RF MEMS and their applications [[electronic resource] /] / Vijay K. Varadan, K. J. Vinoy, K.A. Jose |
Autore | Varadan V. K. <1943-> |
Pubbl/distr/stampa | West Sussex, England ; ; Hoboken, NJ, : J. Wiley, c2003 |
Descrizione fisica | 1 online resource (408 p.) |
Disciplina |
621.3815
621.38413 |
Altri autori (Persone) |
VinoyK. J <1969-> (Kalarickaparambil Joseph)
JoseK. A |
Soggetto topico |
Radio circuits - Equipment and supplies
Microelectromechanical systems Microwave circuits |
ISBN |
1-280-26970-7
9786610269709 0-470-34173-4 0-470-84619-4 0-470-85660-2 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
RF MEMS and Their Applications; Contents; Preface; 1 Microelectromechanical systems (MEMS) and radio frequency MEMS; 1.1 Introduction; 1.2 MEMS; 1.3 Microfabrications for MEMS; 1.3.1 Bulk micromachining of silicon; 1.3.2 Surface micromachining of silicon; 1.3.3 Wafer bonding for MEMS; 1.3.4 LIGA process; 1.3.5 Micromachining of polymeric MEMS devices; 1.3.6 Three-dimensional microfabrications; 1.4 Electromechanical transducers; 1.4.1 Piezoelectric transducers; 1.4.2 Electrostrictive transducers; 1.4.3 Magnetostrictive transducers; 1.4.4 Electrostatic actuators
1.4.5 Electromagnetic transducers1.4.6 Electrodynamic transducers; 1.4.7 Electrothermal actuators; 1.4.8 Comparison of electromechanical actuation schemes; 1.5 Microsensing for MEMS; 1.5.1 Piezoresistive sensing; 1.5.2 Capacitive sensing; 1.5.3 Piezoelectric sensing; 1.5.4 Resonant sensing; 1.5.5 Surface acoustic wave sensors; 1.6 Materials for MEMS; 1.6.1 Metal and metal alloys for MEMS; 1.6.2 Polymers for MEMS; 1.6.3 Other materials for MEMS; 1.7 Scope of this book; References; 2 MEMS materials and fabrication techniques; 2.1 Metals; 2.1.1 Evaporation; 2.1.2 Sputtering; 2.2 Semiconductors 2.2.1 Electrical and chemical properties2.2.2 Growth and deposition; 2.3 Thin films for MEMS and their deposition techniques; 2.3.1 Oxide film formation by thermal oxidation; 2.3.2 Deposition of silicon dioxide and silicon nitride; 2.3.3 Polysilicon film deposition; 2.3.4 Ferroelectric thin films; 2.4 Materials for polymer MEMS; 2.4.1 Classification of polymers; 2.4.2 UV radiation curing; 2.4.3 SU-8 for polymer MEMS; 2.5 Bulk micromachining for silicon-based MEMS; 2.5.1 Isotropic and orientation-dependent wet etching; 2.5.2 Dry etching; 2.5.3 Buried oxide process; 2.5.4 Silicon fusion bonding 2.5.5 Anodic bonding2.6 Silicon surface micromachining; 2.6.1 Sacrificial layer technology; 2.6.2 Material systems in sacrificial layer technology; 2.6.3 Surface micromachining using plasma etching; 2.6.4 Combined integrated-circuit technology and anisotropic wet etching; 2.7 Microstereolithography for polymer MEMS; 2.7.1 Scanning method; 2.7.2 Two-photon microstereolithography; 2.7.3 Surface micromachining of polymer MEMS; 2.7.4 Projection method; 2.7.5 Polymeric MEMS architecture with silicon, metal and ceramics; 2.7.6 Microstereolithography integrated with thick-film lithography 2.8 ConclusionsReferences; 3 RF MEMS switches and micro relays; 3.1 Introduction; 3.2 Switch parameters; 3.3 Basics of switching; 3.3.1 Mechanical switches; 3.3.2 Electronic switches; 3.4 Switches for RF and microwave applications; 3.4.1 Mechanical RF switches; 3.4.2 PIN diode RF switches; 3.4.3 Metal oxide semiconductor field effect transistors and monolithic microwave integrated circuits; 3.4.4 RF MEMS switches; 3.4.5 Integration and biasing issues for RF switches; 3.5 Actuation mechanisms for MEMS devices; 3.5.1 Electrostatic switching; 3.5.2 Approaches for low-actuation-voltage switches 3.5.3 Mercury contact switches |
Record Nr. | UNINA-9910830401703321 |
Varadan V. K. <1943-> | ||
West Sussex, England ; ; Hoboken, NJ, : J. Wiley, c2003 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
RF MEMS and their applications / / Vijay K. Varadan, K. J. Vinoy, K.A. Jose |
Autore | Varadan V. K. <1943-> |
Pubbl/distr/stampa | West Sussex, England ; ; Hoboken, NJ, : J. Wiley, c2003 |
Descrizione fisica | 1 online resource (408 p.) |
Disciplina | 621.384/13 |
Altri autori (Persone) |
VinoyK. J <1969-> (Kalarickaparambil Joseph)
JoseK. A |
Soggetto topico |
Radio circuits - Equipment and supplies
Microelectromechanical systems Microwave circuits |
ISBN |
1-280-26970-7
9786610269709 0-470-34173-4 0-470-84619-4 0-470-85660-2 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
RF MEMS and Their Applications; Contents; Preface; 1 Microelectromechanical systems (MEMS) and radio frequency MEMS; 1.1 Introduction; 1.2 MEMS; 1.3 Microfabrications for MEMS; 1.3.1 Bulk micromachining of silicon; 1.3.2 Surface micromachining of silicon; 1.3.3 Wafer bonding for MEMS; 1.3.4 LIGA process; 1.3.5 Micromachining of polymeric MEMS devices; 1.3.6 Three-dimensional microfabrications; 1.4 Electromechanical transducers; 1.4.1 Piezoelectric transducers; 1.4.2 Electrostrictive transducers; 1.4.3 Magnetostrictive transducers; 1.4.4 Electrostatic actuators
1.4.5 Electromagnetic transducers1.4.6 Electrodynamic transducers; 1.4.7 Electrothermal actuators; 1.4.8 Comparison of electromechanical actuation schemes; 1.5 Microsensing for MEMS; 1.5.1 Piezoresistive sensing; 1.5.2 Capacitive sensing; 1.5.3 Piezoelectric sensing; 1.5.4 Resonant sensing; 1.5.5 Surface acoustic wave sensors; 1.6 Materials for MEMS; 1.6.1 Metal and metal alloys for MEMS; 1.6.2 Polymers for MEMS; 1.6.3 Other materials for MEMS; 1.7 Scope of this book; References; 2 MEMS materials and fabrication techniques; 2.1 Metals; 2.1.1 Evaporation; 2.1.2 Sputtering; 2.2 Semiconductors 2.2.1 Electrical and chemical properties2.2.2 Growth and deposition; 2.3 Thin films for MEMS and their deposition techniques; 2.3.1 Oxide film formation by thermal oxidation; 2.3.2 Deposition of silicon dioxide and silicon nitride; 2.3.3 Polysilicon film deposition; 2.3.4 Ferroelectric thin films; 2.4 Materials for polymer MEMS; 2.4.1 Classification of polymers; 2.4.2 UV radiation curing; 2.4.3 SU-8 for polymer MEMS; 2.5 Bulk micromachining for silicon-based MEMS; 2.5.1 Isotropic and orientation-dependent wet etching; 2.5.2 Dry etching; 2.5.3 Buried oxide process; 2.5.4 Silicon fusion bonding 2.5.5 Anodic bonding2.6 Silicon surface micromachining; 2.6.1 Sacrificial layer technology; 2.6.2 Material systems in sacrificial layer technology; 2.6.3 Surface micromachining using plasma etching; 2.6.4 Combined integrated-circuit technology and anisotropic wet etching; 2.7 Microstereolithography for polymer MEMS; 2.7.1 Scanning method; 2.7.2 Two-photon microstereolithography; 2.7.3 Surface micromachining of polymer MEMS; 2.7.4 Projection method; 2.7.5 Polymeric MEMS architecture with silicon, metal and ceramics; 2.7.6 Microstereolithography integrated with thick-film lithography 2.8 ConclusionsReferences; 3 RF MEMS switches and micro relays; 3.1 Introduction; 3.2 Switch parameters; 3.3 Basics of switching; 3.3.1 Mechanical switches; 3.3.2 Electronic switches; 3.4 Switches for RF and microwave applications; 3.4.1 Mechanical RF switches; 3.4.2 PIN diode RF switches; 3.4.3 Metal oxide semiconductor field effect transistors and monolithic microwave integrated circuits; 3.4.4 RF MEMS switches; 3.4.5 Integration and biasing issues for RF switches; 3.5 Actuation mechanisms for MEMS devices; 3.5.1 Electrostatic switching; 3.5.2 Approaches for low-actuation-voltage switches 3.5.3 Mercury contact switches |
Record Nr. | UNINA-9910877226603321 |
Varadan V. K. <1943-> | ||
West Sussex, England ; ; Hoboken, NJ, : J. Wiley, c2003 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Smart material systems and MEMS [[electronic resource] ] : design and development methodologies / / Vijay K. Varadan, K.J. Vinoy, S. Gopalakrishnan |
Autore | Varadan V. K. <1943-> |
Pubbl/distr/stampa | Chichester, England ; ; Hoboken, NJ, : John Wiley & Sons, c2006 |
Descrizione fisica | 1 online resource (420 p.) |
Disciplina | 621.381 |
Altri autori (Persone) |
VinoyK. J <1969-> (Kalarickaparambil Joseph)
GopalakrishnanS |
Soggetto topico |
Microelectromechanical systems
Smart materials |
ISBN |
1-280-72170-7
9786610721702 0-470-09363-3 0-470-09362-5 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Smart Material Systems and MEMS; Contents; Preface; About the Authors; Part 1: Fundamentals; 1 Introduction to Smart Systems; 1.1 Components of a smart system; 1.1.1 'Smartness'; 1.1.2 Sensors, actuators, transducers; 1.1.3 Micro electromechanical systems (MEMS); 1.1.4 Control algorithms; 1.1.5 Modeling approaches; 1.1.6 Effects of scaling; 1.1.7 Optimization schemes; 1.2 Evolution of smart materials and structures; 1.3 Application areas for smart systems; 1.4 Organization of the book; References; 2 Processing of Smart Materials; 2.1 Introduction; 2.2 Semiconductors and their processing
2.2.1 Silicon crystal growth from the melt2.2.2 Epitaxial growth of semiconductors; 2.3 Metals and metallization techniques; 2.4 Ceramics; 2.4.1 Bulk ceramics; 2.4.2 Thick films; 2.4.3 Thin films; 2.5 Silicon micromachining techniques; 2.6 Polymers and their synthesis; 2.6.1 Classification of polymers; 2.6.2 Methods of polymerization; 2.7 UV radiation curing of polymers; 2.7.1 Relationship between wavelength and radiation energy; 2.7.2 Mechanisms of UV curing; 2.7.3 Basic kinetics of photopolymerization; 2.8 Deposition techniques for polymer thin films 2.9 Properties and synthesis of carbon nanotubesReferences; Part 2: Design Principles; 3 Sensors for Smart Systems; 3.1 Introduction; 3.2 Conductometric sensors; 3.3 Capacitive sensors; 3.4 Piezoelectric sensors; 3.5 Magnetostrictive sensors; 3.6 Piezoresistive sensors; 3.7 Optical sensors; 3.8 Resonant sensors; 3.9 Semiconductor-based sensors; 3.10 Acoustic sensors; 3.11 Polymeric sensors; 3.12 Carbon nanotube sensors; References; 4 Actuators for Smart Systems; 4.1 Introduction; 4.2 Electrostatic transducers; 4.3 Electromagnetic transducers; 4.4 Electrodynamic transducers 4.5 Piezoelectric transducers4.6 Electrostrictive transducers; 4.7 Magnetostrictive transducers; 4.8 Electrothermal actuators; 4.9 Comparison of actuation schemes; References; 5 Design Examples for Sensors and Actuators; 5.1 Introduction; 5.2 Piezoelectric sensors; 5.3 MEMS IDT-based accelerometers; 5.4 Fiber-optic gyroscopes; 5.5 Piezoresistive pressure sensors; 5.6 SAW-based wireless strain sensors; 5.7 SAW-based chemical sensors; 5.8 Microfluidic systems; References; Part 3: Modeling Techniques; 6 Introductory Concepts in Modeling; 6.1 Introduction to the theory of elasticity 6.1.1 Description of motion6.1.2 Strain; 6.1.3 Strain-displacement relationship; 6.1.4 Governing equations of motion; 6.1.5 Constitutive relations; 6.1.6 Solution procedures in the linear theory of elasticity; 6.1.7 Plane problems in elasticity; 6.2 Theory of laminated composites; 6.2.1 Introduction; 6.2.2 Micromechanical analysis of a lamina; 6.2.3 Stress-strain relations for a lamina; 6.2.4 Analysis of a laminate; 6.3 Introduction to wave propagation in structures; 6.3.1 Fourier analysis; 6.3.2 Wave characteristics in 1-D waveguides; References; 7 Introduction to the Finite Element Method 7.1 Introduction |
Record Nr. | UNINA-9910143710803321 |
Varadan V. K. <1943-> | ||
