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Co-Simulations of Microwave Circuits and High-Frequency Electromagnetic Fields
Co-Simulations of Microwave Circuits and High-Frequency Electromagnetic Fields
Autore Tong Mei Song
Edizione [1st ed.]
Pubbl/distr/stampa Singapore : , : Springer Singapore Pte. Limited, , 2024
Descrizione fisica 1 online resource (461 pages)
Disciplina 621.38132
Altri autori (Persone) LiXiao Yu
ISBN 9789819983070
9789819983063
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Intro -- Preface -- Acknowledgements -- Contents -- About the Authors -- 1 Introduction to Co-simulations of Microwave Circuits and High-Frequency Electromagnetic Fields -- 1.1 Introduction -- 1.2 Overview of Advanced Design System (ADS) -- 1.2.1 Development History of ADS -- 1.2.2 Main Functions of ADS -- 1.2.3 Characteristics of ADS -- 1.2.4 Application Scenarios of ADS -- 1.3 Overview of High Frequency Structure Simulator (HFSS) -- 1.3.1 Development History of HFSS -- 1.3.2 Main Functions of HFSS -- 1.3.3 Characteristics of HFSS -- 1.3.4 Application Scenarios of HFSS -- 1.4 Advantages of Co-simulations -- 1.5 Outlook -- References -- 2 Co-simulations of High-Frequency Electromagnetic Fields (HFEMFs) -- 2.1 Introduction -- 2.1.1 Definition and Application of HFEMFs -- 2.1.2 Development History of HFEMFs -- 2.2 Principle of HFEMFs -- 2.2.1 Maxwell's Equations and Numerical Solution Method -- 2.2.2 Time-Domain and Frequency-Domain Analysis Methods -- 2.2.3 Boundary Element Method and Finite Element Method -- 2.3 Error Analysis in HFEMFs -- 2.4 Application of ADS to HFEMFs -- 2.4.1 Simulations Tools in ADS -- 2.4.2 Guidance of ADS Simulations for HFEMFs -- 2.5 Application of HFSS to HFEMFs -- 2.5.1 Simulation Steps in HFSS -- 2.5.2 Guidance of HFSS Simulations for HFEMFs -- 2.6 Co-simulations for HFEMFs -- 2.6.1 Definition of Co-simulations for HFEMFs -- 2.6.2 Co-simulations of HFEMFs with ADS -- 2.6.3 Co-simulations with HFSS for HFEMFs -- 2.7 Future Prospects of Simulations for HFEMFs -- 2.7.1 Model Refinement and Simulation Accuracy -- 2.7.2 Computational Efficiency and Simulation Speed -- 2.7.3 Artificial Intelligence and Machine Learning for Simulations of HFEMFs -- 2.7.4 Standardization and Interoperability -- 2.8 Co-simulations of Designer with HFSS for HFEMFs -- 2.8.1 Iris Waveguide Filter -- 2.8.2 Modeling and Simulations in HFSS.
2.8.3 Dynamic Link Between HFSS and Designer -- 2.8.4 Solution by Designer -- 2.8.5 Optimization in Designer -- 2.8.6 Export to HFSS for Verification -- References -- 3 Co-simulations of Microwave Circuits -- 3.1 Introduction -- 3.1.1 Basic Concepts of Microwave Circuits -- 3.1.2 Main Components of Microwave Circuits -- 3.1.3 Design Method of Microwave Circuits -- 3.1.4 Development of Microwave Circuits -- 3.1.5 Characteristics of Low-Frequency Simulations for Microwave Circuits -- 3.1.6 Development History of Simulation Technologies for Low-Frequency Microwave Circuits -- 3.2 Principle of Microwave Circuit Simulations -- 3.2.1 Electromagnetic Field Equations -- 3.2.2 Transmission Line Theory -- 3.2.3 Equivalent Circuit Model of Microwave Circuits -- 3.2.4 Finite Element Method and Finite-Difference Time-Domain Method -- 3.2.5 Electromagnetic Field and Circuit Coupling -- 3.2.6 Error Analysis and Compensation -- 3.3 ADS for Low-Frequency Simulations of Microwave Circuits -- 3.3.1 Microwave Circuit Component Library -- 3.3.2 Main Functions and Settings -- 3.3.3 Practical Functions for Low-Frequency Design of Microwave Circuits -- 3.3.4 Circuit Modeling and Parameter Extraction -- 3.3.5 Advanced Analysis Function -- 3.4 HFSS for Low-Frequency Simulations of Microwave Circuits -- 3.4.1 Microwave Circuit Component Library and Model Import -- 3.4.2 Geometric Modeling and Material Parameter Setting -- 3.4.3 Boundary Conditions and Meshing -- 3.4.4 Post-processing of Simulations Results -- 3.4.5 Optimization Design and Parameter Scanning -- 3.4.6 Some Problems in Low-Frequency Simulations of Microwave Circuits -- 3.5 Co-simulations for Low-Frequency Microwave Circuits -- 3.5.1 Concept and Method -- 3.5.2 Co-simulations with ADS for Low-Frequency Microwave Circuits -- 3.5.3 Co-simulations with HFSS for Low-Frequency Microwave Circuits.
3.6 An Example of Co-simulations Based on ADS -- 3.6.1 Implementing Parametric Modeling in ADS Layout Environment -- 3.6.2 Co-simulations of Field and Circuit Based on RFPro -- References -- 4 Co-simulations of Antennas -- 4.1 Introduction -- 4.1.1 Significance of Simulations in Antenna Designs -- 4.1.2 Basic Process of Antenna Simulations -- 4.2 Principle of Simulations for Antenna Designs -- 4.2.1 Basic Theory of Antennas -- 4.2.2 Radiation Characteristics of Antennas -- 4.2.3 Electromagnetic Problems in Antenna Designs -- 4.2.4 Optimization Algorithms in Antenna Designs -- 4.2.5 Error Analysis and Calibration -- 4.3 ADS for Antenna Simulations -- 4.4 HFSS for Antenna Simulations -- 4.5 Co-simulations for Antenna Designs -- 4.6 Co-simulations with ADS for Antenna Designs -- 4.6.1 Co-simulations of CST Studio Suite with ADS -- 4.6.2 Co-simulations of WIPL-D with ADS -- 4.6.3 Co-simulations of XFdtd with ADS -- 4.7 Co-simulations with HFSS for Antenna Designs -- 4.7.1 Co-simulations of Antenna Magus with HFSS -- 4.7.2 Co-simulations of EMCoS Antenna VirtualLab with HFSS -- 4.8 Prospect of Simulations for Antenna Designs -- 4.9 Co-simulations of Microstrip Antennas Based on HFSS and ADS -- 4.10 Co-simulations of Microstrip Antennas Based on Circuits and HFSS -- References -- 5 Co-simulations of Electromagnetic Compatibility -- 5.1 Introduction -- 5.2 Fundamental of EMC Designs -- 5.2.1 Quantification of EMC Performances -- 5.2.2 EMC Analysis Methods -- 5.2.3 EMC Analyses and Applications -- 5.2.4 Typical Problems and Solutions -- 5.3 EMC Simulations in ADS -- 5.3.1 ADS Implementation of EMC Simulations -- 5.3.2 EMC Analysis Module in ADS -- 5.4 EMC Simulations in HFSS -- 5.4.1 HFSS Implementation of EMC Simulations -- 5.4.2 EMC Analysis Modules in HFSS -- 5.4.3 EMC Simulation Method and Process in HFSS -- 5.5 Co-simulations of EMC with ADS.
5.5.1 Co-simulations of CST Studio Suite with ADS -- 5.5.2 Co-simulations of AWR Microwave Office with ADS -- 5.5.3 Co-simulations of Simbeor with ADS -- 5.6 Co-simulations of EMC with HFSS -- 5.6.1 Co-simulations of Ansys SIwave with HFSS -- 5.6.2 Co-simulations of Altium Designer with HFSS -- 5.6.3 Co-simulations of HyperLynx with HFSS -- 5.7 Optimization Methods in EMC Analyses -- 5.7.1 Parameter Optimization -- 5.7.2 Structure Optimization -- 5.7.3 Layout Optimization -- 5.7.4 Challenges in Optimization Processes -- 5.8 Development and Prospect -- 5.9 Simulations of RF Links Based on CST and ADS -- 5.9.1 Overall Framework of Simulations -- 5.9.2 PCB Preparation -- 5.9.3 CST Imports and Simulations -- 5.9.4 ADS Simulations -- References -- 6 Co-simulations of Thermal Properties -- 6.1 Introduction -- 6.2 Definitions and Applications of Thermal Parameters -- 6.2.1 Thermal Transfer -- 6.2.2 Thermal Convection -- 6.2.3 Thermal Radiation -- 6.3 Types and Technologies of Thermal Simulations -- 6.3.1 Classification by Simulated Objects -- 6.3.2 Classification by Scopes of Simulations -- 6.3.3 Classification by Purposes of Simulations -- 6.3.4 Technologies of Thermal Simulations -- 6.4 Principle of Thermal Simulations -- 6.4.1 Heat Conduction Equation -- 6.4.2 Boundary and Initial Conditions -- 6.4.3 Thermal Source Modeling -- 6.4.4 Mesh Generation and Solution Algorithms -- 6.5 Co-simulations of Thermal Properties -- 6.5.1 Interaction between Thermal Simulations and Electromagnetic Simulations -- 6.5.2 Effect of Thermal Simulations on Electromagnetic Performances -- 6.6 Co-simulations of Thermal Properties with ADS -- 6.6.1 Co-simulations of FloTHERM with ADS -- 6.6.2 Co-simulations of Icepak with ADS -- 6.7 Co-simulations of Thermal Properties with HFSS -- 6.7.1 Co-simulations of FloTHERM with HFSS -- 6.7.2 Co-simulations of Icepak with HFSS.
6.8 Practices and Skills for Thermal Simulations -- 6.8.1 Model Preparation -- 6.8.2 Parameter Setups and Optimizations -- 6.9 Co-simulations of Thermal Properties with HFSS and Icepak -- References -- 7 Co-simulations of Structures -- 7.1 Introduction -- 7.2 Goals and Challenges of Structural Simulations -- 7.3 Categories and Methods of Structural Simulations -- 7.3.1 Static Simulations -- 7.3.2 Dynamic Simulations -- 7.3.3 Thermodynamic Simulations -- 7.3.4 Fluid-Mechanic Simulations -- 7.4 Principles of Structural Simulations -- 7.4.1 Stress and Strain Analyses -- 7.4.2 Material Models and Mechanical Properties -- 7.4.3 Boundary Conditions and Loads -- 7.4.4 Mesh Generation and Solution Algorithms -- 7.4.5 Result Analysis and Verification -- 7.5 Co-simulations of Thermal and Structural Properties -- 7.5.1 Requirements and Methods of Structural Co-simulations -- 7.5.2 Framework and Process of Structural Co-simulations -- 7.5.3 Data Transfer and Interface in Structural Co-simulations -- 7.6 Co-simulations of Structural Simulation Software with ADS -- 7.6.1 Structural Co-simulations of SIMULIA Abaqus with ADS -- 7.6.2 Structural Co-simulations of MSC Software with ADS -- 7.7 Co-simulations Structural Simulation Software with HFSS -- 7.7.1 Structural Co-simulations of ANSYS Mechanical with HFSS -- 7.7.2 Structural Co-simulations of COMSOL Multiphysics with HFSS -- 7.7.3 Structural Co-simulations of Ansys Multiphysics with HFSS -- 7.8 Static Simulations of Structures by Combining Hypermesh and Ansys -- References -- 8 Automation Interfaces and Script Programming Methods for Co-simulations -- 8.1 Introduction -- 8.2 Advanced Extension Language (AEL) Interfaces in ADS -- 8.2.1 Basic Concept of AEL Interfaces -- 8.2.2 Writing, Loading, and Running AEL Scripts -- 8.2.3 A Simple Example -- 8.3 Python Data Link (PDL) for ADS.
8.3.1 Basic Concept and Architecture of PDL.
Record Nr. UNINA-9910872185203321
Tong Mei Song  
Singapore : , : Springer Singapore Pte. Limited, , 2024
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
The Nyström method in electromagnetics / / Mei Song Tong, Weng Cho Chew
The Nyström method in electromagnetics / / Mei Song Tong, Weng Cho Chew
Autore Tong Mei Song
Pubbl/distr/stampa Hoboken, New Jersey, USA : , : Wiley-IEEE Press, , 2019
Descrizione fisica 1 online resource (525 pages)
Disciplina 537.0151
Soggetto topico Electromagnetism - Mathematics
Integral equations - Numerical solutions
ISBN 1-119-28487-2
1-119-28485-6
1-119-28488-0
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Electromagnetics, physics, and mathematics -- Computational electromagnetics -- Nyström method -- Numerical quadrature rules -- Singularity treatment -- Application to conducting media -- Application to penetrable media -- Incorporation with multilevel fast multipole algorithm -- Application to solve multiphysics problems -- Application to solve time-domain integral equations.
Record Nr. UNINA-9910555272603321
Tong Mei Song  
Hoboken, New Jersey, USA : , : Wiley-IEEE Press, , 2019
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
The Nyström method in electromagnetics / / Mei Song Tong, Weng Cho Chew
The Nyström method in electromagnetics / / Mei Song Tong, Weng Cho Chew
Autore Tong Mei Song
Pubbl/distr/stampa Hoboken, New Jersey, USA : , : Wiley-IEEE Press, , 2019
Descrizione fisica 1 online resource (525 pages)
Disciplina 537.0151
Soggetto topico Electromagnetism - Mathematics
Integral equations - Numerical solutions
ISBN 1-119-28487-2
1-119-28485-6
1-119-28488-0
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Electromagnetics, physics, and mathematics -- Computational electromagnetics -- Nyström method -- Numerical quadrature rules -- Singularity treatment -- Application to conducting media -- Application to penetrable media -- Incorporation with multilevel fast multipole algorithm -- Application to solve multiphysics problems -- Application to solve time-domain integral equations.
Record Nr. UNINA-9910830445603321
Tong Mei Song  
Hoboken, New Jersey, USA : , : Wiley-IEEE Press, , 2019
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui