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Adhesion [[electronic resource] ] : current research and applications / / edited by Wulff Possart
| Adhesion [[electronic resource] ] : current research and applications / / edited by Wulff Possart |
| Pubbl/distr/stampa | Weinheim, : Wiley-VCH, c2005 |
| Descrizione fisica | 1 online resource (609 p.) |
| Disciplina |
541.33
620.199 |
| Altri autori (Persone) | PossartWulff |
| Soggetto topico |
Adhesion
Adsorption |
| ISBN |
1-280-85418-9
9786610854189 3-527-60730-7 3-527-60710-2 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Adhesion; Preface; Contents; List of Contributors; 1 The Interfacial Chemistry of Adhesion: Novel Routes to the Holy Grail?; Abstract; 1.1 Introduction; 1.2 Development of a Model Interphase; 1.3 The Buried Interface; 1.4 Conclusion; Acknowledgments; References; 2 Modeling Fundamental Aspects of the Surface Chemistry of Oxides and their Interactions with Coupling Agents; Abstract; 2.1 Introduction: Atomistic Simulations in Adhesion; 2.2 Prediction of Surface Properties: Ideal Reconstructions on α-SiO(2) (0001); 2.3 Organic Components of the Adhesive and Substrate-Adhesive Interaction
2.4 Conclusion and OutlookReferences; 3 Adhesion at the Nanoscale: an Approach by AFM; Abstract; 3.1 Introduction; 3.2 Materials and Methods; 3.2.1 Preparation of Oxidized Silica Surface; 3.2.2 Grafting of Functionalized SAMs onto Silicon Wafer; 3.2.3 Crosslinking and Functionalization of PDMS Networks; 3.2.4 Characterization of the SAMs; 3.3 Results and Discussion; 3.3.1 Force-Distance Curve Measurements and AFM Calibration; 3.3.1.1 Force-Distance Curve Features; 3.3.1.2 The DD Curve (Contact Mode); 3.3.1.3 AFM Calibration; 3.3.1.3.1 Determination of the Spring Constant of the Cantilever 3.3.1.3.2 Nonlinearity of the Quadrant of Photodiodes3.3.1.3.3 Scan Rate of the Cantilever; 3.3.1.3.4 Systematic Check; 3.3.2 Force-Distance Curves on Rigid Systems of Controlled Surface Chemistry; 3.3.3 Force-Distance Measurements on Polymers; 3.3.3.1 Force-Indentation Measurements on Polymers; 3.3.3.2 Force-Indentation Curves on Systems of Controlled Surface Chemistry and Controlled Mechanical Properties; 3.4 Conclusion; References; 4 Organization of PCL-b-PMMA Diblock Thin Films: Relationship to the Adsorption Substrate Chemistry; Abstract; 4.1 Introduction; 4.2 Materials and Methods 4.2.1 PCL-b-PMMA Diblocks4.2.2 Infrared Spectroscopy; 4.2.2.1 Transmission; 4.2.2.2 Polarization-Modulation Infrared Reflection-Absorption Spectroscopy (PM-IRRAS); 4.2.3 Atomic Force Microscopy (AFM); 4.3 Results and Discussion; 4.3.1 PCL-b-PMMA Bulk Characterization; 4.3.2 PCL-b-PMMA Thin Films on OH-Functionalized Gold Substrates; 4.3.3 PCL-b-PMMA Thin Films on Gold Substrates; 4.4 Conclusion; References; 5 Adhesion and Friction Properties of Elastomers at Macroscopic and Nanoscopic Scales; Abstract; 5.1 Introduction; 5.2 Materials and Methods; 5.3 Results and Discussion 5.3.1 Adherence Energy5.3.2 Macroscale Friction; 5.3.3 Nanoscale Friction and Adhesion; 5.4 Conclusion; References; 6 Chemical Structure Formation and Morphology in Ultrathin Polyurethane Films on Metals; Abstract; 6.1 Introduction; 6.2 Materials and Methods; 6.2.1 Sample Preparation; 6.2.2 Experimental Characterization; 6.2.3 IR Spectra Calculation; 6.2.4 IR Band Assignment; 6.3 Results and Discussion; 6.3.1 Curing at Room Temperature; 6.3.2 Morphology of Thin Films; 6.3.3 Chemical Structure of Cured Films; 6.4 Conclusion; Acknowledgments; References 7 Properties of the Interphase Epoxy-Amine/Metal: Influences from the Nature of the Amine and the Metal |
| Record Nr. | UNINA-9910144005303321 |
| Weinheim, : Wiley-VCH, c2005 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Adhesion [[electronic resource] ] : current research and applications / / edited by Wulff Possart
| Adhesion [[electronic resource] ] : current research and applications / / edited by Wulff Possart |
| Pubbl/distr/stampa | Weinheim, : Wiley-VCH, c2005 |
| Descrizione fisica | 1 online resource (609 p.) |
| Disciplina |
541.33
620.199 |
| Altri autori (Persone) | PossartWulff |
| Soggetto topico |
Adhesion
Adsorption |
| ISBN |
1-280-85418-9
9786610854189 3-527-60730-7 3-527-60710-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Adhesion; Preface; Contents; List of Contributors; 1 The Interfacial Chemistry of Adhesion: Novel Routes to the Holy Grail?; Abstract; 1.1 Introduction; 1.2 Development of a Model Interphase; 1.3 The Buried Interface; 1.4 Conclusion; Acknowledgments; References; 2 Modeling Fundamental Aspects of the Surface Chemistry of Oxides and their Interactions with Coupling Agents; Abstract; 2.1 Introduction: Atomistic Simulations in Adhesion; 2.2 Prediction of Surface Properties: Ideal Reconstructions on α-SiO(2) (0001); 2.3 Organic Components of the Adhesive and Substrate-Adhesive Interaction
2.4 Conclusion and OutlookReferences; 3 Adhesion at the Nanoscale: an Approach by AFM; Abstract; 3.1 Introduction; 3.2 Materials and Methods; 3.2.1 Preparation of Oxidized Silica Surface; 3.2.2 Grafting of Functionalized SAMs onto Silicon Wafer; 3.2.3 Crosslinking and Functionalization of PDMS Networks; 3.2.4 Characterization of the SAMs; 3.3 Results and Discussion; 3.3.1 Force-Distance Curve Measurements and AFM Calibration; 3.3.1.1 Force-Distance Curve Features; 3.3.1.2 The DD Curve (Contact Mode); 3.3.1.3 AFM Calibration; 3.3.1.3.1 Determination of the Spring Constant of the Cantilever 3.3.1.3.2 Nonlinearity of the Quadrant of Photodiodes3.3.1.3.3 Scan Rate of the Cantilever; 3.3.1.3.4 Systematic Check; 3.3.2 Force-Distance Curves on Rigid Systems of Controlled Surface Chemistry; 3.3.3 Force-Distance Measurements on Polymers; 3.3.3.1 Force-Indentation Measurements on Polymers; 3.3.3.2 Force-Indentation Curves on Systems of Controlled Surface Chemistry and Controlled Mechanical Properties; 3.4 Conclusion; References; 4 Organization of PCL-b-PMMA Diblock Thin Films: Relationship to the Adsorption Substrate Chemistry; Abstract; 4.1 Introduction; 4.2 Materials and Methods 4.2.1 PCL-b-PMMA Diblocks4.2.2 Infrared Spectroscopy; 4.2.2.1 Transmission; 4.2.2.2 Polarization-Modulation Infrared Reflection-Absorption Spectroscopy (PM-IRRAS); 4.2.3 Atomic Force Microscopy (AFM); 4.3 