Structural dynamics of electronic and photonic systems [[electronic resource] /] / edited by Ephraim Suhir, David S. Steinberg, T.X. Yu |
Pubbl/distr/stampa | Hoboken, N.J., : Wiley, 2010 |
Descrizione fisica | 1 online resource (610 p.) |
Disciplina | 621.382 |
Altri autori (Persone) |
SuhirEphraim
YuT. X <1941-> (Tongxi) SteinbergDavid S |
Soggetto topico |
Electronic apparatus and appliances - Reliability
Optoelectronic devices - Reliability Fault tolerance (Engineering) Microstructure Structural dynamics |
ISBN |
1-283-07236-X
9786613072368 0-470-88665-X 0-470-88679-X 0-470-95001-3 0-470-88678-1 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Structural Dynamics of Electronic and Photonic Systems; Contents; Preface; Contributors; 1 Some Major Structural Dynamics-Related Failure Modes and Mechanisms in Micro- and Opto-Electronic Systems and Dynamic Stability of These Systems; 2 Linear Response to Shocks and Vibrations; 3 Linear and Nonlinear Vibrations Caused by Periodic Impulses; 4 Random Vibrations of Structural Elements in Electronic and Photonic Systems; 5 Natural Frequencies and Failure Mechanisms of Electronic and Photonic Structures Subjected to Sinusoidal or Random Vibrations
6 Drop/Impact of Typical Portable Electronic Devices: Experimentation and Modeling7 Shock Test Methods and Test Standards for Portable Electronic Devices; 8 Dynamic Response of Solder Joint Interconnections to Vibration and Shock; 9 Test Equipment, Test Methods, Test Fixtures, and Test Sensors for Evaluating Electronic Equipment; 10 Correlation between Package-Level High-Speed Solder Ball Shear/Pull and Board-Level Mechanical Drop Tests with Brittle Fracture Failure Mode, Strength, and Energy 11 Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging12 Fatigue Damage Evaluation for Microelectronic Components Subjected to Vibration; 13 Vibration Considerations for Sensitive Research and Production Facilities; 14 Applications of Finite Element Analysis: Attributes and Challenges; 15 Shock Simulation of Drop Test of Hard Disk Drives; 16 Shock Protection of Portable Electronic Devices Using a "Cushion" of an Array of Wires (AOW); 17 Board-Level Reliability of Lead-Free Solder under Mechanical Shock and Vibration Loads 18 Dynamic Response of PCB Structures to Shock Loading in Reliability Tests19 Linear Response of Single-Degree-of-Freedom System to Impact Load: Could Shock Tests Adequately Mimic Drop Test Conditions?; 20 Shock Isolation of Micromachined Device for High-g Applications; 21 Reliability Assessment of Microelectronics Packages Using Dynamic Testing Methods; 22 Thermal Cycle and Vibration/Drop Reliability of Area Array Package Assemblies; 23 Could an Impact Load of Finite Duration Be Substituted with an Instantaneous Impulse?; Index |
Record Nr. | UNINA-9910139456003321 |
Hoboken, N.J., : Wiley, 2010 | ||
![]() | ||
Lo trovi qui: Univ. Federico II | ||
|
Structural dynamics of electronic and photonic systems [[electronic resource] /] / edited by Ephraim Suhir, David S. Steinberg, T.X. Yu |
Pubbl/distr/stampa | Hoboken, N.J., : Wiley, 2010 |
Descrizione fisica | 1 online resource (610 p.) |
Disciplina | 621.382 |
Altri autori (Persone) |
SuhirEphraim
YuT. X <1941-> (Tongxi) SteinbergDavid S |
Soggetto topico |
Electronic apparatus and appliances - Reliability
Optoelectronic devices - Reliability Fault tolerance (Engineering) Microstructure Structural dynamics |
ISBN |
1-283-07236-X
9786613072368 0-470-88665-X 0-470-88679-X 0-470-95001-3 0-470-88678-1 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Structural Dynamics of Electronic and Photonic Systems; Contents; Preface; Contributors; 1 Some Major Structural Dynamics-Related Failure Modes and Mechanisms in Micro- and Opto-Electronic Systems and Dynamic Stability of These Systems; 2 Linear Response to Shocks and Vibrations; 3 Linear and Nonlinear Vibrations Caused by Periodic Impulses; 4 Random Vibrations of Structural Elements in Electronic and Photonic Systems; 5 Natural Frequencies and Failure Mechanisms of Electronic and Photonic Structures Subjected to Sinusoidal or Random Vibrations
6 Drop/Impact of Typical Portable Electronic Devices: Experimentation and Modeling7 Shock Test Methods and Test Standards for Portable Electronic Devices; 8 Dynamic Response of Solder Joint Interconnections to Vibration and Shock; 9 Test Equipment, Test Methods, Test Fixtures, and Test Sensors for Evaluating Electronic Equipment; 10 Correlation between Package-Level High-Speed Solder Ball Shear/Pull and Board-Level Mechanical Drop Tests with Brittle Fracture Failure Mode, Strength, and Energy 11 Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging12 Fatigue Damage Evaluation for Microelectronic Components Subjected to Vibration; 13 Vibration Considerations for Sensitive Research and Production Facilities; 14 Applications of Finite Element Analysis: Attributes and Challenges; 15 Shock Simulation of Drop Test of Hard Disk Drives; 16 Shock Protection of Portable Electronic Devices Using a "Cushion" of an Array of Wires (AOW); 17 Board-Level Reliability of Lead-Free Solder under Mechanical Shock and Vibration Loads 18 Dynamic Response of PCB Structures to Shock Loading in Reliability Tests19 Linear Response of Single-Degree-of-Freedom System to Impact Load: Could Shock Tests Adequately Mimic Drop Test Conditions?; 20 Shock Isolation of Micromachined Device for High-g Applications; 21 Reliability Assessment of Microelectronics Packages Using Dynamic Testing Methods; 22 Thermal Cycle and Vibration/Drop Reliability of Area Array Package Assemblies; 23 Could an Impact Load of Finite Duration Be Substituted with an Instantaneous Impulse?; Index |
Record Nr. | UNINA-9910830683803321 |
Hoboken, N.J., : Wiley, 2010 | ||
![]() | ||
Lo trovi qui: Univ. Federico II | ||
|
Structural dynamics of electronic and photonic systems / / edited by Ephraim Suhir, David S. Steinberg, T.X. Yu |
Pubbl/distr/stampa | Hoboken, N.J., : Wiley, 2010 |
Descrizione fisica | 1 online resource (610 p.) |
Disciplina | 621.382 |
Altri autori (Persone) |
SuhirEphraim
YuT. X <1941-> (Tongxi) SteinbergDavid S |
Soggetto topico |
Electronic apparatus and appliances - Reliability
Optoelectronic devices - Reliability Fault tolerance (Engineering) Microstructure Structural dynamics |
ISBN |
1-283-07236-X
9786613072368 0-470-88665-X 0-470-88679-X 0-470-95001-3 0-470-88678-1 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Structural Dynamics of Electronic and Photonic Systems; Contents; Preface; Contributors; 1 Some Major Structural Dynamics-Related Failure Modes and Mechanisms in Micro- and Opto-Electronic Systems and Dynamic Stability of These Systems; 2 Linear Response to Shocks and Vibrations; 3 Linear and Nonlinear Vibrations Caused by Periodic Impulses; 4 Random Vibrations of Structural Elements in Electronic and Photonic Systems; 5 Natural Frequencies and Failure Mechanisms of Electronic and Photonic Structures Subjected to Sinusoidal or Random Vibrations
6 Drop/Impact of Typical Portable Electronic Devices: Experimentation and Modeling7 Shock Test Methods and Test Standards for Portable Electronic Devices; 8 Dynamic Response of Solder Joint Interconnections to Vibration and Shock; 9 Test Equipment, Test Methods, Test Fixtures, and Test Sensors for Evaluating Electronic Equipment; 10 Correlation between Package-Level High-Speed Solder Ball Shear/Pull and Board-Level Mechanical Drop Tests with Brittle Fracture Failure Mode, Strength, and Energy 11 Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging12 Fatigue Damage Evaluation for Microelectronic Components Subjected to Vibration; 13 Vibration Considerations for Sensitive Research and Production Facilities; 14 Applications of Finite Element Analysis: Attributes and Challenges; 15 Shock Simulation of Drop Test of Hard Disk Drives; 16 Shock Protection of Portable Electronic Devices Using a "Cushion" of an Array of Wires (AOW); 17 Board-Level Reliability of Lead-Free Solder under Mechanical Shock and Vibration Loads 18 Dynamic Response of PCB Structures to Shock Loading in Reliability Tests19 Linear Response of Single-Degree-of-Freedom System to Impact Load: Could Shock Tests Adequately Mimic Drop Test Conditions?; 20 Shock Isolation of Micromachined Device for High-g Applications; 21 Reliability Assessment of Microelectronics Packages Using Dynamic Testing Methods; 22 Thermal Cycle and Vibration/Drop Reliability of Area Array Package Assemblies; 23 Could an Impact Load of Finite Duration Be Substituted with an Instantaneous Impulse?; Index |
Record Nr. | UNINA-9910841067603321 |
Hoboken, N.J., : Wiley, 2010 | ||
![]() | ||
Lo trovi qui: Univ. Federico II | ||
|