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Theory and Practice of Thermal Transient Testing of Electronic Components [[electronic resource] /] / edited by Marta Rencz, Gábor Farkas, András Poppe
Theory and Practice of Thermal Transient Testing of Electronic Components [[electronic resource] /] / edited by Marta Rencz, Gábor Farkas, András Poppe
Edizione [1st ed. 2022.]
Pubbl/distr/stampa Cham : , : Springer International Publishing : , : Imprint : Springer, , 2022
Descrizione fisica 1 online resource (389 pages)
Disciplina 621.381
Soggetto topico Electronics
Electric power production
Electronic circuits
Materials
Electronics and Microelectronics, Instrumentation
Electrical Power Engineering
Electronic Circuits and Systems
Materials Engineering
ISBN 3-030-86174-0
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Introduction: the Importance and Motivation -- Theoretical Background: History, the Network Identification by Deconvolution (NID) Method, Structure Functions, the Thermal Signature -- The Use of Thermal Transient Testing -- General Practical Questions and the Flow of Thermal Transient Measurements -- On the Accuracy and Repeatability of Thermal Measurements.
Record Nr. UNISA-996508664103316
Cham : , : Springer International Publishing : , : Imprint : Springer, , 2022
Materiale a stampa
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
Theory and Practice of Thermal Transient Testing of Electronic Components / / edited by Marta Rencz, Gábor Farkas, András Poppe
Theory and Practice of Thermal Transient Testing of Electronic Components / / edited by Marta Rencz, Gábor Farkas, András Poppe
Edizione [1st ed. 2022.]
Pubbl/distr/stampa Cham : , : Springer International Publishing : , : Imprint : Springer, , 2022
Descrizione fisica 1 online resource (389 pages)
Disciplina 621.381
621.381548
Soggetto topico Electronics
Electric power production
Electronic circuits
Materials
Electronics and Microelectronics, Instrumentation
Electrical Power Engineering
Electronic Circuits and Systems
Materials Engineering
ISBN 3-030-86174-0
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Introduction: the Importance and Motivation -- Theoretical Background: History, the Network Identification by Deconvolution (NID) Method, Structure Functions, the Thermal Signature -- The Use of Thermal Transient Testing -- General Practical Questions and the Flow of Thermal Transient Measurements -- On the Accuracy and Repeatability of Thermal Measurements.
Record Nr. UNINA-9910645887203321
Cham : , : Springer International Publishing : , : Imprint : Springer, , 2022
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Thermal and Electro-thermal System Simulation 2020
Thermal and Electro-thermal System Simulation 2020
Autore Rencz Márta
Pubbl/distr/stampa Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Descrizione fisica 1 online resource (310 p.)
Soggetto topico History of engineering and technology
Soggetto non controllato 3D IC
accuracy repeatability and reproducibility of thermal measurements
AlGaN-GaN HEMT
BCI-DCTM
beyond CMOS
BGA
CFD
CoB LEDs
compact thermal model
computation time
Delphi4LED
detailed thermal model
digital luminaire design
digital twin
DVFS
electro-thermal model
electro-thermal simulation
electronic packages
electronics cooling
experimental validation
finite volume method
heat generation
heat transfer mechanisms
hotspot
Industry 4.0
Joint Electron Device Engineering Council (JEDEC) metrics
LED
LED lifetime modelling
LED multi-domain modelling
life testing
lifetime extrapolation and modelling of LEDs
Light-emitting diodes
liquid cooling
lithium-ion battery
LM-80
magnetic nanoparticle
measurements
microchannels
microfluidics
modal approach
modelling
module temperature
multi-domain modeling
non-destructive testing
nonlinear thermal model
OpenFOAM
optical efficiency
phonon transport mechanisms
phosphor modeling
power LED measurement and simulation
power LEDs
pulse transformer
reliability testing
rheology
ROM
self-heating
size effect
solar energy
SPICE
Spice-like modelling of LEDs
statistical analysis
TDTR
thermal conductivity
thermal impedance
thermal interface resistance
thermal modelling
thermal pads
thermal phenomena
thermal resistance
thermal simulation
thermal testability
thermal testing standards
thermal transient testing
thermal-aware task scheduling
thermal-electronic circuits
TM-21
two-phase solver
vertical structure
VO2
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910557118503321
Rencz Márta  
Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui