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Applications of electrochemistry in medicine / / Mordechay Schlesinger, editor
Applications of electrochemistry in medicine / / Mordechay Schlesinger, editor
Edizione [1st ed. 2013.]
Pubbl/distr/stampa New York : , : Springer, , 2013
Descrizione fisica 1 online resource (xi, 452 pages) : illustrations (some color)
Disciplina 541.37
Collana Modern Aspects of Electrochemistry
Soggetto topico Electrochemistry
Clinical chemistry
ISBN 1-4614-6148-0
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Applications of electrochemistry in medicine -- Applications of electrochemistry in the design and development of medical technologies and devices -- Intracoronary stents: Medical devices at the interface of biology and electrochemistry -- Screen printed electrodes open new vistas in sensing: Application to medical diagnosis -- Electrochemical glucose sensors and their application in diabetes management -- Electrochemistry of adhesion and spreading of lipid vesicles on electrodes -- Bio-electrochemistry and chalcogens.
Record Nr. UNINA-9910437808703321
New York : , : Springer, , 2013
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Fundamentals of electrochemical deposition [[electronic resource] /] / Milan Paunovic, Mordechay Schlesinger
Fundamentals of electrochemical deposition [[electronic resource] /] / Milan Paunovic, Mordechay Schlesinger
Autore Paunovic Milan
Edizione [2nd ed.]
Pubbl/distr/stampa Hoboken, N.J., : Wiley-Interscience, c2006
Descrizione fisica 1 online resource (388 p.)
Disciplina 541.37
671.732
Altri autori (Persone) SchlesingerMordechay
Collana The Electrochemical Society series
Soggetto topico Electroplating
Soggetto genere / forma Electronic books.
ISBN 1-280-55149-6
9786610551491
0-470-00940-3
0-470-00939-X
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto FUNDAMENTALS OF ELECTROCHEMICAL DEPOSITION; CONTENTS; Preface to the Second Edition; Preface to the First Edition; 1. Overview; 2. Water and Ionic Solutions; 3. Metals and Metal Surfaces; 4. Metal-Solution Interphase; 5. Equilibrium Electrode Potential; 6. Kinetics and Mechanism of Electrodeposition; 7. Nucleation and Growth Models; 8. Electroless Deposition; 9. Displacement Deposition; 10. Effect of Additives; 11. Electrodeposition of Alloys; 12. Metal Deposit and Current Distribution; 13. Characterization of Metallic Surfaces and Thin Films; 14. In Situ Characterization of Deposition
15. Mathematical Modeling in Electrochemistry16. Structure and Properties of Deposits; 17. Electrodeposited Multilayers; 18. Interdiffusion in Thin Films; 19. Applications in Semiconductor Technology; 20. Applications in the Fields of Magnetism and Microelectronics; 21. Frontiers in Applications: The Field of Medicine; Index
Record Nr. UNINA-9910143569903321
Paunovic Milan  
Hoboken, N.J., : Wiley-Interscience, c2006
Materiale a stampa
Lo trovi qui: Univ. Federico II
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Modern electroplating [[electronic resource] /] / edited by Mordechay Schlesinger, Milan Paunovic
Modern electroplating [[electronic resource] /] / edited by Mordechay Schlesinger, Milan Paunovic
Edizione [5th ed.]
Pubbl/distr/stampa Hoboken, NJ, : Wiley, c2010
Descrizione fisica 1 online resource (749 p.)
Disciplina 671.7/32
Altri autori (Persone) PaunovicMilan
SchlesingerMordechay
Collana The ECS series of texts and monographs
Soggetto topico Electroplating
Metals - Finishing
ISBN 1-118-06314-7
1-283-37153-7
9786613371539
0-470-60262-7
0-470-60263-5
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto MODERN ELECTROPLATING; CONTENTS; PREFACE; PREFACE TO THE FOURTH EDITION; CONTRIBUTORS; CONVERSION FACTORS; GRAPHICAL CONVERSIONS; THE ELECTROCHEMICAL SOCIETY SERIES; 1 FUNDAMENTAL CONSIDERATIONS; 2 ELECTRODEPOSITION OF COPPER; 3 ELECTRODEPOSITION OF NICKEL; 4 ELECTRODEPOSITION OF GOLD; 5 ELECTROLESS AND ELECTRODEPOSITION OF SILVER; 6 TIN AND TIN ALLOYS FOR LEAD-FREE SOLDER; 7 ELECTRODEPOSITION OF CHROMIUM; 8 ELECTRODEPOSITION OF LEAD AND LEAD ALLOYS; 9 ELECTRODEPOSITION OF TIN-LEAD ALLOYS; 10 ELECTRODEPOSITION OF ZINC AND ZINC ALLOYS; 11 ELECTRODEPOSITION OF IRON AND IRON ALLOYS
12 PALLADIUM ELECTROPLATING13 ELECTROCHEMICAL DEPOSITION PROCESS FOR ULSI INTERCONNECTION DEVICES; 14 ELECTRODEPOSITION OF SEMICONDUCTORS; 15 DEPOSITION ON NONCONDUCTORS; 16 CONDUCTIVE POLYMERS: ELECTROPLATING OF ORGANIC FILMS; 17 ELECTROLESS DEPOSITION OF COPPER; 18 ELECTROLESS DEPOSITION OF NICKEL; 19 ELECTROCHEMICAL SYNTHESIS OF METAL ALLOYS FOR MAGNETIC RECORDING SYSTEMS; 20 ELECTROLESS DEPOSITION OF PALLADIUM AND PLATINUM; 21 ELECTROLESS DEPOSITION OF GOLD; 22 ELECTROLESS DEPOSITION OF ALLOYS; 23 PREPARATION FOR DEPOSITION; 24 MANUFACTURING TOOLS; 25 MONITORING AND CONTROL
26 ENVIRONMENTAL ASPECTS OF ELECTRODEPOSITION27 APPLICATIONS TO MAGNETIC RECORDING AND MICROELECTRONIC TECHNOLOGIES; 28 MICROELECTROMECHANICAL SYSTEMS; 29 ANALYSIS OF ELECTROPLATED FILMS USING DUAL-BEAM FIB/SEM AND TEM TECHNIQUES; 30 IONIC LIQUID TREATMENTS FOR ENHANCED CORROSION RESISTANCE OF MAGNESIUM-BASED SUBSTRATES; APPENDIX; INDEX
Record Nr. UNINA-9910133458303321
Hoboken, NJ, : Wiley, c2010
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Modern electroplating / / edited by Mordechay Schlesinger, Milan Paunovic
Modern electroplating / / edited by Mordechay Schlesinger, Milan Paunovic
Edizione [5th ed.]
Pubbl/distr/stampa Hoboken, NJ, : Wiley, c2010
Descrizione fisica 1 online resource (749 p.)
Disciplina 671.7/32
Altri autori (Persone) PaunovicMilan
SchlesingerMordechay
Collana The ECS series of texts and monographs
Soggetto topico Electroplating
Metals - Finishing
ISBN 1-118-06314-7
1-283-37153-7
9786613371539
0-470-60262-7
0-470-60263-5
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto MODERN ELECTROPLATING; CONTENTS; PREFACE; PREFACE TO THE FOURTH EDITION; CONTRIBUTORS; CONVERSION FACTORS; GRAPHICAL CONVERSIONS; THE ELECTROCHEMICAL SOCIETY SERIES; 1 FUNDAMENTAL CONSIDERATIONS; 2 ELECTRODEPOSITION OF COPPER; 3 ELECTRODEPOSITION OF NICKEL; 4 ELECTRODEPOSITION OF GOLD; 5 ELECTROLESS AND ELECTRODEPOSITION OF SILVER; 6 TIN AND TIN ALLOYS FOR LEAD-FREE SOLDER; 7 ELECTRODEPOSITION OF CHROMIUM; 8 ELECTRODEPOSITION OF LEAD AND LEAD ALLOYS; 9 ELECTRODEPOSITION OF TIN-LEAD ALLOYS; 10 ELECTRODEPOSITION OF ZINC AND ZINC ALLOYS; 11 ELECTRODEPOSITION OF IRON AND IRON ALLOYS
12 PALLADIUM ELECTROPLATING13 ELECTROCHEMICAL DEPOSITION PROCESS FOR ULSI INTERCONNECTION DEVICES; 14 ELECTRODEPOSITION OF SEMICONDUCTORS; 15 DEPOSITION ON NONCONDUCTORS; 16 CONDUCTIVE POLYMERS: ELECTROPLATING OF ORGANIC FILMS; 17 ELECTROLESS DEPOSITION OF COPPER; 18 ELECTROLESS DEPOSITION OF NICKEL; 19 ELECTROCHEMICAL SYNTHESIS OF METAL ALLOYS FOR MAGNETIC RECORDING SYSTEMS; 20 ELECTROLESS DEPOSITION OF PALLADIUM AND PLATINUM; 21 ELECTROLESS DEPOSITION OF GOLD; 22 ELECTROLESS DEPOSITION OF ALLOYS; 23 PREPARATION FOR DEPOSITION; 24 MANUFACTURING TOOLS; 25 MONITORING AND CONTROL
26 ENVIRONMENTAL ASPECTS OF ELECTRODEPOSITION27 APPLICATIONS TO MAGNETIC RECORDING AND MICROELECTRONIC TECHNOLOGIES; 28 MICROELECTROMECHANICAL SYSTEMS; 29 ANALYSIS OF ELECTROPLATED FILMS USING DUAL-BEAM FIB/SEM AND TEM TECHNIQUES; 30 IONIC LIQUID TREATMENTS FOR ENHANCED CORROSION RESISTANCE OF MAGNESIUM-BASED SUBSTRATES; APPENDIX; INDEX
Record Nr. UNINA-9910826412903321
Hoboken, NJ, : Wiley, c2010
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui