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Understanding fabless IC technology [[electronic resource] /] / Jeorge S. Hurtarte, Evert A. Wolsheimer, Lisa M. Tafoya
Understanding fabless IC technology [[electronic resource] /] / Jeorge S. Hurtarte, Evert A. Wolsheimer, Lisa M. Tafoya
Autore Hurtarte Jeorge S
Edizione [1st edition]
Pubbl/distr/stampa Amsterdam ; ; Boston, : Elsevier/Newnes, c2007
Descrizione fisica 1 online resource (294 p.)
Disciplina 621.3815
Altri autori (Persone) WolsheimerEvert A
TafoyaLisa M
Collana Communications engineering series
Soggetto topico Integrated circuits - Design and construction
Integrated circuits industry
Soggetto genere / forma Electronic books.
ISBN 1-281-03653-6
9786611036539
0-08-055119-X
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Front Cover; Understanding Fabless IC Technology; Copyright Page; Contents; Acknowledgements; Preface; PART 1 - Manufacturing Strategies: Understanding Fabless IC Technology; Chapter 1: More than a Decade of Transition in the Semiconductor Industry; 1.1 FSA is Established; 1.2 Early Success; 1.3 Early Success Trend Continues; 1.4 Semiconductor Business Models; 1.5 Outsourcing Will Accelerate; 1.6 IDMs are Going Fabless; 1.7 A Case Study: Cypress Semiconductor; 1.8 More IDMs are Outsourcing; 1.9 Geographic Manufacturing Centers; Chapter 2: Fabless Semiconductor Manufacturing
2.1 Foundry Revenue Growth2.2 Semiconductor Back-End Services; 2.3 Semiconductor Equipment; Chapter 3: Qualities of Successful Fabless Companies; 3.1 Defining Events for the Fabless Market; 3.2 Thriving in the Fabless Model; 3.3 Key Qualities for Success; 3.4 The Future of Fabless; PART 2 - An In-Depth Understanding of the Fabless Semiconductor Business Model; Chapter 4: Semiconductor Manufacturing Basics; 4.1 Semiconductor Processes; 4.2 Semiconductor Manufacturing Steps; 4.3 Wafer Size; 4.4 Manufacturing Costs; 4.5 Conclusion; Chapter 5: Fabless ASICs; 5.1 Introduction
5.2 Origins of the ASIC Industry5.3 Emergence of the Fabless ASIC Business Model; 5.4 The Fabless ASIC Model: How It Works; 5.5 The Services and Capabilities of a Fabless ASIC Supplier; 5.6 Conclusion; Chapter 6: Electronic Design Automation; 6.1 Fabless EDA Overview; 6.2 Fabless EDA Selection Process; 6.3 Physical Design EDA; Chapter 7: Intellectual Property; 7.1 SIP Industry Overview; 7.2 SIP Business Environment; 7.3 Sourcing SIP Products; 7.4 Baseline Terminology; 7.5 Finding SIP and Related Products; 7.6 Evaluating SIP Business Models; 7.7 SIP Product Enablers
7.8 Examples by SIP Product Type7.9 Licensing SIP Products; 7.10 Provider and Buyer Perspectives; 7.11 The Evolution of the IP Industry; 7.12 Intellectual Property Considerations; 7.13 IP Outsourcing; 7.14 Making IP Work in the Fabless Semiconductor Community; 7.15 IP Acquisition Considerations for Fabless IC Companies; Chapter 8: e-Commerce; 8.1 The Virtual Fab Challenge; 8.2 Semiconductor & Fabless Manufacturing: What is Different?; 8.3 ""Build to Forecast"" for Outsourced Manufacturing; 8.4 ERP System Solutions; 8.5 The Information Ecosystem: Where Communication is Key
Chapter 9: Quality and Reliability9.1 General; 9.2 Front-End; 9.3 Back-End; 9.4 Environment, Health and Safety; Chapter 10: Test Development; 10.1 Simplifying Outsourced Test Development; 10.2 Preparation; 10.3 Evaluation; 10.4 Conclusion; PART 3 - Becoming a Best-in-Class Fabless Company; Chapter 11: Best Practices for Fabless Companies; 11.1 Achieving Best-in-Class Operations Practices; 11.2 A Foundry Manager's Role in a Fabless Company; 11.3 Closing the Loop: Understanding the Manufacturing Flow; 11.4 Managing a Virtual Manufacturing Chain; Chapter 12: Building the Right Partnerships
12.1 Suppliers are (Almost) Just as Important as Customers
Record Nr. UNINA-9910457066503321
Hurtarte Jeorge S  
Amsterdam ; ; Boston, : Elsevier/Newnes, c2007
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Understanding fabless IC technology [[electronic resource] /] / Jeorge S. Hurtarte, Evert A. Wolsheimer, Lisa M. Tafoya
Understanding fabless IC technology [[electronic resource] /] / Jeorge S. Hurtarte, Evert A. Wolsheimer, Lisa M. Tafoya
Autore Hurtarte Jeorge S
Edizione [1st edition]
Pubbl/distr/stampa Amsterdam ; ; Boston, : Elsevier/Newnes, c2007
Descrizione fisica 1 online resource (294 p.)
Disciplina 621.3815
Altri autori (Persone) WolsheimerEvert A
TafoyaLisa M
Collana Communications engineering series
Soggetto topico Integrated circuits - Design and construction
Integrated circuits industry
ISBN 1-281-03653-6
9786611036539
0-08-055119-X
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Front Cover; Understanding Fabless IC Technology; Copyright Page; Contents; Acknowledgements; Preface; PART 1 - Manufacturing Strategies: Understanding Fabless IC Technology; Chapter 1: More than a Decade of Transition in the Semiconductor Industry; 1.1 FSA is Established; 1.2 Early Success; 1.3 Early Success Trend Continues; 1.4 Semiconductor Business Models; 1.5 Outsourcing Will Accelerate; 1.6 IDMs are Going Fabless; 1.7 A Case Study: Cypress Semiconductor; 1.8 More IDMs are Outsourcing; 1.9 Geographic Manufacturing Centers; Chapter 2: Fabless Semiconductor Manufacturing
2.1 Foundry Revenue Growth2.2 Semiconductor Back-End Services; 2.3 Semiconductor Equipment; Chapter 3: Qualities of Successful Fabless Companies; 3.1 Defining Events for the Fabless Market; 3.2 Thriving in the Fabless Model; 3.3 Key Qualities for Success; 3.4 The Future of Fabless; PART 2 - An In-Depth Understanding of the Fabless Semiconductor Business Model; Chapter 4: Semiconductor Manufacturing Basics; 4.1 Semiconductor Processes; 4.2 Semiconductor Manufacturing Steps; 4.3 Wafer Size; 4.4 Manufacturing Costs; 4.5 Conclusion; Chapter 5: Fabless ASICs; 5.1 Introduction
5.2 Origins of the ASIC Industry5.3 Emergence of the Fabless ASIC Business Model; 5.4 The Fabless ASIC Model: How It Works; 5.5 The Services and Capabilities of a Fabless ASIC Supplier; 5.6 Conclusion; Chapter 6: Electronic Design Automation; 6.1 Fabless EDA Overview; 6.2 Fabless EDA Selection Process; 6.3 Physical Design EDA; Chapter 7: Intellectual Property; 7.1 SIP Industry Overview; 7.2 SIP Business Environment; 7.3 Sourcing SIP Products; 7.4 Baseline Terminology; 7.5 Finding SIP and Related Products; 7.6 Evaluating SIP Business Models; 7.7 SIP Product Enablers
7.8 Examples by SIP Product Type7.9 Licensing SIP Products; 7.10 Provider and Buyer Perspectives; 7.11 The Evolution of the IP Industry; 7.12 Intellectual Property Considerations; 7.13 IP Outsourcing; 7.14 Making IP Work in the Fabless Semiconductor Community; 7.15 IP Acquisition Considerations for Fabless IC Companies; Chapter 8: e-Commerce; 8.1 The Virtual Fab Challenge; 8.2 Semiconductor & Fabless Manufacturing: What is Different?; 8.3 ""Build to Forecast"" for Outsourced Manufacturing; 8.4 ERP System Solutions; 8.5 The Information Ecosystem: Where Communication is Key
Chapter 9: Quality and Reliability9.1 General; 9.2 Front-End; 9.3 Back-End; 9.4 Environment, Health and Safety; Chapter 10: Test Development; 10.1 Simplifying Outsourced Test Development; 10.2 Preparation; 10.3 Evaluation; 10.4 Conclusion; PART 3 - Becoming a Best-in-Class Fabless Company; Chapter 11: Best Practices for Fabless Companies; 11.1 Achieving Best-in-Class Operations Practices; 11.2 A Foundry Manager's Role in a Fabless Company; 11.3 Closing the Loop: Understanding the Manufacturing Flow; 11.4 Managing a Virtual Manufacturing Chain; Chapter 12: Building the Right Partnerships
12.1 Suppliers are (Almost) Just as Important as Customers
Record Nr. UNINA-9910784353303321
Hurtarte Jeorge S  
Amsterdam ; ; Boston, : Elsevier/Newnes, c2007
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui