Info
- Utilizzare la checkbox di selezione a fianco di ciascun documento per attivare le funzionalità di stampa, invio email, download nei formati disponibili del (i) record.
Applications of electrochemistry in medicine / / Mordechay Schlesinger, editor
| Applications of electrochemistry in medicine / / Mordechay Schlesinger, editor |
| Edizione | [1st ed. 2013.] |
| Pubbl/distr/stampa | New York, : Springer, c2013 |
| Descrizione fisica | 1 online resource (xi, 452 pages) : illustrations (some color) |
| Disciplina | 541.37 |
| Altri autori (Persone) | SchlesingerMordechay |
| Collana | Modern aspects of electrochemistry |
| Soggetto topico |
Electrochemistry
Clinical chemistry |
| ISBN | 1-4614-6148-0 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Applications of electrochemistry in medicine -- Applications of electrochemistry in the design and development of medical technologies and devices -- Intracoronary stents: Medical devices at the interface of biology and electrochemistry -- Screen printed electrodes open new vistas in sensing: Application to medical diagnosis -- Electrochemical glucose sensors and their application in diabetes management -- Electrochemistry of adhesion and spreading of lipid vesicles on electrodes -- Bio-electrochemistry and chalcogens. |
| Record Nr. | UNINA-9910437808703321 |
| New York, : Springer, c2013 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Fundamentals of electrochemical deposition [[electronic resource] /] / Milan Paunovic, Mordechay Schlesinger
| Fundamentals of electrochemical deposition [[electronic resource] /] / Milan Paunovic, Mordechay Schlesinger |
| Autore | Paunovic Milan |
| Edizione | [2nd ed.] |
| Pubbl/distr/stampa | Hoboken, N.J., : Wiley-Interscience, c2006 |
| Descrizione fisica | 1 online resource (388 p.) |
| Disciplina |
541.37
671.732 |
| Altri autori (Persone) | SchlesingerMordechay |
| Collana | The Electrochemical Society series |
| Soggetto topico | Electroplating |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-280-55149-6
9786610551491 0-470-00940-3 0-470-00939-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
FUNDAMENTALS OF ELECTROCHEMICAL DEPOSITION; CONTENTS; Preface to the Second Edition; Preface to the First Edition; 1. Overview; 2. Water and Ionic Solutions; 3. Metals and Metal Surfaces; 4. Metal-Solution Interphase; 5. Equilibrium Electrode Potential; 6. Kinetics and Mechanism of Electrodeposition; 7. Nucleation and Growth Models; 8. Electroless Deposition; 9. Displacement Deposition; 10. Effect of Additives; 11. Electrodeposition of Alloys; 12. Metal Deposit and Current Distribution; 13. Characterization of Metallic Surfaces and Thin Films; 14. In Situ Characterization of Deposition
15. Mathematical Modeling in Electrochemistry16. Structure and Properties of Deposits; 17. Electrodeposited Multilayers; 18. Interdiffusion in Thin Films; 19. Applications in Semiconductor Technology; 20. Applications in the Fields of Magnetism and Microelectronics; 21. Frontiers in Applications: The Field of Medicine; Index |
| Record Nr. | UNINA-9910143569903321 |
Paunovic Milan
|
||
