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Solder Joint Reliability [[electronic resource] /] / S.W. Ricky Lee
| Solder Joint Reliability [[electronic resource] /] / S.W. Ricky Lee |
| Autore | Ricky Lee S. W |
| Pubbl/distr/stampa | Bradford, England, : Emerald Group, 2004 |
| Descrizione fisica | 1 online resource (113 p.) |
| Collana | Soldering and Surface Mount Technology. No. 2 |
| Soggetto topico |
Solder and soldering
Welded joints |
| Soggetto genere / forma | Electronic books. |
| ISBN |
1-280-51553-8
9786610515530 1-84544-414-0 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Contents; English abstracts; French abstracts; German abstracts; Editorial; Contributors; Long term mechanical reliability with lead-free solders; Comparison of solder ball shear strengths for various nickel platings on the bond pads of a PBGA substrate; Strategies for improving the reliability of solder joints on power semiconductor devices; CBGA solder joint thermal fatigue life estimation by a simple method; Reliability testing and data analysis of lead-free solder joints for high-density packages; Failure analysis of lead-free solder joints for high-density packages
Thermal cycling reliability of lead-free chip resistor solder jointsInternet commentary; Book reviews; Company profile; New products; Industry news; Exhibitions and conferences; Appointments; International diary; |
| Record Nr. | UNINA-9910450531103321 |
Ricky Lee S. W
|
||
| Bradford, England, : Emerald Group, 2004 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Solder Joint Reliability [[electronic resource] /] / S.W. Ricky Lee
| Solder Joint Reliability [[electronic resource] /] / S.W. Ricky Lee |
| Autore | Ricky Lee S. W |
| Pubbl/distr/stampa | Bradford, England, : Emerald Group, 2004 |
| Descrizione fisica | 1 online resource (113 p.) |
| Collana | Soldering and Surface Mount Technology. No. 2 |
| Soggetto topico |
Solder and soldering
Welded joints |
| ISBN |
1-280-51553-8
9786610515530 1-84544-414-0 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Contents; English abstracts; French abstracts; German abstracts; Editorial; Contributors; Long term mechanical reliability with lead-free solders; Comparison of solder ball shear strengths for various nickel platings on the bond pads of a PBGA substrate; Strategies for improving the reliability of solder joints on power semiconductor devices; CBGA solder joint thermal fatigue life estimation by a simple method; Reliability testing and data analysis of lead-free solder joints for high-density packages; Failure analysis of lead-free solder joints for high-density packages
Thermal cycling reliability of lead-free chip resistor solder jointsInternet commentary; Book reviews; Company profile; New products; Industry news; Exhibitions and conferences; Appointments; International diary; |
| Record Nr. | UNINA-9910782916203321 |
|
Ricky Lee S. W
|
||
| Bradford, England, : Emerald Group, 2004 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Solder Joint Reliability / / S.W. Ricky Lee
| Solder Joint Reliability / / S.W. Ricky Lee |
| Autore | Ricky Lee S. W |
| Edizione | [1st ed.] |
| Pubbl/distr/stampa | Bradford, England, : Emerald Group, 2004 |
| Descrizione fisica | 1 online resource (113 p.) |
| Disciplina | 621.9;671.56 |
| Collana | Soldering and Surface Mount Technology. No. 2 |
| Soggetto topico |
Solder and soldering
Welded joints |
| ISBN |
1-280-51553-8
9786610515530 1-84544-414-0 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Contents; English abstracts; French abstracts; German abstracts; Editorial; Contributors; Long term mechanical reliability with lead-free solders; Comparison of solder ball shear strengths for various nickel platings on the bond pads of a PBGA substrate; Strategies for improving the reliability of solder joints on power semiconductor devices; CBGA solder joint thermal fatigue life estimation by a simple method; Reliability testing and data analysis of lead-free solder joints for high-density packages; Failure analysis of lead-free solder joints for high-density packages
Thermal cycling reliability of lead-free chip resistor solder jointsInternet commentary; Book reviews; Company profile; New products; Industry news; Exhibitions and conferences; Appointments; International diary; |
| Record Nr. | UNINA-9910825569403321 |
|
Ricky Lee S. W
|
||
| Bradford, England, : Emerald Group, 2004 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||