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The ESD control program handbook [[electronic resource] /] / Jeremy M Smallwood, Electrostatic Solutions Ltd, Southampton, Southampton, UK
The ESD control program handbook [[electronic resource] /] / Jeremy M Smallwood, Electrostatic Solutions Ltd, Southampton, Southampton, UK
Autore Smallwood J. M (Jeremy M.)
Edizione [First edition.]
Pubbl/distr/stampa Hoboken, New Jersey : , : John Wiley & Sons, Inc., , [2020]
Descrizione fisica 1 online resource (541 pages)
Disciplina 537.52
Collana IEEE
Soggetto topico Electric discharges
ISBN 1-118-69455-4
1-118-69457-0
1-118-69454-6
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto 11.4 Environmental conditions -- 11.5 Summary of the standard test methods and their applications -- 11.6 Measurement equipment -- 11.6.1 Choosing a resistance meter for high resistance measurements -- 11.6.2 Low resistance meter for soldering iron grounding test -- 11.6.3 Resistance measurement electrodes -- 11.6.4 Concentric ring electrodes for packaging surface and volume resistance measurement -- 11.6.5 Two-point probe for packaging surface resistance measurements -- 11.6.6 Footwear test electrode -- 11.6.7 Hand-held electrode -- 11.6.8 Tool test electrode -- 11.6.9 Metal plate electrode for volume resistance measurements -- 11.6.10 Insulating supports -- 11.6.11 ESD ground connectors -- 11.6.12 Electrostatic field meters and voltmeters -- 11.6.13 Charge Plate Monitors (CPM) -- 11.7 Common problems with measurements -- 11.7.1 Humidity -- 11.7.2 Accidental measurement of parallel paths -- 11.8 Standard measurements specified by IEC 61340-5-1 and ANSI/ESD S20.20 -- 11.8.1 Resistance to ground -- 11.8.2 Point to point resistance -- 11.8.3 Personal grounding equipment tests -- 11.8.4 Surface resistance of packaging materials -- 11.8.5 Volume resistance of packaging materials -- 11.8.6 ESD Shielding of bags -- 11.8.7 Evaluation of ESD Shielding of packaging systems -- 11.8.8 Measurement of ioniser decay time and offset voltage -- 11.8.9 Walk test of footwear and flooring -- 11.9 Useful measurements not specified by IEC 61340-5-1 and ESD S20.20 -- 11.9.1 Electrostatic fields and voltages -- 11.9.2 Measurement of electric fields at the position of the ESDS -- 11.9.3 Measurement of surface voltages on large objects using an electrostatic field meter calibrated as a surface voltmeter -- 11.9.4 Measurement of voltage on devices or small conductors -- 11.9.5 Resistance of tools -- 11.9.6 Resistance of soldering irons -- 11.9.7 Resistance of gloves or finger cots -- 11.9.8 Charge decay measurements -- 11.9.9 Faraday pail measurement of charge on an object -- 11.9.10 ESD event detection.
References -- Bibliographý -- 12 ESD Training -- 12.1 Why do we need ESD training? -- 12.2 Training planning -- 12.3 Who needs training? -- 12.4 Training form and content -- 12.4.1 Training goals -- 12.4.2 Initial training -- 12.4.3 Refresher training -- 12.4.4 Training methods -- 12.4.5 Supporting information -- 12.4.6 Training considerations -- 12.4.7 Public tutorials and courses -- 12.4.8 Qualifications and Certification -- 12.4.9 National and International ESD groups and electrostatics interest organisations -- 12.4.10 Conferences -- 12.4.11 Books, articles and online resources -- 12.5 Electrostatic and ESD theory -- 12.5.1 The prós and cońs of theory -- 12.5.2 A technical and non-technical explanation of electrostatic charging -- 12.6 Demonstrations of ESD control related issues -- 12.6.1 The role of demonstrations -- 12.6.2 Demonstrating real ESD damage -- 12.6.3 The cost of ESD damage -- 12.7 Electrostatic demonstrations -- 12.7.1 The value of electrostatic demonstrations -- 12.7.2 The prós and cońs of demonstrations -- 12.7.3 Useful equipment for demonstrations -- 12.7.4 Showing how easy it is to generate electrostatic charge -- 12.7.5 Understanding electrostatic fields -- 12.7.6 Understanding charge and voltage -- 12.7.7 Tribocharging -- 12.7.8 Production of ESD -- 12.7.9 Equipotential bonding and grounding -- 12.7.10 Induction charging -- 12.7.11 ESD on demand ́ the ́perpetual ESD generatoŕ -- 12.7.12 Body voltage and personal grounding -- 12.7.13 Charge generation and electrostatic field shielding of bags -- 12.7.14 Insulators cannot be grounded -- 12.7.15 Neutralising charge - Charge decay and voltage offset of ionisers -- 12.8 Evaluation -- 12.8.1 The need for evaluation -- 12.8.2 Practical test -- 12.8.3 Written tests -- 12.8.4 Pass criteria -- References -- Bibliography -- 13 The future -- 13.1 General trends -- 13.2 ESD withstand voltage trends -- 13.2.1 Integrated circuit ESD withstand voltage trends -- 13.2.2 Other component ESD withstand voltage trends.
13.2.3 Availability of ESD withstand voltage data -- 13.2.4 Device ESD withstand test -- 13.3 ESD control programs and process controls -- 13.3.1 ESD control program development strategies -- 13.3.2 Human body ESD -- 13.3.3 ESD between ESDS and conductive items -- 13.3.4 Charged board, module and cable discharge events -- 13.3.5 Optimisation -- 13.4 Standards -- 13.5 ESD control equipment and materials -- 13.5.1 ESD control materials -- 13.5.2 ESD protective packaging -- 13.6 ESD related measurements -- 13.6.1 ESD protective packaging measurements -- 13.6.2 Voltage measurement on ESDS and ungrounded conductors -- 13.6.3 Measurements related to ESD risk in automated handling equipment -- 13.7 System ESD immunity -- 13.8 Education and training -- References -- Bibliography -- Appendix A. An example draft ESD control program -- A. ESD program plan at XXX LTD -- A.1 Introduction -- A.2 Scope -- A.3 Terms and definitions -- A.4 Personal safety -- A.5 ESD control program -- A.5.1 ESD control program requirements -- A.5.2 ESD Coordinator -- A.5.3 Tailoring ESD control requirements -- A.6 ESD control program technical requirements -- A.6.1 ESD ground -- A.6.2 Personal grounding -- A.6.3 ESD Protected Areas (EPA) -- A.6.4 ESD protective packaging -- A.6.5 Marking of ESD related items -- A.7 Compliance verification plan -- A.8 ESD training plan -- A.8.1 General requirements of the ESD Training Plan -- A.8.2 Training records -- A.8.3 Training content and frequency -- A.9 ESD control product qualification -- A.10 ESD control program references -- References.
Introduction -- Foreword -- Preface -- Acknowledgements -- 1 Definitions and Terminology -- 1.1 Scientific notation and SI unit prefixes -- 1.2 Charge, electrostatic fields and voltage -- 1.2.1 Charge -- 1.2.2 Ions -- 1.2.3 Dissipation and neutralization of electrostatic charge -- 1.2.4 Voltage (potential) -- 1.2.5 Electric or electrostatic field -- 1.2.6 Gausśs Law -- 1.2.7 Electrostatic attraction (ESA) -- 1.2.8 Permittivity -- 1.3 Electric current -- 1.4 Electrostatic discharge (ESD) -- 1.4.1 ESD Models -- 1.4.2 ElectroMagnetic Interference (EMI) -- 1.5 Earthing, grounding and equipotential bonding -- 1.6 Power and Energy -- 1.7 Resistance, resistivity and conductivity -- 1.7.1 Resistance -- 1.7.2 Resistivity and conductivity -- 1.7.2.1 Surface resistivity and surface resistance -- 1.7.2.2 Volume resistance, volume resistivity and conductivity -- 1.7.3 Insulators, conductors, conductive, dissipative and antistatic materials -- 1.7.4 Point to point resistance -- 1.7.5 Resistance to ground -- 1.7.6 Combination of resistances -- 1.8 Capacitance -- 1.9 Shielding -- 1.10 Dielectric breakdown strength -- 1.11 Relative humidity and dew point -- References -- 2 The principles of static electricity and electrostatic discharge (ESD) control -- 2.1 Overview -- 2.2 Contact charge generation (triboelectrification) -- 2.2.1 The polarity and magnitude of charging -- 2.3 Electrostatic charge build-up and dissipation -- 2.3.1 A simple electrical model of electrostatic charge build-up -- 2.3.2 Capacitance is variable -- 2.3.3 Charge decay time -- 2.3.4 Conductors and insulators revisited -- 2.3.5 The effect of relative humidity -- 2.4 Conductors in electrostatic fields -- 2.4.1 Voltage on conducting and insulating bodies and surfaces -- 2.4.2 Electrostatic field in practical situations -- 2.4.3 Faraday cage -- 2.4.4 Induction: An isolated conductive object attains a voltage when in an electric field -- 2.4.1 Induction charging: An object can become charged by grounding it -- 2.4.2 Faraday pail and shielding of charges within a closed object.
2.5 Electrostatic discharges -- 2.5.1 ESD (sparks) between conducting objects -- 2.5.2 ESD from insulating surfaces -- 2.5.3 Corona discharge -- 2.5.4 Other types of discharge -- 2.6 Common electrostatic discharge sources -- 2.6.1 ESD from the human body -- 2.6.2 ESD from charged conductive objects -- 2.6.3 Charged device ESD -- 2.6.4 ESD from a charged board -- 2.6.5 ESD from a charged module -- 2.6.6 ESD from charged cables -- 2.7 Electronic models of ESD -- 2.8 Electrostatic attraction (ESA) -- 2.8.1 ESA and particle contamination -- 2.8.2 Neutralisation of surface voltages by air ions -- 2.8.3 Ionisers -- 2.8.4 Rate of charge neutralisation -- 2.8.5 The region of effective charge neutralisation around an ioniser -- 2.8.6 Ioniser balance and charging of a surface by an unbalanced ioniser -- 2.9 Electromagnetic interference (EMI) -- 2.10 How to avoid ESD damage of components -- 2.10.1 The circumstances leading to ESD damage of a component -- 2.10.2 Risk of ESD damage -- 2.10.3 The principles of ESD control -- References -- Bibliography -- 3 ESD sensitive devices (ESDS) -- 3.1 What are ESD sensitive devices? -- 3.2 Measuring ESD Susceptibility -- 3.2.1 Modelling electrostatic discharges -- 3.2.2 Standard ESD susceptibility tests -- 3.2.3 ESD withstand voltage -- 3.2.4 Human Body Model component susceptibility test -- 3.2.5 System level Human Body ESD susceptibility test -- 3.2.6 Machine Model component susceptibility test -- 3.2.7 Charged Device Model component susceptibility test -- 3.2.8 Comparison of test methods -- 3.2.9 Failure criteria used in ESD susceptibility test -- 3.2.10 Transmission line pulse techniques -- 3.2.11 The relation between ESD withstand voltage and ESD damage -- 3.2.12 Trends in component ESD test -- 3.3 ESD susceptibility of components -- 3.3.1 Introduction -- 3.3.2 Latent failures -- 3.3.3 Built-in on-chip ESD protection and ESD protection targets -- 3.3.4 ESD sensitivity of typical components -- 3.3.5 Discrete devices -- 3.3.6 The effect of scaling.
3.3.7 Package effects -- 3.4 Some common types of ESD damage -- 3.4.1 Failure mechanisms -- 3.4.2 Breakdown of thin dielectric layers -- 3.4.3 MOSFETs -- 3.4.4 Susceptibility to electrostatic fields and breakdown between closely spaced conductors -- 3.4.5 Semiconductor junctions -- 3.4.6 Field effect structures and non-conductive device lids -- 3.4.7 Piezoelectric crystals -- 3.4.8 Light emitting diodes -- 3.4.9 Magnetoresistive heads -- 3.4.10 MicroElectroMechanical Systems (MEMS) -- 3.4.11 Burnout of device conductors or resistors -- 3.4.12 Passive components -- 3.4.13 Printed circuit boards and assemblies -- 3.4.14 Modules and system components -- 3.5 System level ESD -- 3.5.1 Introduction -- 3.5.2 The relationship between system level immunity and component ESD withstand -- 3.5.3 Charged cable ESD (Cable Discharge Events) -- 3.5.4 System-Efficient ESD Design (SEED) -- References -- Bibliography -- 4.1 Why habits? -- 4.2 The basis of ESD protection -- 4.3 What is an ESDS? -- 4.4 Habit 1: Always handle ESD sensitive components within an ESD Protected Area (EPA) -- 4.4.1 What is an EPA? -- 4.4.2 Defining the EPA boundary -- 4.4.3 Marking the EPA boundary -- 4.4.4 What is an insignificant level of ESD risk? -- 4.4.5 What are the sources of ESD risk? -- 4.4.6 What ESD protection measures are needed in the EPA? -- 4.4.7 Who will decide what ESD protection measures are required? -- 4.5 Habit 2: Where possible avoid use of insulators near ESDS -- 4.5.1 What is an insulator? -- 4.5.2 Essential and non-essential insulators -- 4.5.3 Remove non-essential insulators from the vicinity of ESDS -- 4.6 Habit 3: Reduce ESD risks from essential insulators -- 4.6.1 What is an insulator? -- 4.6.1 Insulators cannot be grounded -- 4.6.2 What to do about ESD risk from essential insulators -- 4.6.3 Using ionisers to reduce charge levels on insulators -- 4.7 Habit 4: Ground conductors, especially people -- 4.7.1 What is a conductor? -- 4.7.2 Conductive, dissipative or insulative? -- 4.7.3 Properties of a conductor.
4.7.4 Charge and voltage decay time -- 4.7.5 The importance of material contact resistance in protecting ESDS -- 4.7.6 Safety considerations -- 4.7.7 Elimination of ESD by grounding and equipotential bonding -- 4.7.8 Understanding the grounding (earth) system -- 4.7.9 Grounding personnel handling ESDS -- 4.7.10 Grounding ESD control equipment -- 4.7.11 What if a conductor cannot be grounded? -- 4.8 Habit 5: Protect ESDS using ESD packaging -- 4.8.1 Dońt take ordinary packaging materials into an EPA -- 4.8.2 The basic functions of ESD packaging -- 4.8.3 Only open ESD packaging within an EPA -- 4.8.4 Dońt put papers or other unsuitable material in a package with an ESDS -- 4.9 Habit 6: Train personnel to know how to use ESD control equipment and procedures -- 4.9.1 Why train people? -- 4.9.2 Who needs ESD training? -- 4.9.3 What training do they need? -- 4.9.4 Refresher training -- 4.10 Habit 7: Check and test to make sure everythinǵs working -- 4.10.1 Why do we need to check and test? -- 4.10.2 What needs to be tested? -- 4.10.3 ESD control product qualification -- 4.10.4 ESD control product or system compliance verification -- 4.10.5 Test methods and pass criteria -- 4.10.6 How often should ESD control items be tested? -- 4.11 The seven habits and ESD standards -- 4.12 Handling very sensitive devices -- 4.13 Controlling other ESD sources -- References -- Bibliography -- 5 Automated systems -- 5.1 What makes automated handling and assembly different? -- 5.2 Conductive, static dissipative and insulative materials -- 5.3 Safety and AHE -- 5.4 Understanding ESD sources and risks -- 5.5 A strategy for ESD control -- 5.5.1 General principles of ESD control in AHE -- 5.5.2 The conditions leading to ESD damage -- 5.5.3 Strategies for ESD control in automated equipment -- 5.5.4 Qualification of ESD control measures -- 5.5.5 Compliance verification of ESD control measures -- 5.5.6 ESD training implications -- 5.5.7 Modification of existing AHE -- 5.6 Determination and implementation of ESD control measures in AHE.
5.6.1 Define the critical path of ESDS -- 5.6.2 Examine the critical path and identify ESD risks -- 5.6.3 Determine appropriate ESD control measures -- 5.6.4 Include ESD control in new equipment specification -- 5.6.5 Document the ESD control measures used in the machine -- 5.6.6 Implement maintenance and compliance verification of ESD control measures -- 5.7 Materials, techniques and equipment used for ESD control in AHE -- 5.7.1 Grounding all conductors that make contact with ESDS -- 5.7.2 Isolated conductors -- 5.7.3 Preventing induced voltages on ESDS -- 5.7.4 Reducing tribocharging of ESDS -- 5.7.5 Using resistive contact materials to limit charged device ESD current -- 5.7.6 Anodisation -- 5.7.7 Bearings -- 5.7.8 Conveyor belts -- 5.7.9 Using ionisers to reduce charge levels on ESDS, essential insulators and isolated conductors -- 5.7.10 Vacuum pickers -- 5.8 ESD protective packaging -- 5.9 Measurements in AHE -- 5.9.1 Overview of measurements in AHE -- 5.9.2 Resistance measurements -- 5.9.3 Electrostatic field and voltage measurements -- 5.9.4 Charge measurements -- 5.9.5 Measurement of the voltage decay time and offset voltage due to neutralization by an ionizer -- 5.9.6 ESD current measurements -- 5.9.7 Detection of ESD using EMI detectors -- 5.1 Handling very sensitive components -- References -- Bibliography -- 6 ESD control standards -- 6.1 Introduction -- 6.2 The development of ESD control standards -- 6.3 Who writes the standards? -- 6.4 The IEC and ESDA standards -- 6.4.1 Standards numbering -- 6.4.2 The language of standards -- 6.4.3 Definitions used in standards -- 6.5 Requirements of IEC61340-5-1 and ANSI/ESD S20.20 standards -- 6.5.1 Background -- 6.5.2 Documentation and planning -- 6.5.3 Technical basis of the ESD control program -- 6.5.4 Personal safety -- 6.5.5 ESD Coordinator -- 6.5.6 Tailoring the ESD program -- 6.5.7 The ESD Program Plan -- 6.5.8 Training Plan -- 6.5.9 Product Qualification Plan -- 6.5.10 Compliance Verification Plan -- 6.5.11 Test methods.
6.5.12 ESD Control Program Plan technical requirements -- 6.5.13 ESD Packaging -- 6.5.14 Marking -- References -- Bibliography -- 7 Selection, use, care and maintenance of equipment and materials for ESD control -- 7.1 Introduction -- 7.1.1 Selection and qualification of equipment -- 7.1.2 Use -- 7.1.3 Cleaning, care and maintenance of equipment -- 7.1.4 Compliance verification -- 7.2 ESD control earth (ground) -- 7.2.1 What does the ESD control earth do? -- 7.2.2 Choosing an ESD control earth -- 7.2.3 Qualification of ESD control earth -- 7.2.4 Compliance verification of ESD control earth -- 7.2.5 Common problems with ground connections -- 7.3 The ESD control floor -- 7.3.1 What does an ESD control floor do? -- 7.3.2 Permanent ESD control floor material -- 7.3.3 Semi-permanent or non-permanent ESD control floor materials -- 7.3.4 Selection of floor materials -- 7.3.5 Floor material qualification test -- 7.3.6 Acceptance of a floor installation -- 7.3.7 Use of floor materials -- 7.3.8 Care and maintenance of floors -- 7.3.9 Compliance verification test -- 7.3.10 Common problems -- 7.4 Earth bonding -- 7.4.1 The role of earth bonding points -- 7.4.2 Selection of earth bonding points -- 7.4.3 Qualification of earth bonding points -- 7.4.4 Use of earth bonding points -- 7.4.5 Compliance verification of earth bonding points -- 7.5 Personal grounding -- 7.5.1 What is the purpose of personal grounding? -- 7.5.2 Personal grounding and electrical safety -- 7.5.3 Wrist straps -- 7.5.4 Footwear and flooring grounding -- 7.5.5 Grounding via ESD control seating -- 7.5.1 Personal grounding via an ESD garment -- 7.6 Work surfaces -- 7.6.1 What does a work surface do? -- 7.6.2 Types of work surfaces -- 7.6.3 Selection of a work surface -- 7.6.4 Workstation qualification test -- 7.6.5 Acceptance of work surfaces -- 7.6.6 Cleaning and maintenance of work surfaces -- 7.6.7 Compliance verification test of work surfaces -- 7.6.8 Common problems -- 7.7 Storage racks and shelves -- 7.7.1 Should it be an EPA rack or shelf?.
7.7.2 Selection, care and maintenance of racks and shelves -- 7.7.3 Qualification test of EPA shelves and racks -- 7.7.4 Acceptance of shelves and racks -- 7.7.5 Cleaning and maintenance of shelves and racks -- 7.7.6 Compliance verification test of shelves and racks -- 7.7.7 Common problems -- 7.8 Trolleys, carts and mobile equipment -- 7.8.1 Types of trolleys, carts and mobile equipment -- 7.8.2 Selection, care and maintenance of trolleys, carts and mobile equipment -- 7.8.3 Qualification of trolleys, carts and mobile equipment -- 7.8.4 Compliance verification of trolleys, carts and mobile equipment -- 7.8.5 Common problems -- 7.9 Seats -- 7.9.1 What is an ESD control seat for? -- 7.9.2 Types of ESD seating -- 7.9.3 Selection of seating -- 7.9.4 Qualification test of seating -- 7.9.5 Cleaning and maintenance of seating -- 7.9.6 Compliance verification test of seating -- 7.9.7 Common problems -- 7.9.8 Personal grounding via ESD control seating -- 7.10 Ionisers -- 7.10.1 What does an ioniser do? -- 7.10.2 Ion sources -- 7.10.3 Types of ioniser system -- 7.10.4 Selection of ionisers -- 7.10.5 Qualification test of ionisers -- 7.10.6 Cleaning and maintenance of ionisers -- 7.10.7 Compliance verification test of ionisers -- 7.10.8 Common problems -- 7.11 ESD control garments -- 7.11.1 What does an ESD control garment do? -- 7.11.2 Types of ESD control garments -- 7.11.3 Selection of ESD control garments -- 7.11.4 Qualification test of ESD control garments -- 7.11.5 Use of ESD control garments -- 7.11.6 Cleaning and maintenance of ESD control garments -- 7.11.7 Compliance verification of ESD control garments -- 7.11.8 Personal grounding via an ESD garment -- 7.12 Hand tools -- 7.12.1 Why have ESD hand tools? -- 7.12.2 Types of hand tool -- 7.12.3 Qualification test of hand tools -- 7.12.4 Use of hand tools -- 7.12.5 Compliance verification test of hand tools -- 7.12.6 Common problems with ESD control hand tools -- 7.13 Soldering or desoldering irons -- 7.13.1 ESD control issues with soldering or desoldering irons.
