among Current, Voltage, Energy, and Power
1.10 Summary References; Review Questions; Problems; 2 Buck PWM DC-DC Converter; 2.1 Introduction; 2.2 DC Analysis of PWM Buck Converter for CCM; 2.2.1 Circuit Description; 2.2.2 Assumptions; 2.2.3 Time Interval: 0 < t DT; 2.2.4 Time Interval: DT < t T; 2.2.5 Device Stresses for CCM; 2.2.6 DC Voltage Transfer Function for CCM; 2.2.7 Boundary Between CCM and DCM; 2.2.8 Capacitors; 2.2.9 Ripple Voltage in Buck Converter for CCM; 2.2.10 Switching Losses with Linear MOSFET Output Capacitance; 2.2.11 Switching Losses with Nonlinear MOSFET Output Capacitance
2.2.12 Power Losses and Efficiency of Buck Converter for CCM 2.2.13 DC Voltage Transfer Function of Lossy Converter for CCM; 2.2.14 MOSFET Gate-Drive Power; 2.2.15 Gate Driver; 2.2.16 Design of Buck Converter for CCM; 2.3 DC Analysis of PWM Buck Converter for DCM; 2.3.1 Time Interval: 0 < t DT; 2.3.2 Time Interval: DT < t (D + D1)T; 2.3.3 Time Interval: (D + D1)T < t T; 2.3.4 Device Stresses for DCM; 2.3.5 DC Voltage Transfer Function for DCM; 2.3.6 Maximum Inductance for DCM; 2.3.7 Power Losses and Efficiency of Buck Converter for DCM; 2.3.8 Design of Buck Converter for DCM
2.4 Buck Converter with Input Filter 2.5 Buck Converter with Synchronous Rectifier; 2.6 Buck Converter with Positive Common Rail; 2.7 Quadratic Buck Converter; 2.8 Tapped-Inductor Buck Converters; 2.8.1 Tapped-Inductor Common-Diode Buck Converter; 2.8.2 Tapped-Inductor Common-Transistor Buck Converter; 2.8.3 Watkins-Johnson Converter; 2.9 Multiphase Buck Converter; 2.10 Switched-Inductor Buck Converter; 2.11 Layout; 2.12 Summary; References; Review Questions; Problems; 3 Boost PWM DC-DC Converter; 3.1 Introduction; 3.2 DC Analysis of PWM Boost Converter for CCM; 3.2.1 Circuit Description
3.2.2 Assumptions3.2.3 Time Interval: 0 < t DT; 3.2.4 Time Interval: DT < t T; 3.2.5 DC Voltage Transfer Function for CCM; 3.2.6 Boundary Between CCM and DCM; 3.2.7 Ripple Voltage in Boost Converter for CCM; 3.2.8 Power Losses and Efficiency of Boost Converter for CCM; 3.2.9 DC Voltage Transfer Function of Lossy Boost Converter for CCM; 3.2.10 Design of Boost Converter for CCM; 3.3 DC Analysis of PWM Boost Converter for DCM; 3.3.1 Time Interval: 0 < t DT; 3.3.2 Time Interval: DT < t (D + D1)T; 3.3.3 Time Interval: (D + D1)T < t T; 3.3.4 Device Stresses for DCM
3.3.5 DC Voltage Transfer Function for DCM
Record Nr. UNINA-9910166636003321
Kazimierczuk Marian K.  
Chichester, West Sussex, [England] : , : Wiley, , 2016
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Pulse-width modulated DC-DC power converters / / Marian K. Kazimierczuk
Pulse-width modulated DC-DC power converters / / Marian K. Kazimierczuk
Autore Kazimierczuk Marian K.
Edizione [Second edition.]
Pubbl/distr/stampa Chichester, West Sussex, [England] : , : Wiley, , 2016
Descrizione fisica 1 online resource (963 p.)
