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Adhesion [[electronic resource] ] : current research and applications / / edited by Wulff Possart
Adhesion [[electronic resource] ] : current research and applications / / edited by Wulff Possart
Pubbl/distr/stampa Weinheim, : Wiley-VCH, c2005
Descrizione fisica 1 online resource (609 p.)
Disciplina 541.33
620.199
Altri autori (Persone) PossartWulff
Soggetto topico Adhesion
Adsorption
ISBN 1-280-85418-9
9786610854189
3-527-60730-7
3-527-60710-2
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Adhesion; Preface; Contents; List of Contributors; 1 The Interfacial Chemistry of Adhesion: Novel Routes to the Holy Grail?; Abstract; 1.1 Introduction; 1.2 Development of a Model Interphase; 1.3 The Buried Interface; 1.4 Conclusion; Acknowledgments; References; 2 Modeling Fundamental Aspects of the Surface Chemistry of Oxides and their Interactions with Coupling Agents; Abstract; 2.1 Introduction: Atomistic Simulations in Adhesion; 2.2 Prediction of Surface Properties: Ideal Reconstructions on α-SiO(2) (0001); 2.3 Organic Components of the Adhesive and Substrate-Adhesive Interaction
2.4 Conclusion and OutlookReferences; 3 Adhesion at the Nanoscale: an Approach by AFM; Abstract; 3.1 Introduction; 3.2 Materials and Methods; 3.2.1 Preparation of Oxidized Silica Surface; 3.2.2 Grafting of Functionalized SAMs onto Silicon Wafer; 3.2.3 Crosslinking and Functionalization of PDMS Networks; 3.2.4 Characterization of the SAMs; 3.3 Results and Discussion; 3.3.1 Force-Distance Curve Measurements and AFM Calibration; 3.3.1.1 Force-Distance Curve Features; 3.3.1.2 The DD Curve (Contact Mode); 3.3.1.3 AFM Calibration; 3.3.1.3.1 Determination of the Spring Constant of the Cantilever
3.3.1.3.2 Nonlinearity of the Quadrant of Photodiodes3.3.1.3.3 Scan Rate of the Cantilever; 3.3.1.3.4 Systematic Check; 3.3.2 Force-Distance Curves on Rigid Systems of Controlled Surface Chemistry; 3.3.3 Force-Distance Measurements on Polymers; 3.3.3.1 Force-Indentation Measurements on Polymers; 3.3.3.2 Force-Indentation Curves on Systems of Controlled Surface Chemistry and Controlled Mechanical Properties; 3.4 Conclusion; References; 4 Organization of PCL-b-PMMA Diblock Thin Films: Relationship to the Adsorption Substrate Chemistry; Abstract; 4.1 Introduction; 4.2 Materials and Methods
4.2.1 PCL-b-PMMA Diblocks4.2.2 Infrared Spectroscopy; 4.2.2.1 Transmission; 4.2.2.2 Polarization-Modulation Infrared Reflection-Absorption Spectroscopy (PM-IRRAS); 4.2.3 Atomic Force Microscopy (AFM); 4.3 Results and Discussion; 4.3.1 PCL-b-PMMA Bulk Characterization; 4.3.2 PCL-b-PMMA Thin Films on OH-Functionalized Gold Substrates; 4.3.3 PCL-b-PMMA Thin Films on Gold Substrates; 4.4 Conclusion; References; 5 Adhesion and Friction Properties of Elastomers at Macroscopic and Nanoscopic Scales; Abstract; 5.1 Introduction; 5.2 Materials and Methods; 5.3 Results and Discussion
5.3.1 Adherence Energy5.3.2 Macroscale Friction; 5.3.3 Nanoscale Friction and Adhesion; 5.4 Conclusion; References; 6 Chemical Structure Formation and Morphology in Ultrathin Polyurethane Films on Metals; Abstract; 6.1 Introduction; 6.2 Materials and Methods; 6.2.1 Sample Preparation; 6.2.2 Experimental Characterization; 6.2.3 IR Spectra Calculation; 6.2.4 IR Band Assignment; 6.3 Results and Discussion; 6.3.1 Curing at Room Temperature; 6.3.2 Morphology of Thin Films; 6.3.3 Chemical Structure of Cured Films; 6.4 Conclusion; Acknowledgments; References
7 Properties of the Interphase Epoxy-Amine/Metal: Influences from the Nature of the Amine and the Metal
Record Nr. UNINA-9910144005303321
Weinheim, : Wiley-VCH, c2005
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Adhesion [[electronic resource] ] : current research and applications / / edited by Wulff Possart
Adhesion [[electronic resource] ] : current research and applications / / edited by Wulff Possart
Pubbl/distr/stampa Weinheim, : Wiley-VCH, c2005
Descrizione fisica 1 online resource (609 p.)
