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Electromigration in ULSI interconnections [[electronic resource] /] / Cher Ming Tan
| Electromigration in ULSI interconnections [[electronic resource] /] / Cher Ming Tan |
| Autore | Tan Cher Ming <1959-> |
| Pubbl/distr/stampa | Hackensack, N.J., : World Scientific, c2010 |
| Descrizione fisica | 1 online resource (312 p.) |
| Disciplina | 621.395 |
| Collana | International series on advances in solid state electronics and technology (ASSET) |
| Soggetto topico |
Integrated circuits - Ultra large scale integration
Electrodiffusion |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-283-14371-2
9786613143716 981-4273-33-3 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Preface; Contents; 1. Introduction; 2. History of Electromigration; 3. Experimental Studies of Al Interconnections; 4. Experimental Studies of Cu Interconnections; 5. Numerical Modeling of Electromigration; 6. Future Challenges; Index; Biography |
| Record Nr. | UNINA-9910456216003321 |
Tan Cher Ming <1959->
|
||
| Hackensack, N.J., : World Scientific, c2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Electromigration in ULSI interconnections [[electronic resource] /] / Cher Ming Tan
| Electromigration in ULSI interconnections [[electronic resource] /] / Cher Ming Tan |
| Autore | Tan Cher Ming <1959-> |
| Pubbl/distr/stampa | Hackensack, N.J., : World Scientific, c2010 |
| Descrizione fisica | 1 online resource (312 p.) |
| Disciplina | 621.395 |
| Collana | International series on advances in solid state electronics and technology (ASSET) |
| Soggetto topico |
Integrated circuits - Ultra large scale integration
Electrodiffusion |
| ISBN |
1-283-14371-2
9786613143716 981-4273-33-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Preface; Contents; 1. Introduction; 2. History of Electromigration; 3. Experimental Studies of Al Interconnections; 4. Experimental Studies of Cu Interconnections; 5. Numerical Modeling of Electromigration; 6. Future Challenges; Index; Biography |
| Record Nr. | UNINA-9910780711903321 |
|
Tan Cher Ming <1959->
|
||
| Hackensack, N.J., : World Scientific, c2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Electromigration modeling at circuit layout level / / Cher Ming Tan, Feifei He
| Electromigration modeling at circuit layout level / / Cher Ming Tan, Feifei He |
| Autore | Tan Cher Ming <1959-> |
| Edizione | [1st ed. 2013.] |
| Pubbl/distr/stampa | Singapore ; ; New York, : Springer, c2013 |
| Descrizione fisica | 1 online resource (x, 103 pages) : illustrations (chiefly color) |
| Disciplina | 621.3815 |
| Altri autori (Persone) | HeFeifei |
| Collana | SpringerBriefs in applied sciences and technology, Reliability |
| Soggetto topico |
Integrated circuits - Reliability
Electrodiffusion - Simulation methods |
| ISBN | 981-4451-21-5 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Introduction -- 3D Circuit Model Construction and Simulation -- Comparison of EM Performance in Circuit Structure and Test Structure -- Interconnect EM Reliability Modeling at Circuit Layout Level -- Conclusion. |
| Record Nr. | UNINA-9910739461403321 |
|
Tan Cher Ming <1959->
|
||
| Singapore ; ; New York, : Springer, c2013 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||