Disciplina 621.381/044
Soggetto topico DC-to-DC converters
Pulse circuits
PWM power converters
ISBN 1-119-00959-6
1-119-00957-X
1-119-00956-1
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Pulse-Width Modulated DC--DC Power Converters; Contents; About the Author; Preface; Nomenclature; 1 Introduction; 1.1 Classification of Power Supplies; 1.2 Basic Functions of Voltage Regulators; 1.3 Power Relationships in DC-DC Converters; 1.4 DC Transfer Functions of DC-DC Converters; 1.5 Static Characteristics of DC Voltage Regulators; 1.6 Dynamic Characteristics of DC Voltage Regulators; 1.7 Linear Voltage Regulators; 1.7.1 Series Voltage Regulator; 1.7.2 Shunt Voltage Regulator; 1.8 Topologies of PWM DC-DC Converters; 1.9 Relationships Among Current, Voltage, Energy, and Power
1.10 Summary References; Review Questions; Problems; 2 Buck PWM DC-DC Converter; 2.1 Introduction; 2.2 DC Analysis of PWM Buck Converter for CCM; 2.2.1 Circuit Description; 2.2.2 Assumptions; 2.2.3 Time Interval: 0 < t DT; 2.2.4 Time Interval: DT < t T; 2.2.5 Device Stresses for CCM; 2.2.6 DC Voltage Transfer Function for CCM; 2.2.7 Boundary Between CCM and DCM; 2.2.8 Capacitors; 2.2.9 Ripple Voltage in Buck Converter for CCM; 2.2.10 Switching Losses with Linear MOSFET Output Capacitance; 2.2.11 Switching Losses with Nonlinear MOSFET Output Capacitance
2.2.12 Power Losses and Efficiency of Buck Converter for CCM 2.2.13 DC Voltage Transfer Function of Lossy Converter for CCM; 2.2.14 MOSFET Gate-Drive Power; 2.2.15 Gate Driver; 2.2.16 Design of Buck Converter for CCM; 2.3 DC Analysis of PWM Buck Converter for DCM; 2.3.1 Time Interval: 0 < t DT; 2.3.2 Time Interval: DT < t (D + D1)T; 2.3.3 Time Interval: (D + D1)T < t T; 2.3.4 Device Stresses for DCM; 2.3.5 DC Voltage Transfer Function for DCM; 2.3.6 Maximum Inductance for DCM; 2.3.7 Power Losses and Efficiency of Buck Converter for DCM; 2.3.8 Design of Buck Converter for DCM
2.4 Buck Converter with Input Filter 2.5 Buck Converter with Synchronous Rectifier; 2.6 Buck Converter with Positive Common Rail; 2.7 Quadratic Buck Converter; 2.8 Tapped-Inductor Buck Converters; 2.8.1 Tapped-Inductor Common-Diode Buck Converter; 2.8.2 Tapped-Inductor Common-Transistor Buck Converter; 2.8.3 Watkins-Johnson Converter; 2.9 Multiphase Buck Converter; 2.10 Switched-Inductor Buck Converter; 2.11 Layout; 2.12 Summary; References; Review Questions; Problems; 3 Boost PWM DC-DC Converter; 3.1 Introduction; 3.2 DC Analysis of PWM Boost Converter for CCM; 3.2.1 Circuit Description
3.2.2 Assumptions3.2.3 Time Interval: 0 < t DT; 3.2.4 Time Interval: DT < t T; 3.2.5 DC Voltage Transfer Function for CCM; 3.2.6 Boundary Between CCM and DCM; 3.2.7 Ripple Voltage in Boost Converter for CCM; 3.2.8 Power Losses and Efficiency of Boost Converter for CCM; 3.2.9 DC Voltage Transfer Function of Lossy Boost Converter for CCM; 3.2.10 Design of Boost Converter for CCM; 3.3 DC Analysis of PWM Boost Converter for DCM; 3.3.1 Time Interval: 0 < t DT; 3.3.2 Time Interval: DT < t (D + D1)T; 3.3.3 Time Interval: (D + D1)T < t T; 3.3.4 Device Stresses for DCM
3.3.5 DC Voltage Transfer Function for DCM
Record Nr. UNINA-9910827318403321
Kazimierczuk Marian K.  
Chichester, West Sussex, [England] : , : Wiley, , 2016
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui