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Substrate Surface Preparation Handbook
| Substrate Surface Preparation Handbook |
| Autore | Robertson Max |
| Pubbl/distr/stampa | Norwood : , : Artech House, , 2011 |
| Descrizione fisica | 1 online resource (196 p.) |
| Disciplina |
621.3815
671 |
| Collana | Artech House applied photonics series |
| Soggetto topico |
Optical materials - Surfaces
Glass grinding and polishing |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-5231-1759-1
1-60807-214-2 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Substrate SurfacePreparation Handbook; Contents; Foreword; Preface; 1 Introduction; 1.1 Choosing a Process; 1.2 Definitions of Processes Used in This Book; 1.3 Lapping, Grinding, and Polishing Abrasives; 2 Preparation: Before the Start; 2.1 Plates and Measurement; 2.1.1 Plate Measurement; 2.1.2 Maintaining Plate Shape; 2.2 Lapping Plates; 2.2.1 Glazing; 2.3 Polishing Plates; 2.4 Polishing Surfaces: Care and Conditioning; 2.5 Baseplates for Polishing; 2.5.1 Baseplate Materials; 2.6 The Use of Smoothing Blocks; 2.7 Jigs; 2.7.1 When to Use a Jig; 2.7.2 Jig Balance; 2.7.3 Jig Maintenance.
2.8 Sample Mounting2.8.1 Vacuum Mounting; 2.8.2 Wax Mounting; 2.8 -- Automated Bonding; 2.8.4 Evaporated Wax Films; 2.8.5 Surface Tension Mounting; 2.8.6 Epoxy Bonding; 2.9 Sample Viewing and Assessment; 2.10 Plate and Sample Flatness Control; 2.10.1 Wafer Distortion; 2.11 Conclusion; References; 3 Lapping; 3.1 The Lapping Process; 3.1.1 If the Stock Removal Is Too Slow; 3.1.2 If the Stock Removal Is Too Fast; 3.2 Plate Shape Monitoring; 3.3 Scratching; 3.4 Smoothing; References; 4 Polishing; 4.1 Introduction; 4.2 Sample Load; 4.3 Abrasives; 4.4 Edge Polishing; 4.5 Slurry Flow Rate. 4.6 Grit Sizes4.7 Aligning the Sample; 4.8 The Polishing Run; 4.8.1 Before the Start; 4.8.2 Monitoring Progress; 4.9 Jig Rotation; 4.10 Sample Surface Shape and In-Process Alignment; 4.11 Chemical Polishing; 4.12 Chemomechanical Polishing; 4.13 Fluid Jet Polishing: Future Developments; References; 5 Specific Processes and Materials; 5.1 Geology; 5.2 Hard Materials; 5.2.1 Lapping Hard Materials; 5.2.2 Polishing Hard Materials; 5.3 Water-Soluble Materials; 5.4 Electro-Optic Materials; 5.4.1 Infrared and Electro-Optic Materials; 5.4.2 Processing Infared and Electro-Optic Materials; References. 6 Specialized Techniques6.1 Diamond Machining: Introduction; 6.1.1 Diamond Machining of Ductile Materials; 6.1.2 Diamond Machining of Brittle Materials; 6.2 Sawing; 6.2.1 Wire Saws; 6.2.2 High-Speed Saws; 6.2.3 Annular Saws; References; 7 Surface; 7.1 The Lapped Surface Finish; 7.2 Subsurface Damage; 7.3 Understanding Surface Finish; 7.3.1 Cutoff; 7.3.2 Stylus Radius; Reference; 8 Optics; 8.1 Glass; 8.2 Processing with Pitch; 8.3 Pitch Alternatives; 8.4 Spherical Surfaces; 8.5 Blocking Spherical Components; 8.6 Specifying Diamond Tooling; 8.7 Testing of Optical Components; References. 9 Semiconductor Device DeconstructionReferences; 10 Metallurgical Polishing and Microscopy; 10.1 Processing; 10.1.1 Process Stages; 10.2 Examination; 10.3 Microscope Setup; References; 11 Laboratory Setup; 11.1 Equipment Locations; 11.2 Laboratory Layout and Dimensions; 11.3 Optimizing the Process Route; 11.4 Sample Cleaning; 11.5 Safety Regulations; 11.6 Lab Environment; 11.7 Consumables; References; 12 Using Interferometry; 12.1 Basic Principles; 12.2 Analysis of Fringe Patterns; 12.3 Normal and Grazing Incidence; 12.4 Introducing the Workshop Interferometer; References; Bibliography. |
| Record Nr. | UNINA-9910461281303321 |
Robertson Max
|
||
| Norwood : , : Artech House, , 2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Substrate Surface Preparation Handbook
| Substrate Surface Preparation Handbook |
| Autore | Robertson Max |
| Pubbl/distr/stampa | Norwood : , : Artech House, , 2011 |
| Descrizione fisica | 1 online resource (196 p.) |
| Disciplina |
621.3815
671 |
| Collana | Artech House applied photonics series |
| Soggetto topico |
Optical materials - Surfaces
Glass grinding and polishing |
| ISBN |
1-5231-1759-1
1-60807-214-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Substrate SurfacePreparation Handbook; Contents; Foreword; Preface; 1 Introduction; 1.1 Choosing a Process; 1.2 Definitions of Processes Used in This Book; 1.3 Lapping, Grinding, and Polishing Abrasives; 2 Preparation: Before the Start; 2.1 Plates and Measurement; 2.1.1 Plate Measurement; 2.1.2 Maintaining Plate Shape; 2.2 Lapping Plates; 2.2.1 Glazing; 2.3 Polishing Plates; 2.4 Polishing Surfaces: Care and Conditioning; 2.5 Baseplates for Polishing; 2.5.1 Baseplate Materials; 2.6 The Use of Smoothing Blocks; 2.7 Jigs; 2.7.1 When to Use a Jig; 2.7.2 Jig Balance; 2.7.3 Jig Maintenance.