Results and Discussion; 4.3.1 PCL-b-PMMA Bulk Characterization; 4.3.2 PCL-b-PMMA Thin Films on OH-Functionalized Gold Substrates; 4.3.3 PCL-b-PMMA Thin Films on Gold Substrates; 4.4 Conclusion; References; 5 Adhesion and Friction Properties of Elastomers at Macroscopic and Nanoscopic Scales; Abstract; 5.1 Introduction; 5.2 Materials and Methods; 5.3 Results and Discussion 5.3.1 Adherence Energy5.3.2 Macroscale Friction; 5.3.3 Nanoscale Friction and Adhesion; 5.4 Conclusion; References; 6 Chemical Structure Formation and Morphology in Ultrathin Polyurethane Films on Metals; Abstract; 6.1 Introduction; 6.2 Materials and Methods; 6.2.1 Sample Preparation; 6.2.2 Experimental Characterization; 6.2.3 IR Spectra Calculation; 6.2.4 IR Band Assignment; 6.3 Results and Discussion; 6.3.1 Curing at Room Temperature; 6.3.2 Morphology of Thin Films; 6.3.3 Chemical Structure of Cured Films; 6.4 Conclusion; Acknowledgments; References 7 Properties of the Interphase Epoxy-Amine/Metal: Influences from the Nature of the Amine and the Metal |
| Record Nr. | UNINA-9910830596403321 |
| Weinheim, : Wiley-VCH, c2005 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Adhesion : current research and applications / / edited by Wulff Possart
| Adhesion : current research and applications / / edited by Wulff Possart |
| Pubbl/distr/stampa | Weinheim, : Wiley-VCH, c2005 |
| Descrizione fisica | 1 online resource (609 p.) |
| Disciplina |
541.33
620.199 |
| Altri autori (Persone) | PossartWulff |
| Soggetto topico |
Adhesion
Adsorption |
| ISBN |
1-280-85418-9
9786610854189 3-527-60730-7 3-527-60710-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Adhesion; Preface; Contents; List of Contributors; 1 The Interfacial Chemistry of Adhesion: Novel Routes to the Holy Grail?; Abstract; 1.1 Introduction; 1.2 Development of a Model Interphase; 1.3 The Buried Interface; 1.4 Conclusion; Acknowledgments; References; 2 Modeling Fundamental Aspects of the Surface Chemistry of Oxides and their Interactions with Coupling Agents; Abstract; 2.1 Introduction: Atomistic Simulations in Adhesion; 2.2 Prediction of Surface Properties: Ideal Reconstructions on α-SiO(2) (0001); 2.3 Organic Components of the Adhesive and Substrate-Adhesive Interaction
2.4 Conclusion and OutlookReferences; 3 Adhesion at the Nanoscale: an Approach by AFM; Abstract; 3.1 Introduction; 3.2 Materials and Methods; 3.2.1 Preparation of Oxidized Silica Surface; 3.2.2 Grafting of Functionalized SAMs onto Silicon Wafer; 3.2.3 Crosslinking and Functionalization of PDMS Networks; 3.2.4 Characterization of the SAMs; 3.3 Results and Discussion; 3.3.1 Force-Distance Curve Measurements and AFM Calibration; 3.3.1.1 Force-Distance Curve Features; 3.3.1.2 The DD Curve (Contact Mode); 3.3.1.3 AFM Calibration; 3.3.1.3.1 Determination of the Spring Constant of the Cantilever 3.3.1.3.2 Nonlinearity of the Quadrant of Photodiodes3.3.1.3.3 Scan Rate of the Cantilever; 3.3.1.3.4 Systematic Check; 3.3.2 Force-Distance Curves on Rigid Systems of Controlled Surface Chemistry; 3.3.3 Force-Distance Measurements on Polymers; 3.3.3.1 Force-Indentation Measurements on Polymers; 3.3.3.2 Force-Indentation Curves on Systems of Controlled Surface Chemistry and Controlled Mechanical Properties; 3.4 Conclusion; References; 4 Organization of PCL-b-PMMA Diblock Thin Films: Relationship to the Adsorption Substrate Chemistry; Abstract; 4.1 Introduction; 4.2 Materials and Methods 4.2.1 PCL-b-PMMA Diblocks4.2.2 Infrared Spectroscopy; 4.2.2.1 Transmission; 4.2.2.2 Polarization-Modulation Infrared Reflection-Absorption Spectroscopy (PM-IRRAS); 4.2.3 Atomic Force Microscopy (AFM); 4.3 Results and Discussion; 4.3.1 PCL-b-PMMA Bulk Characterization; 4.3.2 PCL-b-PMMA Thin Films on OH-Functionalized Gold Substrates; 4.3.3 PCL-b-PMMA Thin Films on Gold Substrates; 4.4 Conclusion; References; 5 Adhesion and Friction Properties of Elastomers at Macroscopic and Nanoscopic Scales; Abstract; 5.1 Introduction; 5.2 Materials and Methods; 5.3 Results and Discussion 5.3.1 Adherence Energy5.3.2 Macroscale Friction; 5.3.3 Nanoscale Friction and Adhesion; 5.4 Conclusion; References; 6 Chemical Structure Formation and Morphology in Ultrathin Polyurethane Films on Metals; Abstract; 6.1 Introduction; 6.2 Materials and Methods; 6.2.1 Sample Preparation; 6.2.2 Experimental Characterization; 6.2.3 IR Spectra Calculation; 6.2.4 IR Band Assignment; 6.3 Results and Discussion; 6.3.1 Curing at Room Temperature; 6.3.2 Morphology of Thin Films; 6.3.3 Chemical Structure of Cured Films; 6.4 Conclusion; Acknowledgments; References 7 Properties of the Interphase Epoxy-Amine/Metal: Influences from the Nature of the Amine and the Metal |
| Record Nr. | UNINA-9910877006403321 |
| Weinheim, : Wiley-VCH, c2005 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Adhesion : current research and applications [based on lectures held at the 7th European Conference on Adhesion (EURADH) in Freiburg (Germany) in September 2004] / organized b the DECHEMA in cooperation with the Section Française de l'Adhésion of the Société Française du Vide and the British Society for Adhesion and Adhesives ; edited by Wulff Possart
| Adhesion : current research and applications [based on lectures held at the 7th European Conference on Adhesion (EURADH) in Freiburg (Germany) in September 2004] / organized b the DECHEMA in cooperation with the Section Française de l'Adhésion of the Société Française du Vide and the British Society for Adhesion and Adhesives ; edited by Wulff Possart |
| Pubbl/distr/stampa | Weinheim, : Wiley-VCH, 2005 |
| Descrizione fisica | XXXII, 575 p. : ill. ; 25 cm. |
| Disciplina |
620.1
620.199 |
| Soggetto topico | Adesivi |
| ISBN | 3527312633 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISANNIO-RMS1549873 |
| Weinheim, : Wiley-VCH, 2005 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. del Sannio | ||
| ||
Adhesion abd adhesives : science and technology / A.J. Kinloch
| Adhesion abd adhesives : science and technology / A.J. Kinloch |
| Autore | Kinloch, A.J. |
| Pubbl/distr/stampa | London : Chapman & Hall, copyr. 1987 |
| Disciplina | 620.199 |
| Soggetto non controllato | adesivi |
| ISBN | 0-412-27440-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-990000137540203316 |
Kinloch, A.J.
