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1036-2020 - IEEE guide for the application of shunt power capacitors / / IEEE
1036-2020 - IEEE guide for the application of shunt power capacitors / / IEEE
Pubbl/distr/stampa [Place of publication not identified] : , : IEEE, , 2021
Descrizione fisica 1 online resource
Disciplina 621.315
Soggetto topico Capacitors
Electrical engineering
ISBN 1-5044-6566-0
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910444459303321
[Place of publication not identified] : , : IEEE, , 2021
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
1036-2020 - IEEE guide for the application of shunt power capacitors / / IEEE
1036-2020 - IEEE guide for the application of shunt power capacitors / / IEEE
Pubbl/distr/stampa [Place of publication not identified] : , : IEEE, , 2021
Descrizione fisica 1 online resource
Disciplina 621.315
Soggetto topico Capacitors
Electrical engineering
ISBN 1-5044-6566-0
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNISA-996574638003316
[Place of publication not identified] : , : IEEE, , 2021
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
Advanced electrical and electronics materials : processes and applications / / K. M. Gupta and Nishu Gupta ; cover design by Russell Richardson
Advanced electrical and electronics materials : processes and applications / / K. M. Gupta and Nishu Gupta ; cover design by Russell Richardson
Autore Gupta K. M.
Pubbl/distr/stampa Hoboken, New Jersey : , : Scrivener Publishing, , 2015
Descrizione fisica 1 online resource (1140 p.)
Disciplina 621.315
Collana Advanced Material Series
Soggetto topico Capacitors
Electric resistors
Electronics - Materials
ISBN 1-118-99857-X
1-118-99856-1
1-118-99858-8
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Cover; Half Title page; Title page; Copyright page; Dedication; Preface; Acknowledgement; About the Authors; Abbreviations; Chapter 1: General Introduction to Electrical and Electronic Materials; 1.1 Importance of Materials; 1.2 Importance of Electrical and Electronic Materials; 1.3 Classification of Electrical and Electronic Materials; 1.4 Scope of Electrical and Electronic Materials; 1.5 Requirements of Engineering Materials; 1.6 Operational Requirements of Electrical and Electronic Materials; 1.7 Classification of Solids on the Basis of Energy Gap
1.8 Glimpse of Some Electronic Products, Their Working Principles and Choicest Materials1.9 Different Types of Engineering Materials; 1.10 Different Levels of Materials Structure; 1.11 Spintronics (The Electronics of Tomorrow) and Spintronic Materials; 1.12 Ferromagnetic Semiconductor; 1.13 Left-Handed (LH) Materials; 1.14 Solved Examples; Chapter 2: Atomic Models, Bonding in Solids, Crystal Geometry, and Miller Indices; 2.1 Atomic Models; 2.2 Bohr's Quantum Atomic Model; 2.3 Modern Concept of Atomic Model; 2.4 Electron Configuration; 2.5 Meaning of Chemical (or Atomic) Bonding
2.6 Classification of Chemical Bonds2.7 Ionic Bond; 2.8 Covalent Bonds; 2.9 Monocrystalline and Polycrystalline Crystal Structures; 2.10 Space Lattice; 2.11 Basis; 2.12 Unit Cell and Crystal; 2.13 Bravais Crystal System; 2.14 Primitive and Non-Primitive Unit Cells; 2.15 Coordination Number; 2.16 Atomic Packing Fraction; 2.17 Calculation of Density (or Bulk Density); 2.18 Miller Indices; 2.19 Interplaner Spacing; 2.20 Linear Density; 2.21 Planer Density; Chapter 3: Solid Structures, Characterization of Materials, Crystal Imperfections, and Mechanical Properties of Materials
3.1 Crystallography3.2 Crystalline and Non-Crystalline Structures; 3.3 Hexagonally Closed Packed Structure (HCP); 3.4 VOIDS; 3.5 Covalent Solids; 3.6 Bragg's Law of X-Rays Diffraction; 3.7 Structure Determination; 3.8 Microscopy; 3.9 Different Types of Metallurgical Microscopes and Their Features; 3.10 Working Principle of Electron Microscope; 3.11 Ideal and Real Crystals, and Imperfections; 3.12 Classification of Imperfections; 3.13 Point Imperfections; 3.14 Effects of Point Imperfections; 3.15 Line Imperfections; 3.16 Features of Edge Dislocation; 3.17 Screw Dislocation
3.18 Characteristics of Dislocations3.19 Sources of Dislocations, Their Effects and Remedies; 3.20 Grain Boundary; 3.21 Twin or Twinning; 3.22 Mechanical Properties of Metals; Chapter 4: Conductive Materials: Electron Theories, Properties and Behaviour; 4.1 Electrons and Their Role in Conductivity; 4.2 Electron Theories of Solids; 4.3 Free Electron Theory; 4.4 Energy Band Theory; 4.5 Brillouin Zone Theory; 4.6 Conductors; 4.7 Factors Affecting Conductivity (and Resistivity) of Metals; 4.8 Thermal Conductivity; 4.9 Heating Effect of Current; 4.10 Thermoelectric Effect (or Thermoelectricity)
4.11 Seebeck Effect
Record Nr. UNISA-996202316803316
Gupta K. M.  