| Hoboken, N.J., : Wiley-Interscience, c2006 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Fundamentals of electrochemical deposition / / Milan Paunovic, Mordechay Schlesinger
| Fundamentals of electrochemical deposition / / Milan Paunovic, Mordechay Schlesinger |
| Autore | Paunovic Milan |
| Edizione | [2nd ed.] |
| Pubbl/distr/stampa | Hoboken, N.J., : Wiley-Interscience, c2006 |
| Descrizione fisica | 1 online resource (388 p.) |
| Disciplina | 671.7/32 |
| Altri autori (Persone) | SchlesingerMordechay |
| Collana | The Electrochemical Society series |
| Soggetto topico | Electroplating |
| ISBN |
1-280-55149-6
9786610551491 0-470-00940-3 0-470-00939-X |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
FUNDAMENTALS OF ELECTROCHEMICAL DEPOSITION; CONTENTS; Preface to the Second Edition; Preface to the First Edition; 1. Overview; 2. Water and Ionic Solutions; 3. Metals and Metal Surfaces; 4. Metal-Solution Interphase; 5. Equilibrium Electrode Potential; 6. Kinetics and Mechanism of Electrodeposition; 7. Nucleation and Growth Models; 8. Electroless Deposition; 9. Displacement Deposition; 10. Effect of Additives; 11. Electrodeposition of Alloys; 12. Metal Deposit and Current Distribution; 13. Characterization of Metallic Surfaces and Thin Films; 14. In Situ Characterization of Deposition
15. Mathematical Modeling in Electrochemistry16. Structure and Properties of Deposits; 17. Electrodeposited Multilayers; 18. Interdiffusion in Thin Films; 19. Applications in Semiconductor Technology; 20. Applications in the Fields of Magnetism and Microelectronics; 21. Frontiers in Applications: The Field of Medicine; Index |
| Record Nr. | UNINA-9910877206503321 |
|
Paunovic Milan
|
||
| Hoboken, N.J., : Wiley-Interscience, c2006 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Modern electroplating [[electronic resource] /] / edited by Mordechay Schlesinger, Milan Paunovic
| Modern electroplating [[electronic resource] /] / edited by Mordechay Schlesinger, Milan Paunovic |
| Edizione | [5th ed.] |
| Pubbl/distr/stampa | Hoboken, NJ, : Wiley, c2010 |
| Descrizione fisica | 1 online resource (749 p.) |
| Disciplina | 671.7/32 |
| Altri autori (Persone) |
PaunovicMilan
SchlesingerMordechay |
| Collana | The ECS series of texts and monographs |
| Soggetto topico |
Electroplating
Metals - Finishing |
| ISBN |
1-118-06314-7
1-283-37153-7 9786613371539 0-470-60262-7 0-470-60263-5 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
MODERN ELECTROPLATING; CONTENTS; PREFACE; PREFACE TO THE FOURTH EDITION; CONTRIBUTORS; CONVERSION FACTORS; GRAPHICAL CONVERSIONS; THE ELECTROCHEMICAL SOCIETY SERIES; 1 FUNDAMENTAL CONSIDERATIONS; 2 ELECTRODEPOSITION OF COPPER; 3 ELECTRODEPOSITION OF NICKEL; 4 ELECTRODEPOSITION OF GOLD; 5 ELECTROLESS AND ELECTRODEPOSITION OF SILVER; 6 TIN AND TIN ALLOYS FOR LEAD-FREE SOLDER; 7 ELECTRODEPOSITION OF CHROMIUM; 8 ELECTRODEPOSITION OF LEAD AND LEAD ALLOYS; 9 ELECTRODEPOSITION OF TIN-LEAD ALLOYS; 10 ELECTRODEPOSITION OF ZINC AND ZINC ALLOYS; 11 ELECTRODEPOSITION OF IRON AND IRON ALLOYS
12 PALLADIUM ELECTROPLATING13 ELECTROCHEMICAL DEPOSITION PROCESS FOR ULSI INTERCONNECTION DEVICES; 14 ELECTRODEPOSITION OF SEMICONDUCTORS; 15 DEPOSITION ON NONCONDUCTORS; 16 CONDUCTIVE POLYMERS: ELECTROPLATING OF ORGANIC FILMS; 17 ELECTROLESS DEPOSITION OF COPPER; 18 ELECTROLESS DEPOSITION OF NICKEL; 19 ELECTROCHEMICAL SYNTHESIS OF METAL ALLOYS FOR MAGNETIC RECORDING SYSTEMS; 20 ELECTROLESS DEPOSITION OF PALLADIUM AND PLATINUM; 21 ELECTROLESS DEPOSITION OF GOLD; 22 ELECTROLESS DEPOSITION OF ALLOYS; 23 PREPARATION FOR DEPOSITION; 24 MANUFACTURING TOOLS; 25 MONITORING AND CONTROL 26 ENVIRONMENTAL ASPECTS OF ELECTRODEPOSITION27 APPLICATIONS TO MAGNETIC RECORDING AND MICROELECTRONIC TECHNOLOGIES; 28 MICROELECTROMECHANICAL SYSTEMS; 29 ANALYSIS OF ELECTROPLATED FILMS USING DUAL-BEAM FIB/SEM AND TEM TECHNIQUES; 30 IONIC LIQUID TREATMENTS FOR ENHANCED CORROSION RESISTANCE OF MAGNESIUM-BASED SUBSTRATES; APPENDIX; INDEX |
| Record Nr. | UNINA-9910133458303321 |
| Hoboken, NJ, : Wiley, c2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Modern electroplating / / edited by Mordechay Schlesinger, Milan Paunovic
| Modern electroplating / / edited by Mordechay Schlesinger, Milan Paunovic |
| Edizione | [5th ed.] |
| Pubbl/distr/stampa | Hoboken, NJ, : Wiley, c2010 |
| Descrizione fisica | 1 online resource (749 p.) |
| Disciplina | 671.7/32 |
| Altri autori (Persone) |
PaunovicMilan
SchlesingerMordechay |
| Collana | The ECS series of texts and monographs |
| Soggetto topico |
Electroplating
Metals - Finishing |
| ISBN |
1-118-06314-7
1-283-37153-7 9786613371539 0-470-60262-7 0-470-60263-5 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
MODERN ELECTROPLATING; CONTENTS; PREFACE; PREFACE TO THE FOURTH EDITION; CONTRIBUTORS; CONVERSION FACTORS; GRAPHICAL CONVERSIONS; THE ELECTROCHEMICAL SOCIETY SERIES; 1 FUNDAMENTAL CONSIDERATIONS; 2 ELECTRODEPOSITION OF COPPER; 3 ELECTRODEPOSITION OF NICKEL; 4 ELECTRODEPOSITION OF GOLD; 5 ELECTROLESS AND ELECTRODEPOSITION OF SILVER; 6 TIN AND TIN ALLOYS FOR LEAD-FREE SOLDER; 7 ELECTRODEPOSITION OF CHROMIUM; 8 ELECTRODEPOSITION OF LEAD AND LEAD ALLOYS; 9 ELECTRODEPOSITION OF TIN-LEAD ALLOYS; 10 ELECTRODEPOSITION OF ZINC AND ZINC ALLOYS; 11 ELECTRODEPOSITION OF IRON AND IRON ALLOYS
12 PALLADIUM ELECTROPLATING13 ELECTROCHEMICAL DEPOSITION PROCESS FOR ULSI INTERCONNECTION DEVICES; 14 ELECTRODEPOSITION OF SEMICONDUCTORS; 15 DEPOSITION ON NONCONDUCTORS; 16 CONDUCTIVE POLYMERS: ELECTROPLATING OF ORGANIC FILMS; 17 ELECTROLESS DEPOSITION OF COPPER; 18 ELECTROLESS DEPOSITION OF NICKEL; 19 ELECTROCHEMICAL SYNTHESIS OF METAL ALLOYS FOR MAGNETIC RECORDING SYSTEMS; 20 ELECTROLESS DEPOSITION OF PALLADIUM AND PLATINUM; 21 ELECTROLESS DEPOSITION OF GOLD; 22 ELECTROLESS DEPOSITION OF ALLOYS; 23 PREPARATION FOR DEPOSITION; 24 MANUFACTURING TOOLS; 25 MONITORING AND CONTROL 26 ENVIRONMENTAL ASPECTS OF ELECTRODEPOSITION27 APPLICATIONS TO MAGNETIC RECORDING AND MICROELECTRONIC TECHNOLOGIES; 28 MICROELECTROMECHANICAL SYSTEMS; 29 ANALYSIS OF ELECTROPLATED FILMS USING DUAL-BEAM FIB/SEM AND TEM TECHNIQUES; 30 IONIC LIQUID TREATMENTS FOR ENHANCED CORROSION RESISTANCE OF MAGNESIUM-BASED SUBSTRATES; APPENDIX; INDEX |
| Record Nr. | UNINA-9910826412903321 |
| Hoboken, NJ, : Wiley, c2010 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||