Chichester, England ; ; Hoboken, NJ, : John Wiley & Sons, c2006 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Smart material systems and MEMS [[electronic resource] ] : design and development methodologies / / Vijay K. Varadan, K.J. Vinoy, S. Gopalakrishnan |
Autore | Varadan V. K. <1943-> |
Pubbl/distr/stampa | Chichester, England ; ; Hoboken, NJ, : John Wiley & Sons, c2006 |
Descrizione fisica | 1 online resource (420 p.) |
Disciplina | 621.381 |
Altri autori (Persone) |
VinoyK. J <1969-> (Kalarickaparambil Joseph)
GopalakrishnanS |
Soggetto topico |
Microelectromechanical systems
Smart materials |
ISBN |
1-280-72170-7
9786610721702 0-470-09363-3 0-470-09362-5 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Smart Material Systems and MEMS; Contents; Preface; About the Authors; Part 1: Fundamentals; 1 Introduction to Smart Systems; 1.1 Components of a smart system; 1.1.1 'Smartness'; 1.1.2 Sensors, actuators, transducers; 1.1.3 Micro electromechanical systems (MEMS); 1.1.4 Control algorithms; 1.1.5 Modeling approaches; 1.1.6 Effects of scaling; 1.1.7 Optimization schemes; 1.2 Evolution of smart materials and structures; 1.3 Application areas for smart systems; 1.4 Organization of the book; References; 2 Processing of Smart Materials; 2.1 Introduction; 2.2 Semiconductors and their processing
2.2.1 Silicon crystal growth from the melt2.2.2 Epitaxial growth of semiconductors; 2.3 Metals and metallization techniques; 2.4 Ceramics; 2.4.1 Bulk ceramics; 2.4.2 Thick films; 2.4.3 Thin films; 2.5 Silicon micromachining techniques; 2.6 Polymers and their synthesis; 2.6.1 Classification of polymers; 2.6.2 Methods of polymerization; 2.7 UV radiation curing of polymers; 2.7.1 Relationship between wavelength and radiation energy; 2.7.2 Mechanisms of UV curing; 2.7.3 Basic kinetics of photopolymerization; 2.8 Deposition techniques for polymer thin films 2.9 Properties and synthesis of carbon nanotubesReferences; Part 2: Design Principles; 3 Sensors for Smart Systems; 3.1 Introduction; 3.2 Conductometric sensors; 3.3 Capacitive sensors; 3.4 Piezoelectric sensors; 3.5 Magnetostrictive sensors; 3.6 Piezoresistive sensors; 3.7 Optical sensors; 3.8 Resonant sensors; 3.9 Semiconductor-based sensors; 3.10 Acoustic sensors; 3.11 Polymeric sensors; 3.12 Carbon nanotube sensors; References; 4 Actuators for Smart Systems; 4.1 Introduction; 4.2 Electrostatic transducers; 4.3 Electromagnetic transducers; 4.4 Electrodynamic transducers 4.5 Piezoelectric transducers4.6 Electrostrictive transducers; 4.7 Magnetostrictive transducers; 4.8 Electrothermal actuators; 4.9 Comparison of actuation schemes; References; 5 Design Examples for Sensors and Actuators; 5.1 Introduction; 5.2 Piezoelectric sensors; 5.3 MEMS IDT-based accelerometers; 5.4 Fiber-optic gyroscopes; 5.5 Piezoresistive pressure sensors; 5.6 SAW-based wireless strain sensors; 5.7 SAW-based chemical sensors; 5.8 Microfluidic systems; References; Part 3: Modeling Techniques; 6 Introductory Concepts in Modeling; 6.1 Introduction to the theory of elasticity 6.1.1 Description of motion6.1.2 Strain; 6.1.3 Strain-displacement relationship; 6.1.4 Governing equations of motion; 6.1.5 Constitutive relations; 6.1.6 Solution procedures in the linear theory of elasticity; 6.1.7 Plane problems in elasticity; 6.2 Theory of laminated composites; 6.2.1 Introduction; 6.2.2 Micromechanical analysis of a lamina; 6.2.3 Stress-strain relations for a lamina; 6.2.4 Analysis of a laminate; 6.3 Introduction to wave propagation in structures; 6.3.1 Fourier analysis; 6.3.2 Wave characteristics in 1-D waveguides; References; 7 Introduction to the Finite Element Method 7.1 Introduction |
Record Nr. | UNINA-9910830035603321 |
Varadan V. K. <1943-> | ||
Chichester, England ; ; Hoboken, NJ, : John Wiley & Sons, c2006 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Smart material systems and MEMS : design and development methodologies / / Vijay K. Varadan, K.J. Vinoy, S. Gopalakrishnan |
Autore | Varadan V. K. <1943-> |
Pubbl/distr/stampa | Chichester, England ; ; Hoboken, NJ, : John Wiley & Sons, c2006 |
Descrizione fisica | 1 online resource (420 p.) |
Disciplina | 621.381 |
Altri autori (Persone) |
VinoyK. J <1969-> (Kalarickaparambil Joseph)
GopalakrishnanS |
Soggetto topico |
Microelectromechanical systems
Smart materials |
ISBN |
1-280-72170-7
9786610721702 0-470-09363-3 0-470-09362-5 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Smart Material Systems and MEMS; Contents; Preface; About the Authors; Part 1: Fundamentals; 1 Introduction to Smart Systems; 1.1 Components of a smart system; 1.1.1 'Smartness'; 1.1.2 Sensors, actuators, transducers; 1.1.3 Micro electromechanical systems (MEMS); 1.1.4 Control algorithms; 1.1.5 Modeling approaches; 1.1.6 Effects of scaling; 1.1.7 Optimization schemes; 1.2 Evolution of smart materials and structures; 1.3 Application areas for smart systems; 1.4 Organization of the book; References; 2 Processing of Smart Materials; 2.1 Introduction; 2.2 Semiconductors and their processing
2.2.1 Silicon crystal growth from the melt2.2.2 Epitaxial growth of semiconductors; 2.3 Metals and metallization techniques; 2.4 Ceramics; 2.4.1 Bulk ceramics; 2.4.2 Thick films; 2.4.3 Thin films; 2.5 Silicon micromachining techniques; 2.6 Polymers and their synthesis; 2.6.1 Classification of polymers; 2.6.2 Methods of polymerization; 2.7 UV radiation curing of polymers; 2.7.1 Relationship between wavelength and radiation energy; 2.7.2 Mechanisms of UV curing; 2.7.3 Basic kinetics of photopolymerization; 2.8 Deposition techniques for polymer thin films 2.9 Properties and synthesis of carbon nanotubesReferences; Part 2: Design Principles; 3 Sensors for Smart Systems; 3.1 Introduction; 3.2 Conductometric sensors; 3.3 Capacitive sensors; 3.4 Piezoelectric sensors; 3.5 Magnetostrictive sensors; 3.6 Piezoresistive sensors; 3.7 Optical sensors; 3.8 Resonant sensors; 3.9 Semiconductor-based sensors; 3.10 Acoustic sensors; 3.11 Polymeric sensors; 3.12 Carbon nanotube sensors; References; 4 Actuators for Smart Systems; 4.1 Introduction; 4.2 Electrostatic transducers; 4.3 Electromagnetic transducers; 4.4 Electrodynamic transducers 4.5 Piezoelectric transducers4.6 Electrostrictive transducers; 4.7 Magnetostrictive transducers; 4.8 Electrothermal actuators; 4.9 Comparison of actuation schemes; References; 5 Design Examples for Sensors and Actuators; 5.1 Introduction; 5.2 Piezoelectric sensors; 5.3 MEMS IDT-based accelerometers; 5.4 Fiber-optic gyroscopes; 5.5 Piezoresistive pressure sensors; 5.6 SAW-based wireless strain sensors; 5.7 SAW-based chemical sensors; 5.8 Microfluidic systems; References; Part 3: Modeling Techniques; 6 Introductory Concepts in Modeling; 6.1 Introduction to the theory of elasticity 6.1.1 Description of motion6.1.2 Strain; 6.1.3 Strain-displacement relationship; 6.1.4 Governing equations of motion; 6.1.5 Constitutive relations; 6.1.6 Solution procedures in the linear theory of elasticity; 6.1.7 Plane problems in elasticity; 6.2 Theory of laminated composites; 6.2.1 Introduction; 6.2.2 Micromechanical analysis of a lamina; 6.2.3 Stress-strain relations for a lamina; 6.2.4 Analysis of a laminate; 6.3 Introduction to wave propagation in structures; 6.3.1 Fourier analysis; 6.3.2 Wave characteristics in 1-D waveguides; References; 7 Introduction to the Finite Element Method 7.1 Introduction |
Record Nr. | UNINA-9910876626203321 |
Varadan V. K. <1943-> | ||
Chichester, England ; ; Hoboken, NJ, : John Wiley & Sons, c2006 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|