2.8 Sample Mounting2.8.1 Vacuum Mounting; 2.8.2 Wax Mounting; 2.8 -- Automated Bonding; 2.8.4 Evaporated Wax Films; 2.8.5 Surface Tension Mounting; 2.8.6 Epoxy Bonding; 2.9 Sample Viewing and Assessment; 2.10 Plate and Sample Flatness Control; 2.10.1 Wafer Distortion; 2.11 Conclusion; References; 3 Lapping; 3.1 The Lapping Process; 3.1.1 If the Stock Removal Is Too Slow; 3.1.2 If the Stock Removal Is Too Fast; 3.2 Plate Shape Monitoring; 3.3 Scratching; 3.4 Smoothing; References; 4 Polishing; 4.1 Introduction; 4.2 Sample Load; 4.3 Abrasives; 4.4 Edge Polishing; 4.5 Slurry Flow Rate. 4.6 Grit Sizes4.7 Aligning the Sample; 4.8 The Polishing Run; 4.8.1 Before the Start; 4.8.2 Monitoring Progress; 4.9 Jig Rotation; 4.10 Sample Surface Shape and In-Process Alignment; 4.11 Chemical Polishing; 4.12 Chemomechanical Polishing; 4.13 Fluid Jet Polishing: Future Developments; References; 5 Specific Processes and Materials; 5.1 Geology; 5.2 Hard Materials; 5.2.1 Lapping Hard Materials; 5.2.2 Polishing Hard Materials; 5.3 Water-Soluble Materials; 5.4 Electro-Optic Materials; 5.4.1 Infrared and Electro-Optic Materials; 5.4.2 Processing Infared and Electro-Optic Materials; References. 6 Specialized Techniques6.1 Diamond Machining: Introduction; 6.1.1 Diamond Machining of Ductile Materials; 6.1.2 Diamond Machining of Brittle Materials; 6.2 Sawing; 6.2.1 Wire Saws; 6.2.2 High-Speed Saws; 6.2.3 Annular Saws; References; 7 Surface; 7.1 The Lapped Surface Finish; 7.2 Subsurface Damage; 7.3 Understanding Surface Finish; 7.3.1 Cutoff; 7.3.2 Stylus Radius; Reference; 8 Optics; 8.1 Glass; 8.2 Processing with Pitch; 8.3 Pitch Alternatives; 8.4 Spherical Surfaces; 8.5 Blocking Spherical Components; 8.6 Specifying Diamond Tooling; 8.7 Testing of Optical Components; References. 9 Semiconductor Device DeconstructionReferences; 10 Metallurgical Polishing and Microscopy; 10.1 Processing; 10.1.1 Process Stages; 10.2 Examination; 10.3 Microscope Setup; References; 11 Laboratory Setup; 11.1 Equipment Locations; 11.2 Laboratory Layout and Dimensions; 11.3 Optimizing the Process Route; 11.4 Sample Cleaning; 11.5 Safety Regulations; 11.6 Lab Environment; 11.7 Consumables; References; 12 Using Interferometry; 12.1 Basic Principles; 12.2 Analysis of Fringe Patterns; 12.3 Normal and Grazing Incidence; 12.4 Introducing the Workshop Interferometer; References; Bibliography. |
| Record Nr. | UNINA-9910789702303321 |
|
Robertson Max
|
||
| Norwood : , : Artech House, , 2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Substrate Surface Preparation Handbook
| Substrate Surface Preparation Handbook |
| Autore | Robertson Max |
| Pubbl/distr/stampa | Norwood : , : Artech House, , 2011 |
| Descrizione fisica | 1 online resource (196 p.) |
| Disciplina |
621.3815
671 |
| Collana | Artech House applied photonics series |
| Soggetto topico |
Optical materials - Surfaces
Glass grinding and polishing |
| ISBN |
1-5231-1759-1
1-60807-214-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Substrate SurfacePreparation Handbook; Contents; Foreword; Preface; 1 Introduction; 1.1 Choosing a Process; 1.2 Definitions of Processes Used in This Book; 1.3 Lapping, Grinding, and Polishing Abrasives; 2 Preparation: Before the Start; 2.1 Plates and Measurement; 2.1.1 Plate Measurement; 2.1.2 Maintaining Plate Shape; 2.2 Lapping Plates; 2.2.1 Glazing; 2.3 Polishing Plates; 2.4 Polishing Surfaces: Care and Conditioning; 2.5 Baseplates for Polishing; 2.5.1 Baseplate Materials; 2.6 The Use of Smoothing Blocks; 2.7 Jigs; 2.7.1 When to Use a Jig; 2.7.2 Jig Balance; 2.7.3 Jig Maintenance.
2.8 Sample Mounting2.8.1 Vacuum Mounting; 2.8.2 Wax Mounting; 2.8 -- Automated Bonding; 2.8.4 Evaporated Wax Films; 2.8.5 Surface Tension Mounting; 2.8.6 Epoxy Bonding; 2.9 Sample Viewing and Assessment; 2.10 Plate and Sample Flatness Control; 2.10.1 Wafer Distortion; 2.11 Conclusion; References; 3 Lapping; 3.1 The Lapping Process; 3.1.1 If the Stock Removal Is Too Slow; 3.1.2 If the Stock Removal Is Too Fast; 3.2 Plate Shape Monitoring; 3.3 Scratching; 3.4 Smoothing; References; 4 Polishing; 4.1 Introduction; 4.2 Sample Load; 4.3 Abrasives; 4.4 Edge Polishing; 4.5 Slurry Flow Rate. 4.6 Grit Sizes4.7 Aligning the Sample; 4.8 The Polishing Run; 4.8.1 Before the Start; 4.8.2 Monitoring Progress; 4.9 Jig Rotation; 4.10 Sample Surface Shape and In-Process Alignment; 4.11 Chemical Polishing; 4.12 Chemomechanical Polishing; 4.13 Fluid Jet Polishing: Future Developments; References; 5 Specific Processes and Materials; 5.1 Geology; 5.2 Hard Materials; 5.2.1 Lapping Hard Materials; 5.2.2 Polishing Hard Materials; 5.3 Water-Soluble Materials; 5.4 Electro-Optic Materials; 5.4.1 Infrared and Electro-Optic Materials; 5.4.2 Processing Infared and Electro-Optic Materials; References. 6 Specialized Techniques6.1 Diamond Machining: Introduction; 6.1.1 Diamond Machining of Ductile Materials; 6.1.2 Diamond Machining of Brittle Materials; 6.2 Sawing; 6.2.1 Wire Saws; 6.2.2 High-Speed Saws; 6.2.3 Annular Saws; References; 7 Surface; 7.1 The Lapped Surface Finish; 7.2 Subsurface Damage; 7.3 Understanding Surface Finish; 7.3.1 Cutoff; 7.3.2 Stylus Radius; Reference; 8 Optics; 8.1 Glass; 8.2 Processing with Pitch; 8.3 Pitch Alternatives; 8.4 Spherical Surfaces; 8.5 Blocking Spherical Components; 8.6 Specifying Diamond Tooling; 8.7 Testing of Optical Components; References. 9 Semiconductor Device DeconstructionReferences; 10 Metallurgical Polishing and Microscopy; 10.1 Processing; 10.1.1 Process Stages; 10.2 Examination; 10.3 Microscope Setup; References; 11 Laboratory Setup; 11.1 Equipment Locations; 11.2 Laboratory Layout and Dimensions; 11.3 Optimizing the Process Route; 11.4 Sample Cleaning; 11.5 Safety Regulations; 11.6 Lab Environment; 11.7 Consumables; References; 12 Using Interferometry; 12.1 Basic Principles; 12.2 Analysis of Fringe Patterns; 12.3 Normal and Grazing Incidence; 12.4 Introducing the Workshop Interferometer; References; Bibliography. |
| Record Nr. | UNINA-9910824877703321 |
|
Robertson Max
|
||
| Norwood : , : Artech House, , 2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||