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Numerical methods in thermal management of electronic systems [[electronic resource] /] / guest editor: Professor K.N. Seetharamu
Numerical methods in thermal management of electronic systems [[electronic resource] /] / guest editor: Professor K.N. Seetharamu
Pubbl/distr/stampa Bradford, England, : Emerald Group Publishing, c2005
Descrizione fisica 1 online resource (115 p.)
Disciplina 532.0050285
Altri autori (Persone) SeetharamuK. N
Collana International journal of numerical methods for heat & fluid flow
Soggetto topico Fluid dynamics - Mathematics
Heat - Transmission - Mathematics
Soggetto genere / forma Electronic books.
ISBN 1-280-50829-9
9786610508297
1-84544-236-9
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto CONTENTS; EDITORIAL ADVISORY BOARD; Editorial; Analysis and optimization of the thermal performance of microchannel heat sinks; Optimization of thermal resistance of stacked micro-channel using genetic algorithms; Thermal analysis of micro-channel heat exchangers with two-phase flow using FEM; Application of computational fluid dynamics simulation tools for thermal characterization of electronic packages; Forced convection heat transfer from solder balls on a printed circuit board using the characteristic based split (CBS)
Steady and unsteady thermal analysis of a triple stack cold plate with heat lossesNote from the publisher
Record Nr. UNINA-9910450040703321
Bradford, England, : Emerald Group Publishing, c2005
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Numerical methods in thermal management of electronic systems [[electronic resource] /] / guest editor: Professor K.N. Seetharamu
Numerical methods in thermal management of electronic systems [[electronic resource] /] / guest editor: Professor K.N. Seetharamu
Pubbl/distr/stampa Bradford, England, : Emerald Group Publishing, c2005
Descrizione fisica 1 online resource (115 p.)
Disciplina 532.0050285
Altri autori (Persone) SeetharamuK. N
Collana International journal of numerical methods for heat & fluid flow
Soggetto topico Fluid dynamics - Mathematics
Heat - Transmission - Mathematics
ISBN 1-280-50829-9
9786610508297
1-84544-236-9
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto CONTENTS; EDITORIAL ADVISORY BOARD; Editorial; Analysis and optimization of the thermal performance of microchannel heat sinks; Optimization of thermal resistance of stacked micro-channel using genetic algorithms; Thermal analysis of micro-channel heat exchangers with two-phase flow using FEM; Application of computational fluid dynamics simulation tools for thermal characterization of electronic packages; Forced convection heat transfer from solder balls on a printed circuit board using the characteristic based split (CBS)
Steady and unsteady thermal analysis of a triple stack cold plate with heat lossesNote from the publisher
Record Nr. UNINA-9910783211603321
Bradford, England, : Emerald Group Publishing, c2005
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Numerical methods in thermal management of electronic systems / / guest editor: Professor K.N. Seetharamu
Numerical methods in thermal management of electronic systems / / guest editor: Professor K.N. Seetharamu
Edizione [1st ed.]
Pubbl/distr/stampa Bradford, England, : Emerald Group Publishing, c2005
Descrizione fisica 1 online resource (115 p.)
Disciplina 532.0050285
Altri autori (Persone) SeetharamuK. N
Collana International journal of numerical methods for heat & fluid flow
Soggetto topico Fluid dynamics - Mathematics
Heat - Transmission - Mathematics
ISBN 1-280-50829-9
9786610508297
1-84544-236-9
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto CONTENTS; EDITORIAL ADVISORY BOARD; Editorial; Analysis and optimization of the thermal performance of microchannel heat sinks; Optimization of thermal resistance of stacked micro-channel using genetic algorithms; Thermal analysis of micro-channel heat exchangers with two-phase flow using FEM; Application of computational fluid dynamics simulation tools for thermal characterization of electronic packages; Forced convection heat transfer from solder balls on a printed circuit board using the characteristic based split (CBS)
Steady and unsteady thermal analysis of a triple stack cold plate with heat lossesNote from the publisher
Record Nr. UNINA-9910807022803321
Bradford, England, : Emerald Group Publishing, c2005
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui