The art and science of microelectronic circuit design / / A. I. Belous, Vitali Saladukha |
Autore | Belous A. I (Anatoliĭ Ivanovich) |
Pubbl/distr/stampa | Cham, Switzerland : , : Springer, , [2022] |
Descrizione fisica | 1 online resource (445 pages) |
Disciplina | 621.38173 |
Soggetto topico | Integrated circuits |
ISBN | 3-030-89854-7 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Intro -- Preface -- Acknowledgements -- Contents -- Chapter 1: Standard Characteristics of Digital Microcircuits -- 1.1 Structure of Digital Microciruits -- 1.1.1 General Structure of Digital Microcircuits -- 1.1.2 Architecture of Internal Cells of Digital Microcircuits -- 1.1.3 Architecture of Digital Mirocircuit Matching Elements -- 1.2 System of Main Parameters and Chracteristics of Digital Microcircuits -- 1.2.1 Functional Parameters of Digital Microcircuits -- 1.2.2 Electical Parameters of Digital Microcircuits -- 1.2.3 Dynamic Parameters of Digital Microcircuits -- 1.3 Schematic Implementation of Digital Microcircuits -- 1.3.1 Power Characteristics of Standard Logic Cells of Digital Microcircuits -- 1.3.2 Schematic Implementation of Standard Digital Microcircuits -- 1.3.3 Techniques of Digital Microcircuits Element Base Selection -- 1.4 Impact of Destabilizing Factors on Serviceability of Digital Microcircuits -- 1.4.1 Immunity of Digital Microcircuits to Electrostatic Discharge -- 1.4.2 Microcircuits Overload Tolerance -- 1.4.3 Dependence of Electrical Characteristics of Digital Microcircuits Upon Operational Modes -- 1.4.4 Immunity of Digital Microcircuits to the Impact Produced by Interferences -- 1.5 Parasitic Elements and Effects in Digital Microcircuits -- 1.5.1 Parasitic Transistor Elements Inside Digital Microcircuit Dice -- 1.5.2 Miller´s Effect -- 1.5.3 Latch-Up Effect -- References -- Chapter 2: Schematic Solutions of Digital CMOS Microcircuits -- 2.1 Standard Logic Cells of Digital CMOS Microcircuits -- 2.1.1 Static CMOS Logic Cells -- 2.1.2 Standard LC of Dynamic CMOS Logic -- 2.2 Memory Elements of the Digital CMOS Integrated Circuits -- 2.2.1 Memory Elements, Clocked by the Level of the Synchrosignal -- 2.2.2 Memory Elements, Clocked by the Synchrosignal Edge -- References.
Chapter 3: Schematic Technical Solutions of the Bipolar Integrated Circuits -- 3.1 Digital Integrated Circuits on the Bipolar Transistors with the Schottky Diodes -- 3.1.1 Basic TTLS Logic Elements of Digital Integrated Circuits -- 3.1.2 Basic Logic Elements of Schottky Transistor Logic -- 3.1.3 Basic Logic Elements of the Integrated Schottky Logic -- 3.1.4 Base Logic Elements of the Diode-Transistor Logic with Schottky Diodes -- 3.2 Memory Elements of TTLS Integrated Circuits -- 3.2.1 Memory Elements, Synchrosignal Edge Cycled -- 3.2.2 Memory Elements, Cycled by the Level of the Synchrosignal -- 3.3 Schematics of the Input Matching Elements of the TTLS Integrated Circuits -- 3.3.1 Input Matching TTLS Elements of Integrated Circuits with the standard TTL input levels -- 3.3.2 Input ME TTLS of Integrated Circuits with the Enhanced Load Capacitance -- 3.3.3 Input ME TTLS of the Integrated Circuits with the Paraphrase Outputs -- 3.3.4 Input ME TTLS Integrated Circuits with Memory -- 3.3.5 Input BE TTLS of Integrated Circuits with the Enhanced Noise Immunity -- 3.3.6 Input Matching Element with Conversion of the Signal Levels -- 3.3.7 Protection Diagrams of the Input ME TTLS Integrated Circuits -- 3.4 Schematics of the Output Matching Elements of TTLS Integrated Circuits -- 3.4.1 Output ME TTLS of Integrated Circuits with Standard TTL Output Levels -- 3.4.2 Output ME of TTLS Integrated Circuits with Memory -- 3.4.3 Output ME of TTLS Integrated Circuits with Conversion of signal levels -- 3.4.4 Schematics of the Protection Circuits of the Output ME of TTLS Integrated Circuits -- 3.5 Digital Integrated Circuits on the Basis of the Integrated Injection Logic -- 3.5.1 Varieties of the Basic Elements of the I2L Integrated Circuits -- 3.5.2 Memory Elements of I2L Integrated Circuits. 3.5.3 Schematics of the Input Matching Elements of the I2L Integrated Circuits -- 3.5.4 Protection of the I2L Pins of the Integrated Circuits from Overvoltage and Static Electricity -- References -- Chapter 4: Circuit Engineering of Bi-CMOS IC -- 4.1 Basic Logic Elements of Bi-CMOS IC -- 4.2 Bi-CMOS IC Memory Elements -- 4.3 Circuit Engineering of Bi-CMOS IC Input Matching Components -- 4.3.1 Input MC of Bi-CMOS IC with Signal Level Conversion -- 4.3.2 Input MC of Bi-CMOS IC with Increased Load Capacity -- 4.3.3 Input MC of Bi-CMOS IC with Paraphase Outputs -- 4.3.4 Input MC of Bi-CMOS IC with Increased Noise Immunity -- 4.3.5 Input MC of Bi-CMOS Memory IC -- 4.3.6 Circuit Engineering of Input MC of Bi-CMOS IC Protection -- 4.4 Circuit Engineering of Bi-CMOS IC Matching Output Components -- 4.4.1 Output MC of Bi-CMOS IC with the Formation of CMOS Output Levels -- 4.4.2 Output MC of Bi-CMOS ICs with the Formation of TTL Output Levels -- 4.4.3 Output MC of Bi-CMOS IC with the Formation of ECL Output Levels -- 4.4.4 Output MC BI-CMOS Memory ICs -- 4.4.5 Circuit Engineering of the Output MC BI-CMOS IC Protection Circuits -- References -- Chapter 5: Structure and Specific Features of Design Libraries for Submicron Microcircuits -- 5.1 Development Process Flow and Standard Structure of a Process Design Kit (PDK) -- 5.2 Terms and Definitions Used to Describe PDK Components -- 5.3 PDK Standardization -- 5.4 Mixed Analog/Digital Microcircuit Design Flow -- 5.5 Summarized Information Model of Mixed Analog-Digital IC Design -- 5.6 Specifying Basic PDK Components and Standard Elements List -- 5.7 Development Features of Digital Libraries for Designing ASICs with Submicron Design Rules -- 5.8 Structural and Circuit-Level Features of Designing Basic Cells for Submicron Microcircuits Library -- 5.8.1 Voltage Level Shifters -- 5.8.2 Power Gating Circuits. 5.8.3 Isolation Library Cells for Submicron Microcircuits -- 5.8.4 ``Always-on´´ Buffers -- 5.9 Standard PDK Data Files -- 5.10 Standard PDK Current Source Models (CCS) -- 5.11 Methods and Examples of Standard IC Design Tools Adaptation to 90, 65, and 45 Nm Microcircuit Design -- 5.11.1 Synopsys Tutorial (Educational) Design Kit: Capabilities, Applications, and Prospects -- 5.11.2 Synopsys EDK Overview -- 5.11.3 Synopsys Digital Standard Cell Library -- 5.11.4 I/O Standard Cell Library -- 5.11.5 Standard Set of PDK Memory Modules -- 5.11.6 Phase-Locked Loop (PLL) -- 5.11.7 Geography of EDK Applications and Prospects -- 5.12 Contents of Educational Design Kits Provided by IMEC -- References -- Chapter 6: Digital IC and System-on-Chip Design Flows -- 6.1 Choosing the IC Design Flow -- 6.2 System Design Stage -- 6.3 Functional Design Stage (Fig. 6.3) -- 6.4 Logic Design Stage -- 6.5 Physical (Topological) Design Stage -- 6.6 Stage of Physical Verification and Preparation for Production (Fig. 6.6) -- 6.7 Project Certification -- 6.8 SoC Design Flow -- 6.8.1 Trends in the Development of Design Tools -- 6.8.2 SoC Design Methodology -- 6.8.3 SoC Design Flow -- 6.8.4 SoC System Design -- 6.8.5 CAD Software for the System Level -- 6.9 Practical Example of the System-on-Chip Simulation -- 6.9.1 Standard Design Flow of the SoC of Cadence Company -- 6.9.2 Description of the Simulation and Verification Environment -- 6.9.3 Project in the Cadence Incisive Environment -- References -- Chapter 7: Fundamentals of CMOS Microcircuits Logic Design with Reduced Power Consumption -- 7.1 Basics of Low-Power-Driven Logic Synthesis of CMOS Microcircuits -- 7.2 Identification of Power Dissipation Sources in CMOS Microcircuits -- 7.3 Probabilistic Evaluation of Optimization Options by Predicted Switching Activity of IC Nodes. 7.4 Selection of Element Basis for Low-Power CMOS Microcircuit Design -- 7.5 Logic Synthesis of CMOS Microcircuits in the Basis of Library Elements -- 7.6 Power Dissipation-Driven Optimization of Two-Level Logic Circuits -- 7.7 Selection of Basic Gates for Technology-Independent Functional Circuit -- 7.8 Optimization of Multilevel Logic Circuits of Multi-input Gates -- 7.9 Optimization of Multilevel Logic Circuits of Double Input Gates -- 7.10 Technology Mapping -- 7.11 Estimation of Power Consumption of Designed CMOS Microcircuits at Logic and Circuitry Levels -- 7.12 Low-Power CMOS Microcircuit Design Technology with ELS Package -- 7.13 ELS Software Package Architecture -- 7.14 Functional Capabilities of ELS Software Package -- References -- Chapter 8: Fundamentals of Building a Quality Management System for Manufacturing Submicron Integrated Circuits Based on Test ... -- 8.1 Methodology of the Organization of Technological Test Control in the Process of Design and Production of Microelectronic P... -- 8.1.1 Place and Role of Semiconductor Test Structures in the Process of Manufacturing Integrated Circuits -- 8.1.2 Classification of Technological Test Structures -- 8.1.3 Methods of Placing Test Structures on Semiconductor Wafers -- 8.2 Principles of Control of the Process of Manufacturing Chips Using Test Structures -- 8.2.1 Assessment of the Quality of the Process Based on the Method of Interoperative Control of Wafers -- 8.2.2 Typical Composition of the Test Module for Monitoring Production Processes -- 8.2.3 Typical Composition of Test Structures for Quality Control of Submicron ICs -- 8.2.4 Statistical Processing of Measurement Results of Test Structures -- 8.3 Forecasting the IC Yield Based on the Results of the Test Control -- 8.3.1 Features of Simulation of the IC Yield. 