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Innovating in a Learning Community : Emergence of an Open Information Infrastructure in China's Pharmaceutical Distribution Industry / / by Kai Reimers, Xunhua Guo, Mingzhi Li, Bin Xie, Tiantian Zhang
| Innovating in a Learning Community : Emergence of an Open Information Infrastructure in China's Pharmaceutical Distribution Industry / / by Kai Reimers, Xunhua Guo, Mingzhi Li, Bin Xie, Tiantian Zhang |
| Autore | Reimers Kai |
| Edizione | [1st ed. 2014.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2014 |
| Descrizione fisica | 1 online resource (67 p.) |
| Disciplina | 615.10684 |
| Collana | SpringerBriefs in Digital Spaces |
| Soggetto topico |
Information technology
Business—Data processing Medical economics Pharmacy Medical informatics Production management Management Industrial management IT in Business Health Economics Health Informatics Operations Management Innovation/Technology Management |
| ISBN | 3-319-05098-2 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction -- A Simple Theoretical Framework -- Method -- Historical Context and Precedents -- Summary of Data Analysis -- Findings -- Theoretical Implications -- Extensions -- Answering the Research Question -- Managerial Implications -- Limitations -- Appendix I: Data Synthesis -- Appendix II: Development of Electronic Patient Records and Drug Tracking Technologies in China. |
| Record Nr. | UNINA-9910298553703321 |
Reimers Kai
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| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2014 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Thermal Management for Opto-Electronics Packaging and Applications
| Thermal Management for Opto-Electronics Packaging and Applications |
| Autore | Luo Xiaobing |
| Edizione | [1st ed.] |
| Pubbl/distr/stampa | Newark : , : John Wiley & Sons, Incorporated, , 2024 |
| Descrizione fisica | 1 online resource (370 pages) |
| Altri autori (Persone) |
HuRun
XieBin |
| Soggetto topico |
Electronic packaging
Heat engineering |
| ISBN |
9781119179283
1119179289 9781119179290 1119179297 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Cover -- Title Page -- Copyright Page -- Contents -- List of Nomenclatures -- About the Authors -- Preface -- Chapter 1 Introduction -- 1.1 Development History of Packaging -- 1.1.1 BGA -- 1.1.2 CSP -- 1.1.3 MCM -- 1.1.4 3D Packaging -- 1.2 Heat Generation in Opto-electronic Package -- 1.2.1 Heat Generation Due to Nonradiative Recombination -- 1.2.2 Heat Generation Due to Shockley–Read–Hall (SRH) Recombination -- 1.2.3 Heat Generation Due to Auger Recombination -- 1.2.4 Heat Generation Due to Surface Recombination -- 1.2.5 Heat Generation Due to Current Crowding and Overflow -- 1.2.6 Heat Generation Due to Light Absorption -- 1.3 Thermal Issues and Challenges -- 1.3.1 Thermal Management -- 1.3.2 Mechanical/Electrical Reliability -- 1.4 Organization Arrangement -- References -- Chapter 2 Thermal Conduction and Solutions -- 2.1 Concept of Thermal Conduction -- 2.2 Thermal Resistance -- 2.2.1 Basic Concept of Thermal Resistance -- 2.2.2 Thermal Contact Resistance |
| Record Nr. | UNINA-9911019458603321 |
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Luo Xiaobing
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| Newark : , : John Wiley & Sons, Incorporated, , 2024 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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