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Acta Universitatis Carolinae Philologica
Acta Universitatis Carolinae Philologica
Pubbl/distr/stampa Praha, : Universita Karlova
Descrizione fisica 1 online resource
Disciplina 405
Soggetto topico Philology
Klassische Philologie
Zeitschrift
Soggetto genere / forma Aufsatzsammlung
Periodicals.
Monografische Reihe
Aufsatzsammlung
ISSN 2464-6830
Classificazione KA 6209
400
Formato Materiale a stampa
Livello bibliografico Periodico
Lingua di pubblicazione eng
Altri titoli varianti AUC.
Record Nr. UNISA-996321389203316
Praha, : Universita Karlova
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
Acta Universitatis Carolinae Philologica
Acta Universitatis Carolinae Philologica
Pubbl/distr/stampa Praha, : Universita Karlova
Descrizione fisica 1 online resource
Disciplina 405
Soggetto topico Philology
Klassische Philologie
Zeitschrift
Soggetto genere / forma Aufsatzsammlung
Periodicals.
Monografische Reihe
Aufsatzsammlung
ISSN 2464-6830
Classificazione KA 6209
400
Formato Materiale a stampa
Livello bibliografico Periodico
Lingua di pubblicazione eng
Altri titoli varianti AUC.
Record Nr. UNINA-9910247451503321
Praha, : Universita Karlova
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Advanced Intelligent Pipeline Management Technology / / edited by Huai Su [and three others]
Advanced Intelligent Pipeline Management Technology / / edited by Huai Su [and three others]
Edizione [First edition.]
Pubbl/distr/stampa Singapore : , : Springer, , [2023]
Descrizione fisica 1 online resource (199 pages)
Disciplina 405
Soggetto topico Pipelines
ISBN 981-19-9899-X
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Intro -- Acknowledgments -- Contents -- 1 Overview for Pipeline Scheduling -- 1.1 Pipeline Scheduling Content -- 1.1.1 Gas Pipeline Network -- 1.1.2 Oil Pipeline Network -- 1.2 Research Status -- 1.2.1 Optimization Model of Pipeline Network Scheduling -- 1.2.2 Solution Algorithms -- 1.3 Conclusion -- 1.3.1 General Situation -- 1.3.2 Future Development Directions -- References -- 2 Advanced Modeling and Algorithm for Pipeline Scheduling -- 2.1 Modeling Methods -- 2.1.1 Mathematical Programming -- 2.1.2 Generalized Disjunctive Programming (GDP) -- 2.1.3 Resource Task Network (RTN) -- 2.2 Solution Algorithms -- 2.2.1 Mathematical Programming -- 2.2.2 Heuristic Algorithm -- 2.2.3 Metaheuristic Algorithm -- 2.2.4 Dynamic Programming Algorithm -- 2.2.5 Data-Driven Algorithm -- 2.3 Conclusion -- References -- 3 Demand Side Management in Smart Pipeline Networks -- 3.1 Development of Demand Side Management -- 3.2 Methodology -- 3.2.1 Mathematical Models for Gas Networks -- 3.2.2 Pipeline Network Model -- 3.2.3 Analysis of Customer Demands -- 3.2.4 Operating Center Profit Model -- 3.2.5 Objective Functions -- 3.2.6 Intelligent Algorithm for Gas Pipeline System Management -- 3.2.7 Forecasting Model of Customer Demand -- 3.3 Case Study -- 3.4 Conclusion -- References -- 4 Life Cycle Analysis of Pipeline Networks -- 4.1 Environmental Impacts of Pipelines -- 4.2 Carbon Emission Stages of Pipeline Transport System -- 4.3 Life Cycle Analysis of Oil Pipelines -- 4.3.1 Infrastructure Construction -- 4.3.2 Pipe Operation -- 4.3.3 Fugitive Emissions -- 4.3.4 Recycle and Disposal -- 4.3.5 Impact on Soil Environment -- 4.4 Life Cycle Analysis of Gas Pipelines -- 4.4.1 Compressor Station -- 4.4.2 Maintenance -- 4.4.3 Leakage -- 4.5 Life Cycle Analysis of Pipeline Samples -- 4.5.1 Oil Pipelines -- 4.5.2 Gas Pipelines -- 4.6 Conclusion -- References.
5 Operation Condition Monitoring for Pipeline -- 5.1 Introduction -- 5.2 Methodology -- 5.2.1 Method for Detecting Changes in Operational States -- 5.2.2 Characteristic Representation -- 5.2.3 Operational State Recognition Method -- 5.3 Case Study -- 5.3.1 Operational State Detection -- 5.3.2 Recognition of Pipeline Operational State on Single Station -- 5.4 Conclusion -- References -- 6 Operation Condition Prediction for Pipeline -- 6.1 Introduction -- 6.2 Methodology -- 6.2.1 Autoencoder -- 6.2.2 Stacked Autoencoder -- 6.3 Data Cleaning -- 6.4 Case Study -- 6.5 Conclusion -- References -- 7 Intelligent Inspection for Pipeline System -- 7.1 Inspection of Oil and Gas Pipelines -- 7.2 Mathematical Model for UAV Path Planning -- 7.2.1 Preliminaries -- 7.2.2 Objective Function -- 7.2.3 Constraints -- 7.3 Two-Stage Solution Methodology -- 7.3.1 First-Stage Solution -- 7.3.2 Second-Stage Solution -- 7.4 Case Study -- 7.5 Conclusions -- References -- 8 Probabilistic Safety Analysis in Complex Pipeline Systems -- 8.1 Evaluation of Natural Gas Pipeline Networks for Supply Reliability -- 8.2 Mathematical Model for Reliability Evaluation -- 8.2.1 Evaluating the Likelihood of Unit Failure -- 8.2.2 Creation of a Stochastic Capacity Network Model -- 8.2.3 Establishment of the Methodology for Capacity Analysis -- 8.2.4 Supply Reliability Assessment of Natural Gas Pipeline Network -- 8.3 Case Study -- 8.4 Conclusions -- References -- 9 Risk Prewarning Method for Pipeline Systems -- 9.1 Risk Prewarning of Oil and Gas Pipelines -- 9.2 Methodology -- 9.2.1 Probabilistic Forecasting Model -- 9.2.2 Dynamic Model of IES -- 9.2.3 Modeling of System Functional States -- 9.2.4 Supply Reliability Analysis -- 9.3 Case Study -- 9.3.1 Data Description -- 9.3.2 Description of the IES Model -- 9.3.3 Results and Discussion -- 9.4 Conclusions -- References.
10 Fault Detection and Diagnose Method for Pressurization Devices -- 10.1 Safety of Oil and Gas Pipeline System -- 10.2 Description of the Mathematical Model -- 10.2.1 Modeling the Pipeline System -- 10.2.2 Supply Capacity Calculation -- 10.2.3 Probabilistic Model for Pipeline System -- 10.3 Maintenance Optimization Based on RL -- 10.3.1 Modeling the Maintenance Optimization Problem -- 10.3.2 DRL-Based Maintenance Management Framework -- 10.4 Validation for the Proposed Method -- 10.4.1 Parameters for Pipeline System -- 10.4.2 Results Analysis -- 10.5 Conclusion -- References -- 11 Intelligent Leakage Detection for Pipelines -- 11.1 Pipeline Leakage Detection -- 11.2 Intelligent Algorithm for Pipeline Leakage Detection -- 11.2.1 Description of the Generative Adversarial Networks -- 11.2.2 The Variants GANs -- 11.3 The Proposed GANs Intelligent Framework for Leakage Detection -- 11.4 Pipeline Leakage Experiments -- 11.4.1 Leakage Data Description -- 11.4.2 Evaluation Metrics -- 11.4.3 Pipeline Leakage Cases -- 11.5 Experimental Conclusion of Pipeline Leakage Detection -- References -- 12 Smart Emergency Management of Pipeline System -- 12.1 Emergency Management -- 12.2 Emergency Scheduling -- 12.3 Mathematical Method -- 12.3.1 Mathematical Model -- 12.3.2 Solving Method -- 12.3.3 Robust Optimization -- 12.4 Case Study -- 12.4.1 Basic Data -- 12.4.2 Case 1 -- 12.4.3 Case 2 -- 12.5 Conclusion -- References.
Record Nr. UNINA-9910770277103321
Singapore : , : Springer, , [2023]
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Advanced materials and components for 5G and beyond / / Colin Tong
Advanced materials and components for 5G and beyond / / Colin Tong
Autore Tong Xingcun Colin
Pubbl/distr/stampa Cham, Switzerland : , : Springer, , [2022]
Descrizione fisica 1 online resource (276 pages)
Disciplina 405
Collana Springer Series in Materials Science
Soggetto topico Physics
ISBN 9783031172076
9783031172069
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Intro -- Preface -- Contents -- Abbreviations -- About the Author -- Chapter 1: 5G Technology Components and Material Solutions for Hardware System Integration -- 1.1 Evolution of 5G Technology -- 1.2 5G Technology Components -- 1.2.1 5G Spectrum -- 1.2.2 Massive Multiple-Input Multiple-Output (MIMO) Antennas -- 1.2.3 Network Slicing -- 1.2.4 Dual Connectivity and Long Term Evolution (LTE) Coexistence -- 1.2.5 Support for Cloud Implementation and Edge Computing -- 1.3 Materials Solutions for 5G Hardware System Integration -- 1.3.1 Evolution of the Cellular Base Station and Its Construction Materials -- 1.3.2 Drivers to 5G Hardware System Integration -- 1.3.3 Materials and Electronic Components for 5G Packaging Technology -- 1.3.3.1 Packaging Requirements for 5G Systems -- 1.3.3.2 Dielectric Materials for 5G Module Packages -- 1.3.3.3 Microwave Circuit Design and Materials -- 1.3.3.4 Thermal Conductors and Thermal Management for 5G -- 1.3.3.5 Integration of Passive Components -- 1.3.3.5.1 Discrete Lumped Circuits for sub6 GHz 5G Bands -- 1.3.3.5.2 Distributed Components for mm-Wave -- 1.3.3.6 Antenna Systems in Package -- 1.3.3.7 High-Precision Patterning in Heterogeneous Package Integration for 5G -- 1.3.4 Nanomaterials for Nanoantennas in 5G -- 1.4 Challenges in 5G and Beyond - 6G -- 1.5 Outlook and Future Perspectives -- References -- Chapter 2: Semiconductor Solutions for 5G -- 2.1 Evolution of 5G Semiconductor Technologies -- 2.2 Effect of CMOS Technology Scaling on Millimeter Wave Operations -- 2.3 Distributed and Lumped Design Approaches for Fabricating Passives -- 2.3.1 Distributed Approach -- 2.3.2 Lumped approach -- 2.4 Comparison of Silicon and III-V Semiconductors -- 2.5 Transistor Model Design Challenge in CMOS Technology -- 2.6 GaN and GaN-on-SiC Wide Bandgap Semiconductors for 5G Applications.
2.6.1 Characteristics of GaN Devices Applied in 5G Technology -- 2.6.2 GaN Power Integration for MMIC in 5G Technology -- 2.6.2.1 GaN Power Integration for MMICS -- 2.6.2.2 GaN Base Station PAs -- 2.6.2.3 GaN Frequency Synthesis -- References -- Chapter 3: Design and Performance Enhancement for 5G Antennas -- 3.1 5G Antenna Classification -- 3.1.1 Classification Based on Input and Output Ports -- 3.1.2 Classification Based on Antenna Types -- 3.2 Performance Enhancement Techniques for 5G Antenna Design -- 3.2.1 General Antenna Performance Enhancement Techniques -- 3.2.2 Mutual Coupling Reduction (Decoupling) Techniques -- 3.3 Structural Design and Building Materials of 5G Antennas -- 3.3.1 SISO Wideband Antennas -- 3.3.1.1 Single Element Antenna -- 3.3.1.2 Multielement Antennas -- 3.3.2 SISO Multiband Antenna -- 3.3.3 MIMO Wideband Antennas -- 3.3.3.1 Multielement Without Metal Rim Antennas -- 3.3.3.1.1 Dual Element Antenna Without Metal Rim -- 3.3.3.1.2 Multielement Antenna Without Metal Rim -- 3.3.3.1.3 Multielement Antenna with Metal Rim -- 3.3.4 MIMO Multiband Antennas -- References -- Chapter 4: PCB Materials and Design Requirements for 5G Systems -- 4.1 The Evolution of Printed Circuit Boards -- 4.1.1 History -- 4.1.2 Materials and Fabrication Process -- 4.2 RF and High Frequency PCB Technologies -- 4.2.1 Basic Circuit Configuration of High-Frequency PCBs -- 4.2.2 Transmission Line Parameters Used in RF/High Frequency PCB Design -- 4.3 Designing High-Frequency PCBs -- 4.3.1 Variables Affecting the Performance of High-Frequency PCBs -- 4.3.2 High-Frequency PCB Layout Techniques -- 4.4 Materials Selection of PCBs for Millimeter Wave Applications -- 4.4.1 High-Frequency PCB Material Selection Guidelines -- 4.4.2 PCB Materials Used for High-Frequency Applications -- 4.4.2.1 PCB Substrate Materials -- 4.4.2.2 Conductors for High-Frequency PCBs.
4.5 The Role of Materials in High Frequency PCB Fabrication -- 4.6 Material Issues Related to 5G Applications -- 4.6.1 Mixed Signal Acceptance Circuit Board Designs -- 4.6.2 EMI Shielding Challenges -- 4.6.3 Impedance Control and Signal Loss -- 4.6.4 Thermal Management Challenges -- 4.6.5 Moisture Absorption -- References -- Chapter 5: Materials for High Frequency Filters -- 5.1 The 5G Effect on Filter Technologies -- 5.1.1 Current Status of Mobile Device Filter Technologies -- 5.1.2 The 5G Filter Performance Challenges -- 5.1.2.1 The 5G Frequency Spectrum -- 5.1.2.2 The 5G Filter Requirements -- 5.1.2.3 Physical Design and Emerging Solutions for the 5G Filters -- 5.2 Materials and Design for Acoustic Filters -- 5.2.1 Current Application and Band Allocation of Acoustic Filter Technology -- 5.2.2 Basic Working Principle of the BAW Filter -- 5.2.2.1 Structure of the BAW Resonator -- 5.2.2.2 Key Parameters of the BAW Resonator -- 5.2.2.3 Topology of the BAW Filter -- 5.2.3 Materials for the BAW Resonator -- 5.2.3.1 Piezoelectric Materials -- 5.2.3.2 Electrode Materials -- 5.2.4 Temperature Compensation -- 5.2.5 Frequency Tenability -- 5.2.6 Lithium Niobate and Laterally Excited Bulk-Wave Resonators (XBAR) -- 5.3 Microwave and Millimeter Wave Filters Based on MEMS Technology -- 5.3.1 Micromachined Filters -- 5.3.1.1 Surface Micromachining Superconductor Filters -- 5.3.1.2 Planar Microstrip Filters -- 5.3.1.3 Coplanar Waveguide Filters -- 5.3.1.4 Micromachined Dielectric Waveguide Resonate Filters -- 5.3.2 Micromachined Tunable Filters -- 5.4 Metamaterial and Metasurface Filters for 5G Communications -- References -- Chapter 6: EMI Shielding Materials and Absorbers for 5G Communications -- 6.1 EMI Shielding Design Principle in 5G Systems -- 6.2 Component Package-Level EMI Shielding for 5G Modules -- 6.3 Board Level EMI Shielding for 5G Systems.
6.4 Design and Materials Selection for 5G Absorbers -- 6.5 Advanced Metallic Composite Materials for High-Frequency EMI Shielding -- 6.5.1 Hollow and Porous Metal-Based EMI Shielding Materials -- 6.5.2 Metal-Based EMI Shielding Composites with Frequency-Selective Transmission -- 6.5.3 Particle-Based EMI Shielding Metallic Composites -- 6.5.4 MXene-Based EMI Shielding Composites -- 6.5.5 Metal-Based Flexible EMI Shielding Materials -- 6.6 Emerging Polymer-Based EMI Shielding and Absorber Materials -- References -- Chapter 7: Thermal Management Materials and Components for 5G Devices -- 7.1 Thermal Management Challenges and Strategies in 5G Devices -- 7.1.1 Form Factor-Constrained Thermal Management Solutions -- 7.1.2 5G Mobile Device Level Thermal Management -- 7.1.3 Base Station Level Thermal Management -- 7.1.4 Emerging Thermal Management Challenges and Strategies -- 7.2 Thermal Management Materials and Components for 5G-Enabled Mobile Devices -- 7.2.1 Thermal Management Design and Fundamental Solutions for Smartphones -- 7.2.1.1 Thermal Management Design Guideline -- 7.2.1.2 Fundamental Thermal Management Solutions -- 7.2.1.2.1 Heat Conduction and Spreading -- 7.2.1.2.2 Convective Air Cooling -- 7.2.1.2.3 Convective Liquid Cooling -- 7.2.2 Material Selection for Heat Spreaders and Heat Sinks -- 7.2.3 Flat Plate Heat Pipes and Vapor Chambers for Mobile Electronic Devices -- 7.2.4 Thermal Interface Materials -- 7.2.5 Thermal Insulation Materials -- 7.2.6 Thermal Metamaterials -- 7.3 Thermal Management of 5G Base Station Antenna Arrays -- 7.3.1 Cooling in Traditional AESA's -- 7.3.2 Cooling in Planar AESA's -- 7.3.3 Antenna Array Cooling at Millimeter Waves -- 7.4 Thermal Management of 5G Edge Computing -- References -- Chapter 8: Protective Packaging and Sealing Materials for 5G Mobile Devices.
8.1 Design of 5G Millimeter Wave Compatible Covers for High-End Mobile Devices -- 8.1.1 Dielectric Cover Design -- 8.1.2 Metallic Cover Design with Inserted Dielectric Slots -- 8.1.3 Integration Design Consideration -- 8.2 Thin Film Encapsulation in 5G Electronic Packaging -- 8.3 Adhesives and Sealants for 5G Systems -- References -- Chapter 9: Perspectives on 5G and Beyond Applications and Related Technologies -- 9.1 Applications in Industry Verticals and Their Needs -- 9.1.1 5G in Automotive -- 9.1.2 Big Data Analytics in 5G -- 9.1.3 5G Emergency Communications -- 9.1.4 Future Factories Enabled by 5G Technology -- 9.1.5 Smart Health-Care Network Based on 5G -- 9.1.6 5G Technology for Smart Energy Management and Smart Cities -- 9.1.6.1 5G Technology for Smart Cities -- 9.1.6.2 Applications of 5G Technology in the Construction Industry and Infrastructures -- 9.1.6.3 Smart Building System Integrated with 5G Communication Technology -- 9.2 Perspectives on 6G Wireless Communications -- 9.3 Challenges and Prospects of Core Materials and Components for 5G and Beyond -- 9.3.1 Ultralow-Loss High-Reliability Copper-Clad Laminates -- 9.3.2 5G Metamaterials and Low-Loss High-Performance RF Technology -- 9.3.3 5G Low-Loss Magnetoelectric Functional Materials and Devices -- 9.3.4 Multimodule Integrated Printed Circuit Boards -- 9.3.5 Manufacturing Technology of Photoelectric Integrated Cables -- 9.3.6 Photonics-Assisted Ultrabroadband RF Transceiver Integrated Modules -- 9.3.7 All-Optical Network and Superlarge-Core Fiber Optic Cables -- References -- Index.
Record Nr. UNISA-996499862603316
Tong Xingcun Colin  
Cham, Switzerland : , : Springer, , [2022]
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
Advanced materials and components for 5G and beyond / / Colin Tong
Advanced materials and components for 5G and beyond / / Colin Tong
Autore Tong Xingcun Colin
Pubbl/distr/stampa Cham, Switzerland : , : Springer, , [2022]
Descrizione fisica 1 online resource (276 pages)
Disciplina 405
Collana Springer Series in Materials Science
Soggetto topico Physics
ISBN 9783031172076
9783031172069
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Intro -- Preface -- Contents -- Abbreviations -- About the Author -- Chapter 1: 5G Technology Components and Material Solutions for Hardware System Integration -- 1.1 Evolution of 5G Technology -- 1.2 5G Technology Components -- 1.2.1 5G Spectrum -- 1.2.2 Massive Multiple-Input Multiple-Output (MIMO) Antennas -- 1.2.3 Network Slicing -- 1.2.4 Dual Connectivity and Long Term Evolution (LTE) Coexistence -- 1.2.5 Support for Cloud Implementation and Edge Computing -- 1.3 Materials Solutions for 5G Hardware System Integration -- 1.3.1 Evolution of the Cellular Base Station and Its Construction Materials -- 1.3.2 Drivers to 5G Hardware System Integration -- 1.3.3 Materials and Electronic Components for 5G Packaging Technology -- 1.3.3.1 Packaging Requirements for 5G Systems -- 1.3.3.2 Dielectric Materials for 5G Module Packages -- 1.3.3.3 Microwave Circuit Design and Materials -- 1.3.3.4 Thermal Conductors and Thermal Management for 5G -- 1.3.3.5 Integration of Passive Components -- 1.3.3.5.1 Discrete Lumped Circuits for sub6 GHz 5G Bands -- 1.3.3.5.2 Distributed Components for mm-Wave -- 1.3.3.6 Antenna Systems in Package -- 1.3.3.7 High-Precision Patterning in Heterogeneous Package Integration for 5G -- 1.3.4 Nanomaterials for Nanoantennas in 5G -- 1.4 Challenges in 5G and Beyond - 6G -- 1.5 Outlook and Future Perspectives -- References -- Chapter 2: Semiconductor Solutions for 5G -- 2.1 Evolution of 5G Semiconductor Technologies -- 2.2 Effect of CMOS Technology Scaling on Millimeter Wave Operations -- 2.3 Distributed and Lumped Design Approaches for Fabricating Passives -- 2.3.1 Distributed Approach -- 2.3.2 Lumped approach -- 2.4 Comparison of Silicon and III-V Semiconductors -- 2.5 Transistor Model Design Challenge in CMOS Technology -- 2.6 GaN and GaN-on-SiC Wide Bandgap Semiconductors for 5G Applications.
2.6.1 Characteristics of GaN Devices Applied in 5G Technology -- 2.6.2 GaN Power Integration for MMIC in 5G Technology -- 2.6.2.1 GaN Power Integration for MMICS -- 2.6.2.2 GaN Base Station PAs -- 2.6.2.3 GaN Frequency Synthesis -- References -- Chapter 3: Design and Performance Enhancement for 5G Antennas -- 3.1 5G Antenna Classification -- 3.1.1 Classification Based on Input and Output Ports -- 3.1.2 Classification Based on Antenna Types -- 3.2 Performance Enhancement Techniques for 5G Antenna Design -- 3.2.1 General Antenna Performance Enhancement Techniques -- 3.2.2 Mutual Coupling Reduction (Decoupling) Techniques -- 3.3 Structural Design and Building Materials of 5G Antennas -- 3.3.1 SISO Wideband Antennas -- 3.3.1.1 Single Element Antenna -- 3.3.1.2 Multielement Antennas -- 3.3.2 SISO Multiband Antenna -- 3.3.3 MIMO Wideband Antennas -- 3.3.3.1 Multielement Without Metal Rim Antennas -- 3.3.3.1.1 Dual Element Antenna Without Metal Rim -- 3.3.3.1.2 Multielement Antenna Without Metal Rim -- 3.3.3.1.3 Multielement Antenna with Metal Rim -- 3.3.4 MIMO Multiband Antennas -- References -- Chapter 4: PCB Materials and Design Requirements for 5G Systems -- 4.1 The Evolution of Printed Circuit Boards -- 4.1.1 History -- 4.1.2 Materials and Fabrication Process -- 4.2 RF and High Frequency PCB Technologies -- 4.2.1 Basic Circuit Configuration of High-Frequency PCBs -- 4.2.2 Transmission Line Parameters Used in RF/High Frequency PCB Design -- 4.3 Designing High-Frequency PCBs -- 4.3.1 Variables Affecting the Performance of High-Frequency PCBs -- 4.3.2 High-Frequency PCB Layout Techniques -- 4.4 Materials Selection of PCBs for Millimeter Wave Applications -- 4.4.1 High-Frequency PCB Material Selection Guidelines -- 4.4.2 PCB Materials Used for High-Frequency Applications -- 4.4.2.1 PCB Substrate Materials -- 4.4.2.2 Conductors for High-Frequency PCBs.
4.5 The Role of Materials in High Frequency PCB Fabrication -- 4.6 Material Issues Related to 5G Applications -- 4.6.1 Mixed Signal Acceptance Circuit Board Designs -- 4.6.2 EMI Shielding Challenges -- 4.6.3 Impedance Control and Signal Loss -- 4.6.4 Thermal Management Challenges -- 4.6.5 Moisture Absorption -- References -- Chapter 5: Materials for High Frequency Filters -- 5.1 The 5G Effect on Filter Technologies -- 5.1.1 Current Status of Mobile Device Filter Technologies -- 5.1.2 The 5G Filter Performance Challenges -- 5.1.2.1 The 5G Frequency Spectrum -- 5.1.2.2 The 5G Filter Requirements -- 5.1.2.3 Physical Design and Emerging Solutions for the 5G Filters -- 5.2 Materials and Design for Acoustic Filters -- 5.2.1 Current Application and Band Allocation of Acoustic Filter Technology -- 5.2.2 Basic Working Principle of the BAW Filter -- 5.2.2.1 Structure of the BAW Resonator -- 5.2.2.2 Key Parameters of the BAW Resonator -- 5.2.2.3 Topology of the BAW Filter -- 5.2.3 Materials for the BAW Resonator -- 5.2.3.1 Piezoelectric Materials -- 5.2.3.2 Electrode Materials -- 5.2.4 Temperature Compensation -- 5.2.5 Frequency Tenability -- 5.2.6 Lithium Niobate and Laterally Excited Bulk-Wave Resonators (XBAR) -- 5.3 Microwave and Millimeter Wave Filters Based on MEMS Technology -- 5.3.1 Micromachined Filters -- 5.3.1.1 Surface Micromachining Superconductor Filters -- 5.3.1.2 Planar Microstrip Filters -- 5.3.1.3 Coplanar Waveguide Filters -- 5.3.1.4 Micromachined Dielectric Waveguide Resonate Filters -- 5.3.2 Micromachined Tunable Filters -- 5.4 Metamaterial and Metasurface Filters for 5G Communications -- References -- Chapter 6: EMI Shielding Materials and Absorbers for 5G Communications -- 6.1 EMI Shielding Design Principle in 5G Systems -- 6.2 Component Package-Level EMI Shielding for 5G Modules -- 6.3 Board Level EMI Shielding for 5G Systems.
6.4 Design and Materials Selection for 5G Absorbers -- 6.5 Advanced Metallic Composite Materials for High-Frequency EMI Shielding -- 6.5.1 Hollow and Porous Metal-Based EMI Shielding Materials -- 6.5.2 Metal-Based EMI Shielding Composites with Frequency-Selective Transmission -- 6.5.3 Particle-Based EMI Shielding Metallic Composites -- 6.5.4 MXene-Based EMI Shielding Composites -- 6.5.5 Metal-Based Flexible EMI Shielding Materials -- 6.6 Emerging Polymer-Based EMI Shielding and Absorber Materials -- References -- Chapter 7: Thermal Management Materials and Components for 5G Devices -- 7.1 Thermal Management Challenges and Strategies in 5G Devices -- 7.1.1 Form Factor-Constrained Thermal Management Solutions -- 7.1.2 5G Mobile Device Level Thermal Management -- 7.1.3 Base Station Level Thermal Management -- 7.1.4 Emerging Thermal Management Challenges and Strategies -- 7.2 Thermal Management Materials and Components for 5G-Enabled Mobile Devices -- 7.2.1 Thermal Management Design and Fundamental Solutions for Smartphones -- 7.2.1.1 Thermal Management Design Guideline -- 7.2.1.2 Fundamental Thermal Management Solutions -- 7.2.1.2.1 Heat Conduction and Spreading -- 7.2.1.2.2 Convective Air Cooling -- 7.2.1.2.3 Convective Liquid Cooling -- 7.2.2 Material Selection for Heat Spreaders and Heat Sinks -- 7.2.3 Flat Plate Heat Pipes and Vapor Chambers for Mobile Electronic Devices -- 7.2.4 Thermal Interface Materials -- 7.2.5 Thermal Insulation Materials -- 7.2.6 Thermal Metamaterials -- 7.3 Thermal Management of 5G Base Station Antenna Arrays -- 7.3.1 Cooling in Traditional AESA's -- 7.3.2 Cooling in Planar AESA's -- 7.3.3 Antenna Array Cooling at Millimeter Waves -- 7.4 Thermal Management of 5G Edge Computing -- References -- Chapter 8: Protective Packaging and Sealing Materials for 5G Mobile Devices.
8.1 Design of 5G Millimeter Wave Compatible Covers for High-End Mobile Devices -- 8.1.1 Dielectric Cover Design -- 8.1.2 Metallic Cover Design with Inserted Dielectric Slots -- 8.1.3 Integration Design Consideration -- 8.2 Thin Film Encapsulation in 5G Electronic Packaging -- 8.3 Adhesives and Sealants for 5G Systems -- References -- Chapter 9: Perspectives on 5G and Beyond Applications and Related Technologies -- 9.1 Applications in Industry Verticals and Their Needs -- 9.1.1 5G in Automotive -- 9.1.2 Big Data Analytics in 5G -- 9.1.3 5G Emergency Communications -- 9.1.4 Future Factories Enabled by 5G Technology -- 9.1.5 Smart Health-Care Network Based on 5G -- 9.1.6 5G Technology for Smart Energy Management and Smart Cities -- 9.1.6.1 5G Technology for Smart Cities -- 9.1.6.2 Applications of 5G Technology in the Construction Industry and Infrastructures -- 9.1.6.3 Smart Building System Integrated with 5G Communication Technology -- 9.2 Perspectives on 6G Wireless Communications -- 9.3 Challenges and Prospects of Core Materials and Components for 5G and Beyond -- 9.3.1 Ultralow-Loss High-Reliability Copper-Clad Laminates -- 9.3.2 5G Metamaterials and Low-Loss High-Performance RF Technology -- 9.3.3 5G Low-Loss Magnetoelectric Functional Materials and Devices -- 9.3.4 Multimodule Integrated Printed Circuit Boards -- 9.3.5 Manufacturing Technology of Photoelectric Integrated Cables -- 9.3.6 Photonics-Assisted Ultrabroadband RF Transceiver Integrated Modules -- 9.3.7 All-Optical Network and Superlarge-Core Fiber Optic Cables -- References -- Index.
Record Nr. UNINA-9910631092503321
Tong Xingcun Colin  
Cham, Switzerland : , : Springer, , [2022]
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Alain Locke on the theoretical foundations for a just and successful peace / / Corey L. Barnes
Alain Locke on the theoretical foundations for a just and successful peace / / Corey L. Barnes
Autore Barnes Corey L.
Pubbl/distr/stampa Cham, Switzerland : , : Palgrave Macmillan, , [2023]
Descrizione fisica 1 online resource (285 pages)
Disciplina 405
Collana African American Philosophy and the African Diaspora
Soggetto topico Philosophy
ISBN 9783031150043
9783031150036
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Intro -- Acknowledgments -- Contents -- Chapter 1: Introduction -- Locke and Me -- Locke and Cosmopolitanism -- On Method -- Chapter Overview -- Chapter 2: One Cosmopolitan World, or None -- Introduction -- Thick/Thin Moral, Political, Economic, and Cultural Cosmopolitanisms -- Locke's Thick Moral Cosmopolitanism -- Locke's Thin Political Cosmopolitanism -- Locke's Thin Economic Cosmopolitanism -- Locke's Thick Cultural Cosmopolitanism -- Conclusion -- Chapter 3: A Theory of True Democracy -- Introduction -- Concepts, Conceptions, and Democracy -- On Political Democracy -- On the Value of Political Democracy -- Conclusion -- Chapter 4: Impediments to True Democracy and a Cosmopolitan World -- Introduction -- On the Origins of Race -- François Bernier, Race, and Liberal and Aesthetic Racism -- Immanuel Kant, Scientific Race, and Scientific Racism -- Johann Blumenbach, Racial Degeneration, and Racist Value -- Arthur de Gobineau, Racial Degeneration, and the Divine Superiority of Whites -- Conclusion -- Chapter 5: A Theory of Race for Democracy and Cosmopolitanism -- Introduction -- On the Significance of and Appropriate Starting Point for Understanding Race -- Locke's Critique of Anthropological Theories of Race -- Locke's Sociocultural Theory of Race -- Locke on Racism -- Conclusion -- Chapter 6: A Theory of Value for Democracy and Cosmopolitanism -- Introduction -- On the Appropriate Starting-Points for Value Theory -- Locke's Critique of Value-Objectivity and Value-Subjectivity -- Locke's Value-Pluralist Theory of Value -- Locke's Value Theory, Democracy, and Cosmopolitanism -- Conclusion -- Chapter 7: Conclusion -- Index.
Record Nr. UNINA-9910624305603321
Barnes Corey L.  
Cham, Switzerland : , : Palgrave Macmillan, , [2023]
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American journal of philology
American journal of philology
Pubbl/distr/stampa Baltimore, Md., : Johns Hopkins University Press, ©1996-
Disciplina 405
Soggetto topico Philology
Classical philology
Philologie
Philologie ancienne
Littérature classique
Philosophie
Civilisation ancienne
Soggetto genere / forma Periodical
periodicals.
Periodicals.
Périodique électronique (Descripteur de forme)
Ressource Internet (Descripteur de forme)
Périodiques.
ISSN 1086-3168
Formato Materiale a stampa
Livello bibliografico Periodico
Lingua di pubblicazione eng
Altri titoli varianti AJP
Record Nr. UNISA-996203749903316
Baltimore, Md., : Johns Hopkins University Press, ©1996-
Materiale a stampa
Lo trovi qui: Univ. di Salerno
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American journal of philology
American journal of philology
Pubbl/distr/stampa Baltimore, Md., : Johns Hopkins University Press, ©1996-
Disciplina 405
Soggetto topico Philology
Classical philology
Philologie
Philologie ancienne
Littérature classique
Philosophie
Civilisation ancienne
Soggetto genere / forma Periodical
periodicals.
Periodicals.
Périodique électronique (Descripteur de forme)
Ressource Internet (Descripteur de forme)
Périodiques.
ISSN 1086-3168
Formato Materiale a stampa
Livello bibliografico Periodico
Lingua di pubblicazione eng
Altri titoli varianti AJP
Record Nr. UNINA-9910131928003321
Baltimore, Md., : Johns Hopkins University Press, ©1996-
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Archiv fur das Studium der neueren Sprachen und Literaturen
Archiv fur das Studium der neueren Sprachen und Literaturen
Disciplina 405
ISSN 0003-8970
Formato Materiale a stampa
Livello bibliografico Periodico
Lingua di pubblicazione ger
Note periodicità Bimestrale. Semestrale dal 1972
Record Nr. UNISA-990000819670203316
Materiale a stampa
Lo trovi qui: Univ. di Salerno
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The Archives of Critical Theory / / edited by Isabelle Aubert and Marcos Nobre
The Archives of Critical Theory / / edited by Isabelle Aubert and Marcos Nobre
Edizione [First edition.]
Pubbl/distr/stampa Cham, Switzerland : , : Springer, , [2023]
Descrizione fisica 1 online resource (278 pages)
Disciplina 405
Soggetto topico Philosophy
ISBN 3-031-36585-2
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Intro -- Preface -- Acknowledgments -- Contents -- List of Figures -- Part I: Introduction -- Researching the Archives of Critical Theory -- References -- Part II: Marx and Engels Archive -- Publishing Marx-Engels-Nachlass: Archive, Editions, and Theoretical Implications -- 1 Introduction -- 2 The Marx-Engels-Nachlass -- 2.1 "The German Ideology" and Researching the Nachlass: A Brief Account -- 2.2 Reading Marx Today: The Nachlass and a Scientific Revolution -- 2.3 Conclusion -- References -- Part III: Walter Benjamin Archive -- Into the Walter Benjamin Archive: An Interview with Ursula Marx -- 1 Introduction -- 2 Interview with Ursula Marx -- References -- Benjamin Anarchivist -- I -- II -- III -- IV -- V -- References -- Part IV: The Institute for Social Research Archive -- The Attitude of the German People: The Institute of Social Research Archive as Contemporary History -- 1 History of the Archive -- 2 Tasks of the Archive -- 2.1 Collection -- 2.2 Preservation -- 2.3 Usability -- 2.4 Research out of the Archive -- 3 Examples of the Archive Material -- 3.1 Group Experiment -- 3.2 The Contest on the German People and Antisemitism -- 4 What of It? -- References -- The Role of Empirical Research in Theodor W. Adorno's Thought: A Personal Experience at the Archive of the Institute for Social Research -- 1 The Research on Democracy and Education at the Institute for Social Research -- 1.1 Research on Democracy in West Germany -- 1.2 Education and Democracy Among the Students -- 2 Education, Democracy, and Resistance in Theodor Adorno's Thought -- References -- Part V: Max Horkheimer Archive -- Working on Cultural Memory: The Literary Estate of Max Horkheimer in the Frankfurt University Library -- References -- The Material Part of Theory: The IfS Exile in Geneva and the Correspondence between Max Horkheimer and Juliette Favez.
