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Robust design of microelectronics assemblies against mechanical shock, temperature and moisture / / E-H Wong, Y.-W Mai
| Robust design of microelectronics assemblies against mechanical shock, temperature and moisture / / E-H Wong, Y.-W Mai |
| Autore | Wong E- H. |
| Pubbl/distr/stampa | Boston, MA : , : Elsevier, , [2015] |
| Descrizione fisica | 1 online resource (477 p.) |
| Disciplina | 621.381046 |
| Collana | Woodhead Publishing series in electronic and optical materials |
| Soggetto topico |
Microelectronics - Design
Industrial design Robust control |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Front Cover; Related titles; Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and MoistureWoodhead Publishing Series i ...; Copyright; Contents; Woodhead Publishing Series in Electronic and Optical Materials; Foreword; Preface; 1 - Introduction; 1.1 Introduction to microelectronic packaging; 1.2 Introduction to robust design; 1.3 Organisation of the book; References; Part 1 - Advances in robust design against temperature-induced failures; 2 - Robust design of microelectronic assemblies against mismatched thermal expansion; 2.1 Introduction; 2.2 Fundamentals
2.3 Comprehensive analysis of a bilayer structure2.4 Microelectronic assembly as a sandwich structure with a continuous bonding layer; 2.5 PCB assembly as a sandwich structure with a layer of solder joints; References; 2. Appendix: prior published works in thermoelasticity; 2. Nomenclature; 2. Mathematical symbols; 3 - Advances in creep-fatigue modelling of solder joints; 3.1 Introduction; 3.2 Life-prediction models for creep-fatigue; 3.3 The unified equation; 3.4 Self-validations and benchmarking; 3.5 Applications; References Part 2 - Advances in robust design against moisture-induced failures4 - Moisture properties and their characterisations; 4.1 Introduction; 4.2 Thermodynamics of water; 4.3 Sorption and its characterisation; 4.4 Diffusivity and its characterisation; 4.5 Hygroscopic swelling and its characterisation; References; 5 - Advances in diffusion and vapour pressure modelling; 5.1 The discontinuity of concentration; 5.2 The fractional saturation; 5.3 Diffusion under time-varying temperature and pressure; 5.4 Advances in vapour pressure modelling; References; Part 3 - Robust design against drop impact 6 - The physics of failure of portable electronic devices in drop impact6.1 Product drop testing; 6.2 The physics of failure; References; 7 - Subsystem testing of solder joints against drop impact; 7.1 Board-level testing; 7.2 Component-level testing; References; 8 - Fatigue resistance of solder joints: strain-life representation; 8.1 Introduction; 8.2 Design of test specimens; 8.3 Fatigue resistance equations: materials; 8.4 Fatigue resistance equations: frequency; 8.5 Fatigue resistance equations: environment; References; 9 - Fatigue crack growth in solder joints at high strain rate 9.1 Introduction9.2 Establishment of continuous crack growth tracking capability; 9.3 Crack propagation characteristics: board-level drop shock test; 9.4 Crack propagation characteristics: high-speed cyclic bending test; 9.5 Three-dimensional fracture mechanics modelling of the crack front; 9.6 Crack propagation in the solder joints of a mobile phone experiencing drop impact; References; 10 - Dynamic deformation of a printed circuit board in drop-shock; 10.1 Introduction; 10.2 Vibration of a test board in the JESD22-B111 drop-shock test 10.3 Analytical solutions for a spring-mass system subjected to half-sine shock |
| Record Nr. | UNINA-9910788103703321 |
Wong E- H.
|
||
| Boston, MA : , : Elsevier, , [2015] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Robust design of microelectronics assemblies against mechanical shock, temperature and moisture / / E-H Wong, Y.-W Mai
| Robust design of microelectronics assemblies against mechanical shock, temperature and moisture / / E-H Wong, Y.-W Mai |
| Autore | Wong E- H. |
| Pubbl/distr/stampa | Boston, MA : , : Elsevier, , [2015] |
| Descrizione fisica | 1 online resource (477 p.) |
| Disciplina | 621.381046 |
| Collana | Woodhead Publishing series in electronic and optical materials |
| Soggetto topico |
Microelectronics - Design
Industrial design Robust control |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Front Cover; Related titles; Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and MoistureWoodhead Publishing Series i ...; Copyright; Contents; Woodhead Publishing Series in Electronic and Optical Materials; Foreword; Preface; 1 - Introduction; 1.1 Introduction to microelectronic packaging; 1.2 Introduction to robust design; 1.3 Organisation of the book; References; Part 1 - Advances in robust design against temperature-induced failures; 2 - Robust design of microelectronic assemblies against mismatched thermal expansion; 2.1 Introduction; 2.2 Fundamentals
2.3 Comprehensive analysis of a bilayer structure2.4 Microelectronic assembly as a sandwich structure with a continuous bonding layer; 2.5 PCB assembly as a sandwich structure with a layer of solder joints; References; 2. Appendix: prior published works in thermoelasticity; 2. Nomenclature; 2. Mathematical symbols; 3 - Advances in creep-fatigue modelling of solder joints; 3.1 Introduction; 3.2 Life-prediction models for creep-fatigue; 3.3 The unified equation; 3.4 Self-validations and benchmarking; 3.5 Applications; References Part 2 - Advances in robust design against moisture-induced failures4 - Moisture properties and their characterisations; 4.1 Introduction; 4.2 Thermodynamics of water; 4.3 Sorption and its characterisation; 4.4 Diffusivity and its characterisation; 4.5 Hygroscopic swelling and its characterisation; References; 5 - Advances in diffusion and vapour pressure modelling; 5.1 The discontinuity of concentration; 5.2 The fractional saturation; 5.3 Diffusion under time-varying temperature and pressure; 5.4 Advances in vapour pressure modelling; References; Part 3 - Robust design against drop impact 6 - The physics of failure of portable electronic devices in drop impact6.1 Product drop testing; 6.2 The physics of failure; References; 7 - Subsystem testing of solder joints against drop impact; 7.1 Board-level testing; 7.2 Component-level testing; References; 8 - Fatigue resistance of solder joints: strain-life representation; 8.1 Introduction; 8.2 Design of test specimens; 8.3 Fatigue resistance equations: materials; 8.4 Fatigue resistance equations: frequency; 8.5 Fatigue resistance equations: environment; References; 9 - Fatigue crack growth in solder joints at high strain rate 9.1 Introduction9.2 Establishment of continuous crack growth tracking capability; 9.3 Crack propagation characteristics: board-level drop shock test; 9.4 Crack propagation characteristics: high-speed cyclic bending test; 9.5 Three-dimensional fracture mechanics modelling of the crack front; 9.6 Crack propagation in the solder joints of a mobile phone experiencing drop impact; References; 10 - Dynamic deformation of a printed circuit board in drop-shock; 10.1 Introduction; 10.2 Vibration of a test board in the JESD22-B111 drop-shock test 10.3 Analytical solutions for a spring-mass system subjected to half-sine shock |
| Record Nr. | UNINA-9910824188203321 |
|
Wong E- H.
|
||
| Boston, MA : , : Elsevier, , [2015] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||