Disciplina 541.33
620.199
Altri autori (Persone) PossartWulff
Soggetto topico Adhesion
Adsorption
ISBN 1-280-85418-9
9786610854189
3-527-60730-7
3-527-60710-2
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Adhesion; Preface; Contents; List of Contributors; 1 The Interfacial Chemistry of Adhesion: Novel Routes to the Holy Grail?; Abstract; 1.1 Introduction; 1.2 Development of a Model Interphase; 1.3 The Buried Interface; 1.4 Conclusion; Acknowledgments; References; 2 Modeling Fundamental Aspects of the Surface Chemistry of Oxides and their Interactions with Coupling Agents; Abstract; 2.1 Introduction: Atomistic Simulations in Adhesion; 2.2 Prediction of Surface Properties: Ideal Reconstructions on α-SiO(2) (0001); 2.3 Organic Components of the Adhesive and Substrate-Adhesive Interaction
2.4 Conclusion and OutlookReferences; 3 Adhesion at the Nanoscale: an Approach by AFM; Abstract; 3.1 Introduction; 3.2 Materials and Methods; 3.2.1 Preparation of Oxidized Silica Surface; 3.2.2 Grafting of Functionalized SAMs onto Silicon Wafer; 3.2.3 Crosslinking and Functionalization of PDMS Networks; 3.2.4 Characterization of the SAMs; 3.3 Results and Discussion; 3.3.1 Force-Distance Curve Measurements and AFM Calibration; 3.3.1.1 Force-Distance Curve Features; 3.3.1.2 The DD Curve (Contact Mode); 3.3.1.3 AFM Calibration; 3.3.1.3.1 Determination of the Spring Constant of the Cantilever
3.3.1.3.2 Nonlinearity of the Quadrant of Photodiodes3.3.1.3.3 Scan Rate of the Cantilever; 3.3.1.3.4 Systematic Check; 3.3.2 Force-Distance Curves on Rigid Systems of Controlled Surface Chemistry; 3.3.3 Force-Distance Measurements on Polymers; 3.3.3.1 Force-Indentation Measurements on Polymers; 3.3.3.2 Force-Indentation Curves on Systems of Controlled Surface Chemistry and Controlled Mechanical Properties; 3.4 Conclusion; References; 4 Organization of PCL-b-PMMA Diblock Thin Films: Relationship to the Adsorption Substrate Chemistry; Abstract; 4.1 Introduction; 4.2 Materials and Methods
4.2.1 PCL-b-PMMA Diblocks4.2.2 Infrared Spectroscopy; 4.2.2.1 Transmission; 4.2.2.2 Polarization-Modulation Infrared Reflection-Absorption Spectroscopy (PM-IRRAS); 4.2.3 Atomic Force Microscopy (AFM); 4.3 Results and Discussion; 4.3.1 PCL-b-PMMA Bulk Characterization; 4.3.2 PCL-b-PMMA Thin Films on OH-Functionalized Gold Substrates; 4.3.3 PCL-b-PMMA Thin Films on Gold Substrates; 4.4 Conclusion; References; 5 Adhesion and Friction Properties of Elastomers at Macroscopic and Nanoscopic Scales; Abstract; 5.1 Introduction; 5.2 Materials and Methods; 5.3 Results and Discussion
5.3.1 Adherence Energy5.3.2 Macroscale Friction; 5.3.3 Nanoscale Friction and Adhesion; 5.4 Conclusion; References; 6 Chemical Structure Formation and Morphology in Ultrathin Polyurethane Films on Metals; Abstract; 6.1 Introduction; 6.2 Materials and Methods; 6.2.1 Sample Preparation; 6.2.2 Experimental Characterization; 6.2.3 IR Spectra Calculation; 6.2.4 IR Band Assignment; 6.3 Results and Discussion; 6.3.1 Curing at Room Temperature; 6.3.2 Morphology of Thin Films; 6.3.3 Chemical Structure of Cured Films; 6.4 Conclusion; Acknowledgments; References
7 Properties of the Interphase Epoxy-Amine/Metal: Influences from the Nature of the Amine and the Metal
Record Nr. UNINA-9910830596403321
Weinheim, : Wiley-VCH, c2005
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Adhesion [[electronic resource] ] : current research and applications / / edited by Wulff Possart
Adhesion [[electronic resource] ] : current research and applications / / edited by Wulff Possart
Pubbl/distr/stampa Weinheim, : Wiley-VCH, c2005
Descrizione fisica 1 online resource (609 p.)
Disciplina 541.33
620.199
Altri autori (Persone) PossartWulff
Soggetto topico Adhesion
Adsorption
ISBN 1-280-85418-9
9786610854189
3-527-60730-7
3-527-60710-2
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Adhesion; Preface; Contents; List of Contributors; 1 The Interfacial Chemistry of Adhesion: Novel Routes to the Holy Grail?; Abstract; 1.1 Introduction; 1.2 Development of a Model Interphase; 1.3 The Buried Interface; 1.4 Conclusion; Acknowledgments; References; 2 Modeling Fundamental Aspects of the Surface Chemistry of Oxides and their Interactions with Coupling Agents; Abstract; 2.1 Introduction: Atomistic Simulations in Adhesion; 2.2 Prediction of Surface Properties: Ideal Reconstructions on α-SiO(2) (0001); 2.3 Organic Components of the Adhesive and Substrate-Adhesive Interaction
2.4 Conclusion and OutlookReferences; 3 Adhesion at the Nanoscale: an Approach by AFM; Abstract; 3.1 Introduction; 3.2 Materials and Methods; 3.2.1 Preparation of Oxidized Silica Surface; 3.2.2 Grafting of Functionalized SAMs onto Silicon Wafer; 3.2.3 Crosslinking and Functionalization of PDMS Networks; 3.2.4 Characterization of the SAMs; 3.3 Results and Discussion; 3.3.1 Force-Distance Curve Measurements and AFM Calibration; 3.3.1.1 Force-Distance Curve Features; 3.3.1.2 The DD Curve (Contact Mode); 3.3.1.3 AFM Calibration; 3.3.1.3.1 Determination of the Spring Constant of the Cantilever
3.3.1.3.2 Nonlinearity of the Quadrant of Photodiodes3.3.1.3.3 Scan Rate of the Cantilever; 3.3.1.3.4 Systematic Check; 3.3.2 Force-Distance Curves on Rigid Systems of Controlled Surface Chemistry; 3.3.3 Force-Distance Measurements on Polymers; 3.3.3.1 Force-Indentation Measurements on Polymers; 3.3.3.2 Force-Indentation Curves on Systems of Controlled Surface Chemistry and Controlled Mechanical Properties; 3.4 Conclusion; References; 4 Organization of PCL-b-PMMA Diblock Thin Films: Relationship to the Adsorption Substrate Chemistry; Abstract; 4.1 Introduction; 4.2 Materials and Methods
4.2.1 PCL-b-PMMA Diblocks4.2.2 Infrared Spectroscopy; 4.2.2.1 Transmission; 4.2.2.2 Polarization-Modulation Infrared Reflection-Absorption Spectroscopy (PM-IRRAS); 4.2.3 Atomic Force Microscopy (AFM); 4.3 Results and Discussion; 4.3.1 PCL-b-PMMA Bulk Characterization; 4.3.2 PCL-b-PMMA Thin Films on OH-Functionalized Gold Substrates; 4.3.3 PCL-b-PMMA Thin Films on Gold Substrates; 4.4 Conclusion; References; 5 Adhesion and Friction Properties of Elastomers at Macroscopic and Nanoscopic Scales; Abstract; 5.1 Introduction; 5.2 Materials and Methods; 5.3 Results and Discussion
5.3.1 Adherence Energy5.3.2 Macroscale Friction; 5.3.3 Nanoscale Friction and Adhesion; 5.4 Conclusion; References; 6 Chemical Structure Formation and Morphology in Ultrathin Polyurethane Films on Metals; Abstract; 6.1 Introduction; 6.2 Materials and Methods; 6.2.1 Sample Preparation; 6.2.2 Experimental Characterization; 6.2.3 IR Spectra Calculation; 6.2.4 IR Band Assignment; 6.3 Results and Discussion; 6.3.1 Curing at Room Temperature; 6.3.2 Morphology of Thin Films; 6.3.3 Chemical Structure of Cured Films; 6.4 Conclusion; Acknowledgments; References
7 Properties of the Interphase Epoxy-Amine/Metal: Influences from the Nature of the Amine and the Metal
Record Nr. UNINA-9910840833903321
Weinheim, : Wiley-VCH, c2005
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Adhesion : current research and applications [based on lectures held at the 7th European Conference on Adhesion (EURADH) in Freiburg (Germany) in September 2004] / organized b the DECHEMA in cooperation with the Section Française de l'Adhésion of the Société Française du Vide and the British Society for Adhesion and Adhesives ; edited by Wulff Possart
Adhesion : current research and applications [based on lectures held at the 7th European Conference on Adhesion (EURADH) in Freiburg (Germany) in September 2004] / organized b the DECHEMA in cooperation with the Section Française de l'Adhésion of the Société Française du Vide and the British Society for Adhesion and Adhesives ; edited by Wulff Possart
Pubbl/distr/stampa Weinheim, : Wiley-VCH, 2005
Descrizione fisica XXXII, 575 p. : ill. ; 25 cm.
