Copper wire bonding / / Preeti S. Chauhan [and three others] |
Autore | Chauhan Preeti S |
Edizione | [1st ed. 2014.] |
Pubbl/distr/stampa | New York : , : Springer, , 2014 |
Descrizione fisica | 1 online resource (xxvi, 235 pages) : illustrations (some color) |
Disciplina | 671.58 |
Collana | Gale eBooks |
Soggetto topico |
Wire bonding (Electronic packaging)
Copper wire |
ISBN | 1-4614-5761-0 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | Copper Wire Bonding -- Bonding Process -- Bonding Metallurgies -- Wire Bond Evaluation -- Thermal Reliability Tests -- Humidity and Electromigration Tests -- Wire Bond Pads -- Concerns and Solutions -- Recommendations -- Appendix A: Reliability Data -- Appendix B: Patents on Copper Wire Bonding. |
Record Nr. | UNINA-9910299461003321 |
Chauhan Preeti S
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New York : , : Springer, , 2014 | ||
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Lo trovi qui: Univ. Federico II | ||
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Optimum Cooling of Data Centers [[electronic resource] ] : Application of Risk Assessment and Mitigation Techniques / / by Jun Dai, Michael M. Ohadi, Diganta Das, Michael G. Pecht |
Autore | Dai Jun |
Edizione | [1st ed. 2014.] |
Pubbl/distr/stampa | New York, NY : , : Springer New York : , : Imprint : Springer, , 2014 |
Descrizione fisica | 1 online resource (194 p.) |
Disciplina | 004.24 |
Soggetto topico |
Buildings—Design and construction
Building Construction Engineering, Architectural Electrical engineering Computer software—Reusability Building Construction and Design Communications Engineering, Networks Performance and Reliability |
ISBN | 1-4614-5602-9 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | Overview of Telecom Industry and Data Centers -- Cooling Methods to Improve Energy Efficiency in Telecom Industry and Data Centers -- Free Air Cooling -- Standards for Telecom Equipment and Data Centers -- Risks of Free Air Cooling -- Steps to Assess Parts for use under Free Air Cooling Condition -- Guidelines for Part Reliability Assessment -- Introduction to PHM -- Development of Sub-system and System for Free Air Cooling -- Future Trends. |
Record Nr. | UNINA-9910299465203321 |
Dai Jun
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New York, NY : , : Springer New York : , : Imprint : Springer, , 2014 | ||
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Lo trovi qui: Univ. Federico II | ||
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Risk-Based Engineering [[electronic resource] ] : An Integrated Approach to Complex Systems—Special Reference to Nuclear Plants / / by Prabhakar V. Varde, Michael G. Pecht |
Autore | Varde Prabhakar V |
Edizione | [1st ed. 2018.] |
Pubbl/distr/stampa | Singapore : , : Springer Singapore : , : Imprint : Springer, , 2018 |
Descrizione fisica | 1 online resource (XXII, 568 p. 141 illus., 59 illus. in color.) |
Disciplina | 658.155 |
Collana | Springer Series in Reliability Engineering |
Soggetto topico |
Quality control
Reliability Industrial safety Mathematical models System theory Nuclear energy Manufactures Quality Control, Reliability, Safety and Risk Mathematical Modeling and Industrial Mathematics Complex Systems Nuclear Energy Manufacturing, Machines, Tools, Processes |
ISBN |
981-13-0090-9
978-981-13-0090-5 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | Preface -- Chapter 1: Introduction -- Chapter 2: Risk Characterization -- Chapter 3: Probabilistic Approach to Reliability Engineering -- Chapter 4: System Reliability Modelling -- Chapter 5: Life Prediction -- Chapter 6: Probabilistic Risk Assessment -- Chapter 7: Risk-based Design -- Chapter 8: Fatigue and Fracture Risk Assessment- A Probabilistic Framework -- Chapter 9: Uncertainty Modeling -- Chapter 10: Human Reliability Analysis -- Chapter 11: Digital system reliability -- Chapter 12: Physics of Failure -- Chapter 13: Prognostics and Health Management -- Chapter 14: Risk Informed Decisions -- Chapter 15: Risk-based / Risk-informed Applications -- Appendix: Statistical Tables. |
Record Nr. | UNINA-9910299924603321 |
Varde Prabhakar V
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Singapore : , : Springer Singapore : , : Imprint : Springer, , 2018 | ||
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Lo trovi qui: Univ. Federico II | ||
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