8.3.2 Model of Postoperative Separation of Defects in the Technological Process of IC Manufacturing. |
Record Nr. | UNINA-9910544845303321 |
Belous A. I (Anatoliĭ Ivanovich) | ||
Cham, Switzerland : , : Springer, , [2022] | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
High Velocity Microparticles in Space : Influence Mechanisms and Mitigating Effects of Electromagnetic Irradiation / / by Anatoly Belous, Vitali Saladukha, Siarhei Shvedau |
Autore | Belous Anatoly |
Edizione | [1st ed. 2019.] |
Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2019 |
Descrizione fisica | 1 online resource (320 pages) |
Disciplina |
604.7
629.472 |
Soggetto topico |
Electronic circuits
Electronics Microelectronics Nanotechnology Circuits and Systems Electronics and Microelectronics, Instrumentation |
ISBN | 3-030-04158-1 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | Chapter 1. Problems with Obtaining Materials for the Protection of Integrated Circuits From High-Velocity Streams of Microparticles and Possible Solutions -- Chapter 2. Methods and Equipment for Studying the Processes of Interaction of High-Velocity Streams of Microparticles with Materials -- Chapter 3. Effects of Exposure to High-Velocity Streams of Microparticles -- Chapter 4. Changes in the Structure and Properties of Single- and Multilayer Materials under the Influence of a High-Velocity Stream of Microparticles -- Chapter 5. Special Aspects of the Production Technology for Multilayer Protective Materials used in the Integrated Circuit Packaging -- Chapter 6. Method of Protection From Electromagnetic Radiation -- Chpater 7. Environmental Friendly Method of Production of Nanocomposites and Nanomembranes. |
Record Nr. | UNINA-9910337628603321 |
Belous Anatoly | ||
Cham : , : Springer International Publishing : , : Imprint : Springer, , 2019 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
High-Speed Digital System Design : Art, Science and Experience / / by Anatoly Belous, Vitali Saladukha |
Autore | Belous Anatoly |
Edizione | [1st ed. 2020.] |
Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2020 |
Descrizione fisica | 1 online resource (XXXVII, 933 p. 751 illus., 532 illus. in color.) |
Disciplina |
621.3815
621.38104 |
Soggetto topico |
Electronic circuits
Electronics Microelectronics Computer engineering Internet of things Embedded computer systems Circuits and Systems Electronics and Microelectronics, Instrumentation Cyber-physical systems, IoT |
ISBN | 3-030-25409-7 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | Chapter 1. Information And Communication Technologies And Systems Based On Them -- Chapter 2. Wired Interfaces Of High-Speed Electronic Devices -- Chapter 3. Wireless Telecommunication Systems -- Chapter 4. Basic Components Of Telecommunication Systems -- Chapter 5. Specialized Chips For Telecommunication Systems -- Chapter 6. Methods And Means Of Ensuring Interference Resistance Of High-Speed Electronic Devices -- Chapter 7. Basics Of Designing Structures Of Printed Circuit Boards Of High-Speed Electronic Devices -- Chapter 8. Packaging Technologies For Electronic Devices -- Chapter 9. Protection Of High-Speed Electronic Devices From Electromagnetic Interference -- Chapter 10. Power Supply Systems Of High-Speed Electronic Devices -- Chapter 11. Measurement And Analysis Of SHF Devices. |
Record Nr. | UNINA-9910366591703321 |
Belous Anatoly | ||
Cham : , : Springer International Publishing : , : Imprint : Springer, , 2020 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Space Microelectronics . Volume 1 : Modern Spacecraft Classification, Failure, and Electrical Component Requirements / / Anatoly Belous, Vitali Saladukha, Siarhei Shvedau |
Autore | Belous Anatoly |
Pubbl/distr/stampa | Norwood : , : Artech House, , [2017] |
Descrizione fisica | 1 online resource (xiv, 399 pages) : illustrations |
Disciplina | 629.474 |
Collana | Artech House space technology and applications series |
Soggetto topico | Space vehicles - Electronic equipment |
Soggetto genere / forma | Electronic books. |
ISBN |
1-5231-3258-2
1-63081-468-7 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Space Microelectronics, Volume 1: Modern Spacecraft Classification, Failure, and Electrical Component Requirements; Contents; Preface; Chapter 1 Modern Spacecraft; 1.1 Space Industry Development; 1.2 Classification of Modern Spacecraft; 1.3 Spacecraft Designs and Structures; 1.4 Spacecraft Onboard Systems; 1.4.1 Classification of Spacecraft Onboard Systems; 1.4.2 Peculiarities of Design of Onboard Information Control Complexes withthe Use of Programmable Logic Microchips; 1.5 Earth Remote Sensing Spacecraft; 1.5.1 ERS Spacecraft of the Russian Federation and the Republic of Belarus
1.5.2 ERS Spacecraft of Ukraine1.5.3 ERS Spacecraft of the United States; 1.5.4 ERS Spacecraft of Fran; 1.5.5 ERS Spacecraft of Japan; 1.5.6 ERS Spacecraft of India; 1.5.7 ERS Spacecraft of China; 1.5.8 ERS Spacecraft of the European Space Agency; 1.5.9 Earth Remote Sensing Spacecraft of Other Countries; 1.6 Earth Remote Sensing Radar Stations; 1.7 The Effect of Space Radiation on SC; 1.8 Micrometeoroid Effect on SC; 1.9 The Problem of Space Debris in Earth Orbit; 1.10 The Use of Microelectronic Technologies for the Development ofSpace Microrocket Engines 1.11 Military and Special-Purpose Spacecraft1.11.1 Missile Early-Warning System; 1.11.2 MEWS Ground-Based Echelon; 1.11.3 Phased Arrays; 1.11.4 MEWS Space Echelon; 1.11.5 Military Reconnaissance Satellites; References; Selected Bibliography; Chapter 2 Launch Vehicle and Spacecraft Failures and Accidents; 2.1 Rocket and Space Technology Safety Issues; 2.2 Analysis of Launch Vehicle Failure Causes; 2.3 Analysis of Spacecraft Failures; 2.4 Analysis of Failure Causes of Rocket and SpaceTechnology Products; 2.5 Trend Analysis of Launch Vehicle Accident Risks in 2000-2009 2.6 Analysis of SC Failure Trends in 2000-20092.7 Analysis of LV and SC Accident Causes in 2000-2009; 2.8 Analysis of Computer System and Software Failures; 2.9 Analysis of Onboard System Failures at the International Space Station in 2000s; 2.10 Methods of Ensuring Onboard Equipment Reliability of Spacecraft of Long-Life Operation; References; Chapter 3 Microwave Electronics for Space and Military Applications; 3.1 Basics of Microwave Electronics; 3.2 Structure and Properties of Gallium Arsenide; 3.3 Comparative Characteristics of GaAs and Si Properties 3.4 Microelectronic Devices Based on GaAs3.4.1 Diodes Based on GaAs; 3.4.2 Field Transistors; 3.5 Heterojunction Bipolar Transistors; 3.6 Optoelectronic Devices on GaAs; 3.6.1 LEDs; 3.6.2 Solar Batteries; 3.7 New Devices on GaAs; 3.8 Condition and Prospects of Development of Monolithic Microwave Integrated Circuits; 3.8.1 Main Spheres of Usage of Monolithic Microwave Integrated Circuits; 3.8.2 Main Materials for MMIC Production; 3.8.3 MMIC Active Elements and Their Reliability; 3.8.4 Advanced MMIC Design and Technology Solutions; 3.9 Basic Areas and Peculiarities of GaAs MMIC Application |
Record Nr. | UNINA-9910480037303321 |
Belous Anatoly | ||
Norwood : , : Artech House, , [2017] | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Space Microelectronics . Volume 1 : Modern Spacecraft Classification, Failure, and Electrical Component Requirements / / Anatoly Belous, Vitali Saladukha, Siarhei Shvedau |
Autore | Belous Anatoly |
Pubbl/distr/stampa | Norwood : , : Artech House, , [2017] |
Descrizione fisica | 1 online resource (xiv, 399 pages) : illustrations |
Disciplina | 629.474 |
Collana | Artech House space technology and applications series |
Soggetto topico | Space vehicles - Electronic equipment |
ISBN |
1-5231-3258-2
1-63081-468-7 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Space Microelectronics, Volume 1: Modern Spacecraft Classification, Failure, and Electrical Component Requirements; Contents; Preface; Chapter 1 Modern Spacecraft; 1.1 Space Industry Development; 1.2 Classification of Modern Spacecraft; 1.3 Spacecraft Designs and Structures; 1.4 Spacecraft Onboard Systems; 1.4.1 Classification of Spacecraft Onboard Systems; 1.4.2 Peculiarities of Design of Onboard Information Control Complexes withthe Use of Programmable Logic Microchips; 1.5 Earth Remote Sensing Spacecraft; 1.5.1 ERS Spacecraft of the Russian Federation and the Republic of Belarus
1.5.2 ERS Spacecraft of Ukraine1.5.3 ERS Spacecraft of the United States; 1.5.4 ERS Spacecraft of Fran; 1.5.5 ERS Spacecraft of Japan; 1.5.6 ERS Spacecraft of India; 1.5.7 ERS Spacecraft of China; 1.5.8 ERS Spacecraft of the European Space Agency; 1.5.9 Earth Remote Sensing Spacecraft of Other Countries; 1.6 Earth Remote Sensing Radar Stations; 1.7 The Effect of Space Radiation on SC; 1.8 Micrometeoroid Effect on SC; 1.9 The Problem of Space Debris in Earth Orbit; 1.10 The Use of Microelectronic Technologies for the Development ofSpace Microrocket Engines 1.11 Military and Special-Purpose Spacecraft1.11.1 Missile Early-Warning System; 1.11.2 MEWS Ground-Based Echelon; 1.11.3 Phased Arrays; 1.11.4 MEWS Space Echelon; 1.11.5 Military Reconnaissance Satellites; References; Selected Bibliography; Chapter 2 Launch Vehicle and Spacecraft Failures and Accidents; 2.1 Rocket and Space Technology Safety Issues; 2.2 Analysis of Launch Vehicle Failure Causes; 2.3 Analysis of Spacecraft Failures; 2.4 Analysis of Failure Causes of Rocket and SpaceTechnology Products; 2.5 Trend Analysis of Launch Vehicle Accident Risks in 2000-2009 2.6 Analysis of SC Failure Trends in 2000-20092.7 Analysis of LV and SC Accident Causes in 2000-2009; 2.8 Analysis of Computer System and Software Failures; 2.9 Analysis of Onboard System Failures at the International Space Station in 2000s; 2.10 Methods of Ensuring Onboard Equipment Reliability of Spacecraft of Long-Life Operation; References; Chapter 3 Microwave Electronics for Space and Military Applications; 3.1 Basics of Microwave Electronics; 3.2 Structure and Properties of Gallium Arsenide; 3.3 Comparative Characteristics of GaAs and Si Properties 3.4 Microelectronic Devices Based on GaAs3.4.1 Diodes Based on GaAs; 3.4.2 Field Transistors; 3.5 Heterojunction Bipolar Transistors; 3.6 Optoelectronic Devices on GaAs; 3.6.1 LEDs; 3.6.2 Solar Batteries; 3.7 New Devices on GaAs; 3.8 Condition and Prospects of Development of Monolithic Microwave Integrated Circuits; 3.8.1 Main Spheres of Usage of Monolithic Microwave Integrated Circuits; 3.8.2 Main Materials for MMIC Production; 3.8.3 MMIC Active Elements and Their Reliability; 3.8.4 Advanced MMIC Design and Technology Solutions; 3.9 Basic Areas and Peculiarities of GaAs MMIC Application |
Record Nr. | UNINA-9910796810803321 |
Belous Anatoly | ||
Norwood : , : Artech House, , [2017] | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Space Microelectronics . Volume 1 : Modern Spacecraft Classification, Failure, and Electrical Component Requirements / / Anatoly Belous, Vitali Saladukha, Siarhei Shvedau |
Autore | Belous Anatoly |
Pubbl/distr/stampa | Norwood : , : Artech House, , [2017] |
Descrizione fisica | 1 online resource (xiv, 399 pages) : illustrations |
Disciplina | 629.474 |
Collana | Artech House space technology and applications series |
Soggetto topico | Space vehicles - Electronic equipment |
ISBN |
1-5231-3258-2
1-63081-468-7 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Space Microelectronics, Volume 1: Modern Spacecraft Classification, Failure, and Electrical Component Requirements; Contents; Preface; Chapter 1 Modern Spacecraft; 1.1 Space Industry Development; 1.2 Classification of Modern Spacecraft; 1.3 Spacecraft Designs and Structures; 1.4 Spacecraft Onboard Systems; 1.4.1 Classification of Spacecraft Onboard Systems; 1.4.2 Peculiarities of Design of Onboard Information Control Complexes withthe Use of Programmable Logic Microchips; 1.5 Earth Remote Sensing Spacecraft; 1.5.1 ERS Spacecraft of the Russian Federation and the Republic of Belarus
1.5.2 ERS Spacecraft of Ukraine1.5.3 ERS Spacecraft of the United States; 1.5.4 ERS Spacecraft of Fran; 1.5.5 ERS Spacecraft of Japan; 1.5.6 ERS Spacecraft of India; 1.5.7 ERS Spacecraft of China; 1.5.8 ERS Spacecraft of the European Space Agency; 1.5.9 Earth Remote Sensing Spacecraft of Other Countries; 1.6 Earth Remote Sensing Radar Stations; 1.7 The Effect of Space Radiation on SC; 1.8 Micrometeoroid Effect on SC; 1.9 The Problem of Space Debris in Earth Orbit; 1.10 The Use of Microelectronic Technologies for the Development ofSpace Microrocket Engines 1.11 Military and Special-Purpose Spacecraft1.11.1 Missile Early-Warning System; 1.11.2 MEWS Ground-Based Echelon; 1.11.3 Phased Arrays; 1.11.4 MEWS Space Echelon; 1.11.5 Military Reconnaissance Satellites; References; Selected Bibliography; Chapter 2 Launch Vehicle and Spacecraft Failures and Accidents; 2.1 Rocket and Space Technology Safety Issues; 2.2 Analysis of Launch Vehicle Failure Causes; 2.3 Analysis of Spacecraft Failures; 2.4 Analysis of Failure Causes of Rocket and SpaceTechnology Products; 2.5 Trend Analysis of Launch Vehicle Accident Risks in 2000-2009 2.6 Analysis of SC Failure Trends in 2000-20092.7 Analysis of LV and SC Accident Causes in 2000-2009; 2.8 Analysis of Computer System and Software Failures; 2.9 Analysis of Onboard System Failures at the International Space Station in 2000s; 2.10 Methods of Ensuring Onboard Equipment Reliability of Spacecraft of Long-Life Operation; References; Chapter 3 Microwave Electronics for Space and Military Applications; 3.1 Basics of Microwave Electronics; 3.2 Structure and Properties of Gallium Arsenide; 3.3 Comparative Characteristics of GaAs and Si Properties 3.4 Microelectronic Devices Based on GaAs3.4.1 Diodes Based on GaAs; 3.4.2 Field Transistors; 3.5 Heterojunction Bipolar Transistors; 3.6 Optoelectronic Devices on GaAs; 3.6.1 LEDs; 3.6.2 Solar Batteries; 3.7 New Devices on GaAs; 3.8 Condition and Prospects of Development of Monolithic Microwave Integrated Circuits; 3.8.1 Main Spheres of Usage of Monolithic Microwave Integrated Circuits; 3.8.2 Main Materials for MMIC Production; 3.8.3 MMIC Active Elements and Their Reliability; 3.8.4 Advanced MMIC Design and Technology Solutions; 3.9 Basic Areas and Peculiarities of GaAs MMIC Application |
Record Nr. | UNINA-9910809940103321 |
Belous Anatoly | ||
Norwood : , : Artech House, , [2017] | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Space microelectronics. . Volume 2 Integrated circuit design for space applications / / Anatoly Belous, Vitali Saladukha, Siarhei Shvedau |
Autore | Belous Anatoly |
Pubbl/distr/stampa | Norwood : , : Artech House, , 2017 |
Descrizione fisica | 1 online resource (xxiv, 604 pages) |
Disciplina | 621.3815 |
Collana | Artech house space technology and applications series |
Soggetto topico | Electronic circuit design |
Soggetto genere / forma | Electronic books. |
ISBN |
1-5231-3259-0
1-63081-469-5 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Intro; Space Microelectronics Volume 2: Integrated Circuit Design for Space Applications; Introduction; Preface; Chapter 1 Considerations for Selection and Application of Foreign Electronic Component Bases in Designing Domestic Spacecraft; 1.1 General Problems of ECB Selection for REE of Space Application; 1.2 Restriction on Export of Foreign-Made Electronic Components to Russia; 1.2.1 Restriction of ECB Exports from the United States; 1.2.2 Restriction on ECB Exports from Europe and Other Countries; 1.2.3 International Export Control Organizations
1.3 Peculiarities of Application of Foreign-Made Industrial ECB in Rocket and Space Technology1.4 Counterfeit Microelectronic Products and Methods of Their Detection; 1.4.1 Types of Counterfeit Components; 1.4.2 Effective Methods of Detecting Counterfeit Products; 1.4.3 Electric Testing of Microelectronic Products for Space Application; 1.5 Peculiarities of Selection and Application of Foreign Processors in Domestic Spacecraft; 1.5.1 Application Aspects of Foreign Processors in Domestic Spacecraft; 1.5.2 Versions and Qualifications of UT 699 and GR 712 Microprocessors 1.5.3 Architecture and Hardware Features of UT 699 and GR 712 Microprocessors of Leon 3FT Family1.5.4 Peculiarities of Microprocessor Leon 3 Programming; 1.6 Radiation-Tolerant DC Converters for Space and Military Applications; 1.6.1 Total Ionizing Dose (TID); 1.6.2 Enhanced Low-Dose Rate Sensitivity (ELDRS); 1.6.3 Single Event Effects (SEE); 1.6.4 Analysis of Parameter Limits in Worst-Case Scenarios; 1.6.5 MIL-PRF-38534 Standard Class K Requirements; 1.6.6 Absence of Optocouplers in Hybrid DC-DC Converters 1.7 Best Practices of Work Arrangement for Producing Electronic Components of Space System On-Board Equipment1.8 Accelerated Reliability Testing of ECB SA; 1.9 Analysis of Test Results for Microcircuits Purchased in Russia Between 2009 and 2011; References; Chapter 2 Peculiarities of the Technological Process of Production and Basic Constructions of Submicron Transistors and Schottky Diodes; 2.1 On the Terminology of Submicron Microelectronics; 2.2 Tendencies and Perspectives of Modern Technology Development in Microelectronics; 2.2.1 Scaling Problem 2.2.2 Modern Submicron Technology: An Example of Its Implementation for Microprocessor Production2.3 Peculiarities of Submicron MOS Transistors; 2.3.1 MOS Transistors Structures in VLSIC; 2.3.2 Methods to Improve MOS Transistor Properties; 2.3.3 MOS Transistors with the Structure Silicon on Insulator; 2.3.4 Transistors with Double, Triple, and Cylindrical Gates; 2.3.5 Other Types of Transistor Structures; 2.3.6 The Peculiarities of Transistors for Analog Applications; 2.4 Constructional-Technological Peculiarities of High-Temperature Schottky Diodes |
Altri titoli varianti | Integrated circuit design for space applications |
Record Nr. | UNINA-9910480720603321 |
Belous Anatoly | ||
Norwood : , : Artech House, , 2017 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Space microelectronics. . Volume 2 Integrated circuit design for space applications / / Anatoly Belous, Vitali Saladukha, Siarhei Shvedau |
Autore | Belous Anatoly |
Pubbl/distr/stampa | Norwood : , : Artech House, , 2017 |
Descrizione fisica | 1 online resource (xxiv, 604 pages) |
Disciplina | 621.3815 |
Collana | Artech house space technology and applications series |
Soggetto topico | Electronic circuit design |
ISBN |
1-5231-3259-0
1-63081-469-5 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Intro; Space Microelectronics Volume 2: Integrated Circuit Design for Space Applications; Introduction; Preface; Chapter 1 Considerations for Selection and Application of Foreign Electronic Component Bases in Designing Domestic Spacecraft; 1.1 General Problems of ECB Selection for REE of Space Application; 1.2 Restriction on Export of Foreign-Made Electronic Components to Russia; 1.2.1 Restriction of ECB Exports from the United States; 1.2.2 Restriction on ECB Exports from Europe and Other Countries; 1.2.3 International Export Control Organizations
1.3 Peculiarities of Application of Foreign-Made Industrial ECB in Rocket and Space Technology1.4 Counterfeit Microelectronic Products and Methods of Their Detection; 1.4.1 Types of Counterfeit Components; 1.4.2 Effective Methods of Detecting Counterfeit Products; 1.4.3 Electric Testing of Microelectronic Products for Space Application; 1.5 Peculiarities of Selection and Application of Foreign Processors in Domestic Spacecraft; 1.5.1 Application Aspects of Foreign Processors in Domestic Spacecraft; 1.5.2 Versions and Qualifications of UT 699 and GR 712 Microprocessors 1.5.3 Architecture and Hardware Features of UT 699 and GR 712 Microprocessors of Leon 3FT Family1.5.4 Peculiarities of Microprocessor Leon 3 Programming; 1.6 Radiation-Tolerant DC Converters for Space and Military Applications; 1.6.1 Total Ionizing Dose (TID); 1.6.2 Enhanced Low-Dose Rate Sensitivity (ELDRS); 1.6.3 Single Event Effects (SEE); 1.6.4 Analysis of Parameter Limits in Worst-Case Scenarios; 1.6.5 MIL-PRF-38534 Standard Class K Requirements; 1.6.6 Absence of Optocouplers in Hybrid DC-DC Converters 1.7 Best Practices of Work Arrangement for Producing Electronic Components of Space System On-Board Equipment1.8 Accelerated Reliability Testing of ECB SA; 1.9 Analysis of Test Results for Microcircuits Purchased in Russia Between 2009 and 2011; References; Chapter 2 Peculiarities of the Technological Process of Production and Basic Constructions of Submicron Transistors and Schottky Diodes; 2.1 On the Terminology of Submicron Microelectronics; 2.2 Tendencies and Perspectives of Modern Technology Development in Microelectronics; 2.2.1 Scaling Problem 2.2.2 Modern Submicron Technology: An Example of Its Implementation for Microprocessor Production2.3 Peculiarities of Submicron MOS Transistors; 2.3.1 MOS Transistors Structures in VLSIC; 2.3.2 Methods to Improve MOS Transistor Properties; 2.3.3 MOS Transistors with the Structure Silicon on Insulator; 2.3.4 Transistors with Double, Triple, and Cylindrical Gates; 2.3.5 Other Types of Transistor Structures; 2.3.6 The Peculiarities of Transistors for Analog Applications; 2.4 Constructional-Technological Peculiarities of High-Temperature Schottky Diodes |
Altri titoli varianti | Integrated circuit design for space applications |
Record Nr. | UNINA-9910796811103321 |
Belous Anatoly | ||
Norwood : , : Artech House, , 2017 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
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Space microelectronics. . Volume 2 Integrated circuit design for space applications / / Anatoly Belous, Vitali Saladukha, Siarhei Shvedau |
Autore | Belous Anatoly |
Pubbl/distr/stampa | Norwood : , : Artech House, , 2017 |
Descrizione fisica | 1 online resource (xxiv, 604 pages) |
Disciplina | 621.3815 |
Collana | Artech house space technology and applications series |
Soggetto topico | Electronic circuit design |
ISBN |
1-5231-3259-0
1-63081-469-5 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Intro; Space Microelectronics Volume 2: Integrated Circuit Design for Space Applications; Introduction; Preface; Chapter 1 Considerations for Selection and Application of Foreign Electronic Component Bases in Designing Domestic Spacecraft; 1.1 General Problems of ECB Selection for REE of Space Application; 1.2 Restriction on Export of Foreign-Made Electronic Components to Russia; 1.2.1 Restriction of ECB Exports from the United States; 1.2.2 Restriction on ECB Exports from Europe and Other Countries; 1.2.3 International Export Control Organizations
1.3 Peculiarities of Application of Foreign-Made Industrial ECB in Rocket and Space Technology1.4 Counterfeit Microelectronic Products and Methods of Their Detection; 1.4.1 Types of Counterfeit Components; 1.4.2 Effective Methods of Detecting Counterfeit Products; 1.4.3 Electric Testing of Microelectronic Products for Space Application; 1.5 Peculiarities of Selection and Application of Foreign Processors in Domestic Spacecraft; 1.5.1 Application Aspects of Foreign Processors in Domestic Spacecraft; 1.5.2 Versions and Qualifications of UT 699 and GR 712 Microprocessors 1.5.3 Architecture and Hardware Features of UT 699 and GR 712 Microprocessors of Leon 3FT Family1.5.4 Peculiarities of Microprocessor Leon 3 Programming; 1.6 Radiation-Tolerant DC Converters for Space and Military Applications; 1.6.1 Total Ionizing Dose (TID); 1.6.2 Enhanced Low-Dose Rate Sensitivity (ELDRS); 1.6.3 Single Event Effects (SEE); 1.6.4 Analysis of Parameter Limits in Worst-Case Scenarios; 1.6.5 MIL-PRF-38534 Standard Class K Requirements; 1.6.6 Absence of Optocouplers in Hybrid DC-DC Converters 1.7 Best Practices of Work Arrangement for Producing Electronic Components of Space System On-Board Equipment1.8 Accelerated Reliability Testing of ECB SA; 1.9 Analysis of Test Results for Microcircuits Purchased in Russia Between 2009 and 2011; References; Chapter 2 Peculiarities of the Technological Process of Production and Basic Constructions of Submicron Transistors and Schottky Diodes; 2.1 On the Terminology of Submicron Microelectronics; 2.2 Tendencies and Perspectives of Modern Technology Development in Microelectronics; 2.2.1 Scaling Problem 2.2.2 Modern Submicron Technology: An Example of Its Implementation for Microprocessor Production2.3 Peculiarities of Submicron MOS Transistors; 2.3.1 MOS Transistors Structures in VLSIC; 2.3.2 Methods to Improve MOS Transistor Properties; 2.3.3 MOS Transistors with the Structure Silicon on Insulator; 2.3.4 Transistors with Double, Triple, and Cylindrical Gates; 2.3.5 Other Types of Transistor Structures; 2.3.6 The Peculiarities of Transistors for Analog Applications; 2.4 Constructional-Technological Peculiarities of High-Temperature Schottky Diodes |
Altri titoli varianti | Integrated circuit design for space applications |
Record Nr. | UNINA-9910825161103321 |
Belous Anatoly | ||
Norwood : , : Artech House, , 2017 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Viruses, Hardware and Software Trojans : Attacks and Countermeasures / / by Anatoly Belous, Vitali Saladukha |
Autore | Belous Anatoly |
Edizione | [1st ed. 2020.] |
Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2020 |
Descrizione fisica | 1 online resource (839 pages) |
Disciplina |
005.8
621.3815 |
Soggetto topico |
Electronic circuits
Computer engineering Internet of things Embedded computer systems Microprocessors Circuits and Systems Cyber-physical systems, IoT Processor Architectures |
ISBN | 3-030-47218-3 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | Introduction -- Information weapon: concepts, means, methods and examples of application -- Computer Viruses, Malicious Logic and Spyware -- Hardware Trojans in Electronic Devices -- Hardware Trojans in Microcircuits -- Methods of Identification of Hardware Trojans in Integrated Circuits -- Reverse Engineering of Integrated Circuits -- Methods of counteracting hardware IC Trojans -- Is the Trojan phenomenon a new stage in the evolution of modern weapons?. |
Record Nr. | UNINA-9910407732303321 |
Belous Anatoly | ||
Cham : , : Springer International Publishing : , : Imprint : Springer, , 2020 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
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