Disciplina 620.1
620.199
Soggetto topico Adesivi
ISBN 3527312633
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNISANNIO-RMS1549873
Weinheim, : Wiley-VCH, 2005
Materiale a stampa
Lo trovi qui: Univ. del Sannio
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Adhesion abd adhesives : science and technology / A.J. Kinloch
Adhesion abd adhesives : science and technology / A.J. Kinloch
Autore Kinloch, A.J.
Pubbl/distr/stampa London : Chapman & Hall, copyr. 1987
Disciplina 620.199
Soggetto non controllato adesivi
ISBN 0-412-27440-X
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNISA-990000137540203316
Kinloch, A.J.  
London : Chapman & Hall, copyr. 1987
Materiale a stampa
Lo trovi qui: Univ. di Salerno
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Adhesive bonding : materials, applications and technology / / Walter Brockmann [and three others] ; translated by Bettina Mikhail
Adhesive bonding : materials, applications and technology / / Walter Brockmann [and three others] ; translated by Bettina Mikhail
Pubbl/distr/stampa Weinheim, [Germany] : , : Wiley-VCH Verlag GmbH & Co. KGaA, , 2009
Descrizione fisica 1 online resource (434 p.)
Disciplina 620.199
Soggetto topico Adhesives
Adhesion
Soggetto genere / forma Electronic books.
ISBN 1-282-02142-7
9786612021428
3-527-62392-2
3-527-62393-0
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Adhesive Bonding Materials, Applications and Technology; Contents; Preface; List of Contributors; 1 Adhesive Bonding as a Joining Technique; 2 The Historical Development of Adhesive Bonding; 3 Adhesion; 3.1 Introduction; 3.2 Classical Adhesion Theories; 3.2.1 Polarization Theory; 3.2.2 Diffusion Theory; 3.2.3 Chemical Reactions; 3.3 Adhesion in Real Systems; 3.3.1 Gold; 3.3.2 Polyethylene and Polypropylene; 3.3.3 Glass; 3.4 New Concepts in the Field of Adhesion; 3.5 Conclusions; 4 Survey and Classification of Adhesives and Primers; 4.1 Noncuring (Pressure-Sensitive) Adhesives
4.2 Physically Setting Adhesives4.2.1 Contact Adhesives; 4.2.2 Plastisol Adhesives; 4.2.3 Hot-Melt Adhesives; 4.3 Chemically Setting Adhesives; 4.3.1 Two-Part Adhesives; 4.3.2 Hot-Setting, One-Part Adhesives; 4.3.3 Cold-Setting, One-Part Adhesives; 4.3.4 Microencapsulated Adhesives; 4.4 Primers; 4.5 General Handling Instructions; 5 Chemistry and Properties of Adhesives and Primers; 5.1 Pressure-Sensitive Adhesives (PSAs); 5.1.1 Introduction; 5.1.2 Chemistry of Pressure-Sensitive Adhesives; 5.1.3 Physical Properties of Pressure-Sensitive Adhesives
5.1.4 Properties of Pressure-Sensitive Adhesives as a Function of Temperature5.1.5 Tack; 5.1.6 Peel Resistance; 5.1.7 Creep; 5.1.8 Formulations of PSAs; 5.1.8.1 Typical Formulation of Natural Rubber-Based PSAs; 5.1.8.2 Typical Formulation of Block Copolymer PSAs; 5.1.8.3 Typical Formulation of Acrylate-Based PSAs; 5.2 Contact Adhesives; 5.2.1 Composition of Contact Adhesives; 5.2.2 Properties and Fields of Application of Contact Adhesives; 5.3 Hot Melts; 5.3.1 Thermoplastic Hot Melts; 5.3.2 Hot-Seal Adhesives; 5.3.3 Plastisols; 5.3.4 Self-Bonding Varnishes
5.3.5 Polyurethane-Based Reactive Hot Melts5.3.6 Epoxy Resin-Based Reactive Hot Melts; 5.3.7 Trends in Hot-Melt Technology; 5.4 Phenolic Resin Adhesives; 5.4.1 Chemistry of Phenolic Resins; 5.4.2 Formulation of Phenolic Resin Adhesives; 5.4.3 Behavior and Applications of Phenolic Resin Adhesives; 5.5 Epoxy Resin Adhesives; 5.5.1 Chemistry of Epoxy Resin Adhesives; 5.5.2 Reactions of Epoxy Resins; 5.5.3 Properties of Epoxy Resin Adhesives; 5.5.4 Formulations of Epoxy Resin Adhesives; 5.5.4.1 Epoxy Resins; 5.5.4.2 Crosslinking Agents; 5.5.4.3 Hardeners
5.5.4.4 Flexibilizers and Additives That Improve Impact Toughness5.5.4.5 Fillers and Thixotroping Agents; 5.5.4.6 Further Additives; 5.5.4.7 Typical Epoxy-Resin Adhesive Formulations; 5.6 Polyurethane Adhesives; 5.6.1 Chemistry of Polyurethanes; 5.6.2 Raw Materials; 5.6.2.1 Isocyanates; 5.6.2.2 Polyols; 5.6.2.3 Catalysts; 5.6.3 Structure and Properties of Polyurethane Adhesives; 5.6.3.1 One-Part Polyurethane Adhesives; 5.6.3.2 Two-Part Polyurethane Adhesives; 5.6.4 Formulations of Polyurethane Adhesives; 5.7 Acrylate Adhesives; 5.7.1 Physically Setting Acrylates
5.7.1.1 Solvent-Containing Acrylates
Record Nr. UNINA-9910144395003321
Weinheim, [Germany] : , : Wiley-VCH Verlag GmbH & Co. KGaA, , 2009
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Adhesive bonding : materials, applications and technology / / Walter Brockmann [and three others] ; translated by Bettina Mikhail
Adhesive bonding : materials, applications and technology / / Walter Brockmann [and three others] ; translated by Bettina Mikhail
Pubbl/distr/stampa Weinheim, [Germany] : , : Wiley-VCH Verlag GmbH & Co. KGaA, , 2009
Descrizione fisica 1 online resource (434 p.)
Disciplina 620.199
Soggetto topico Adhesives
Adhesion
ISBN 1-282-02142-7
9786612021428
3-527-62392-2
3-527-62393-0
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Adhesive Bonding Materials, Applications and Technology; Contents; Preface; List of Contributors; 1 Adhesive Bonding as a Joining Technique; 2 The Historical Development of Adhesive Bonding; 3 Adhesion; 3.1 Introduction; 3.2 Classical Adhesion Theories; 3.2.1 Polarization Theory; 3.2.2 Diffusion Theory; 3.2.3 Chemical Reactions; 3.3 Adhesion in Real Systems; 3.3.1 Gold; 3.3.2 Polyethylene and Polypropylene; 3.3.3 Glass; 3.4 New Concepts in the Field of Adhesion; 3.5 Conclusions; 4 Survey and Classification of Adhesives and Primers; 4.1 Noncuring (Pressure-Sensitive) Adhesives
4.2 Physically Setting Adhesives4.2.1 Contact Adhesives; 4.2.2 Plastisol Adhesives; 4.2.3 Hot-Melt Adhesives; 4.3 Chemically Setting Adhesives; 4.3.1 Two-Part Adhesives; 4.3.2 Hot-Setting, One-Part Adhesives; 4.3.3 Cold-Setting, One-Part Adhesives; 4.3.4 Microencapsulated Adhesives; 4.4 Primers; 4.5 General Handling Instructions; 5 Chemistry and Properties of Adhesives and Primers; 5.1 Pressure-Sensitive Adhesives (PSAs); 5.1.1 Introduction; 5.1.2 Chemistry of Pressure-Sensitive Adhesives; 5.1.3 Physical Properties of Pressure-Sensitive Adhesives
5.1.4 Properties of Pressure-Sensitive Adhesives as a Function of Temperature5.1.5 Tack; 5.1.6 Peel Resistance; 5.1.7 Creep; 5.1.8 Formulations of PSAs; 5.1.8.1 Typical Formulation of Natural Rubber-Based PSAs; 5.1.8.2 Typical Formulation of Block Copolymer PSAs; 5.1.8.3 Typical Formulation of Acrylate-Based PSAs; 5.2 Contact Adhesives; 5.2.1 Composition of Contact Adhesives; 5.2.2 Properties and Fields of Application of Contact Adhesives; 5.3 Hot Melts; 5.3.1 Thermoplastic Hot Melts; 5.3.2 Hot-Seal Adhesives; 5.3.3 Plastisols; 5.3.4 Self-Bonding Varnishes
5.3.5 Polyurethane-Based Reactive Hot Melts5.3.6 Epoxy Resin-Based Reactive Hot Melts; 5.3.7 Trends in Hot-Melt Technology; 5.4 Phenolic Resin Adhesives; 5.4.1 Chemistry of Phenolic Resins; 5.4.2 Formulation of Phenolic Resin Adhesives; 5.4.3 Behavior and Applications of Phenolic Resin Adhesives; 5.5 Epoxy Resin Adhesives; 5.5.1 Chemistry of Epoxy Resin Adhesives; 5.5.2 Reactions of Epoxy Resins; 5.5.3 Properties of Epoxy Resin Adhesives; 5.5.4 Formulations of Epoxy Resin Adhesives; 5.5.4.1 Epoxy Resins; 5.5.4.2 Crosslinking Agents; 5.5.4.3 Hardeners
5.5.4.4 Flexibilizers and Additives That Improve Impact Toughness5.5.4.5 Fillers and Thixotroping Agents; 5.5.4.6 Further Additives; 5.5.4.7 Typical Epoxy-Resin Adhesive Formulations; 5.6 Polyurethane Adhesives; 5.6.1 Chemistry of Polyurethanes; 5.6.2 Raw Materials; 5.6.2.1 Isocyanates; 5.6.2.2 Polyols; 5.6.2.3 Catalysts; 5.6.3 Structure and Properties of Polyurethane Adhesives; 5.6.3.1 One-Part Polyurethane Adhesives; 5.6.3.2 Two-Part Polyurethane Adhesives; 5.6.4 Formulations of Polyurethane Adhesives; 5.7 Acrylate Adhesives; 5.7.1 Physically Setting Acrylates
5.7.1.1 Solvent-Containing Acrylates
Record Nr. UNINA-9910830654203321
Weinheim, [Germany] : , : Wiley-VCH Verlag GmbH & Co. KGaA, , 2009
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Applied adhesive bonding in science and technology / / Halil Ozer, editor
Applied adhesive bonding in science and technology / / Halil Ozer, editor
Pubbl/distr/stampa [Place of publication not identified] : , : IntechOpen, , [2018]
Descrizione fisica 1 online resource (144 pages)
Disciplina 620.199
Soggetto topico Metal bonding
Adhesives
ISBN 953-51-4072-8
953-51-3840-5
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910265149003321
[Place of publication not identified] : , : IntechOpen, , [2018]
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Databook of Adhesion Promoters / / Anna Wypych
Databook of Adhesion Promoters / / Anna Wypych
Autore Wypych Anna
Pubbl/distr/stampa Toronto, Ontario, Canada : , : ChemTec Publishing, , 2018
Descrizione fisica 1 online resource
Disciplina 620.199
Soggetto topico Adhesion
Adhesives
ISBN 1-927885-28-0
1-5231-1353-7
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910583027303321
Wypych Anna  
Toronto, Ontario, Canada : , : ChemTec Publishing, , 2018
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Handbook of Adhesion Technology [[electronic resource] /] / edited by Lucas F. M. da Silva, Andreas Öchsner, Robert D. Adams
Handbook of Adhesion Technology [[electronic resource] /] / edited by Lucas F. M. da Silva, Andreas Öchsner, Robert D. Adams
Edizione [1st ed. 2011.]
Pubbl/distr/stampa Berlin, Heidelberg : , : Springer Berlin Heidelberg : , : Imprint : Springer, , 2011
Descrizione fisica 1 online resource (eReference.)
Disciplina 620.199
Collana Springer reference Handbook of adhesion technology
Soggetto topico Manufactures
Materials science
Polymers  
Engineering design
Mechanics
Mechanics, Applied
Manufacturing, Machines, Tools, Processes
Materials Science, general
Polymer Sciences
Engineering Design
Solid Mechanics
ISBN 3-642-01169-1
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910483436603321
Berlin, Heidelberg : , : Springer Berlin Heidelberg : , : Imprint : Springer, , 2011
Materiale a stampa
Lo trovi qui: Univ. Federico II
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