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Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC / / Er-Ping Li
| Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC / / Er-Ping Li |
| Autore | Li Er-Ping |
| Pubbl/distr/stampa | [United States] : , : IEEE Press |
| Descrizione fisica | 1 online resource (390 p.) |
| Disciplina | 621.3015118 |
| Soggetto topico |
Three-dimensional integrated circuits
Integrated circuits |
| ISBN |
1-280-67311-7
9786613650047 1-118-16674-4 1-118-16672-8 1-118-16675-2 |
| Classificazione | TEC008050 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration. |
| Record Nr. | UNINA-9910141296603321 |
Li Er-Ping
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| [United States] : , : IEEE Press | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC / / Er-Ping Li
| Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC / / Er-Ping Li |
| Autore | Li Er-Ping |
| Pubbl/distr/stampa | [United States] : , : IEEE Press |
| Descrizione fisica | 1 online resource (390 p.) |
| Disciplina | 621.3015118 |
| Soggetto topico |
Three-dimensional integrated circuits
Integrated circuits |
| ISBN |
1-280-67311-7
9786613650047 1-118-16674-4 1-118-16672-8 1-118-16675-2 |
| Classificazione | TEC008050 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration. |
| Record Nr. | UNINA-9910830908503321 |
|
Li Er-Ping
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||
| [United States] : , : IEEE Press | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Electromagnetism of continuous media : mathematical modelling and applications / Mauro Fabrizio and Angelo Morro
| Electromagnetism of continuous media : mathematical modelling and applications / Mauro Fabrizio and Angelo Morro |
| Autore | Fabrizio, Mauro |
| Pubbl/distr/stampa | Oxford ; New York : Oxford University Press, 2003 |
| Descrizione fisica | xvii, 668 p. ; 24 cm |
| Disciplina | 621.3015118 |
| Altri autori (Persone) | Morro, Angeloauthor |
| Soggetto topico |
Electromagnetism
Electric engineering - Mathematical models |
| ISBN | 0198527004 |
| Classificazione |
AMS 78-02
LC QC760.F32 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISALENTO-991001304739707536 |
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Fabrizio, Mauro
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| Oxford ; New York : Oxford University Press, 2003 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. del Salento | ||
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Scientific Computing in Electrical Engineering : SCEE 2020, Eindhoven, The Netherlands, February 2020 / / edited by Martijn van Beurden, Neil Budko, Wil Schilders
| Scientific Computing in Electrical Engineering : SCEE 2020, Eindhoven, The Netherlands, February 2020 / / edited by Martijn van Beurden, Neil Budko, Wil Schilders |
| Edizione | [1st ed. 2021.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2021 |
| Descrizione fisica | 1 online resource (305 pages) |
| Disciplina |
621.3
621.3015118 |
| Collana | The European Consortium for Mathematics in Industry |
| Soggetto topico |
Differential equations
Geometrical optics Wave theory of light Differential Equations Classical Optics, Geometric and Wave optics |
| ISBN | 3-030-84238-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Part I Circuit Simulation and Design -- Efficient model reduction of myelinated compartments as port-Hamiltonian systems -- Towards a Parallel-in-Time Calculation of Time-Periodic Solutions with Unknown Period -- On the Exactness of Rational Polynomial Chaos Formulation for the Uncertainty Quantification of Linear Circuits in the Frequency Domain -- Parallel-in-Time Simulation of Power Converters Using Multirate PDEs -- Part II Device Simulation -- A Maximum Principle for Drift-Diffusion Equations and the Scharfetter-Gummel Discretization -- Numerical calculation of electronic properties of transition metal-doped mWS2 via DFT -- Numerical simulation of thermal conductivity of silicon nanowires -- A Novel Surface Mesh Simplification Method for Flux-Dependent Topography Simulations of Semiconductor Fabrication Processes -- Simulations of a novel DG-GFET -- Part III Computational Electromagnetics -- Electric Circuit Element Boundary Conditions in the Finite Element Method for Full-Wave Frequency Domain Passive Devices -- A convolution quadrature method for Maxwell’s equations in dispersive media -- On the stability of harmonic coupling methods with application to electric machines -- Dielectric Breakdown Prediction with GPU-Accelerated BEM -- Empirical Analysis of a Coaxial Microwave Structure with Finite Transmission Zero -- Frequency-domain non-intrusive greedy Model Order Reduction based on minimal rational approximation -- A Comparison Between Different Formulations for Solving Axisymmetric Time-Harmonic Electromagnetic Wave Problems -- The Magnetization Analysis of Motor Magnet and its Influence on Cogging Torque -- Part IV Mathematical and Computational Methods -- A Combination of Model Order Reduction and Multirate Techniques for Coupled Dynamical Systems -- Waveform relaxation for low frequency coupled field/circuit differential-algebraic models of index 2 -- Splitting Methods for Linear Circuit DAEs of Index 1 in port-Hamiltonian Form -- Reduced order modelling for wafer heating with the Method of Freezing -- Multirate DAE-Simulation and its Application in System Simulation Software for the Development of Electric Vehicles -- A hysteresis loss model for Tellinen’s scalar hysteresis model -- Hybrid Modeling: Towards the Next Level of Scientific Computing in Engineering -- Machine Learning for Initial Value Problems of Parameter-Dependent Dynamical Systems -- Modeling of Thermoelectric Generator via Parametric Model Order Reduction Based on Modified Matrix Interpolation -- Nonlinear Model Order Reduction of a Thermal Human Torso Model -- Multi-Level Iterations for Microgrid Control with Automatic Level Choice -- Multi-Level Inversion Based On Mesh Decoupling. |
| Record Nr. | UNINA-9910552713403321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2021 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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