|
||
| London : Chapman & Hall, copyr. 1987 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
Adhesive bonding : materials, applications and technology / / Walter Brockmann [and three others] ; translated by Bettina Mikhail
| Adhesive bonding : materials, applications and technology / / Walter Brockmann [and three others] ; translated by Bettina Mikhail |
| Pubbl/distr/stampa | Weinheim, [Germany] : , : Wiley-VCH Verlag GmbH & Co. KGaA, , 2009 |
| Descrizione fisica | 1 online resource (434 p.) |
| Disciplina | 620.199 |
| Soggetto topico |
Adhesives
Adhesion |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-282-02142-7
9786612021428 3-527-62392-2 3-527-62393-0 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Adhesive Bonding Materials, Applications and Technology; Contents; Preface; List of Contributors; 1 Adhesive Bonding as a Joining Technique; 2 The Historical Development of Adhesive Bonding; 3 Adhesion; 3.1 Introduction; 3.2 Classical Adhesion Theories; 3.2.1 Polarization Theory; 3.2.2 Diffusion Theory; 3.2.3 Chemical Reactions; 3.3 Adhesion in Real Systems; 3.3.1 Gold; 3.3.2 Polyethylene and Polypropylene; 3.3.3 Glass; 3.4 New Concepts in the Field of Adhesion; 3.5 Conclusions; 4 Survey and Classification of Adhesives and Primers; 4.1 Noncuring (Pressure-Sensitive) Adhesives
4.2 Physically Setting Adhesives4.2.1 Contact Adhesives; 4.2.2 Plastisol Adhesives; 4.2.3 Hot-Melt Adhesives; 4.3 Chemically Setting Adhesives; 4.3.1 Two-Part Adhesives; 4.3.2 Hot-Setting, One-Part Adhesives; 4.3.3 Cold-Setting, One-Part Adhesives; 4.3.4 Microencapsulated Adhesives; 4.4 Primers; 4.5 General Handling Instructions; 5 Chemistry and Properties of Adhesives and Primers; 5.1 Pressure-Sensitive Adhesives (PSAs); 5.1.1 Introduction; 5.1.2 Chemistry of Pressure-Sensitive Adhesives; 5.1.3 Physical Properties of Pressure-Sensitive Adhesives 5.1.4 Properties of Pressure-Sensitive Adhesives as a Function of Temperature5.1.5 Tack; 5.1.6 Peel Resistance; 5.1.7 Creep; 5.1.8 Formulations of PSAs; 5.1.8.1 Typical Formulation of Natural Rubber-Based PSAs; 5.1.8.2 Typical Formulation of Block Copolymer PSAs; 5.1.8.3 Typical Formulation of Acrylate-Based PSAs; 5.2 Contact Adhesives; 5.2.1 Composition of Contact Adhesives; 5.2.2 Properties and Fields of Application of Contact Adhesives; 5.3 Hot Melts; 5.3.1 Thermoplastic Hot Melts; 5.3.2 Hot-Seal Adhesives; 5.3.3 Plastisols; 5.3.4 Self-Bonding Varnishes 5.3.5 Polyurethane-Based Reactive Hot Melts5.3.6 Epoxy Resin-Based Reactive Hot Melts; 5.3.7 Trends in Hot-Melt Technology; 5.4 Phenolic Resin Adhesives; 5.4.1 Chemistry of Phenolic Resins; 5.4.2 Formulation of Phenolic Resin Adhesives; 5.4.3 Behavior and Applications of Phenolic Resin Adhesives; 5.5 Epoxy Resin Adhesives; 5.5.1 Chemistry of Epoxy Resin Adhesives; 5.5.2 Reactions of Epoxy Resins; 5.5.3 Properties of Epoxy Resin Adhesives; 5.5.4 Formulations of Epoxy Resin Adhesives; 5.5.4.1 Epoxy Resins; 5.5.4.2 Crosslinking Agents; 5.5.4.3 Hardeners 5.5.4.4 Flexibilizers and Additives That Improve Impact Toughness5.5.4.5 Fillers and Thixotroping Agents; 5.5.4.6 Further Additives; 5.5.4.7 Typical Epoxy-Resin Adhesive Formulations; 5.6 Polyurethane Adhesives; 5.6.1 Chemistry of Polyurethanes; 5.6.2 Raw Materials; 5.6.2.1 Isocyanates; 5.6.2.2 Polyols; 5.6.2.3 Catalysts; 5.6.3 Structure and Properties of Polyurethane Adhesives; 5.6.3.1 One-Part Polyurethane Adhesives; 5.6.3.2 Two-Part Polyurethane Adhesives; 5.6.4 Formulations of Polyurethane Adhesives; 5.7 Acrylate Adhesives; 5.7.1 Physically Setting Acrylates 5.7.1.1 Solvent-Containing Acrylates |