1 The First Exile of the IfS -- 1.1 The Political Context of an Exile -- 1.2 Social Research and Social Philosophy -- 2 The Correspondence Between Max Horkheimer and Juliette Favez -- 2.1 The Content of the Exchanges -- 2.2 The Juliette Favez Enigma -- 2.3 Elements of a Correspondence -- 2.4 Mail Management -- 2.5 The Materiality of Thinking -- 3 The Archive of Reconstruction -- References -- Not Just Director, Methodologist, or Partner: A Brief History of the Reception of Horkheimer's Work -- 1 The Director, the Methodologist, the Partner: The Reception of Horkheimer's Work During the 1970s and the 1980s -- 2 After the Collected Writings and the Max Horkheimer Archive Research: Horkheimer as the Philosopher -- References -- Part VI: Theodor W. Adorno Archive -- Adorno and the Archiving of the Ephemeral: Remarks on His Literary Estate -- References -- Adorno and the Post-war Artistic Debates: A Perspective Through the Archives -- 1 Introduction -- 2 The Darmstadt Music Debates and the Origins of Adorno's Conception of a Musique Informelle -- 3 Modern Art and Its Developments: The Verfransung of the Arts -- 4 Conclusion -- References -- T.W. Adorno, H. Becker, and the Challenges of Education in an "Administered World" (1955-1969): Unpublished Radio Conversations from the Theodor W. Adorno Archive -- 1 Introduction: Adorno's Writings on Pedagogy -- 1.1 Education as Social Critique in Adorno -- 2 How It All Started: Educating Adults - A Challenge in "Administered" Post-War Germany -- 3 1961: Halbbildung - What Is That Exactly? -- 4 1966 - "Ideologie der Unbildung": Adorno's Anti-conservative Theory of Bildung -- 5 1968 - Education and "Evaluation": A Missing Piece in Adorno's Theory of Bildung -- 6 Conclusion -- References -- Part VII: Friedrich Pollock Archive -- Symbiosis and Dispersion: The Friedrich Pollock Papers.
1 The Pollock Papers in Frankfurt -- 2 The Fondo Pollock in Florence -- 3 Other Archives -- 4 Material Conditions -- 5 Legal Issues of the Estate -- 6 Further Research -- 6.1 Transcription of the Postcard -- References -- Part VIII: Herbert Marcuse and Leo Löwenthal Archive -- Leo Löwenthal and Herbert Marcuse: Analysis of the Enemy and Volumes from the Marcuse Archive -- 1 Marcuse's Thematic Emphases in the Volumes of His Estate -- 2 You Must Know Your Enemy: Lying Prophets and Enemy Analysis -- 3 Die Lügenpropheten: Prophets of Deceit -- 4 Enemy Analysis -- 5 Individual and Terror -- References -- Archive Beyond Files: A Brief Note on a Personal Experience in the Marcuse Archive -- 1 Interview with Peter-Erwin Jansen -- References -- Part IX: Between Archives -- Critical Theory and Primary Source Research: Subjective Reflections on Working in the Herbert Marcuse and Max Horkheimer Archives -- 1 Introduction -- 2 The Marcuse Archive -- 2.1 Searching for Traces of Marcuse's Early Encounter with Heidegger -- 2.2 Archival Discoveries from Marcuse's Later Life -- 3 The Horkheimer Archive -- 3.1 Back and Forth Between Frankfurt and Berkeley in the 1990s -- 4 Discoveries in the Horkheimer Archive -- 4.1 Horkheimer Before, During, and After World War I -- 4.2 Horkheimer's Studies in Frankfurt, 1919-1925 -- 4.3 Horkheimer as Lecturer in Frankfurt, 1925-1931 -- 5 Conclusion -- References -- Part X: Jürgen Habermas Archive -- The Habermas Papers: An Interview with Roman Yos -- References -- Two Letters Between Jürgen Habermas and Karl-Otto Apel, Dated 1965: Comments on the Exchange -- 1 Introduction -- 2 Comment on the Letter from Jürgen Habermas to Karl-Otto Apel (March 25, 1965) -- 3 Comment on Karl-Otto Apel's Response to Jürgen Habermas -- References -- Letter from Jürgen Habermas to Herbert Marcuse, July 10, 1978: Translation of the Letter and Comment.
1 Introduction -- 2 Translation of Jürgen Habermas's Letter to Herbert Marcuse -- 3 Comment on the Letter from Jürgen Habermas to Herbert Marcuse (July 10, 1978) -- References -- Appendix: Practical Information on the Archives -- Marx-Engels Archives -- Walter Benjamin Archiv (WBA) and Theodor W. Adorno Archiv (TWAA) -- Archiv des Instituts für Sozialforschung -- Max Horkheimer Archiv (MHA) -- Friedrich Pollock Papers -- Herbert Marcuse Archiv (HMA) / Leo Löwenthal Archiv (LLA) -- Habermas's Bequest (Na 60) -- Index.
Record Nr. UNINA-9910746957103321
Cham, Switzerland : , : Springer, , [2023]
Materiale a stampa
Lo trovi qui: Univ. Federico II
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