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Adhesives technology for electronic applications : materials, processing, reliability / / James J. Licari and Dale W. Swanson
| Adhesives technology for electronic applications : materials, processing, reliability / / James J. Licari and Dale W. Swanson |
| Autore | Licari James J |
| Edizione | [2nd ed.] |
| Pubbl/distr/stampa | Boston, : Elsevier, c2011 |
| Descrizione fisica | 1 online resource (415 p.) |
| Disciplina | 621.381 |
| Altri autori (Persone) | SwansonDale W |
| Collana | Materials and processes for electronic applications series |
| Soggetto topico |
Electronics - Materials
Adhesives Electronic packaging |
| ISBN |
1-283-15268-1
9786613152688 1-4377-7890-9 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Front Cover; Dedication; Adhesives Technology for Electronic Applications: Materials, Processing, Reliability; Copyright; Contents; Preface; Acknowledgments; Disclaimer; Chapter 1 -Introduction; 1.1 -Adhesive types and classifications; 1.2 -Summary of packaging technologies; 1.3 -History of adhesives in electronic applications; 1.4 -Comparison of polymer adhesives with metallurgical and vitreous attachment materials; 1.5 -Specifications; 1.6 -Market and market trends; References; Chapter 2 -Functions and theory of adhesives; 2.1 -Mechanical attachment; 2.2 -Electrical connections
2.3 -Thermal dissipation2.4 -Stress dissipation; References; Chapter 3 -Chemistry, Formulation, and Properties of Adhesives; 3.1 -Chemistry; 3.2 -Formulation additives; 3.3 -Formulation processes; 3.4 -Properties; References; Chapter 4 -Adhesive Bonding Processes; 4.1 -Cleaning; 4.2 -Surface treatments; 4.3 -Adhesive dispensing; 4.4 -Placement of devices and components; 4.5 -Curing; 4.6 -Rework; References; Chapter 5 -Applications; 5.1 -General applications; 5.2 -Specific applications; References; Chapter 6 -Reliability; 6.1 -Physics of failure methodology; 6.2 -Failure modes and mechanisms 6.3 -Reliability prediction and modeling6.4 -Qualification, quality control, and specifications; References; Chapter 7 -Test and Inspection Methods; 7.1 -Physical tests; 7.2 -Electrical tests; 7.3 -Environmental tests; 7.4 -Thermal tests; 7.5 -Mechanical and thermomechanical tests; 7.6 -Chemical analysis; References; Appendix; Conversion factors; Abbreviations, Acronyms, and Symbols; Index |
| Record Nr. | UNINA-9911004764503321 |
Licari James J
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| Boston, : Elsevier, c2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Adhesives technology for electronic applications : materials, processes, reliability / / by James J. Licari and Dale W. Swanson
| Adhesives technology for electronic applications : materials, processes, reliability / / by James J. Licari and Dale W. Swanson |
| Autore | Licari James J. <1930-> |
| Pubbl/distr/stampa | Norwich, NY, : William Andrew Pub., c2005 |
| Descrizione fisica | 1 online resource (477 p.) |
| Disciplina | 621.381 |
| Altri autori (Persone) | SwansonDale W |
| Collana | Materials and processes for electronic applications series |
| Soggetto topico |
Electronics - Materials
Adhesives Electronic packaging |
| ISBN |
1-282-01328-9
9786612013287 0-8155-1600-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Front Cover; Adhesives Technology for Electronic Applications: Materials, Processes, Reliability; Copyright Page; Table of Contents; Chapter 1. Introduction; 1.1 ADHESIVE TYPES AND DEFINITIONS; 1.2 SUMMARY OF PACKAGING TECHNOLOGIES; 1.3 HISTORY OF ADHESIVES IN ELECTRONIC APPLICATIONS; 1.4 COMPARISON OF POLYMER ADHESIVES WITH METALLURGICAL AND VITREOUS ATTACHMENT MATERIALS; 1.5 SPECIFICATIONS; 1.6 THE MARKET; REFERENCES; Chapter 2. Functions and Theory of Adhesives; 2.1 MECHANICAL ATTACHMENT; 2.2 ELECTRICAL CONNECTIONS; 2.3 THERMAL DISSIPATION; 2.4 STRESS DISSIPATION; REFERENCES
Chapter 3. Chemistry, Formulation, and Properties of Adhesives3.1 CHEMISTRY; 3.2 FORMULATION; 3.3 PROPERTIES; REFERENCES; Chapter 4. Adhesive Bonding Processes; 4.1 CLEANING; 4.2 SURFACE TREATMENTS; 4.3 ADHESIVE DISPENSING; 4.4 PLACEMENT OF DEVICES AND COMPONENTS; 4.5 CURING; 4.6 REWORK; REFERENCES; Chapter 5. Applications; 5.1 GENERAL APPLICATIONS; 5.2 SPECIFIC APPLICATIONS; REFERENCES; Chapter 6. Reliability; 6.1 FAILURE MODES AND MECHANISMS; 6.2 SPECIFICATIONS; REFERENCES; Chapter 7. Test and Inspection Methods; 7.1 PHYSICAL TESTS; 7.2 ELECTRICAL TESTS; 7.3 ENVIRONMENTAL TESTS 7.4 THERMAL TESTS7.5 MECHANICAL AND THERMOMECHANICAL TESTS; 7.6 CHEMICAL ANALYSIS; REFERENCES; Appendix; CONVERSION FACTORS; ABBREVIATIONS, ACRONYMS, AND SYMBOLS; Index |
| Record Nr. | UNINA-9911004800603321 |
|
Licari James J. <1930->
|
||
| Norwich, NY, : William Andrew Pub., c2005 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||