Hoboken, New Jersey : , : Scrivener Publishing, , 2015
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
Advanced electrical and electronics materials : processes and applications / / K. M. Gupta and Nishu Gupta ; cover design by Russell Richardson
Advanced electrical and electronics materials : processes and applications / / K. M. Gupta and Nishu Gupta ; cover design by Russell Richardson
Autore Gupta K. M.
Pubbl/distr/stampa Hoboken, New Jersey : , : Scrivener Publishing, , 2015
Descrizione fisica 1 online resource (1140 p.)
Disciplina 621.315
Collana Advanced Material Series
Soggetto topico Capacitors
Electric resistors
Electronics - Materials
ISBN 1-118-99857-X
1-118-99856-1
1-118-99858-8
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Cover; Half Title page; Title page; Copyright page; Dedication; Preface; Acknowledgement; About the Authors; Abbreviations; Chapter 1: General Introduction to Electrical and Electronic Materials; 1.1 Importance of Materials; 1.2 Importance of Electrical and Electronic Materials; 1.3 Classification of Electrical and Electronic Materials; 1.4 Scope of Electrical and Electronic Materials; 1.5 Requirements of Engineering Materials; 1.6 Operational Requirements of Electrical and Electronic Materials; 1.7 Classification of Solids on the Basis of Energy Gap
1.8 Glimpse of Some Electronic Products, Their Working Principles and Choicest Materials1.9 Different Types of Engineering Materials; 1.10 Different Levels of Materials Structure; 1.11 Spintronics (The Electronics of Tomorrow) and Spintronic Materials; 1.12 Ferromagnetic Semiconductor; 1.13 Left-Handed (LH) Materials; 1.14 Solved Examples; Chapter 2: Atomic Models, Bonding in Solids, Crystal Geometry, and Miller Indices; 2.1 Atomic Models; 2.2 Bohr's Quantum Atomic Model; 2.3 Modern Concept of Atomic Model; 2.4 Electron Configuration; 2.5 Meaning of Chemical (or Atomic) Bonding
2.6 Classification of Chemical Bonds2.7 Ionic Bond; 2.8 Covalent Bonds; 2.9 Monocrystalline and Polycrystalline Crystal Structures; 2.10 Space Lattice; 2.11 Basis; 2.12 Unit Cell and Crystal; 2.13 Bravais Crystal System; 2.14 Primitive and Non-Primitive Unit Cells; 2.15 Coordination Number; 2.16 Atomic Packing Fraction; 2.17 Calculation of Density (or Bulk Density); 2.18 Miller Indices; 2.19 Interplaner Spacing; 2.20 Linear Density; 2.21 Planer Density; Chapter 3: Solid Structures, Characterization of Materials, Crystal Imperfections, and Mechanical Properties of Materials
3.1 Crystallography3.2 Crystalline and Non-Crystalline Structures; 3.3 Hexagonally Closed Packed Structure (HCP); 3.4 VOIDS; 3.5 Covalent Solids; 3.6 Bragg's Law of X-Rays Diffraction; 3.7 Structure Determination; 3.8 Microscopy; 3.9 Different Types of Metallurgical Microscopes and Their Features; 3.10 Working Principle of Electron Microscope; 3.11 Ideal and Real Crystals, and Imperfections; 3.12 Classification of Imperfections; 3.13 Point Imperfections; 3.14 Effects of Point Imperfections; 3.15 Line Imperfections; 3.16 Features of Edge Dislocation; 3.17 Screw Dislocation
3.18 Characteristics of Dislocations3.19 Sources of Dislocations, Their Effects and Remedies; 3.20 Grain Boundary; 3.21 Twin or Twinning; 3.22 Mechanical Properties of Metals; Chapter 4: Conductive Materials: Electron Theories, Properties and Behaviour; 4.1 Electrons and Their Role in Conductivity; 4.2 Electron Theories of Solids; 4.3 Free Electron Theory; 4.4 Energy Band Theory; 4.5 Brillouin Zone Theory; 4.6 Conductors; 4.7 Factors Affecting Conductivity (and Resistivity) of Metals; 4.8 Thermal Conductivity; 4.9 Heating Effect of Current; 4.10 Thermoelectric Effect (or Thermoelectricity)
4.11 Seebeck Effect
Record Nr. UNINA-9910132441103321
Gupta K. M.  
Hoboken, New Jersey : , : Scrivener Publishing, , 2015
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Advanced electrical and electronics materials : processes and applications / / K. M. Gupta and Nishu Gupta ; cover design by Russell Richardson
Advanced electrical and electronics materials : processes and applications / / K. M. Gupta and Nishu Gupta ; cover design by Russell Richardson
Autore Gupta K. M.
Pubbl/distr/stampa Hoboken, New Jersey : , : Scrivener Publishing, , 2015
Descrizione fisica 1 online resource (1140 p.)
Disciplina 621.315
Collana Advanced Material Series
Soggetto topico Capacitors
Electric resistors
Electronics - Materials
ISBN 1-118-99857-X
1-118-99856-1
1-118-99858-8
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Cover; Half Title page; Title page; Copyright page; Dedication; Preface; Acknowledgement; About the Authors; Abbreviations; Chapter 1: General Introduction to Electrical and Electronic Materials; 1.1 Importance of Materials; 1.2 Importance of Electrical and Electronic Materials; 1.3 Classification of Electrical and Electronic Materials; 1.4 Scope of Electrical and Electronic Materials; 1.5 Requirements of Engineering Materials; 1.6 Operational Requirements of Electrical and Electronic Materials; 1.7 Classification of Solids on the Basis of Energy Gap
1.8 Glimpse of Some Electronic Products, Their Working Principles and Choicest Materials1.9 Different Types of Engineering Materials; 1.10 Different Levels of Materials Structure; 1.11 Spintronics (The Electronics of Tomorrow) and Spintronic Materials; 1.12 Ferromagnetic Semiconductor; 1.13 Left-Handed (LH) Materials; 1.14 Solved Examples; Chapter 2: Atomic Models, Bonding in Solids, Crystal Geometry, and Miller Indices; 2.1 Atomic Models; 2.2 Bohr's Quantum Atomic Model; 2.3 Modern Concept of Atomic Model; 2.4 Electron Configuration; 2.5 Meaning of Chemical (or Atomic) Bonding
2.6 Classification of Chemical Bonds2.7 Ionic Bond; 2.8 Covalent Bonds; 2.9 Monocrystalline and Polycrystalline Crystal Structures; 2.10 Space Lattice; 2.11 Basis; 2.12 Unit Cell and Crystal; 2.13 Bravais Crystal System; 2.14 Primitive and Non-Primitive Unit Cells; 2.15 Coordination Number; 2.16 Atomic Packing Fraction; 2.17 Calculation of Density (or Bulk Density); 2.18 Miller Indices; 2.19 Interplaner Spacing; 2.20 Linear Density; 2.21 Planer Density; Chapter 3: Solid Structures, Characterization of Materials, Crystal Imperfections, and Mechanical Properties of Materials
3.1 Crystallography3.2 Crystalline and Non-Crystalline Structures; 3.3 Hexagonally Closed Packed Structure (HCP); 3.4 VOIDS; 3.5 Covalent Solids; 3.6 Bragg's Law of X-Rays Diffraction; 3.7 Structure Determination; 3.8 Microscopy; 3.9 Different Types of Metallurgical Microscopes and Their Features; 3.10 Working Principle of Electron Microscope; 3.11 Ideal and Real Crystals, and Imperfections; 3.12 Classification of Imperfections; 3.13 Point Imperfections; 3.14 Effects of Point Imperfections; 3.15 Line Imperfections; 3.16 Features of Edge Dislocation; 3.17 Screw Dislocation
3.18 Characteristics of Dislocations3.19 Sources of Dislocations, Their Effects and Remedies; 3.20 Grain Boundary; 3.21 Twin or Twinning; 3.22 Mechanical Properties of Metals; Chapter 4: Conductive Materials: Electron Theories, Properties and Behaviour; 4.1 Electrons and Their Role in Conductivity; 4.2 Electron Theories of Solids; 4.3 Free Electron Theory; 4.4 Energy Band Theory; 4.5 Brillouin Zone Theory; 4.6 Conductors; 4.7 Factors Affecting Conductivity (and Resistivity) of Metals; 4.8 Thermal Conductivity; 4.9 Heating Effect of Current; 4.10 Thermoelectric Effect (or Thermoelectricity)
4.11 Seebeck Effect
Record Nr. UNINA-9910828839503321
Gupta K. M.  
Hoboken, New Jersey : , : Scrivener Publishing, , 2015
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
AIEE No 18-1934 (ASA C55 1934) : AIEE Standards for Capacitors / / Institute of Electrical and Electronics Engineers
AIEE No 18-1934 (ASA C55 1934) : AIEE Standards for Capacitors / / Institute of Electrical and Electronics Engineers
Pubbl/distr/stampa Piscataway, New Jersey : , : IEEE, , 1933
Descrizione fisica 1 online resource (203 pages)
Disciplina 621.315
Soggetto topico Capacitors
ISBN 1-5044-0183-2
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti AIEE No 18-1934
Record Nr. UNISA-996280831503316
Piscataway, New Jersey : , : IEEE, , 1933
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
AIEE No 18-1934 (ASA C55 1934) : AIEE Standards for Capacitors / / Institute of Electrical and Electronics Engineers
AIEE No 18-1934 (ASA C55 1934) : AIEE Standards for Capacitors / / Institute of Electrical and Electronics Engineers
Pubbl/distr/stampa Piscataway, New Jersey : , : IEEE, , 1933
Descrizione fisica 1 online resource (203 pages)
Disciplina 621.315
Soggetto topico Capacitors
ISBN 1-5044-0183-2
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti AIEE No 18-1934
Record Nr. UNINA-9910137389703321
Piscataway, New Jersey : , : IEEE, , 1933
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
ANSI C93.1-1999 / / Institute of Electrical and Electronics Engineers
ANSI C93.1-1999 / / Institute of Electrical and Electronics Engineers
Pubbl/distr/stampa New York, New York : , : IEEE, , 1999
Descrizione fisica 1 online resource (42 pages)
Disciplina 621.315
Soggetto topico Capacitors - Standards
ISBN 0-7381-4036-8
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti C93.1-1999 - American National Standard Requirements for Power-Line Carrier Coupling Capacitors and Coupling Capacitor Voltage Transformers
ANSI C93.1-1999: American National Standard Requirements for Power-Line Carrier Coupling Capacitors and Coupling Capacitor Voltage Transformers (CCVT
Record Nr. UNISA-996279858303316
New York, New York : , : IEEE, , 1999
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
ANSI C93.1-1999 / / Institute of Electrical and Electronics Engineers
ANSI C93.1-1999 / / Institute of Electrical and Electronics Engineers
Pubbl/distr/stampa New York, New York : , : IEEE, , 1999
Descrizione fisica 1 online resource (42 pages)
Disciplina 621.315
Soggetto topico Capacitors - Standards
ISBN 0-7381-4036-8
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti C93.1-1999 - American National Standard Requirements for Power-Line Carrier Coupling Capacitors and Coupling Capacitor Voltage Transformers
ANSI C93.1-1999: American National Standard Requirements for Power-Line Carrier Coupling Capacitors and Coupling Capacitor Voltage Transformers (CCVT
Record Nr. UNINA-9910135783403321
New York, New York : , : IEEE, , 1999
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
ANSI/IEEE Std 18-1980 / / Institute of Electrical and Electronics Engineers
ANSI/IEEE Std 18-1980 / / Institute of Electrical and Electronics Engineers
Pubbl/distr/stampa [Place of publication not identified] : , : IEEE, , 1980
Descrizione fisica 1 online resource (32 pages)
Disciplina 621.315
Soggetto topico Capacitors
ISBN 0-7381-4177-1
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti ANSI/IEEE Std 18-1980: IEEE Standard for Shunt Power Capacitors
Record Nr. UNISA-996279874003316
[Place of publication not identified] : , : IEEE, , 1980
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui