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Beyond-CMOS Technologies for Next Generation Computer Design / / edited by Rasit O. Topaloglu, H.-S. Philip Wong
| Beyond-CMOS Technologies for Next Generation Computer Design / / edited by Rasit O. Topaloglu, H.-S. Philip Wong |
| Edizione | [1st ed. 2019.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2019 |
| Descrizione fisica | 1 online resource (IX, 271 p. 159 illus., 141 illus. in color.) |
| Disciplina | 621.3815 |
| Soggetto topico |
Electronic circuits
Microprocessors Logic design Circuits and Systems Electronic Circuits and Devices Processor Architectures Logic Design |
| ISBN | 3-319-90385-3 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Beyond-Silicon Devices: Considerations for Circuits and Architectures -- Functionality-enhanced devices: from transistors to circuit-level opportunities -- Heterogeneous integration of 2D materials and devices on a Si platform -- Emerging NVM Circuit Techniques and Implementations for Energy-Efficient Systems -- The Processing-in-Memory Paradigm: Mechanisms to Enable Adoption -- Emerging Steep-Slope Devices and Circuits: Opportunities and Challenges -- Spin-based Majority Computation -- Index. |
| Record Nr. | UNINA-9910337656903321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2019 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
More than Moore Technologies for Next Generation Computer Design [[electronic resource] /] / edited by Rasit O. Topaloglu
| More than Moore Technologies for Next Generation Computer Design [[electronic resource] /] / edited by Rasit O. Topaloglu |
| Edizione | [1st ed. 2015.] |
| Pubbl/distr/stampa | New York, NY : , : Springer New York : , : Imprint : Springer, , 2015 |
| Descrizione fisica | 1 online resource (225 p.) |
| Disciplina |
004.1
620 621.381 621.3815 |
| Soggetto topico |
Electronic circuits
Electronics Microelectronics Microprocessors Circuits and Systems Electronics and Microelectronics, Instrumentation Processor Architectures |
| ISBN | 1-4939-2163-0 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Impact of TSV and Device Scaling on the Quality of 3D Ics -- 3D Integration Technology -- Design and Optimization of Spin-Transfer Torque MRAMs -- Embedded STT-MRAM: Device and Design -- A Thermal and Process Variation Aware MTJ Switching Model and Its Applications in Soft Error Analysis -- Nano-Photonic Networks-on-Chip for Future Chip Multiprocessors -- Design Automation for On-chip Nanophotonic Integration. |
| Record Nr. | UNINA-9910299681603321 |
| New York, NY : , : Springer New York : , : Imprint : Springer, , 2015 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||