7.13.2 Qualification of soldering irons -- 7.13.3 Compliance verification of soldering irons -- 7.14 Gloves and finger cots -- 7.14.1 Why have gloves and finger cots? -- 7.14.2 Types of gloves and finger cots -- 7.14.3 Selection of gloves or finger cots for ESD control -- 7.14.4 Qualification test of gloves and finger cots -- 7.14.5 Cleaning and maintenance of gloves -- 7.14.6 Compliance verification test of gloves and finger cots -- 7.14.7 Common problems with gloves and finger cots -- 7.15 Marking of ESD control equipment -- References -- Bibliography -- 8 ESD control packaging -- 8.1 Why is packaging important in ESD control? -- 8.2 Packaging functions -- 8.3 ESD control packaging terminology -- 8.3.1 Terminology in general usage -- 8.1 ESD packaging properties -- 8.1.1 Triboelectric charging -- 8.1.2 Surface resistance -- 8.1.3 Volume resistance -- 8.1.4 Electrostatic field shielding -- 8.1.5 ESD shielding -- 8.2 Use of ESD protective packaging -- 8.2.1 The importance of ESD packaging properties -- 8.2.2 Packaging used within the EPA -- 8.2.3 Packaging used to protect ESDS outside the EPA -- 8.2.4 Packaging used for non-ESD susceptible items -- 8.2.5 Avoiding charged cables and modules -- 8.3 Materials and processes used in ESD protective packaging -- 8.3.1 Introduction -- 8.3.2 Antistats, pink polythene and low charging materials -- 8.3.1 Static dissipative and conductive polymers -- 8.3.2 Intrinsically conductive or dissipative polymers -- 8.3.3 Metallised film -- 8.3.4 Anodised aluminium -- 8.3.5 Vacuum forming of filled polymers -- 8.3.6 Injection moulding -- 8.3.7 Embossing -- 8.3.8 Vapour deposition -- 8.3.9 Surface coating -- 8.3.10 Lamination -- 8.4 Types and forms of ESD protective packaging -- 8.4.1 Bags -- 8.4.2 Bubble wrap -- 8.4.3 Foam -- 8.4.4 Boxes, trays and PCB racks -- 8.4.5 Tape and reel -- 8.4.1 Sticks (tubes) -- 8.4.2 Self-adhesive tapes and labels -- 8.5 Packaging standards -- 8.5.1 ESD control and protection packaging standards -- 8.5.2 Moisture barrier packaging standards.
8.5.3 ESD control packaging measurements -- 8.6 How to select an appropriate packaging system -- 8.6.1 Introduction -- 8.6.2 Customer requirements -- 8.6.3 What is the form of the ESDS? -- 8.6.4 ESD threats and ESD susceptibility -- 8.6.5 The intended packaging task -- 8.6.6 Evaluate the operational environment for the packaging -- 8.6.7 Selecting the ESD packaging type and ESD protective functions -- 8.6.8 Testing the packaging system -- 8.7 Marking of ESD protective packaging -- References -- Bibliography -- 9 How to evaluate an ESD Control Program -- 9.1 Introduction -- 9.2 Evaluation of ESD risks -- 9.2.1 Sources of ESD risk -- 9.2.2 Evaluation of ESD susceptibility of components and assemblies 2 -- 9.3 Evaluating process capability based on HBM, MM and CDM data -- 9.3.1 Process capability evaluation -- 9.3.2 Human body ESD and manual handling processes -- 9.3.3 ESD risk due to ungrounded conductors -- 9.3.4 Charged device ESD risks -- 9.3.5 Damage to voltage sensitive structures such as a capacitor or a MOSFET gate -- 9.3.6 Evaluating ESD risk from electrostatic fields -- 9.3.7 Troubleshooting -- 9.4 Evaluating ESD protection needs -- 9.4.1 Standard ESD control precautions do not necessarily address all ESD risks -- 9.4.2 Evaluating return on investment for ESD protection measures -- 9.4.3 What is the maximum acceptable resistance to ground? -- 9.4.4 Should there be a minimum resistance to ground? -- 9.4.5 ESD from charged tools -- 9.4.6 Use of gloves or finger cots -- 9.4.7 Charged cable ESD -- 9.4.8 Charged board ESD -- 9.4.9 Charged module or assembly ESD -- 9.5 Evaluation of cost effectiveness of the ESD control program -- 9.5.1 The cost of an inadequate ESD control program -- 9.5.2 The benefit arising from of the ESD control program -- 9.5.3 Evaluation of the cost of an ESD control program -- 9.5.4 Return on investment (ROI) in ESD control -- 9.5.5 Optimising an ESD control program -- 9.6 Evaluation of compliance of an ESD control program with a standard.
9.6.1 Two steps to compliance evaluation -- 9.6.2 Using checklists to evaluate compliance of documentation with a standard -- 9.6.3 Evaluation of compliance of a facility with the ESD control program -- 9.6.4 Common Problems -- References -- 10 How to develop an ESD control program -- 10.1 What do we need for a successful ESD control program? -- 10.1.1 The ESD control strategy -- 10.1.2 How to develop an ESD control program -- 10.1.3 Safety and ESD control -- 10.2 The EPA -- 10.2.1 Where do I need an EPA? -- 10.2.2 Boundaries and signage -- 10.3 What are the sources of ESD risk in the EPA? -- 10.4 How to determine appropriate ESD measures -- 10.4.1 ESD control principles -- 10.4.2 Select convenient ways of working -- 10.5 Documentation of ESD procedures -- 10.5.1 What should the documentation cover? -- 10.5.2 Writing an ESD Control Program Plan that is compliant with a standard -- 10.5.3 Introduction section -- 10.5.4 Scope -- 10.5.5 Terms and definitions -- 10.5.6 Personal safety -- 10.5.7 ESD Control Program -- 10.5.8 ESD Program Plan -- 10.5.9 ESD Training Plan -- 10.5.10 ESD control product qualification -- 10.5.11 Compliance verification plan -- 10.5.12 ESD Program Technical requirements -- 10.5.13 ESD Protected areas -- 10.5.14 ESD protective packaging -- 10.5.15 Marking of ESD related items -- 10.5.16 References -- 10.6 Evaluating ESD protection needs -- 10.7 Optimising the ESD control program -- 10.7.1 Costs and benefits of ESD control -- 10.7.2 Strategies for optimisation -- 10.8 Considerations for specific areas of the facility -- 10.8.1 The varying ESD control requirements of different areas -- 10.8.2 Goods In and Stores -- 10.8.3 Kitting -- 10.8.4 Despatch -- 10.8.5 Test -- 10.8.6 Research and development -- 10.9 Update and improvement -- 11 ESD Measurements -- 11.1 Introduction -- 11.2 Standard measurements -- 11.3 Product qualification or compliance verification? -- 11.3.1 Measurement methods for Product Qualification -- 11.3.2 Measurement methods for Compliance Verification.
Record Nr. UNINA-9910554838903321
Smallwood J. M (Jeremy M.)  
Hoboken, New Jersey : , : John Wiley & Sons, Inc., , [2020]
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The ESD control program handbook [[electronic resource] /] / Jeremy M Smallwood, Electrostatic Solutions Ltd, Southampton, Southampton, UK
The ESD control program handbook [[electronic resource] /] / Jeremy M Smallwood, Electrostatic Solutions Ltd, Southampton, Southampton, UK
Autore Smallwood J. M (Jeremy M.)
Edizione [First edition.]
Pubbl/distr/stampa Hoboken, New Jersey : , : John Wiley & Sons, Inc., , [2020]
Descrizione fisica 1 online resource (541 pages)
Disciplina 537.52
Collana IEEE
Soggetto topico Electric discharges
ISBN 1-118-69455-4
1-118-69457-0
1-118-69454-6
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto 11.4 Environmental conditions -- 11.5 Summary of the standard test methods and their applications -- 11.6 Measurement equipment -- 11.6.1 Choosing a resistance meter for high resistance measurements -- 11.6.2 Low resistance meter for soldering iron grounding test -- 11.6.3 Resistance measurement electrodes -- 11.6.4 Concentric ring electrodes for packaging surface and volume resistance measurement -- 11.6.5 Two-point probe for packaging surface resistance measurements -- 11.6.6 Footwear test electrode -- 11.6.7 Hand-held electrode -- 11.6.8 Tool test electrode -- 11.6.9 Metal plate electrode for volume resistance measurements -- 11.6.10 Insulating supports -- 11.6.11 ESD ground connectors -- 11.6.12 Electrostatic field meters and voltmeters -- 11.6.13 Charge Plate Monitors (CPM) -- 11.7 Common problems with measurements -- 11.7.1 Humidity -- 11.7.2 Accidental measurement of parallel paths -- 11.8 Standard measurements specified by IEC 61340-5-1 and ANSI/ESD S20.20 -- 11.8.1 Resistance to ground -- 11.8.2 Point to point resistance -- 11.8.3 Personal grounding equipment tests -- 11.8.4 Surface resistance of packaging materials -- 11.8.5 Volume resistance of packaging materials -- 11.8.6 ESD Shielding of bags -- 11.8.7 Evaluation of ESD Shielding of packaging systems -- 11.8.8 Measurement of ioniser decay time and offset voltage -- 11.8.9 Walk test of footwear and flooring -- 11.9 Useful measurements not specified by IEC 61340-5-1 and ESD S20.20 -- 11.9.1 Electrostatic fields and voltages -- 11.9.2 Measurement of electric fields at the position of the ESDS -- 11.9.3 Measurement of surface voltages on large objects using an electrostatic field meter calibrated as a surface voltmeter -- 11.9.4 Measurement of voltage on devices or small conductors -- 11.9.5 Resistance of tools -- 11.9.6 Resistance of soldering irons -- 11.9.7 Resistance of gloves or finger cots -- 11.9.8 Charge decay measurements -- 11.9.9 Faraday pail measurement of charge on an object -- 11.9.10 ESD event detection.
References -- Bibliographý -- 12 ESD Training -- 12.1 Why do we need ESD training? -- 12.2 Training planning -- 12.3 Who needs training? -- 12.4 Training form and content -- 12.4.1 Training goals -- 12.4.2 Initial training -- 12.4.3 Refresher training -- 12.4.4 Training methods -- 12.4.5 Supporting information -- 12.4.6 Training considerations -- 12.4.7 Public tutorials and courses -- 12.4.8 Qualifications and Certification -- 12.4.9 National and International ESD groups and electrostatics interest organisations -- 12.4.10 Conferences -- 12.4.11 Books, articles and online resources -- 12.5 Electrostatic and ESD theory -- 12.5.1 The prós and cońs of theory -- 12.5.2 A technical and non-technical explanation of electrostatic charging -- 12.6 Demonstrations of ESD control related issues -- 12.6.1 The role of demonstrations -- 12.6.2 Demonstrating real ESD damage -- 12.6.3 The cost of ESD damage -- 12.7 Electrostatic demonstrations -- 12.7.1 The value of electrostatic demonstrations -- 12.7.2 The prós and cońs of demonstrations -- 12.7.3 Useful equipment for demonstrations -- 12.7.4 Showing how easy it is to generate electrostatic charge -- 12.7.5 Understanding electrostatic fields -- 12.7.6 Understanding charge and voltage -- 12.7.7 Tribocharging -- 12.7.8 Production of ESD -- 12.7.9 Equipotential bonding and grounding -- 12.7.10 Induction charging -- 12.7.11 ESD on demand ́ the ́perpetual ESD generatoŕ -- 12.7.12 Body voltage and personal grounding -- 12.7.13 Charge generation and electrostatic field shielding of bags -- 12.7.14 Insulators cannot be grounded -- 12.7.15 Neutralising charge - Charge decay and voltage offset of ionisers -- 12.8 Evaluation -- 12.8.1 The need for evaluation -- 12.8.2 Practical test -- 12.8.3 Written tests -- 12.8.4 Pass criteria -- References -- Bibliography -- 13 The future -- 13.1 General trends -- 13.2 ESD withstand voltage trends -- 13.2.1 Integrated circuit ESD withstand voltage trends -- 13.2.2 Other component ESD withstand voltage trends.
13.2.3 Availability of ESD withstand voltage data -- 13.2.4 Device ESD withstand test -- 13.3 ESD control programs and process controls -- 13.3.1 ESD control program development strategies -- 13.3.2 Human body ESD -- 13.3.3 ESD between ESDS and conductive items -- 13.3.4 Charged board, module and cable discharge events -- 13.3.5 Optimisation -- 13.4 Standards -- 13.5 ESD control equipment and materials -- 13.5.1 ESD control materials -- 13.5.2 ESD protective packaging -- 13.6 ESD related measurements -- 13.6.1 ESD protective packaging measurements -- 13.6.2 Voltage measurement on ESDS and ungrounded conductors -- 13.6.3 Measurements related to ESD risk in automated handling equipment -- 13.7 System ESD immunity -- 13.8 Education and training -- References -- Bibliography -- Appendix A. An example draft ESD control program -- A. ESD program plan at XXX LTD -- A.1 Introduction -- A.2 Scope -- A.3 Terms and definitions -- A.4 Personal safety -- A.5 ESD control program -- A.5.1 ESD control program requirements -- A.5.2 ESD Coordinator -- A.5.3 Tailoring ESD control requirements -- A.6 ESD control program technical requirements -- A.6.1 ESD ground -- A.6.2 Personal grounding -- A.6.3 ESD Protected Areas (EPA) -- A.6.4 ESD protective packaging -- A.6.5 Marking of ESD related items -- A.7 Compliance verification plan -- A.8 ESD training plan -- A.8.1 General requirements of the ESD Training Plan -- A.8.2 Training records -- A.8.3 Training content and frequency -- A.9 ESD control product qualification -- A.10 ESD control program references -- References.
Introduction -- Foreword -- Preface -- Acknowledgements -- 1 Definitions and Terminology -- 1.1 Scientific notation and SI unit prefixes -- 1.2 Charge, electrostatic fields and voltage -- 1.2.1 Charge -- 1.2.2 Ions -- 1.2.3 Dissipation and neutralization of electrostatic charge -- 1.2.4 Voltage (potential) -- 1.2.5 Electric or electrostatic field -- 1.2.6 Gausśs Law -- 1.2.7 Electrostatic attraction (ESA) -- 1.2.8 Permittivity -- 1.3 Electric current -- 1.4 Electrostatic discharge (ESD) -- 1.4.1 ESD Models -- 1.4.2 ElectroMagnetic Interference (EMI) -- 1.5 Earthing, grounding and equipotential bonding -- 1.6 Power and Energy -- 1.7 Resistance, resistivity and conductivity -- 1.7.1 Resistance -- 1.7.2 Resistivity and conductivity -- 1.7.2.1 Surface resistivity and surface resistance -- 1.7.2.2 Volume resistance, volume resistivity and conductivity -- 1.7.3 Insulators, conductors, conductive, dissipative and antistatic materials -- 1.7.4 Point to point resistance -- 1.7.5 Resistance to ground -- 1.7.6 Combination of resistances -- 1.8 Capacitance -- 1.9 Shielding -- 1.10 Dielectric breakdown strength -- 1.11 Relative humidity and dew point -- References -- 2 The principles of static electricity and electrostatic discharge (ESD) control -- 2.1 Overview -- 2.2 Contact charge generation (triboelectrification) -- 2.2.1 The polarity and magnitude of charging -- 2.3 Electrostatic charge build-up and dissipation -- 2.3.1 A simple electrical model of electrostatic charge build-up -- 2.3.2 Capacitance is variable -- 2.3.3 Charge decay time -- 2.3.4 Conductors and insulators revisited -- 2.3.5 The effect of relative humidity -- 2.4 Conductors in electrostatic fields -- 2.4.1 Voltage on conducting and insulating bodies and surfaces -- 2.4.2 Electrostatic field in practical situations -- 2.4.3 Faraday cage -- 2.4.4 Induction: An isolated conductive object attains a voltage when in an electric field -- 2.4.1 Induction charging: An object can become charged by grounding it -- 2.4.2 Faraday pail and shielding of charges within a closed object.
2.5 Electrostatic discharges -- 2.5.1 ESD (sparks) between conducting objects -- 2.5.2 ESD from insulating surfaces -- 2.5.3 Corona discharge -- 2.5.4 Other types of discharge -- 2.6 Common electrostatic discharge sources -- 2.6.1 ESD from the human body -- 2.6.2 ESD from charged conductive objects -- 2.6.3 Charged device ESD -- 2.6.4 ESD from a charged board -- 2.6.5 ESD from a charged module -- 2.6.6 ESD from charged cables -- 2.7 Electronic models of ESD -- 2.8 Electrostatic attraction (ESA) -- 2.8.1 ESA and particle contamination -- 2.8.2 Neutralisation of surface voltages by air ions -- 2.8.3 Ionisers -- 2.8.4 Rate of charge neutralisation -- 2.8.5 The region of effective charge neutralisation around an ioniser -- 2.8.6 Ioniser balance and charging of a surface by an unbalanced ioniser -- 2.9 Electromagnetic interference (EMI) -- 2.10 How to avoid ESD damage of components -- 2.10.1 The circumstances leading to ESD damage of a component -- 2.10.2 Risk of ESD damage -- 2.10.3 The principles of ESD control -- References -- Bibliography -- 3 ESD sensitive devices (ESDS) -- 3.1 What are ESD sensitive devices? -- 3.2 Measuring ESD Susceptibility -- 3.2.1 Modelling electrostatic discharges -- 3.2.2 Standard ESD susceptibility tests -- 3.2.3 ESD withstand voltage -- 3.2.4 Human Body Model component susceptibility test -- 3.2.5 System level Human Body ESD susceptibility test -- 3.2.6 Machine Model component susceptibility test -- 3.2.7 Charged Device Model component susceptibility test -- 3.2.8 Comparison of test methods -- 3.2.9 Failure criteria used in ESD susceptibility test -- 3.2.10 Transmission line pulse techniques -- 3.2.11 The relation between ESD withstand voltage and ESD damage -- 3.2.12 Trends in component ESD test -- 3.3 ESD susceptibility of components -- 3.3.1 Introduction -- 3.3.2 Latent failures -- 3.3.3 Built-in on-chip ESD protection and ESD protection targets -- 3.3.4 ESD sensitivity of typical components -- 3.3.5 Discrete devices -- 3.3.6 The effect of scaling.
3.3.7 Package effects -- 3.4 Some common types of ESD damage -- 3.4.1 Failure mechanisms -- 3.4.2 Breakdown of thin dielectric layers -- 3.4.3 MOSFETs -- 3.4.4 Susceptibility to electrostatic fields and breakdown between closely spaced conductors -- 3.4.5 Semiconductor junctions -- 3.4.6 Field effect structures and non-conductive device lids -- 3.4.7 Piezoelectric crystals -- 3.4.8 Light emitting diodes -- 3.4.9 Magnetoresistive heads -- 3.4.10 MicroElectroMechanical Systems (MEMS) -- 3.4.11 Burnout of device conductors or resistors -- 3.4.12 Passive components -- 3.4.13 Printed circuit boards and assemblies -- 3.4.14 Modules and system components -- 3.5 System level ESD -- 3.5.1 Introduction -- 3.5.2 The relationship between system level immunity and component ESD withstand -- 3.5.3 Charged cable ESD (Cable Discharge Events) -- 3.5.4 System-Efficient ESD Design (SEED) -- References -- Bibliography -- 4.1 Why habits? -- 4.2 The basis of ESD protection -- 4.3 What is an ESDS? -- 4.4 Habit 1: Always handle ESD sensitive components within an ESD Protected Area (EPA) -- 4.4.1 What is an EPA? -- 4.4.2 Defining the EPA boundary -- 4.4.3 Marking the EPA boundary -- 4.4.4 What is an insignificant level of ESD risk? -- 4.4.5 What are the sources of ESD risk? -- 4.4.6 What ESD protection measures are needed in the EPA? -- 4.4.7 Who will decide what ESD protection measures are required? -- 4.5 Habit 2: Where possible avoid use of insulators near ESDS -- 4.5.1 What is an insulator? -- 4.5.2 Essential and non-essential insulators -- 4.5.3 Remove non-essential insulators from the vicinity of ESDS -- 4.6 Habit 3: Reduce ESD risks from essential insulators -- 4.6.1 What is an insulator? -- 4.6.1 Insulators cannot be grounded -- 4.6.2 What to do about ESD risk from essential insulators -- 4.6.3 Using ionisers to reduce charge levels on insulators -- 4.7 Habit 4: Ground conductors, especially people -- 4.7.1 What is a conductor? -- 4.7.2 Conductive, dissipative or insulative? -- 4.7.3 Properties of a conductor.
4.7.4 Charge and voltage decay time -- 4.7.5 The importance of material contact resistance in protecting ESDS -- 4.7.6 Safety considerations -- 4.7.7 Elimination of ESD by grounding and equipotential bonding -- 4.7.8 Understanding the grounding (earth) system -- 4.7.9 Grounding personnel handling ESDS -- 4.7.10 Grounding ESD control equipment -- 4.7.11 What if a conductor cannot be grounded? -- 4.8 Habit 5: Protect ESDS using ESD packaging -- 4.8.1 Dońt take ordinary packaging materials into an EPA -- 4.8.2 The basic functions of ESD packaging -- 4.8.3 Only open ESD packaging within an EPA -- 4.8.4 Dońt put papers or other unsuitable material in a package with an ESDS -- 4.9 Habit 6: Train personnel to know how to use ESD control equipment and procedures -- 4.9.1 Why train people? -- 4.9.2 Who needs ESD training? -- 4.9.3 What training do they need? -- 4.9.4 Refresher training -- 4.10 Habit 7: Check and test to make sure everythinǵs working -- 4.10.1 Why do we need to check and test? -- 4.10.2 What needs to be tested? -- 4.10.3 ESD control product qualification -- 4.10.4 ESD control product or system compliance verification -- 4.10.5 Test methods and pass criteria -- 4.10.6 How often should ESD control items be tested? -- 4.11 The seven habits and ESD standards -- 4.12 Handling very sensitive devices -- 4.13 Controlling other ESD sources -- References -- Bibliography -- 5 Automated systems -- 5.1 What makes automated handling and assembly different? -- 5.2 Conductive, static dissipative and insulative materials -- 5.3 Safety and AHE -- 5.4 Understanding ESD sources and risks -- 5.5 A strategy for ESD control -- 5.5.1 General principles of ESD control in AHE -- 5.5.2 The conditions leading to ESD damage -- 5.5.3 Strategies for ESD control in automated equipment -- 5.5.4 Qualification of ESD control measures -- 5.5.5 Compliance verification of ESD control measures -- 5.5.6 ESD training implications -- 5.5.7 Modification of existing AHE -- 5.6 Determination and implementation of ESD control measures in AHE.
5.6.1 Define the critical path of ESDS -- 5.6.2 Examine the critical path and identify ESD risks -- 5.6.3 Determine appropriate ESD control measures -- 5.6.4 Include ESD control in new equipment specification -- 5.6.5 Document the ESD control measures used in the machine -- 5.6.6 Implement maintenance and compliance verification of ESD control measures -- 5.7 Materials, techniques and equipment used for ESD control in AHE -- 5.7.1 Grounding all conductors that make contact with ESDS -- 5.7.2 Isolated conductors -- 5.7.3 Preventing induced voltages on ESDS -- 5.7.4 Reducing tribocharging of ESDS -- 5.7.5 Using resistive contact materials to limit charged device ESD current -- 5.7.6 Anodisation -- 5.7.7 Bearings -- 5.7.8 Conveyor belts -- 5.7.9 Using ionisers to reduce charge levels on ESDS, essential insulators and isolated conductors -- 5.7.10 Vacuum pickers -- 5.8 ESD protective packaging -- 5.9 Measurements in AHE -- 5.9.1 Overview of measurements in AHE -- 5.9.2 Resistance measurements -- 5.9.3 Electrostatic field and voltage measurements -- 5.9.4 Charge measurements -- 5.9.5 Measurement of the voltage decay time and offset voltage due to neutralization by an ionizer -- 5.9.6 ESD current measurements -- 5.9.7 Detection of ESD using EMI detectors -- 5.1 Handling very sensitive components -- References -- Bibliography -- 6 ESD control standards -- 6.1 Introduction -- 6.2 The development of ESD control standards -- 6.3 Who writes the standards? -- 6.4 The IEC and ESDA standards -- 6.4.1 Standards numbering -- 6.4.2 The language of standards -- 6.4.3 Definitions used in standards -- 6.5 Requirements of IEC61340-5-1 and ANSI/ESD S20.20 standards -- 6.5.1 Background -- 6.5.2 Documentation and planning -- 6.5.3 Technical basis of the ESD control program -- 6.5.4 Personal safety -- 6.5.5 ESD Coordinator -- 6.5.6 Tailoring the ESD program -- 6.5.7 The ESD Program Plan -- 6.5.8 Training Plan -- 6.5.9 Product Qualification Plan -- 6.5.10 Compliance Verification Plan -- 6.5.11 Test methods.
6.5.12 ESD Control Program Plan technical requirements -- 6.5.13 ESD Packaging -- 6.5.14 Marking -- References -- Bibliography -- 7 Selection, use, care and maintenance of equipment and materials for ESD control -- 7.1 Introduction -- 7.1.1 Selection and qualification of equipment -- 7.1.2 Use -- 7.1.3 Cleaning, care and maintenance of equipment -- 7.1.4 Compliance verification -- 7.2 ESD control earth (ground) -- 7.2.1 What does the ESD control earth do? -- 7.2.2 Choosing an ESD control earth -- 7.2.3 Qualification of ESD control earth -- 7.2.4 Compliance verification of ESD control earth -- 7.2.5 Common problems with ground connections -- 7.3 The ESD control floor -- 7.3.1 What does an ESD control floor do? -- 7.3.2 Permanent ESD control floor material -- 7.3.3 Semi-permanent or non-permanent ESD control floor materials -- 7.3.4 Selection of floor materials -- 7.3.5 Floor material qualification test -- 7.3.6 Acceptance of a floor installation -- 7.3.7 Use of floor materials -- 7.3.8 Care and maintenance of floors -- 7.3.9 Compliance verification test -- 7.3.10 Common problems -- 7.4 Earth bonding -- 7.4.1 The role of earth bonding points -- 7.4.2 Selection of earth bonding points -- 7.4.3 Qualification of earth bonding points -- 7.4.4 Use of earth bonding points -- 7.4.5 Compliance verification of earth bonding points -- 7.5 Personal grounding -- 7.5.1 What is the purpose of personal grounding? -- 7.5.2 Personal grounding and electrical safety -- 7.5.3 Wrist straps -- 7.5.4 Footwear and flooring grounding -- 7.5.5 Grounding via ESD control seating -- 7.5.1 Personal grounding via an ESD garment -- 7.6 Work surfaces -- 7.6.1 What does a work surface do? -- 7.6.2 Types of work surfaces -- 7.6.3 Selection of a work surface -- 7.6.4 Workstation qualification test -- 7.6.5 Acceptance of work surfaces -- 7.6.6 Cleaning and maintenance of work surfaces -- 7.6.7 Compliance verification test of work surfaces -- 7.6.8 Common problems -- 7.7 Storage racks and shelves -- 7.7.1 Should it be an EPA rack or shelf?.
7.7.2 Selection, care and maintenance of racks and shelves -- 7.7.3 Qualification test of EPA shelves and racks -- 7.7.4 Acceptance of shelves and racks -- 7.7.5 Cleaning and maintenance of shelves and racks -- 7.7.6 Compliance verification test of shelves and racks -- 7.7.7 Common problems -- 7.8 Trolleys, carts and mobile equipment -- 7.8.1 Types of trolleys, carts and mobile equipment -- 7.8.2 Selection, care and maintenance of trolleys, carts and mobile equipment -- 7.8.3 Qualification of trolleys, carts and mobile equipment -- 7.8.4 Compliance verification of trolleys, carts and mobile equipment -- 7.8.5 Common problems -- 7.9 Seats -- 7.9.1 What is an ESD control seat for? -- 7.9.2 Types of ESD seating -- 7.9.3 Selection of seating -- 7.9.4 Qualification test of seating -- 7.9.5 Cleaning and maintenance of seating -- 7.9.6 Compliance verification test of seating -- 7.9.7 Common problems -- 7.9.8 Personal grounding via ESD control seating -- 7.10 Ionisers -- 7.10.1 What does an ioniser do? -- 7.10.2 Ion sources -- 7.10.3 Types of ioniser system -- 7.10.4 Selection of ionisers -- 7.10.5 Qualification test of ionisers -- 7.10.6 Cleaning and maintenance of ionisers -- 7.10.7 Compliance verification test of ionisers -- 7.10.8 Common problems -- 7.11 ESD control garments -- 7.11.1 What does an ESD control garment do? -- 7.11.2 Types of ESD control garments -- 7.11.3 Selection of ESD control garments -- 7.11.4 Qualification test of ESD control garments -- 7.11.5 Use of ESD control garments -- 7.11.6 Cleaning and maintenance of ESD control garments -- 7.11.7 Compliance verification of ESD control garments -- 7.11.8 Personal grounding via an ESD garment -- 7.12 Hand tools -- 7.12.1 Why have ESD hand tools? -- 7.12.2 Types of hand tool -- 7.12.3 Qualification test of hand tools -- 7.12.4 Use of hand tools -- 7.12.5 Compliance verification test of hand tools -- 7.12.6 Common problems with ESD control hand tools -- 7.13 Soldering or desoldering irons -- 7.13.1 ESD control issues with soldering or desoldering irons.
7.13.2 Qualification of soldering irons -- 7.13.3 Compliance verification of soldering irons -- 7.14 Gloves and finger cots -- 7.14.1 Why have gloves and finger cots? -- 7.14.2 Types of gloves and finger cots -- 7.14.3 Selection of gloves or finger cots for ESD control -- 7.14.4 Qualification test of gloves and finger cots -- 7.14.5 Cleaning and maintenance of gloves -- 7.14.6 Compliance verification test of gloves and finger cots -- 7.14.7 Common problems with gloves and finger cots -- 7.15 Marking of ESD control equipment -- References -- Bibliography -- 8 ESD control packaging -- 8.1 Why is packaging important in ESD control? -- 8.2 Packaging functions -- 8.3 ESD control packaging terminology -- 8.3.1 Terminology in general usage -- 8.1 ESD packaging properties -- 8.1.1 Triboelectric charging -- 8.1.2 Surface resistance -- 8.1.3 Volume resistance -- 8.1.4 Electrostatic field shielding -- 8.1.5 ESD shielding -- 8.2 Use of ESD protective packaging -- 8.2.1 The importance of ESD packaging properties -- 8.2.2 Packaging used within the EPA -- 8.2.3 Packaging used to protect ESDS outside the EPA -- 8.2.4 Packaging used for non-ESD susceptible items -- 8.2.5 Avoiding charged cables and modules -- 8.3 Materials and processes used in ESD protective packaging -- 8.3.1 Introduction -- 8.3.2 Antistats, pink polythene and low charging materials -- 8.3.1 Static dissipative and conductive polymers -- 8.3.2 Intrinsically conductive or dissipative polymers -- 8.3.3 Metallised film -- 8.3.4 Anodised aluminium -- 8.3.5 Vacuum forming of filled polymers -- 8.3.6 Injection moulding -- 8.3.7 Embossing -- 8.3.8 Vapour deposition -- 8.3.9 Surface coating -- 8.3.10 Lamination -- 8.4 Types and forms of ESD protective packaging -- 8.4.1 Bags -- 8.4.2 Bubble wrap -- 8.4.3 Foam -- 8.4.4 Boxes, trays and PCB racks -- 8.4.5 Tape and reel -- 8.4.1 Sticks (tubes) -- 8.4.2 Self-adhesive tapes and labels -- 8.5 Packaging standards -- 8.5.1 ESD control and protection packaging standards -- 8.5.2 Moisture barrier packaging standards.
8.5.3 ESD control packaging measurements -- 8.6 How to select an appropriate packaging system -- 8.6.1 Introduction -- 8.6.2 Customer requirements -- 8.6.3 What is the form of the ESDS? -- 8.6.4 ESD threats and ESD susceptibility -- 8.6.5 The intended packaging task -- 8.6.6 Evaluate the operational environment for the packaging -- 8.6.7 Selecting the ESD packaging type and ESD protective functions -- 8.6.8 Testing the packaging system -- 8.7 Marking of ESD protective packaging -- References -- Bibliography -- 9 How to evaluate an ESD Control Program -- 9.1 Introduction -- 9.2 Evaluation of ESD risks -- 9.2.1 Sources of ESD risk -- 9.2.2 Evaluation of ESD susceptibility of components and assemblies 2 -- 9.3 Evaluating process capability based on HBM, MM and CDM data -- 9.3.1 Process capability evaluation -- 9.3.2 Human body ESD and manual handling processes -- 9.3.3 ESD risk due to ungrounded conductors -- 9.3.4 Charged device ESD risks -- 9.3.5 Damage to voltage sensitive structures such as a capacitor or a MOSFET gate -- 9.3.6 Evaluating ESD risk from electrostatic fields -- 9.3.7 Troubleshooting -- 9.4 Evaluating ESD protection needs -- 9.4.1 Standard ESD control precautions do not necessarily address all ESD risks -- 9.4.2 Evaluating return on investment for ESD protection measures -- 9.4.3 What is the maximum acceptable resistance to ground? -- 9.4.4 Should there be a minimum resistance to ground? -- 9.4.5 ESD from charged tools -- 9.4.6 Use of gloves or finger cots -- 9.4.7 Charged cable ESD -- 9.4.8 Charged board ESD -- 9.4.9 Charged module or assembly ESD -- 9.5 Evaluation of cost effectiveness of the ESD control program -- 9.5.1 The cost of an inadequate ESD control program -- 9.5.2 The benefit arising from of the ESD control program -- 9.5.3 Evaluation of the cost of an ESD control program -- 9.5.4 Return on investment (ROI) in ESD control -- 9.5.5 Optimising an ESD control program -- 9.6 Evaluation of compliance of an ESD control program with a standard.
9.6.1 Two steps to compliance evaluation -- 9.6.2 Using checklists to evaluate compliance of documentation with a standard -- 9.6.3 Evaluation of compliance of a facility with the ESD control program -- 9.6.4 Common Problems -- References -- 10 How to develop an ESD control program -- 10.1 What do we need for a successful ESD control program? -- 10.1.1 The ESD control strategy -- 10.1.2 How to develop an ESD control program -- 10.1.3 Safety and ESD control -- 10.2 The EPA -- 10.2.1 Where do I need an EPA? -- 10.2.2 Boundaries and signage -- 10.3 What are the sources of ESD risk in the EPA? -- 10.4 How to determine appropriate ESD measures -- 10.4.1 ESD control principles -- 10.4.2 Select convenient ways of working -- 10.5 Documentation of ESD procedures -- 10.5.1 What should the documentation cover? -- 10.5.2 Writing an ESD Control Program Plan that is compliant with a standard -- 10.5.3 Introduction section -- 10.5.4 Scope -- 10.5.5 Terms and definitions -- 10.5.6 Personal safety -- 10.5.7 ESD Control Program -- 10.5.8 ESD Program Plan -- 10.5.9 ESD Training Plan -- 10.5.10 ESD control product qualification -- 10.5.11 Compliance verification plan -- 10.5.12 ESD Program Technical requirements -- 10.5.13 ESD Protected areas -- 10.5.14 ESD protective packaging -- 10.5.15 Marking of ESD related items -- 10.5.16 References -- 10.6 Evaluating ESD protection needs -- 10.7 Optimising the ESD control program -- 10.7.1 Costs and benefits of ESD control -- 10.7.2 Strategies for optimisation -- 10.8 Considerations for specific areas of the facility -- 10.8.1 The varying ESD control requirements of different areas -- 10.8.2 Goods In and Stores -- 10.8.3 Kitting -- 10.8.4 Despatch -- 10.8.5 Test -- 10.8.6 Research and development -- 10.9 Update and improvement -- 11 ESD Measurements -- 11.1 Introduction -- 11.2 Standard measurements -- 11.3 Product qualification or compliance verification? -- 11.3.1 Measurement methods for Product Qualification -- 11.3.2 Measurement methods for Compliance Verification.
Record Nr. UNINA-9910830354303321
Smallwood J. M (Jeremy M.)  
Hoboken, New Jersey : , : John Wiley & Sons, Inc., , [2020]
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