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Metal based thin films for electronics [[electronic resource] /] / Klaus Wetzig, Claus M. Schneider (eds.)
| Metal based thin films for electronics [[electronic resource] /] / Klaus Wetzig, Claus M. Schneider (eds.) |
| Pubbl/distr/stampa | Weinheim, : Wiley-VCH, c2003 |
| Descrizione fisica | 1 online resource (390 p.) |
| Disciplina | 621.38152 |
| Altri autori (Persone) |
WetzigKlaus
SchneiderClaus M (Claus Michael) |
| Soggetto topico |
Thin films
Metallic films |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-280-52109-0
9786610521098 3-527-60647-5 3-527-60253-4 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Metal Based Thin Films for Electronics; List of Contributors; Contents; 1 Introduction; 2 Thin Film Systems: Basic Aspects; 2.1 Interconnects for Microelectronics; 2.1.1 Introduction; 2.1.2 Metallization Layers; 2.1.3 Materials Science of Metallic Interconnects; 2.1.4 Function of Barrier and Nucleation Layers and Materials Selection; 2.2 Metallization Structures in Acoustoelectronics; 2.2.1 Introduction; 2.2.2 Fundamentals of Surface Acoustic Waves; 2.2.3 Interdigital Transducers (IDTs); 2.2.4 Reflector Gratings; 2.2.5 Waveguides, Energy Trapping; 2.2.6 Multistrip Couplers
2.3 Silicide Layers for Electronics2.3.1 Introduction; 2.3.2 The Basic Chemical and Physical Properties; 2.3.3 Preparation of Silicides; 2.3.4 Silicides with Metallic Conductivity; 2.3.5 Semiconducting Silicides; 2.3.6 Heterogeneously Disordered Silicide Films; 2.4 Complex Layered Systems for Magnetoelectronics; 2.4.1 Introduction; 2.4.2 Magnetism: A Primer; 2.4.3 Magnetic Coupling Phenomena; 2.4.4 Electric Transport in Layered Magnetic Systems; 2.4.5 Functional Thin Film Systems; 2.5 Multilayer and Single-Surface Reflectors for X-Ray Optics; 2.5.1 Introduction 2.5.2 Refraction and Reflection at Single Boundaries2.5.3 Bragg Reflection at 1D Lattice Systems; 2.5.4 Multilayer Preparation; References; 3 Thin Film Preparation and Characterization Techniques; 3.1 Thin Film Preparation Methods; 3.1.1 Introduction; 3.1.2 Physical Vapor Deposition; 3.1.3 Chemical Vapor Deposition; 3.1.4 Non-Vacuum Based Deposition; 3.1.5 Outlook; 3.2 Electron Microscopy and Diffraction; 3.2.1 Transmission Electron Microscopy (TEM) - Imaging; 3.2.2 TEM - Selected Area Electron Diffraction; 3.2.3 In situ-SEM Methods; 3.2.4 Electron Backscatter Diffraction 3.3 X-Ray Scattering Techniques3.3.1 Wide Angle Diffraction; 3.3.2 Reflectometry; 3.3.3 Soft X-Rays and Magnetic Scattering; 3.4 Spectroscopic Techniques; 3.4.1 Element Distribution Analysis; 3.4.2 Element Depth Profile Analysis; 3.5 Stress Measurement Techniques; 3.5.1 Stress and Strain; 3.5.2 Substrate Curvature; 3.5.3 Measurement Techniques; References; 4 Challenges for Thin Film Systems Characterization and Optimization; 4.1 Electromigration in Metallization Layers; 4.1.1 Fundamentals; 4.1.2 Methods for Quantitative Damage Analysis; 4.1.3 Al Interconnects; 4.1.4 Cu Interconnects 4.2 Barrier and Nucleation Layers for Interconnects4.2.1 Introduction; 4.2.2 PVD Barrier Layers for Copper Interconnects; 4.2.3 Barrier/Seed Microstructure and Step Coverage; 4.2.4 New Barrier/Seed Concepts using CVD and ALD; 4.2.5 Atomic Layer Deposition (ALD); 4.3 Acoustomigration in Surface Acoustic Waves Structures; 4.3.1 General Remarks; 4.3.2 Acoustomigration Mechanism; 4.3.3 Metallization Concepts for Power SAW Structures; 4.3.4 Experimental Set-up; 4.3.5 Acoustomigration Experiments; 4.4 Thermal Stability of Magnetoresistive Layer Stacks 4.4.1 Metallic Multilayers as GMR Model Systems |
| Record Nr. | UNINA-9910146230803321 |
| Weinheim, : Wiley-VCH, c2003 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Metal based thin films for electronics [[electronic resource] /] / Klaus Wetzig, Claus M. Schneider (eds.)
| Metal based thin films for electronics [[electronic resource] /] / Klaus Wetzig, Claus M. Schneider (eds.) |
| Pubbl/distr/stampa | Weinheim, : Wiley-VCH, c2003 |
| Descrizione fisica | 1 online resource (390 p.) |
| Disciplina | 621.38152 |
| Altri autori (Persone) |
WetzigKlaus
SchneiderClaus M (Claus Michael) |
| Soggetto topico |
Thin films
Metallic films |
| ISBN |
1-280-52109-0
9786610521098 3-527-60647-5 3-527-60253-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Metal Based Thin Films for Electronics; List of Contributors; Contents; 1 Introduction; 2 Thin Film Systems: Basic Aspects; 2.1 Interconnects for Microelectronics; 2.1.1 Introduction; 2.1.2 Metallization Layers; 2.1.3 Materials Science of Metallic Interconnects; 2.1.4 Function of Barrier and Nucleation Layers and Materials Selection; 2.2 Metallization Structures in Acoustoelectronics; 2.2.1 Introduction; 2.2.2 Fundamentals of Surface Acoustic Waves; 2.2.3 Interdigital Transducers (IDTs); 2.2.4 Reflector Gratings; 2.2.5 Waveguides, Energy Trapping; 2.2.6 Multistrip Couplers
2.3 Silicide Layers for Electronics2.3.1 Introduction; 2.3.2 The Basic Chemical and Physical Properties; 2.3.3 Preparation of Silicides; 2.3.4 Silicides with Metallic Conductivity; 2.3.5 Semiconducting Silicides; 2.3.6 Heterogeneously Disordered Silicide Films; 2.4 Complex Layered Systems for Magnetoelectronics; 2.4.1 Introduction; 2.4.2 Magnetism: A Primer; 2.4.3 Magnetic Coupling Phenomena; 2.4.4 Electric Transport in Layered Magnetic Systems; 2.4.5 Functional Thin Film Systems; 2.5 Multilayer and Single-Surface Reflectors for X-Ray Optics; 2.5.1 Introduction 2.5.2 Refraction and Reflection at Single Boundaries2.5.3 Bragg Reflection at 1D Lattice Systems; 2.5.4 Multilayer Preparation; References; 3 Thin Film Preparation and Characterization Techniques; 3.1 Thin Film Preparation Methods; 3.1.1 Introduction; 3.1.2 Physical Vapor Deposition; 3.1.3 Chemical Vapor Deposition; 3.1.4 Non-Vacuum Based Deposition; 3.1.5 Outlook; 3.2 Electron Microscopy and Diffraction; 3.2.1 Transmission Electron Microscopy (TEM) - Imaging; 3.2.2 TEM - Selected Area Electron Diffraction; 3.2.3 In situ-SEM Methods; 3.2.4 Electron Backscatter Diffraction 3.3 X-Ray Scattering Techniques3.3.1 Wide Angle Diffraction; 3.3.2 Reflectometry; 3.3.3 Soft X-Rays and Magnetic Scattering; 3.4 Spectroscopic Techniques; 3.4.1 Element Distribution Analysis; 3.4.2 Element Depth Profile Analysis; 3.5 Stress Measurement Techniques; 3.5.1 Stress and Strain; 3.5.2 Substrate Curvature; 3.5.3 Measurement Techniques; References; 4 Challenges for Thin Film Systems Characterization and Optimization; 4.1 Electromigration in Metallization Layers; 4.1.1 Fundamentals; 4.1.2 Methods for Quantitative Damage Analysis; 4.1.3 Al Interconnects; 4.1.4 Cu Interconnects 4.2 Barrier and Nucleation Layers for Interconnects4.2.1 Introduction; 4.2.2 PVD Barrier Layers for Copper Interconnects; 4.2.3 Barrier/Seed Microstructure and Step Coverage; 4.2.4 New Barrier/Seed Concepts using CVD and ALD; 4.2.5 Atomic Layer Deposition (ALD); 4.3 Acoustomigration in Surface Acoustic Waves Structures; 4.3.1 General Remarks; 4.3.2 Acoustomigration Mechanism; 4.3.3 Metallization Concepts for Power SAW Structures; 4.3.4 Experimental Set-up; 4.3.5 Acoustomigration Experiments; 4.4 Thermal Stability of Magnetoresistive Layer Stacks 4.4.1 Metallic Multilayers as GMR Model Systems |
| Record Nr. | UNINA-9910830309903321 |
| Weinheim, : Wiley-VCH, c2003 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Metal based thin films for electronics / / Klaus Wetzig, Claus M. Schneider (eds.)
| Metal based thin films for electronics / / Klaus Wetzig, Claus M. Schneider (eds.) |
| Pubbl/distr/stampa | Weinheim, : Wiley-VCH, c2003 |
| Descrizione fisica | 1 online resource (390 p.) |
| Disciplina | 621.38152 |
| Altri autori (Persone) |
WetzigKlaus
SchneiderClaus M (Claus Michael) |
| Soggetto topico |
Thin films
Metallic films |
| ISBN |
1-280-52109-0
9786610521098 3-527-60647-5 3-527-60253-4 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Metal Based Thin Films for Electronics; List of Contributors; Contents; 1 Introduction; 2 Thin Film Systems: Basic Aspects; 2.1 Interconnects for Microelectronics; 2.1.1 Introduction; 2.1.2 Metallization Layers; 2.1.3 Materials Science of Metallic Interconnects; 2.1.4 Function of Barrier and Nucleation Layers and Materials Selection; 2.2 Metallization Structures in Acoustoelectronics; 2.2.1 Introduction; 2.2.2 Fundamentals of Surface Acoustic Waves; 2.2.3 Interdigital Transducers (IDTs); 2.2.4 Reflector Gratings; 2.2.5 Waveguides, Energy Trapping; 2.2.6 Multistrip Couplers
2.3 Silicide Layers for Electronics2.3.1 Introduction; 2.3.2 The Basic Chemical and Physical Properties; 2.3.3 Preparation of Silicides; 2.3.4 Silicides with Metallic Conductivity; 2.3.5 Semiconducting Silicides; 2.3.6 Heterogeneously Disordered Silicide Films; 2.4 Complex Layered Systems for Magnetoelectronics; 2.4.1 Introduction; 2.4.2 Magnetism: A Primer; 2.4.3 Magnetic Coupling Phenomena; 2.4.4 Electric Transport in Layered Magnetic Systems; 2.4.5 Functional Thin Film Systems; 2.5 Multilayer and Single-Surface Reflectors for X-Ray Optics; 2.5.1 Introduction 2.5.2 Refraction and Reflection at Single Boundaries2.5.3 Bragg Reflection at 1D Lattice Systems; 2.5.4 Multilayer Preparation; References; 3 Thin Film Preparation and Characterization Techniques; 3.1 Thin Film Preparation Methods; 3.1.1 Introduction; 3.1.2 Physical Vapor Deposition; 3.1.3 Chemical Vapor Deposition; 3.1.4 Non-Vacuum Based Deposition; 3.1.5 Outlook; 3.2 Electron Microscopy and Diffraction; 3.2.1 Transmission Electron Microscopy (TEM) - Imaging; 3.2.2 TEM - Selected Area Electron Diffraction; 3.2.3 In situ-SEM Methods; 3.2.4 Electron Backscatter Diffraction 3.3 X-Ray Scattering Techniques3.3.1 Wide Angle Diffraction; 3.3.2 Reflectometry; 3.3.3 Soft X-Rays and Magnetic Scattering; 3.4 Spectroscopic Techniques; 3.4.1 Element Distribution Analysis; 3.4.2 Element Depth Profile Analysis; 3.5 Stress Measurement Techniques; 3.5.1 Stress and Strain; 3.5.2 Substrate Curvature; 3.5.3 Measurement Techniques; References; 4 Challenges for Thin Film Systems Characterization and Optimization; 4.1 Electromigration in Metallization Layers; 4.1.1 Fundamentals; 4.1.2 Methods for Quantitative Damage Analysis; 4.1.3 Al Interconnects; 4.1.4 Cu Interconnects 4.2 Barrier and Nucleation Layers for Interconnects4.2.1 Introduction; 4.2.2 PVD Barrier Layers for Copper Interconnects; 4.2.3 Barrier/Seed Microstructure and Step Coverage; 4.2.4 New Barrier/Seed Concepts using CVD and ALD; 4.2.5 Atomic Layer Deposition (ALD); 4.3 Acoustomigration in Surface Acoustic Waves Structures; 4.3.1 General Remarks; 4.3.2 Acoustomigration Mechanism; 4.3.3 Metallization Concepts for Power SAW Structures; 4.3.4 Experimental Set-up; 4.3.5 Acoustomigration Experiments; 4.4 Thermal Stability of Magnetoresistive Layer Stacks 4.4.1 Metallic Multilayers as GMR Model Systems |
| Record Nr. | UNINA-9910876805303321 |
| Weinheim, : Wiley-VCH, c2003 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||