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Identity Management : concepts, technologies, and systems / / Elisa Bertino, Kenji Takahashi
| Identity Management : concepts, technologies, and systems / / Elisa Bertino, Kenji Takahashi |
| Autore | Bertino Elisa |
| Pubbl/distr/stampa | Boston, Massachusetts ; , : Artech House, , 2010 |
| Descrizione fisica | 1 online resource (198 p.) |
| Disciplina | 005.8 |
| Altri autori (Persone) | TakahashiKenji |
| Collana | Information security and privacy series |
| Soggetto topico |
Computer networks - Security measures
Computer security Business enterprises - Computer networks - Security measures |
| Soggetto genere / forma | Electronic books. |
| ISBN | 1-60807-040-9 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | 1. Introduction -- 2. What Is Identity Management? -- 2.1 Stakeholders and Their Requirements -- 2.2 Identity Life Cycle -- 2.3 Identity Assurance -- References -- 3. Fundamental Technologies andProcesses -- |
| Record Nr. | UNINA-9910458895803321 |
Bertino Elisa
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| Boston, Massachusetts ; , : Artech House, , 2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Identity Management : concepts, technologies, and systems / / Elisa Bertino, Kenji Takahashi
| Identity Management : concepts, technologies, and systems / / Elisa Bertino, Kenji Takahashi |
| Autore | Bertino Elisa |
| Pubbl/distr/stampa | Boston, Massachusetts ; , : Artech House, , 2010 |
| Descrizione fisica | 1 online resource (198 p.) |
| Disciplina | 005.8 |
| Altri autori (Persone) | TakahashiKenji |
| Collana | Information security and privacy series |
| Soggetto topico |
Computer networks - Security measures
Computer security Business enterprises - Computer networks - Security measures |
| ISBN | 1-60807-040-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | 1. Introduction -- 2. What Is Identity Management? -- 2.1 Stakeholders and Their Requirements -- 2.2 Identity Life Cycle -- 2.3 Identity Assurance -- References -- 3. Fundamental Technologies andProcesses -- |
| Record Nr. | UNINA-9910785597803321 |
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Bertino Elisa
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| Boston, Massachusetts ; , : Artech House, , 2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Proceedings of the 6th ACM Workshop on Digital Identity Management
| Proceedings of the 6th ACM Workshop on Digital Identity Management |
| Pubbl/distr/stampa | [Place of publication not identified], : ACM, 2010 |
| Descrizione fisica | 1 online resource (64 pages) |
| Collana | ACM Conferences |
| Soggetto topico |
Electrical & Computer Engineering
Engineering & Applied Sciences Telecommunications |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | DIM '10 |
| Record Nr. | UNINA-9910376004803321 |
| [Place of publication not identified], : ACM, 2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Three-Dimensional Integration of Semiconductors : Processing, Materials, and Applications / / edited by Kazuo Kondo, Morihiro Kada, Kenji Takahashi
| Three-Dimensional Integration of Semiconductors : Processing, Materials, and Applications / / edited by Kazuo Kondo, Morihiro Kada, Kenji Takahashi |
| Edizione | [1st ed. 2015.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2015 |
| Descrizione fisica | 1 online resource (423 p.) |
| Disciplina | 621.38152 |
| Soggetto topico |
Electrochemistry
Electrical engineering Semiconductors Mechanical engineering Biomedical engineering Electrical Engineering Mechanical Engineering Biomedical Engineering and Bioengineering |
| ISBN | 3-319-18675-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Research and Development History of Three Dimensional (3D) Integration Technology -- Recent Research and Development Activities of Three Dimensional (3D) Integration Technology -- TSV Processes -- Wafer and Die Bonding Processes -- Metrology and Inspection -- TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability -- Trends in 3D Integrated Circuit (3D-IC) Testing Technology -- Dream Chip Project at ASET. |
| Record Nr. | UNINA-9910298608203321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2015 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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