| Record Nr. | UNINA-9910144395003321 |
| Weinheim, [Germany] : , : Wiley-VCH Verlag GmbH & Co. KGaA, , 2009 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Adhesive bonding : materials, applications and technology / / Walter Brockmann [and three others] ; translated by Bettina Mikhail
| Adhesive bonding : materials, applications and technology / / Walter Brockmann [and three others] ; translated by Bettina Mikhail |
| Pubbl/distr/stampa | Weinheim, [Germany] : , : Wiley-VCH Verlag GmbH & Co. KGaA, , 2009 |
| Descrizione fisica | 1 online resource (434 p.) |
| Disciplina | 620.199 |
| Soggetto topico |
Adhesives
Adhesion |
| ISBN |
1-282-02142-7
9786612021428 3-527-62392-2 3-527-62393-0 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Adhesive Bonding Materials, Applications and Technology; Contents; Preface; List of Contributors; 1 Adhesive Bonding as a Joining Technique; 2 The Historical Development of Adhesive Bonding; 3 Adhesion; 3.1 Introduction; 3.2 Classical Adhesion Theories; 3.2.1 Polarization Theory; 3.2.2 Diffusion Theory; 3.2.3 Chemical Reactions; 3.3 Adhesion in Real Systems; 3.3.1 Gold; 3.3.2 Polyethylene and Polypropylene; 3.3.3 Glass; 3.4 New Concepts in the Field of Adhesion; 3.5 Conclusions; 4 Survey and Classification of Adhesives and Primers; 4.1 Noncuring (Pressure-Sensitive) Adhesives
4.2 Physically Setting Adhesives4.2.1 Contact Adhesives; 4.2.2 Plastisol Adhesives; 4.2.3 Hot-Melt Adhesives; 4.3 Chemically Setting Adhesives; 4.3.1 Two-Part Adhesives; 4.3.2 Hot-Setting, One-Part Adhesives; 4.3.3 Cold-Setting, One-Part Adhesives; 4.3.4 Microencapsulated Adhesives; 4.4 Primers; 4.5 General Handling Instructions; 5 Chemistry and Properties of Adhesives and Primers; 5.1 Pressure-Sensitive Adhesives (PSAs); 5.1.1 Introduction; 5.1.2 Chemistry of Pressure-Sensitive Adhesives; 5.1.3 Physical Properties of Pressure-Sensitive Adhesives 5.1.4 Properties of Pressure-Sensitive Adhesives as a Function of Temperature5.1.5 Tack; 5.1.6 Peel Resistance; 5.1.7 Creep; 5.1.8 Formulations of PSAs; 5.1.8.1 Typical Formulation of Natural Rubber-Based PSAs; 5.1.8.2 Typical Formulation of Block Copolymer PSAs; 5.1.8.3 Typical Formulation of Acrylate-Based PSAs; 5.2 Contact Adhesives; 5.2.1 Composition of Contact Adhesives; 5.2.2 Properties and Fields of Application of Contact Adhesives; 5.3 Hot Melts; 5.3.1 Thermoplastic Hot Melts; 5.3.2 Hot-Seal Adhesives; 5.3.3 Plastisols; 5.3.4 Self-Bonding Varnishes 5.3.5 Polyurethane-Based Reactive Hot Melts5.3.6 Epoxy Resin-Based Reactive Hot Melts; 5.3.7 Trends in Hot-Melt Technology; 5.4 Phenolic Resin Adhesives; 5.4.1 Chemistry of Phenolic Resins; 5.4.2 Formulation of Phenolic Resin Adhesives; 5.4.3 Behavior and Applications of Phenolic Resin Adhesives; 5.5 Epoxy Resin Adhesives; 5.5.1 Chemistry of Epoxy Resin Adhesives; 5.5.2 Reactions of Epoxy Resins; 5.5.3 Properties of Epoxy Resin Adhesives; 5.5.4 Formulations of Epoxy Resin Adhesives; 5.5.4.1 Epoxy Resins; 5.5.4.2 Crosslinking Agents; 5.5.4.3 Hardeners 5.5.4.4 Flexibilizers and Additives That Improve Impact Toughness5.5.4.5 Fillers and Thixotroping Agents; 5.5.4.6 Further Additives; 5.5.4.7 Typical Epoxy-Resin Adhesive Formulations; 5.6 Polyurethane Adhesives; 5.6.1 Chemistry of Polyurethanes; 5.6.2 Raw Materials; 5.6.2.1 Isocyanates; 5.6.2.2 Polyols; 5.6.2.3 Catalysts; 5.6.3 Structure and Properties of Polyurethane Adhesives; 5.6.3.1 One-Part Polyurethane Adhesives; 5.6.3.2 Two-Part Polyurethane Adhesives; 5.6.4 Formulations of Polyurethane Adhesives; 5.7 Acrylate Adhesives; 5.7.1 Physically Setting Acrylates 5.7.1.1 Solvent-Containing Acrylates |
| Record Nr. | UNINA-9910830654203321 |
| Weinheim, [Germany] : , : Wiley-VCH Verlag GmbH & Co. KGaA, , 2009 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Applied adhesive bonding in science and technology / / Halil Ozer, editor
| Applied adhesive bonding in science and technology / / Halil Ozer, editor |
| Pubbl/distr/stampa | [Place of publication not identified] : , : IntechOpen, , [2018] |
| Descrizione fisica | 1 online resource (144 pages) |
| Disciplina | 620.199 |
| Soggetto topico |
Metal bonding
Adhesives |
| ISBN |
953-51-4072-8
953-51-3840-5 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910265149003321 |
| [Place of publication not identified] : , : IntechOpen, , [2018] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Databook of Adhesion Promoters / / Anna Wypych
| Databook of Adhesion Promoters / / Anna Wypych |
| Autore | Wypych Anna |
| Pubbl/distr/stampa | Toronto, Ontario, Canada : , : ChemTec Publishing, , 2018 |
| Descrizione fisica | 1 online resource |
| Disciplina | 620.199 |
| Soggetto topico |
Adhesion
Adhesives |
| ISBN |
1-927885-28-0
1-5231-1353-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910583027303321 |
|
Wypych Anna
|
||
| Toronto, Ontario, Canada : , : ChemTec Publishing, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Handbook of Adhesion Technology [[electronic resource] /] / edited by Lucas F. M. da Silva, Andreas Öchsner, Robert D. Adams
| Handbook of Adhesion Technology [[electronic resource] /] / edited by Lucas F. M. da Silva, Andreas Öchsner, Robert D. Adams |
| Edizione | [1st ed. 2011.] |
| Pubbl/distr/stampa | Berlin, Heidelberg : , : Springer Berlin Heidelberg : , : Imprint : Springer, , 2011 |
| Descrizione fisica | 1 online resource (eReference.) |
| Disciplina | 620.199 |
| Collana | Springer reference Handbook of adhesion technology |
| Soggetto topico |
Manufactures
Materials science Polymers Engineering design Mechanics Mechanics, Applied Manufacturing, Machines, Tools, Processes Materials Science, general Polymer Sciences Engineering Design Solid Mechanics |
| ISBN | 3-642-01169-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910483436603321 |
| Berlin, Heidelberg : , : Springer Berlin Heidelberg : , : Imprint : Springer, , 2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
