Fundamentals of electrochemical deposition [[electronic resource] /] / Milan Paunovic, Mordechay Schlesinger |
Autore | Paunovic Milan |
Edizione | [2nd ed.] |
Pubbl/distr/stampa | Hoboken, N.J., : Wiley-Interscience, c2006 |
Descrizione fisica | 1 online resource (388 p.) |
Disciplina |
541.37
671.732 |
Altri autori (Persone) | SchlesingerMordechay |
Collana | The Electrochemical Society series |
Soggetto topico | Electroplating |
Soggetto genere / forma | Electronic books. |
ISBN |
1-280-55149-6
9786610551491 0-470-00940-3 0-470-00939-X |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
FUNDAMENTALS OF ELECTROCHEMICAL DEPOSITION; CONTENTS; Preface to the Second Edition; Preface to the First Edition; 1. Overview; 2. Water and Ionic Solutions; 3. Metals and Metal Surfaces; 4. Metal-Solution Interphase; 5. Equilibrium Electrode Potential; 6. Kinetics and Mechanism of Electrodeposition; 7. Nucleation and Growth Models; 8. Electroless Deposition; 9. Displacement Deposition; 10. Effect of Additives; 11. Electrodeposition of Alloys; 12. Metal Deposit and Current Distribution; 13. Characterization of Metallic Surfaces and Thin Films; 14. In Situ Characterization of Deposition
15. Mathematical Modeling in Electrochemistry16. Structure and Properties of Deposits; 17. Electrodeposited Multilayers; 18. Interdiffusion in Thin Films; 19. Applications in Semiconductor Technology; 20. Applications in the Fields of Magnetism and Microelectronics; 21. Frontiers in Applications: The Field of Medicine; Index |
Record Nr. | UNINA-9910143569903321 |
Paunovic Milan
![]() |
||
Hoboken, N.J., : Wiley-Interscience, c2006 | ||
![]() | ||
Lo trovi qui: Univ. Federico II | ||
|
Fundamentals of electrochemical deposition / / Milan Paunovic, Mordechay Schlesinger |
Autore | Paunovic Milan |
Edizione | [2nd ed.] |
Pubbl/distr/stampa | Hoboken, N.J., : Wiley-Interscience, c2006 |
Descrizione fisica | 1 online resource (388 p.) |
Disciplina | 671.7/32 |
Altri autori (Persone) | SchlesingerMordechay |
Collana | The Electrochemical Society series |
Soggetto topico | Electroplating |
ISBN |
1-280-55149-6
9786610551491 0-470-00940-3 0-470-00939-X |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
FUNDAMENTALS OF ELECTROCHEMICAL DEPOSITION; CONTENTS; Preface to the Second Edition; Preface to the First Edition; 1. Overview; 2. Water and Ionic Solutions; 3. Metals and Metal Surfaces; 4. Metal-Solution Interphase; 5. Equilibrium Electrode Potential; 6. Kinetics and Mechanism of Electrodeposition; 7. Nucleation and Growth Models; 8. Electroless Deposition; 9. Displacement Deposition; 10. Effect of Additives; 11. Electrodeposition of Alloys; 12. Metal Deposit and Current Distribution; 13. Characterization of Metallic Surfaces and Thin Films; 14. In Situ Characterization of Deposition
15. Mathematical Modeling in Electrochemistry16. Structure and Properties of Deposits; 17. Electrodeposited Multilayers; 18. Interdiffusion in Thin Films; 19. Applications in Semiconductor Technology; 20. Applications in the Fields of Magnetism and Microelectronics; 21. Frontiers in Applications: The Field of Medicine; Index |
Record Nr. | UNINA-9910877206503321 |
Paunovic Milan
![]() |
||
Hoboken, N.J., : Wiley-Interscience, c2006 | ||
![]() | ||
Lo trovi qui: Univ. Federico II | ||
|